TWI790395B - 載板的去除方法 - Google Patents

載板的去除方法 Download PDF

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TWI790395B
TWI790395B TW108128059A TW108128059A TWI790395B TW I790395 B TWI790395 B TW I790395B TW 108128059 A TW108128059 A TW 108128059A TW 108128059 A TW108128059 A TW 108128059A TW I790395 B TWI790395 B TW I790395B
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木内逸人
鈴木克彥
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日商迪思科股份有限公司
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Abstract

[課題]提供一種可以容易地從工件去除載板之載板的去除方法。 [解決手段]一種載板的去除方法，是從隔著暫時接著層而設置於載板的正面的工件去除該載板，前述載板的去除方法包含以下步驟：第1保持步驟，以第1保持組件保持載板並使工件露出；落差部形成步驟，從工件側沿著載板的外周緣加工載板，而在載板的外周緣形成背面側比正面側更向外突出的落差部；第2保持步驟，以第2保持組件保持工件並使載板露出；及載板去除步驟，以去除組件對落差部施加力，而讓載板朝離開工件的方向移動，藉此從工件去除載板。

Description

載板的去除方法
發明領域 本發明是有關於一種從隔著暫時接著層而重疊於載板的工件將載板去除之載板的去除方法。
發明背景 在以行動電話及個人電腦為代表的電子機器中，具備有電子電路等的元件之元件晶片已成為必要的構成要件。元件晶片是藉由例如以分割預定線(切割道)將晶圓的正面區劃成複數個區域，並在各區域形成元件後，沿著此分割預定線將晶圓分割而獲得，其中前述晶圓是以矽等半導體材料所構成。
以如上述之方法所得到的元件晶片，是例如固定於CSP(晶片尺寸封裝，Chip Size Package)用的母板，並於以打線接合(wire bonding)等的方法進行電連接後，以塑模樹脂密封。像這樣，藉由以塑模樹脂將元件晶片密封來形成封裝元件，而變得可以保護元件晶片免受衝撃、光、熱、水等外在因素影響。
近年來，已開始採用被稱為FOWLP(扇出型晶圓級封裝，Fan-Out Wafer Level Package)之封裝技術，前述封裝技術是使用晶圓級之再配線技術來將封裝端子形成於元件晶片的區域外之技術(參照例如專利文獻1)。又，在尺寸比晶圓更大的面板(代表性的是用於液晶面板的製造之玻璃基板)的等級中也有將封裝元件成批製造之被稱為FOPLP(扇出型面板級封裝，Fan-Out Panel Level Packaging)之封裝技術被提出。
在FOPLP中是例如在作為暫時基板之載板的正面隔著暫時接著層而形成配線層(RDL：Redistribution Layer(重新佈線層))，並將元件晶片接合於此配線層。接著，將元件晶片以塑模樹脂密封而得到封裝面板。之後，藉由磨削等方法將封裝面板形成得較薄後，分割此封裝面板，藉此完成封裝元件。 先前技術文獻 專利文獻
專利文獻1：日本專利特開2016-201519號公報
發明概要 發明欲解決之課題 在上述之FOPLP中，是例如在將封裝面板分割成封裝元件後，從此封裝元件去除載板。具體而言，是從載板拾取各個封裝元件。然而，若封裝元件的尺寸較小，會難以從載板拾取此封裝元件。
另一方面，也考慮有下述作法：在將封裝面板分割成封裝元件之前，將載板從封裝面板剝離並去除。然而，由於在暫時接著層具有強到一定程度的接著力，因此難以在不損傷封裝面板或載板的情況下將載板從封裝面板剝離。
本發明是有鑒於所述的問題點而作成之發明，其目的在於提供一種可以容易地從封裝面板等的工件去除載板之載板的去除方法。 用以解決課題之手段
根據本發明的一態樣，可提供一種載板的去除方法，是從隔著暫時接著層而設置於載板的正面的工件去除該載板，前述載板的去除方法具備有： 第1保持步驟，以第1保持組件保持該載板並使該工件露出； 落差部形成步驟，在實施該第1保持步驟後，從該工件側沿著該載板的外周緣加工該載板，而在該載板的外周緣形成背面側比正面側更向外突出的落差部； 第2保持步驟，在實施該落差部形成步驟後，以第2保持組件保持該工件並使該載板露出；及 載板去除步驟，在實施該第2保持步驟後，以去除組件對該落差部施加力，而讓該載板朝從該工件離開的方向移動，藉此從該工件去除該載板。
較佳的是，在本發明的一態樣中，在前述載板去除步驟中是一邊以去除組件對該落差部施加力一邊對該工件與該載板之間噴附流體。 發明效果
在本發明的一態樣之載板的去除方法中，是從工件側沿著載板的外周緣加工載板，而在載板的外周緣形成背面側比正面側更向外突出的落差部。據此，以保持有工件的狀態對落差部施加力，而讓載板朝從工件離開的方向移動，藉此可以容易地從工件去除載板。
用以實施發明之形態 參照附加圖式，針對本發明的一個態樣的實施形態進行說明。本實施形態之載板的去除方法包含第1保持步驟(參照圖1(B))、落差部形成步驟(參照圖2(A)及圖2(B))、第2保持步驟(參照圖3(A))、及載板去除步驟(參照圖3(B))。
在第1保持步驟中是保持包含載板與工件的複合基板的載板側並使工件側露出。在落差部形成步驟中，是將切割刀片沿著載板的外周緣切入，而在此載板的外周緣形成落差部。在第2保持步驟中，是保持複合基板的工件側並使載板側露出。
在載板去除步驟中，是藉由對載板的落差部施加力，而讓載板朝從工件離開的方向移動，而從工件去除載板。以下，詳述本實施形態之載板的去除方法。
圖1(A)是顯示在本實施形態之載板的去除方法中所使用的複合基板1的構成例的截面圖。複合基板1包含有例如以鈉玻璃、硼矽玻璃、石英玻璃等的絕緣體材料所形成的載板3。此載板3具有例如大致平坦的第1面(正面)3a、及與第1面3a為相反的相反側的第2面(背面)3b，且在從第1面3a側或第2面3b側觀看的平面視角下構成為矩形。載板3的厚度為例如2mm以下，代表性的是1.1mm。
再者，在本實施形態中，雖然是使用以鈉玻璃、硼矽玻璃、石英玻璃等的絕緣體材料所形成的載板3，但對於載板3的材質、形狀、構造、大小等並無特別的限制。也可以使用例如以半導體、陶瓷、樹脂、或金屬等的材料所形成的板等來作為載板3。亦可將圓盤狀的半導體晶圓等作為載板3。
在載板3的第1面3a側是隔著暫時接著層5而配置有工件7。此暫時接著層5是例如藉由重疊金屬膜或絕緣體膜等的方式而設置於第1面3a的大致整體，並且具有接著載板3與工件7的功能。暫時接著層5的厚度為例如20μm以下，代表性的是5μm。在後述之載板去除步驟中從工件7剝離、去除載板3時，會將此暫時接著層5分離成密合於載板3側的第1部分、與密合於工件7側的第2部分。
工件7也被稱為例如封裝面板或封裝晶圓等，並且包含與暫時接著層5相接的配線層(RDL)、接合於配線層的複數個元件晶片、及將各元件晶片密封的塑模樹脂層。此工件7是構成為例如在平面視角下與載板3大致相同大小、形狀。工件7的厚度為例如1.5mm以下，代表性的是0.6mm。
再者，此工件7的第1面(正面)7a側亦可藉磨削等方法來加工。又，於工件7內相鄰的元件晶片之間的區域內設定有分割預定線(切斷預定線)。藉由沿著此分割預定線來切斷工件7，可得到對應於各元件晶片的複數個封裝元件。但是，對工件7的材質、形狀、構造、大小等並無特別的限制。
在本實施形態之載板的去除方法中，首先是進行保持上述之複合基板1的載板3側並使工件7側露出的第1保持步驟。圖1(B)是針對第1保持步驟而顯示的截面圖。再者，在圖1(B)中是將一部分的構成要件以功能方塊來顯示。
此第1保持步驟是使用圖1(B)等所示的切割裝置2來進行。切割裝置2具備有用於保持複合基板1的工作夾台(第1保持組件、第1保持單元)4。工作夾台4包含例如以不鏽鋼為代表之金屬材料所形成的圓筒狀的框體6、及配置於以多孔質材料所構成的框體6的上部的保持板8。
保持板8的上表面是形成為用於吸引、保持複合基板1的載板3側的保持面8a。此保持板8的下表面側是透過設置於框體6的內部的流路6a或閥10等而與吸引源12連接。因此，若將閥10開啟，即可以使吸引源12的負壓作用於保持面8a。
此工作夾台4(框體6)是連結於馬達等的旋轉驅動源(未圖示)，並且繞著相對於上述之保持面8a大致垂直的旋轉軸而旋轉。又，工作夾台4(框體6)是受到加工進給機構(未圖示)所支撐，並在相對於上述之保持面8a大致平行的加工進給方向上移動。
在第1保持步驟中，是如圖1(B)所示，例如使載板3的第2面3b接觸於工作夾台4的保持面8a。然後，將閥10開啟而使吸引源12的負壓作用於保持面8a。藉此，可將複合基板1的載板3側吸引、保持於工作夾台4。亦即，複合基板1的工件7成為露出於上方的狀態。
在第1保持步驟後，是進行在載板3的外周緣形成落差部的落差部形成步驟。圖2(A)是針對落差部形成步驟而顯示的截面圖，圖2(B)是顯示在載板3上形成有落差部3c的狀態的截面圖。再者，在圖2(A)中，是將一部分的構成要件以功能方塊來顯示。
落差部形成步驟是繼續使用切割裝置2來進行。如圖2(A)所示，在工作夾台4的上方配置有切割單元14。切割單元14具備有主軸16，前述主軸16是成為相對於保持面8a大致平行的旋轉軸。在主軸16的一端側，裝設有環狀的切割刀片18，前述環狀的切割刀片18是將磨粒分散於結合材而構成。
在主軸16的另一端側，連結有馬達等的旋轉驅動源(未圖示)，且裝設在主軸16的一端側的切割刀片18是藉由從旋轉驅動源所傳來的力而旋轉。此切割單元14是例如受到升降機構(未圖示)與分度進給機構(未圖示)所支撐，且朝相對於保持面8a大致垂直的鉛直方向、及相對於鉛直方向及加工進給方向大致垂直的分度進給方向移動。
在落差部形成步驟中，首先是使保持複合基板1的工作夾台4旋轉，並且將作為加工對象的載板3的外周緣的一部分(在平面視角下相當於矩形的一邊的部分)設成相對於加工進給方向大致平行。接著，使工作夾台4與切割單元14相對地移動，而將切割刀片18定位到上述之外周緣的一部分的延長線上方。
又，將切割刀片18的下端定位在比載板3的第1面3a更低，且比第2面3b更高的位置。之後，一邊旋轉切割刀片18一邊使工作夾台4朝加工進給方向移動。藉此，可以將切割刀片18從第1面3a側(工件7側)沿著載板3的外周緣切入至未到達第2面3b的深度，而形成第2面3b側比第1面3a側更向外(在相對於第1面3a或第2面3b平行的方向上向外)突出的落差部3c。
載板3的外周緣與切割刀片18的重疊的寬度(即所形成的落差部3c的寬度或突出量)是設定在不會對從工件7切出的封裝元件等產生影響的範圍內。例如在設定於工件7的外周的剩餘區域(外周剩餘區域)的寬度較寬的情況下，可以將載板3的外周緣與切割刀片18的重疊的寬度(落差部3c的寬度)也設定得較寬。若考量載板3的去除容易度等，宜將落差部3c的寬度設定為例如0.2mm以上且3mm以下。
如上述，暫時接著層5及工件7是構成為在平面視角下與載板3大致相同大小、形狀。因此，當使切割刀片18從第1面3a側(工件7側)切入載板3的外周緣時，也會同時地將暫時接著層5及工件7的對應區域切割、去除。在載板3的外周緣的一部分形成落差部3c後，反覆進行同樣的順序，而在載板3的外周緣的其他部分也形成落差部3c。當在載板3的外周緣的整體形成落差部3c後，落差部形成步驟即結束。
再者，在本實施形態中，雖然於載板3的外周緣的整體形成有落差部3c，但只要將落差部3c至少形成在載板3的外周緣的一部分即可。又，當載板3或工件7在平面視角下為圓形(即圓盤狀)的情況下，可以藉由例如在將切割刀片18切入載板3的外周緣時使工作夾台4旋轉，而沿著載板3的外周緣來形成落差部3c。
在落差部形成步驟後，是進行保持複合基板1的工件7側且使載板3側露出的第2保持步驟。圖3(A)是針對第2保持步驟而顯示的截面圖。再者，在圖3(A)中，是將一部分的構成要件以功能方塊來顯示。
第2保持步驟是使用圖3(A)等所示的去除裝置22來進行。去除裝置22具備有用於保持複合基板1的工作夾台(第2保持組件、第2保持單元)24。工作夾台24的構造等是與上述之切割裝置2的工作夾台4大致相同。
亦即，工作夾台24包含以不鏽鋼為代表的金屬材料所形成的圓筒狀的框體26、及以多孔質材料所構成且配置於框體26的上部的保持板28。保持板28的上表面是成為用於吸引、保持複合基板1的工件7側的保持面28a。此保持板28的下表面側是透過設置於框體26的內部的流路26a或閥30等而與吸引源32連接。因此，若將閥30開啟，即可以使吸引源32的負壓作用於保持面28a。
如圖3(A)所示，在第2保持步驟中是例如使工件7的第1面7a接觸於工作夾台24的保持面28a。然後，將閥30開啟而使吸引源32的負壓作用於保持面28a。藉此，可將複合基板1的工件7側吸引、保持於工作夾台24。亦即，複合基板1的載板3成為露出於上方的狀態。
再者，在本實施形態的第2保持步驟中，雖然是使工件7的第1面7a對工作夾台24的保持面28a直接接觸，但亦可使多孔片材等介在工件7的第1面7a與工作夾台24的保持面28a之間。藉此，形成為可以防止起因於與保持面28a的接觸之工件7的損傷或污染等。
在第2保持步驟後，是進行從工件7去除載板3的載板去除步驟。圖3(B)是針對載板去除步驟而顯示的局部截面側面圖。再者，在圖3(B)中是將一部分的構成要件以功能方塊來顯示。
載板去除步驟是繼續使用去除裝置22來進行。如圖3(B)所示，在工作夾台24的上方配置有用於將載板3去除的複數個去除臂(去除組件、去除單元)34。各去除臂34是在前端部具有可以支撐載板3的落差部3c之爪狀的構造。又，在各去除臂34的基端側連結有使各去除臂34移動的移動機構(未圖示)。
在載板去除步驟中，首先是使各去除臂34移動到可以藉由各去除臂34之爪狀的前端部從下方支撐載板3的落差部3c的位置。然後，如圖3(B)所示，藉由移動機構使各去除臂34上升。亦即，藉由各去除臂34對載板3的落差部3c施加向上之力。
如上述，複合基板1的工件7側是被工作夾台24所吸引、保持。因此，當藉由各去除臂34來對載板3的落差部3c施加向上之力時，載板3會以暫時接著層5為交界而從工件7被剝離、並且上升。亦即，載板3會朝從工件7離開的方向移動。當將載板3的整體從工件7分離、去除後，載板去除步驟即結束。
再者，已從工件7分離的載板3是例如藉由各去除臂34原樣地被搬出到工作夾台24的外部。當然，亦可使用包含吸附墊等的其他搬送單元來將分離後的載板3搬出到工作夾台24的外部。
如以上，在本實施形態之載板的去除方法中，是將切割刀片18從工件7側沿著載板3的外周緣切入至未到達載板3的背面的深度，而在載板3的外周緣形成使第2面(背面)3b側比第1面(正面)3a側更向外突出的落差部3c。據此，以保持有工件7的狀態對落差部3c施加力，而讓載板3朝從工件7離開的方向移動，藉此可以容易地從工件7去除載板3。
再者，本發明並不因上述實施形態之記載而受到限制，並可作各種變更而實施。例如在上述實施形態中，雖然使用切割裝置2與去除裝置22來從工件7去除載板3，但亦可使用將切割裝置2與去除裝置22的功能合在一起而設置的裝置來從工件7去除載板3。
更具體而言，可以例如對切割裝置2裝入去除裝置22的去除臂34等。當然，亦可相對於去除裝置22裝入切割裝置2的切割單元14等。再者，在這些情況下，形成為可使用相同的工作夾台(工作夾台4或工作夾台24)來進行第1保持步驟與第2保持步驟。
又，在上述實施形態中，雖然是藉由使切割刀片18從工件7側沿著載板3的外周緣切入而形成有落差部3c，但亦可例如藉由從工件7側沿著載板3的外周緣照射雷射光束來形成落差部3c。在這種情況下，是使用可以照射至少可被載板3所吸收之波長的雷射光束的雷射加工裝置(雷射加工單元)來代替切割裝置2(切割單元14)。
又，也可以在載板去除步驟中去除載板3時，對載板3與工件7之間(相當於暫時接著層5的區域)噴附流體。圖4(A)是針對第1變形例的載板去除步驟而顯示的局部截面側面圖。如圖4(A)所示，在第1變形例之載板去除步驟中所使用之去除臂34的內部，設有用於供給流體的流路34a。
於流路34a的上游側是透過閥(未圖示)等而與流體的供給源(未圖示)連接。另一方面，流路34a的下游端是在去除臂34的前端部形成有開口。因此，只要在以各去除臂34的前端部從下方支撐載板3的落差部3c時將閥開啟，就可以將流體噴附到載板3與工件7之間。
例如藉由一邊對載板3與工件7之間噴附流體一邊以去除臂34對落差部3c施加力，而變得可以更容易地從工件7剝離載板3。可以使用例如空氣或水等來作為對載板3與工件7之間噴附的流體。不過，對此流體的種類等並無特別的限制。
又，在上述實施形態等中，雖然是使用複數個去除臂34來從工件7剝離、去除載板3，但也可以使用1個去除臂34來從工件7剝離、去除載板3。圖4(B)是針對使用1個去除臂34來從工件7剝離、去除載板3之第2變形例的載板去除步驟而顯示的局部截面側面圖。
又，在載板去除步驟中對藉由去除臂34所支撐的落差部3c的位置等並無特別的限制。圖5(A)是針對第3變形例的載板去除步驟而顯示的局部截面側面圖，圖5(B)是針對第4變形例的載板去除步驟而顯示的局部截面側面圖。
如圖5(A)所示，在第3變形例的載板去除步驟中是藉由去除臂34在相當於載板3的1個角3d的位置上支撐落差部3c，而將載板3剝離。在這種情況下，載板3是成為從相當於角3d的位置沿著對角線的方向逐漸地被剝離。
另一方面，如圖5(B)所示，在第4變形例的載板去除步驟中是藉由去除臂34在相當於載板3的4個角3d、3e、3f、3g的位置上支撐落差部3c，而將載板3剝離。在這種情況下，載板3是成為從相當於角3d、3e、3f、3g的位置沿著對角線的方向逐漸地被剝離。
另外，上述實施形態之構造、與方法等，只要在不脫離本發明的目的之範圍內，均可適當變更而實施。
1‧‧‧複合基板 2‧‧‧切割裝置 3‧‧‧載板 3a、7a‧‧‧第1面(正面) 3b‧‧‧第2面(背面) 3c‧‧‧落差部 3d、3e、3f、3g‧‧‧角 4‧‧‧工作夾台(第1保持組件、第1保持單元) 5‧‧‧暫時接著層 6、26‧‧‧框體 6a、26a、34a‧‧‧流路 7‧‧‧工件 8、28‧‧‧保持板 8a、28a‧‧‧保持面 10、30‧‧‧閥 12、32‧‧‧吸引源 14‧‧‧切割單元 16‧‧‧主軸 18‧‧‧切割刀片 22‧‧‧去除裝置 24‧‧‧工作夾台(第2保持組件、第2保持單元) 34‧‧‧去除臂(去除組件、去除單元)
圖1(A)是顯示包含載板與工件的複合基板的構成例的截面圖，圖1(B)是針對第1保持步驟而顯示的截面圖。 圖2(A)是針對落差部形成步驟而顯示的截面圖，圖2(B)是顯示已在載板形成落差部之狀態的截面圖。 圖3(A)是針對第2保持步驟而顯示的截面圖，圖3(B)是針對載板去除步驟而顯示的局部截面側面圖。 圖4(A)是針對第1變形例的載板去除步驟而顯示的局部截面側面圖，圖4(B)是針對第2變形例的載板去除步驟而顯示的局部截面側面圖。 圖5(A)是針對第3變形例的載板去除步驟而顯示的局部截面側面圖，圖5(B)是針對第4變形例的載板去除步驟而顯示的局部截面側面圖。
1‧‧‧複合基板
2‧‧‧切割裝置
3‧‧‧載板
3a、7a‧‧‧第1面(正面)
3b‧‧‧第2面(背面)
4‧‧‧工作夾台(第1保持組件、第1保持單元)
5‧‧‧暫時接著層
6‧‧‧框體
6a‧‧‧流路
7‧‧‧工件
8‧‧‧保持板
8a‧‧‧保持面
10‧‧‧閥
12‧‧‧吸引源

Claims (2)

  1. 一種載板的去除方法，是從隔著暫時接著層而設置於載板的正面的工件去除該載板，前述載板的去除方法之特徵在於具備有以下步驟： 第1保持步驟，以第1保持組件保持該載板並使該工件露出； 落差部形成步驟，在實施該第1保持步驟後，從該工件側沿著該載板的外周緣加工該載板，而在該載板的外周緣形成背面側比正面側更向外突出的落差部； 第2保持步驟，在實施該落差部形成步驟後，以第2保持組件保持該工件並使該載板露出；及 載板去除步驟，在實施該第2保持步驟後，以去除組件對該落差部施加力，而讓該載板朝從該工件離開的方向移動，藉此從該工件去除該載板。
  2. 如請求項1之載板的去除方法，其中在該載板去除步驟中是一邊以去除組件對該落差部施加力一邊對該工件與該載板之間噴附流體。
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