TW200623344A - Leadframe, semiconductor package and method for manufacturing the same - Google Patents

Leadframe, semiconductor package and method for manufacturing the same

Info

Publication number
TW200623344A
TW200623344A TW093140835A TW93140835A TW200623344A TW 200623344 A TW200623344 A TW 200623344A TW 093140835 A TW093140835 A TW 093140835A TW 93140835 A TW93140835 A TW 93140835A TW 200623344 A TW200623344 A TW 200623344A
Authority
TW
Taiwan
Prior art keywords
leadframe
semiconductor package
manufacturing
same
chip
Prior art date
Application number
TW093140835A
Other languages
Chinese (zh)
Other versions
TWI263315B (en
Inventor
Hung-Ta Hsu
Tzu-Bin Lin
Ya-Ling Hung
Ya-Yu Hsieh
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW093140835A priority Critical patent/TWI263315B/en
Publication of TW200623344A publication Critical patent/TW200623344A/en
Application granted granted Critical
Publication of TWI263315B publication Critical patent/TWI263315B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

A semiconductor package includes a chip and a leadframe. The chip includes a plurality of solder bumps disposed thereon. The leadframe includes a plurality of leads and annular stoppers, wherein each lead has a surface, and the annular stoppers are respectively formed on the surfaces of the leads and respectively define a solder area for soldering to the corresponding solder bump of the chip.
TW093140835A 2004-12-27 2004-12-27 Leadframe, semiconductor package and method for manufacturing the same TWI263315B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW093140835A TWI263315B (en) 2004-12-27 2004-12-27 Leadframe, semiconductor package and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093140835A TWI263315B (en) 2004-12-27 2004-12-27 Leadframe, semiconductor package and method for manufacturing the same

Publications (2)

Publication Number Publication Date
TW200623344A true TW200623344A (en) 2006-07-01
TWI263315B TWI263315B (en) 2006-10-01

Family

ID=37966331

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093140835A TWI263315B (en) 2004-12-27 2004-12-27 Leadframe, semiconductor package and method for manufacturing the same

Country Status (1)

Country Link
TW (1) TWI263315B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI791537B (en) * 2017-06-22 2023-02-11 日商大口電材股份有限公司 Lead frame and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI791537B (en) * 2017-06-22 2023-02-11 日商大口電材股份有限公司 Lead frame and manufacturing method thereof

Also Published As

Publication number Publication date
TWI263315B (en) 2006-10-01

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