TWI789998B - 助焊劑及焊膏 - Google Patents

助焊劑及焊膏 Download PDF

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Publication number
TWI789998B
TWI789998B TW110142772A TW110142772A TWI789998B TW I789998 B TWI789998 B TW I789998B TW 110142772 A TW110142772 A TW 110142772A TW 110142772 A TW110142772 A TW 110142772A TW I789998 B TWI789998 B TW I789998B
Authority
TW
Taiwan
Prior art keywords
acid
mass
polyamide
flux
aforementioned
Prior art date
Application number
TW110142772A
Other languages
English (en)
Chinese (zh)
Other versions
TW202231399A (zh
Inventor
井上剣太
宮城奈菜子
永井智子
髙木和順
髙木晶子
Original Assignee
日商千住金屬工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2020210556A external-priority patent/JP6947998B1/ja
Application filed by 日商千住金屬工業股份有限公司 filed Critical 日商千住金屬工業股份有限公司
Publication of TW202231399A publication Critical patent/TW202231399A/zh
Application granted granted Critical
Publication of TWI789998B publication Critical patent/TWI789998B/zh

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613Polymers, e.g. resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • B23K35/025Pastes, creams, slurries
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362Selection of compositions of fluxes
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Polyamides (AREA)
TW110142772A 2020-11-18 2021-11-17 助焊劑及焊膏 TWI789998B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2020-192036 2020-11-18
JP2020192036 2020-11-18
JP2020210556A JP6947998B1 (ja) 2020-11-18 2020-12-18 フラックス及びソルダペースト
JP2020-210556 2020-12-18
JP2021-090226 2021-05-28
JP2021090226A JP7137097B2 (ja) 2020-11-18 2021-05-28 フラックス及びソルダペースト

Publications (2)

Publication Number Publication Date
TW202231399A TW202231399A (zh) 2022-08-16
TWI789998B true TWI789998B (zh) 2023-01-11

Family

ID=81708022

Family Applications (2)

Application Number Title Priority Date Filing Date
TW110142773A TWI800987B (zh) 2020-11-18 2021-11-17 助焊劑及焊膏
TW110142772A TWI789998B (zh) 2020-11-18 2021-11-17 助焊劑及焊膏

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW110142773A TWI800987B (zh) 2020-11-18 2021-11-17 助焊劑及焊膏

Country Status (7)

Country Link
US (2) US11986909B2 (fr)
EP (2) EP4230343A4 (fr)
KR (2) KR102645403B1 (fr)
CN (1) CN116419816B (fr)
MX (2) MX2023005577A (fr)
TW (2) TWI800987B (fr)
WO (2) WO2022107805A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6849934B1 (ja) * 2020-03-18 2021-03-31 千住金属工業株式会社 フラックス及びソルダペースト

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CN101905394A (zh) * 2009-06-03 2010-12-08 田村化研株式会社 焊接剂组合物
CN102170994A (zh) * 2008-10-02 2011-08-31 日本斯倍利亚社股份有限公司 助熔剂组合物以及焊膏组合物
CN104220210A (zh) * 2012-06-20 2014-12-17 富士电机株式会社 软钎焊用助焊剂及焊料组合物
WO2017065076A1 (fr) * 2015-10-14 2017-04-20 共栄社化学株式会社 Agent thixotrope et flux et pâte à braser contenant tous les deux celui-ci
CN106825995A (zh) * 2015-09-30 2017-06-13 株式会社田村制作所 助焊剂组合物和焊膏
TW201940276A (zh) * 2018-03-09 2019-10-16 日商歐利生電氣股份有限公司 助焊劑、焊膏、焊接製程、焊接製品的製造方法、bga封裝件的製造方法

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JPH0719932B2 (ja) 1989-04-12 1995-03-06 三菱電機株式会社 レーザダイオードモジュール
JP2974493B2 (ja) 1992-03-26 1999-11-10 共栄社化学株式会社 非水系塗料用流動調整剤
JP3350767B2 (ja) 1993-09-03 2002-11-25 ニホンハンダ株式会社 クリームはんだ
JPH10328882A (ja) 1997-06-03 1998-12-15 Matsushita Electric Ind Co Ltd クリームはんだ
JP4348169B2 (ja) 2003-11-18 2009-10-21 伊藤製油株式会社 ソルダーペースト用揺変性付与剤及びソルダーペースト
JP4962150B2 (ja) 2007-06-08 2012-06-27 荒川化学工業株式会社 ハンダ付け用フラックス組成物及びクリームハンダ組成物
JP2009154170A (ja) 2007-12-25 2009-07-16 Arakawa Chem Ind Co Ltd はんだ用フラックスおよびソルダーペースト
JP5486282B2 (ja) 2009-12-08 2014-05-07 荒川化学工業株式会社 はんだペースト用フラックス及びはんだペースト
JP5400606B2 (ja) 2009-12-29 2014-01-29 株式会社タムラ製作所 ソルダペーストおよびフラックス
CN102528326B (zh) 2010-09-24 2015-07-22 荒川化学工业株式会社 焊接用松香类焊剂以及焊料糊剂
JP5766668B2 (ja) 2012-08-16 2015-08-19 株式会社タムラ製作所 はんだ組成物およびそれを用いたプリント配線基板
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JP6660018B2 (ja) * 2016-07-28 2020-03-04 荒川化学工業株式会社 鉛フリーはんだペースト用フラックス及び鉛フリーはんだペースト
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CN108274155A (zh) 2018-04-17 2018-07-13 深圳市博士达焊锡制品有限公司 一种软钎焊用助焊剂及其制备方法以及一种焊锡膏
JP7084213B2 (ja) * 2018-06-08 2022-06-14 東洋スチレン株式会社 押出発泡用スチレン系樹脂組成物、発泡シート、容器、および板状発泡体
JP6913064B2 (ja) * 2018-09-13 2021-08-04 株式会社タムラ製作所 はんだ組成物および電子基板の製造方法
JP6851352B2 (ja) * 2018-09-20 2021-03-31 株式会社タムラ製作所 レーザーはんだ付け用はんだ組成物および電子基板
JP6575706B1 (ja) 2019-03-05 2019-09-18 千住金属工業株式会社 ソルダペースト
JP6575713B1 (ja) 2019-03-05 2019-09-18 千住金属工業株式会社 フラックス及びソルダペースト
JP7227490B2 (ja) 2019-05-27 2023-02-22 タイガー魔法瓶株式会社 炊飯器
JP6947998B1 (ja) 2020-11-18 2021-10-13 千住金属工業株式会社 フラックス及びソルダペースト

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102170994A (zh) * 2008-10-02 2011-08-31 日本斯倍利亚社股份有限公司 助熔剂组合物以及焊膏组合物
CN101905394A (zh) * 2009-06-03 2010-12-08 田村化研株式会社 焊接剂组合物
CN104220210A (zh) * 2012-06-20 2014-12-17 富士电机株式会社 软钎焊用助焊剂及焊料组合物
CN106825995A (zh) * 2015-09-30 2017-06-13 株式会社田村制作所 助焊剂组合物和焊膏
WO2017065076A1 (fr) * 2015-10-14 2017-04-20 共栄社化学株式会社 Agent thixotrope et flux et pâte à braser contenant tous les deux celui-ci
TW201940276A (zh) * 2018-03-09 2019-10-16 日商歐利生電氣股份有限公司 助焊劑、焊膏、焊接製程、焊接製品的製造方法、bga封裝件的製造方法

Also Published As

Publication number Publication date
EP4230343A4 (fr) 2024-05-01
WO2022107802A1 (fr) 2022-05-27
EP4230342A1 (fr) 2023-08-23
CN116419816A (zh) 2023-07-11
TWI800987B (zh) 2023-05-01
KR20230078816A (ko) 2023-06-02
MX2023005577A (es) 2023-05-29
MX2023005578A (es) 2023-05-29
EP4230342A4 (fr) 2024-05-01
TW202231399A (zh) 2022-08-16
US11986909B2 (en) 2024-05-21
KR102645403B1 (ko) 2024-03-11
CN116419816B (zh) 2024-04-30
TW202227557A (zh) 2022-07-16
US20230321768A1 (en) 2023-10-12
WO2022107805A1 (fr) 2022-05-27
EP4230343A1 (fr) 2023-08-23
KR102702012B1 (ko) 2024-09-04
US11986910B2 (en) 2024-05-21
US20230321767A1 (en) 2023-10-12
KR20230078829A (ko) 2023-06-02

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