TWI825752B - 助銲劑及銲膏 - Google Patents
助銲劑及銲膏 Download PDFInfo
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- TWI825752B TWI825752B TW111120085A TW111120085A TWI825752B TW I825752 B TWI825752 B TW I825752B TW 111120085 A TW111120085 A TW 111120085A TW 111120085 A TW111120085 A TW 111120085A TW I825752 B TWI825752 B TW I825752B
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
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Abstract
本發明係提供一種含有松脂、胺、有機磺酸、搖變劑及溶劑之助銲劑。
Description
本發明係關於一種助銲劑及銲膏。
本申請案係依據2021年5月31日向日本提出申請之特願2021-091197號主張優先権,且在此援用其內容。
使用於銲接之助銲劑係具有下列功效:化學去除作為銲接對象的接合對象物之金屬表面及銲料的金屬氧化物,並在兩者之邊界可使金屬元素移動。因此,藉由使用助銲劑而進行銲接,以在兩者之間形成金屬間化合物,可獲得牢固的接合。如此的助銲劑一般係包含樹脂成分、溶劑、活性劑、搖變劑等。
銲膏係使銲料合金之粉末與助銲劑混合所得到的複合材料。使用銲膏之銲接中,首先於基板印刷銲膏之後,搭載元件,再以被稱為回銲爐之加熱爐,加熱搭載元件之基板。
電子零件回銲用基板之電極依照用途,有時會施予NiAu鍍敷、Cu-Organic Solderability Preservative(Cu-OSP)處理、Sn鍍敷等之各種的表面處理。在助銲劑及銲膏中,對於經施予此等各種之表面處理的任一電極,亦期望發揮良好的潤濕性。
助銲劑及銲膏係藉由含有活性劑,發揮潤濕性。例如,在專利文獻1中,已記載含有對甲苯磺酸作為活性劑之助銲劑。
[先前技術文獻]
[專利文獻]
[專利文獻1]日本特表平8-503168號公報
然而,在專利文獻1記載之助銲劑係經施予各種之表面處理的電極之中,依據表面處理之種類,亦有無法發揮良好的潤濕性之情形。
此外,在回銲處理中,在助銲劑所含的水分、經氣體化之助銲劑等有時在接合部會形成孔洞。孔洞係降低藉由銲接回銲的元件之可靠性。
在基板之兩面回銲電子元件、或者在多層基板回銲電子元件時,係進行複數次之回銲。藉由複數次之回銲,有時在接合部容易形成孔洞。
因此,本發明之目的在於提供一種助銲劑及銲膏,該助銲劑係可對於經施予各種之表面處理的電極提高潤濕性,且即使經過複數次之回銲後,亦可抑制孔洞之發生。
本發明係包含以下之態樣。
[1]一種助銲劑,係含有松脂、胺、有機磺酸、搖變劑及溶劑。
[2]如[1]所述之助銲劑,其中,前述有機磺酸係選自由烷磺酸、烷醇磺酸及芳香族磺酸所組成的群組中之1種以上。
[3]如[2]所述之助銲劑,其中,前述有機磺酸係選自由對甲苯磺酸及甲烷磺酸所組成的群組中之1種以上。
[4]如[1]至[4]中之任一項所述之助銲劑,其中,前述胺係選自由松脂胺、唑類及胍類所組成的群組中之1種以上。
[5]一種銲膏,係含有銲料合金粉末、及[1]至[4]中任一項所述之助銲劑。
[6]一種助銲劑,係含有松脂、松脂胺、1種以上的有機磺酸、搖變劑及溶劑,該1種以上的有機磺酸係選自由烷磺酸、烷醇磺酸及芳香族磺酸所組成的群組,其中,相對於助銲劑之總量(100質量%),前述松脂之含量為5質量%以上50質量%以下,相對於助銲劑之總量(100質量%),前述松脂胺之含量為5質量%以上30質量%以下,相對於助銲劑之總量(100質量%),前述有機磺酸之含量為0.2質量%以上10質量%以下,前述松脂胺之含量相對於前述有機磺酸之含量的比例(質量比)為3.33以上10以下。
[7]一種助銲劑,係含有松脂、唑類、1種以上的有機磺酸、搖變劑及溶劑,該1種以上的有機磺酸係選自由烷磺酸、烷醇磺酸及芳香族磺酸所組成的群組,其中,相對於助銲劑之總量(100質量%),前述松脂之含量為5質量%以上50質量%以下,相對於助銲劑之總量(100質量%),前述唑類之含量為1質量%以上10質量%以下,相對於助銲劑之總量(100
質量%),前述有機磺酸之含量為0.2質量%以上10質量%以下,前述唑類之含量相對於前述有機磺酸之含量的比例(質量比)為1以上3以下。
[8]一種助銲劑,係含有松脂、胍類、1種以上的有機磺酸、搖變劑及溶劑,該1種以上的有機磺酸係選自由烷磺酸、烷醇磺酸及芳香族磺酸所組成的群組,其中,相對於助銲劑之總量(100質量%),前述松脂之含量為5質量%以上50質量%以下,相對於助銲劑之總量(100質量%),前述胍類之含量為2質量%以上20質量%以下,相對於助銲劑之總量(100質量%),前述有機磺酸之含量為0.2質量%以上10質量%以下,前述胍類之含量相對於前述有機磺酸之含量的比例(質量比)為1.66以上5以下。
[9]如[6]至[8]中任一項所述之助銲劑,其中,前述有機磺酸係選自由對甲苯磺酸及甲烷磺酸所組成的群組中之1種以上。
[10]一種銲膏,係含有銲料合金粉末、及[6]至[9]中任一項所述之助銲劑。
若依據本發明,可提供一種助銲劑及銲膏,該助銲劑係可對於經施予各種之表面處理的電極提高潤濕性,且即使經過複數次之回銲後,亦可抑制孔洞之發生。
圖1係在實施例中之潤濕性及孔洞發生的評估中,顯示回銲時之溫度變化的圖表。
圖2對於經施予NiAu鍍敷之基板、Cu-OSP處理玻璃環氧基板、及經施予Sn鍍敷的基板印刷銲膏,顯示回銲後之基板的潤濕之狀態的照片及潤濕之判定基準的圖。
(助銲劑)
本實施型態之助銲劑係含有松脂、胺、有機磺酸、搖變劑及溶劑。
<松脂>
在本發明中,所謂「松脂」係包含:以松脂酸作為主成分之包含松脂酸與其異構物的混合物之天然樹脂、及使天然樹脂經化學修飾而成者(有時稱為松脂衍生物)。
天然樹脂中之松脂酸的含量,就一例而言為40質量%以上80質量%以下。
在本說明書中,所謂「主成分」係指構成化合物之成分中,其化合物中之含量為40質量%以上之成分。
松脂酸之異構物的代表性者,可列舉新松脂酸、長葉松酸(Palustric acid)、左旋海松酸(Levopimaric acid)等。將松脂酸之結構表示於以下。
前述「天然樹脂」例如可列舉樹膠松脂、木材松脂及妥爾油松脂等。
在本發明中所謂「使天然樹脂經化學修飾而成者(松脂衍生物)」係包含對於前述「天然樹脂」施予選自由氫化、脫氫化、中和、環氧烷加成、醯胺化、二聚物化及多聚物化、酯化以及Diels-Alder環化加成所組成的群組中之1種以上之處理而成者。
松脂衍生物例如可列舉純化松脂、改性松脂等。
改性松脂可列舉氫化松脂、聚合松脂、聚合氫化松脂、歧化松脂、酸改性松脂、松脂酯、酸改性氫化松脂、酸酐改性氫化松脂、酸改性歧化松脂、酸酐改性歧化松脂、酚改性松脂及α,β不飽和羧酸改性物(丙烯酸化松脂、馬來酸化松脂、富馬酸化松脂等)、以及該聚合松脂之純化物、氫化物及歧化物、以及該α,β不飽和羧酸改性物之純化物、氫化物及歧化物、松脂醇、氫化松脂醇、松脂酯、氫化松脂酯、松脂皂、氫化松脂皂、酸改性松脂皂等。
在本說明書中,松脂係不包含松脂胺。
松脂係可單獨使用1種,亦可混合2種以上而使用。
在上述之中,前述松脂衍生物較佳係使用選自由酸改性氫化松脂及松脂酯所組成的群組中之1種以上。
前述酸改性氫化松脂係以使用丙烯酸改性氫化松脂為較佳。
前述助銲劑中,相對於前述助銲劑之總量(100質量%),前述松脂的含量係以5質量%以上50質量%以下為較佳,以10質量%以上45質量%以下為更佳,以15質量%以上40質量%以下為再更佳。
<胺>
胺例如可列舉松脂胺、唑類、胍類、烷基胺化合物、胺基醇化合物等。
松脂胺例如可列舉脫氫松香胺、二氫松香胺等。
松脂胺係可單獨使用1種,亦可混合2種以上而使用。
松脂胺係意指所謂之歧化松脂胺。
將脫氫松香胺、二氫松香胺之各結構表示於以下。
唑類例如可列舉2-甲基咪唑、2-乙基咪唑、2-十一烷基咪唑、2-十七烷基咪唑、1,2-二甲基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、2-苯基-4-甲基咪唑、1-苯甲基-2-甲基咪唑、1-苯甲基-2-苯基咪唑、1-氰乙基-2-甲基咪唑、1-氰乙基-2-十一烷基咪唑、1-氰乙基-2-乙基-4-甲基咪唑、1-氰乙基-2-苯基咪唑、1-氰乙基-2-十一烷基咪唑鎓偏苯三甲酸酯、
1-氰乙基-2-苯基咪唑鎓偏苯三甲酸酯、2,4-二胺基-6-[2’-甲基咪唑基-(1’)]-乙基-s-三嗪、2,4-二胺基-6-[2’-十一烷基咪唑基-(1’)]-乙基-s-三嗪、2,4-二胺基-6-[2’-乙基-4’-甲基咪唑基-(1’)]-乙基-s-三嗪、2,4-二胺基-6-[2’-甲基咪唑基-(1’)]-乙基-s-三嗪異三聚氰酸加成物、2-苯基咪唑異三聚氰酸加成物、2-苯基-4,5-二羥基甲基咪唑、2-苯基-4-甲基-5-羥基甲基咪唑、2,3-二氫-1H-吡咯[1,2-a]苯并咪唑、1-十二烷基-2-甲基-3-苯甲基咪唑鎓氯化物、2-甲基咪唑啉、2-苯基咪唑啉、2,4-二胺基-6-乙烯基-s-三嗪、2,4-二胺基-6-乙烯基-s-三嗪異三聚氰酸加成物、2,4-二胺基-6-甲基丙烯醯氧基乙基-s-三嗪、環氧基-咪唑加成物、2-甲基苯并咪唑、2-辛基苯并咪唑、2-戊基苯并咪唑、2-(1-乙基戊基)苯并咪唑、2-壬基苯并咪唑、2-(4-噻唑基)苯并咪唑、苯并咪唑、1,2,4-三唑、2-(2’-羥基-5’-甲基苯基)苯并三唑、2-(2’-羥基-3’-第三丁基-5’-甲基苯基)-5-氯苯并三唑、2-(2’-羥基-3’,5’-二-第三戊基苯基)苯并三唑、2-(2’-羥基-5’-第三辛基苯基)苯并三唑、2,2’-亞甲基雙[6-(2H-苯并三唑-2-基)-4-第三辛基酚]、6-(2-苯并三唑基)-4-第三辛基-6’-第三丁基-4’-甲基-2,2’-亞甲基雙酚、1,2,3-苯并三唑、1-[N,N-雙(2-乙基己基)胺基甲基]苯并三唑、羧基苯并三唑、1-[N,N-雙(2-乙基己基)胺基甲基]甲基苯并三唑、2,2’-[[(甲基-1H-苯并三唑-1-基)甲基]亞胺基]雙乙醇、1-(1’,2’-二羧基乙基)苯并三唑、1-(2,3-二羧基丙基)苯并三唑、1-[(2-乙基己基胺基)甲基]苯并三唑、2,6-雙[(1H-苯并三唑-1-基)甲基]-4-甲基酚、5-甲基苯并三唑、5-苯基四唑等。
胍類例如可列舉1,3-二苯基胍、1,3-二-鄰甲苯基胍、1-鄰甲苯基雙胍、1,3-二-鄰異丙苯基胍、1,3-二-鄰異丙苯基-2-丙醯基胍等。
烷基胺化合物例如可列舉乙基胺、三乙基胺、乙二胺、三乙四胺、環己基胺、十六烷基胺、硬脂基胺等。
胺基醇化合物例如可列舉N,N,N’,N’-肆(2-羥基丙基)乙二胺等。
胺係可單獨使用1種,亦可混合2種以上而使用。
上述之中,前述胺較佳係含有選自由松脂胺、唑類及胍類所組成的群組中之1種以上,更佳係選自由松脂胺及唑類所組成的群組中之1種以上,再更佳係含有唑類。
前述唑類較佳係選自由2-乙基咪唑及2-苯基-4-甲基咪唑所組成的群組中之1種以上。
前述胍類係以二甲苯基胍為較佳。
在前述助銲劑中,相對於前述助銲劑之總量(100質量%),前述胺之合計的含量係以1質量%以上30質量%以下為較佳,以2質量%以上20質量%以下為更佳,以3質量%以上15質量%以下為再更佳,以3質量%以上10質量%以下為特別佳。
藉由前述胺之含量為前述範圍內,可使對於經施予各種之表面處理的電極之潤濕性形成為更優異者。
前述助銲劑為含有唑類時,在前述助銲劑中,相對於前述助銲劑之總量(100質量%),前述唑類之含量係以1質量%以上10質量%以
下為較佳,以2質量%以上8質量%以下為更佳,以3質量%以上6質量%以下為再更佳。
藉由前述唑類之含量為前述範圍內,可使對於經施予各種之表面處理的電極之潤濕性形成為更優異者。
前述助銲劑為包含唑類時,在前述助銲劑中,前述唑類之含量相對於有機磺酸之含量的比例(質量比)係以0.3以上10以下為較佳,以1以上3以下為更佳。
前述助銲劑為包含松脂胺時,在前述助銲劑中,相對於前述助銲劑之總量(100質量%),前述松脂胺之含量係以5質量%以上30質量%以下為較佳,以7質量%以上20質量%以下為更佳,以10質量%以上15質量%以下為再更佳。
藉由前述松脂胺之含量為前述範圍內,可使對於經施予各種之表面處理的電極之潤濕性形成為更優異者。
前述助銲劑為包含松脂胺時,在前述助銲劑中,前述松脂胺之含量相對於有機磺酸之含量的比例(質量比)係以1以上20以下為較佳,以2以上10以下為更佳,以3.33以上10以下為再更佳。
前述助銲劑為包含胍類時,在前述助銲劑中,相對於前述助銲劑之總量(100質量%),前述胍類之含量係以2質量%以上20質量%以下為較佳,以3質量%以上15質量%以下為更佳,以5質量%以上10質量%以下為再更佳。
藉由前述胍類之含量為前述範圍內,可使對於經施予各種之表面處理的電極之潤濕性形成為更優異者。
前述助銲劑為包含胍類時,在前述助銲劑中,前述胍類之含量相對於有機磺酸之含量的比例(質量比)係以0.5以上10以下為較佳,以1以上5以下為更佳,以1.66以上5以下為再更佳。
<有機磺酸>
有機磺酸例如可列舉脂肪族磺酸、芳香族磺酸等。脂肪族磺酸例如可列舉烷磺酸、烷醇磺酸等。
烷磺酸例如可列舉甲烷磺酸、乙烷磺酸、1-丙烷磺酸、2-丙烷磺酸、1-丁烷磺酸、2-丁烷磺酸、戊烷磺酸、己烷磺酸、癸烷磺酸、十二烷磺酸等。
烷醇磺酸例如可列舉2-羥基乙烷-1-磺酸、2-羥基丙烷-1-磺酸、2-羥基丁烷-1-磺酸、2-羥基戊烷-1-磺酸、1-羥基丙烷-2-磺酸、3-羥基丙烷-1-磺酸、4-羥基丁烷-1-磺酸、2-羥基己烷-1-磺酸、2-羥基癸烷-1-磺酸及2-羥基十二烷-1-磺酸等。
芳香族磺酸例如可列舉1-萘磺酸、2-萘磺酸、對甲苯磺酸、二甲苯磺酸、對酚磺酸、甲酚磺酸、磺基水楊酸、硝基苯磺酸、磺基苯甲酸及二苯基胺-4-磺酸等。
有機磺酸係可單獨使用1種,亦可混合2種以上而使用。
前述有機磺酸較佳係含有芳香族磺酸。
芳香族磺酸係以對甲苯磺酸為較佳。
脂肪族磺酸係以烷磺酸為較佳。
烷磺酸係以甲烷磺酸為較佳。
在前述助銲劑中,相對於前述助銲劑之總量(100質量%),前述有機磺酸之含量係以0.2質量%以上10質量%以下為較佳,以0.5質量%以上5質量%以下為更佳,以0.5質量%以上3質量%以下為再更佳,以1質量%以上3質量%以下為特別佳。
藉由前述有機磺酸之含量為前述範圍內以上,可對於經施予各種之表面處理的電極提高潤濕性,且即使經過複數次之回銲後,亦可抑制孔洞之發生。
<搖變劑>
搖變劑例如可列舉酯系搖變劑、醯胺系搖變劑、山梨醇系搖變劑等。
酯系搖變劑例如可列舉酯化合物,具體而言,可列舉氫化蓖麻油、肉豆蔻酸乙酯等。
醯胺系搖變劑例如可列舉:單醯胺、雙醯胺、聚醯胺,具體而言,可列舉月桂醯胺、棕櫚醯胺、硬脂醯胺、二十二烷醯胺、羥基硬脂醯胺、飽和脂肪醯胺、油醯胺、芥子醯胺、不飽和脂肪醯胺、4-甲基苯并醯胺(對甲苯醯胺)、對甲苯甲烷醯胺、芳香族醯胺、六亞甲基羥基硬脂醯胺、取代醯胺、羥甲基硬脂醯胺、羥甲基醯胺、脂肪酸酯醯胺等之單醯胺;亞甲基雙硬脂醯胺、伸乙基雙月桂醯胺、伸乙基雙羥基脂肪酸(脂肪酸之碳數C6至24)醯胺、伸乙基雙羥基硬脂醯胺、飽和脂肪雙醯胺、亞甲基雙油醯胺、不飽和脂肪雙醯胺、間伸二甲苯基雙硬脂醯胺、芳香族雙醯胺等之雙醯胺;飽和脂肪酸聚醯胺、不飽和脂肪酸聚醯胺、芳香族聚醯胺、1,2,3-丙烷三羧酸參(2-甲基環己基醯胺)、環狀醯胺寡聚物、非環狀醯胺寡聚物等之聚醯胺。
前述環狀醯胺寡聚物係可列舉二羧酸與二胺經聚縮合成環狀之醯胺寡聚物、三羧酸與二胺經聚縮合成環狀之醯胺寡聚物、二羧酸與三胺經聚縮合成環狀之醯胺寡聚物、三羧酸與三胺經聚縮合成環狀之醯胺寡聚物、二羧酸及三羧酸與二胺經聚縮合成環狀之醯胺寡聚物、二羧酸及三羧酸與三胺經聚縮合成環狀之醯胺寡聚物、二羧酸與二胺及三胺經聚縮合成環狀之醯胺寡聚物、三羧酸與二胺及三胺經聚縮合成環狀之醯胺寡聚物、二羧酸及三羧酸與二胺及三胺經聚縮合成環狀之醯胺寡聚物等。
又,前述非環狀醯胺寡聚物係可列舉單羧酸與二胺及/或三胺經聚縮合成非環狀之醯胺寡聚物之情形、二羧酸及/或三羧酸與單胺經聚縮合成非環狀之醯胺寡聚物之情形等。若為含有單羧酸或單胺之醯胺寡聚物,單羧酸、單胺發揮作為終端分子(terminal molecules)功能,成為縮減分子量之非環狀醯胺寡聚物。又,二羧酸及/或三羧酸、與二胺及/或三胺經聚縮合成非環狀之醯胺化合物時,非環狀醯胺寡聚物係成為非環狀高分子系醯胺聚合物。再者,非環狀醯胺寡聚物亦包含單羧酸與單胺經聚縮合成非環狀之醯胺寡聚物。
山梨醇系搖變劑例如可列舉二苯亞甲基-D-山梨醇、雙(4-甲基苯亞甲基)-D-山梨醇、(D-)山梨醇、單苯亞甲基(-D-)山梨醇、單(4-甲基苯亞甲基)-(D-)山梨醇等。
搖變劑係可單獨使用1種,亦可混合2種以上而使用。
前述搖變劑較佳係含有酯系搖變劑。
前述酯系搖變劑較佳係含有氫化蓖麻油。
在前述助銲劑中,相對於前述助銲劑之總量(100質量%),前述搖變劑之含量係以3質量%以上20質量%以下為較佳,以5質量%以上15質量%以下為更佳,以7質量%以上10質量%以下為再更佳。
<溶劑>
溶劑例如可列舉水、醇系溶劑、甘醇醚系溶劑、萜烯醇類等。
醇系溶劑例如可列舉異丙基醇、1,2-丁二醇、異茨基環己醇、2,4-二乙基-1,5-庚二醇、2,2-二甲基-1,3-丙二醇、2,5-二甲基-2,5-己二醇、2,5-二甲基-3-己炔-2,5-二醇、2,3-二甲基-2,3-丁二醇、2-甲基戊烷-2,4-二醇、1,1,1-參(羥基甲基)丙烷、2-乙基-2-羥基甲基-1,3-丙二醇、2,2’-氧雙(亞甲基)雙(2-乙基-1,3-丙二醇)、2,2-雙(羥基甲基)-1,3-丙二醇、1,2,6-三羥基己烷、1-乙炔基-1-環己醇、1,4-環己二醇、1,4-環己烷二甲醇、2,4,7,9-四甲基-5-癸炔-4,7-二醇等。
甘醇醚系溶劑例如可列舉二乙二醇單-2-乙基己基醚、乙二醇單苯基醚、二乙二醇單己基醚(己二醇)、二乙二醇二丁基醚、三乙二醇單丁基醚、甲基丙三醇、丁基丙三醇、三乙二醇丁基甲基醚、四乙二醇二甲基醚等。
溶劑係可單獨使用1種,亦可混合2種以上而使用。
前述溶劑較佳係包含甘醇醚系溶劑。
前述甘醇醚系溶劑較佳係包含己二醇。
在前述助銲劑中,相對於前述助銲劑之總量(100質量%),前述溶劑之合計的含量係以40質量%以上80質量%以下為較佳,以40質量%以上75質量%以下為更佳,以50質量%以上75質量%以下為再更佳。
<其他之成分>
在本實施型態中之助銲劑係除了松脂、胺、有機磺酸、搖變劑及溶劑以外,尚可依需要而含有其他成分。
其他成分係可列舉胺及有機磺酸以外之活性劑、松脂以外之樹脂成分、金屬非活性化劑、界面活性劑、矽烷偶合劑、抗氧化劑、著色劑等。
胺及有機磺酸以外之活性劑例如可列舉其他之有機酸系活性劑(亦即,有機磺酸以外之有機酸)、鹵素系活性劑等。
其他之有機酸系活性劑:
其他之有機酸系活性劑例如可列舉羧酸等。
羧酸例如可列舉脂肪族羧酸、芳香族羧酸等。
有機酸系活性劑例如可列舉草酸、丙二酸、琥珀酸、戊二酸、己二酸、壬二酸、二十烷二酸、水楊酸、吡啶二甲酸、二丁基苯胺二甘醇酸、辛二酸、癸二酸、對苯二甲酸、十二烷二酸、對羥基苯基乙酸、吡啶甲酸、苯基琥珀酸、鄰苯二甲酸、月桂酸、苯甲酸、酒石酸、異三聚氰酸參(2-羧基乙基)、1,3-環己烷二羧酸、2,2-雙(羥基甲基)丙酸、2,2-雙(羥基甲基)丁烷酸、2,3-二羥基苯甲酸、2,4-二乙基戊二酸、2-喹啉羧酸、3-羥基苯甲酸、對大茴香酸、硬脂酸、12-羥基硬脂酸、油酸、亞麻油酸、次亞麻油酸、肉豆蔻酸、棕櫚酸、庚二酸、己酸、庚酸、壬酸、異壬酸、癸酸、癸烯酸、十一烷酸、月桂酸、十二烯酸、十三烷酸、肉豆蔻油酸、十五烷酸、異棕櫚酸、棕櫚油酸、十六碳三烯酸、大風子油酸(Hydnocarpic acid)、人造奶油酸、異硬脂酸、反式油酸、6-十八烯酸、十八碳四烯酸、油硬脂酸(Eleostearic acid)、6-十八炔酸、牛油酸、蓖麻油酸、環氧油酸(Vernolic acid)、蘋婆酸(Sterculynic acid)、十九烷酸、二十烷酸、二聚物酸、三聚物酸、在二聚
物酸中添加有氫之氫化物亦即氫化二聚物酸、在三聚物酸中添加有氫之氫化物亦即氫化三聚物酸等。
二聚物酸、三聚物酸例如可列舉屬於油酸與亞麻油酸之反應物的二聚物酸、屬於油酸與亞麻油酸之反應物的三聚物酸、屬於丙烯酸之反應物的二聚物酸、屬於丙烯酸之反應物的三聚物酸、屬於甲基丙烯酸之反應物的二聚物酸、屬於甲基丙烯酸之反應物的三聚物酸、屬於丙烯酸與甲基丙烯酸之反應物的二聚物酸、屬於丙烯酸與甲基丙烯酸之反應物的三聚物酸、屬於油酸之反應物的二聚物酸、屬於油酸之反應物的三聚物酸、屬於亞麻油酸之反應物的二聚物酸、屬於亞麻油酸之反應物的三聚物酸、屬於次亞麻油酸之反應物的二聚物酸、屬於次亞麻油酸之反應物的三聚物酸、屬於丙烯酸與油酸之反應物的二聚物酸、屬於丙烯酸與油酸之反應物的三聚物酸、屬於丙烯酸與亞麻油酸之反應物的二聚物酸、屬於丙烯酸與亞麻油酸之反應物的三聚物酸、屬於丙烯酸與次亞麻油酸之反應物的二聚物酸、屬於丙烯酸與次亞麻油酸之反應物的三聚物酸、屬於甲基丙烯酸與油酸之反應物的二聚物酸、屬於甲基丙烯酸與油酸之反應物的三聚物酸、屬於甲基丙烯酸與亞麻油酸之反應物的二聚物酸、屬於甲基丙烯酸與亞麻油酸之反應物的三聚物酸、屬於甲基丙烯酸與次亞麻油酸之反應物的二聚物酸、屬於甲基丙烯酸與次亞麻油酸之反應物的三聚物酸、屬於油酸與次亞麻油酸之反應物的二聚物酸、屬於油酸與次亞麻油酸之反應物的三聚物酸、屬於亞麻油酸與次亞麻油酸之反應物的二聚物酸、屬於亞麻油酸與次亞麻油酸之反應物的三聚物酸、屬於上述的各二聚物酸之氫化物的氫化二聚物酸、屬於上述的各三聚物酸之氫化物的氫化三聚物酸等。
例如,屬於油酸與亞麻油酸之反應物的二聚物酸係碳數為36之二聚物。又,屬於油酸與亞麻油酸之反應物的三聚物酸係碳數為54之三聚物。
其他之有機酸系活性劑係可單獨使用1種,亦可混合2種以上而使用。
其他之有機酸系活性劑係以羧酸為較佳。
羧酸係以脂肪族羧酸為較佳。
脂肪族羧酸係以脂肪族二羧酸為較佳。
脂肪族二羧酸係以己二酸為較佳。
在前述助銲劑中,相對於前述助銲劑之總量(100質量%),其他之有機酸系活性劑之含量係以0質量%以上10質量%以下為較佳,以0質量%以上5質量%以下為更佳,以0質量%以上3質量%以下為再更佳。
藉由其他之有機酸系活性劑的含量為上述範圍內,即使經過複數次之回銲後,亦容易抑制孔洞之發生。
鹵素系活性劑:
鹵素系活性劑例如可列舉胺氫鹵酸鹽、胺氫鹵酸鹽以外之有機鹵素化合物等。
胺氫鹵酸鹽係使胺與鹵化氫反應而成的化合物。
在此之胺係可列舉脂肪族胺、唑類、胍類等。鹵化氫例如可列舉氯、溴、碘之氫化物。
脂肪族胺例如可列舉乙基胺、二乙基胺、三乙基胺、乙二胺等。
胍類及唑類係可列舉在<胺>中所敘述者。
更具體而言,胺氫鹵酸鹽例如可列舉環己基胺氫溴酸鹽、十六烷基胺氫溴酸鹽、硬脂基胺氫溴酸鹽、乙基胺氫溴酸鹽、二苯基胍氫溴酸鹽、乙基胺鹽酸鹽、硬脂基胺鹽酸鹽、二乙基苯胺鹽酸鹽、二乙醇胺鹽酸鹽、2-乙基己基胺氫溴酸鹽、吡啶氫溴酸鹽、異丙基胺氫溴酸鹽、二乙基胺氫溴酸鹽、二甲基胺氫溴酸鹽、二甲基胺鹽酸鹽、松脂胺氫溴酸鹽、2-乙基己基胺鹽酸鹽、異丙基胺鹽酸鹽、環己基胺鹽酸鹽、2-哌啶甲酸氫溴酸鹽、1,3-二苯基胍鹽酸鹽、二甲基苯甲基胺鹽酸鹽、肼水合物氫溴酸鹽、二甲基環己基胺鹽酸鹽、三壬基胺氫溴酸鹽、二乙基苯胺氫溴酸鹽、2-二乙基胺基乙醇氫溴酸鹽、2-二乙基胺基乙醇鹽酸鹽、氯化銨、二烯丙基胺鹽酸鹽、二烯丙基胺氫溴酸鹽、二乙基胺鹽酸鹽、三乙基胺氫溴酸鹽、三乙基胺鹽酸鹽、肼一鹽酸鹽、肼二鹽酸鹽、肼一氫溴酸鹽、肼二氫溴酸鹽、吡啶鹽酸鹽、苯胺氫溴酸鹽、丁基胺鹽酸鹽、己基胺鹽酸鹽、正辛基胺鹽酸鹽、十二烷基胺鹽酸鹽、二甲基環己基胺氫溴酸鹽、乙二胺二氫溴酸鹽、松脂胺氫溴酸鹽、2-苯基咪唑氫溴酸鹽、4-苯甲基吡啶氫溴酸鹽、L-麩胺酸鹽酸鹽、N-甲基嗎福林鹽酸鹽、甜菜鹼鹽酸鹽、2-哌啶甲酸氫碘酸鹽、環己基胺氫碘酸鹽、1,3-二苯基胍氫氟酸鹽、二乙基胺氫氟酸鹽、2-乙基己基胺氫氟酸鹽酸鹽、環己基胺氫氟酸鹽酸鹽、乙基胺氫氟氟酸鹽酸鹽、松脂胺氫氟酸鹽、環己基胺四氟硼酸鹽、及二環己基胺四氟硼酸鹽等。
又,鹵素系活性劑例如,亦可使用使胺與四氟硼酸(HBF4)反應而成之鹽、使胺與三氟化硼(BF3)反應而成之錯合物。
前述錯合物例如可列舉三氟化硼哌啶等。
胺氫鹵酸鹽以外之有機鹵素化合物例如可列舉反式-2,3-二溴-2-丁烯-1,4-二醇、三烯丙基三聚異氰酸酯六溴化物、異三聚氰酸參-(2,3-二溴丙基)、1-溴-2-丁醇、1-溴-2-丙醇、3-溴-1-丙醇、3-溴-1,2-丙二醇、1,4-二溴-2-丁醇、1,3-二溴-2-丙醇、2,3-二溴-1-丙醇、2,3-二溴-2-丁烯-1,4-二醇等。
又,胺氫鹵酸鹽以外之有機鹵素化合物亦可列舉鹵化羧基化合物,例如可列舉:2-碘苯甲酸、3-碘苯甲酸、2-碘丙酸、5-碘水楊酸、5-碘蒽酸等之碘化羧基化合物;2-氯苯甲酸、3-氯丙酸等之氯化羧基化合物;2,3-二溴丙酸、2,3-二溴琥珀酸、2-溴苯甲酸等之溴化羧基化合物等。
鹵素系活性劑係可單獨使用1種,亦可混合2種以上而使用。
鹵素系活性劑係以胺氫鹵酸鹽為較佳。
胺氫鹵酸鹽較佳係使胍類與鹵化氫反應而成之化合物。
使胍類與鹵化氫反應而成之化合物較佳係使二苯基胍與鹵化氫反應而成之化合物。
使二苯基胍與鹵化氫反應而成之化合物較佳係二苯基胍氫溴酸鹽。
在前述助銲劑中,相對於前述助銲劑之總量(100質量%),前述鹵素系活性劑之含量係以0質量%以上5質量%以下為較佳,以0.2質量%以上3質量%以下為更佳,以0.5質量%以上2質量%以下為再更佳。
松脂系樹脂以外之樹脂成分:
松脂系樹脂以外之樹脂成分例如可列舉萜烯樹脂、改性萜烯樹脂、萜烯酚樹脂、改性萜烯酚樹脂、苯乙烯樹脂、改性苯乙烯樹脂、二甲苯樹脂、
改性二甲苯樹脂、丙烯酸樹脂、聚乙烯樹脂、丙烯酸-聚乙烯共聚合樹脂、環氧樹脂等。
改性萜烯樹脂可列舉芳香族改性萜烯樹脂、氫化萜烯樹脂、氫化芳香族改性萜烯樹脂等。改性萜烯酚樹脂可列舉氫化萜烯酚樹脂等。改性苯乙烯樹脂可列舉苯乙烯丙烯酸樹脂、苯乙烯馬來酸樹脂等。改性二甲苯樹脂可列舉酚改性二甲苯樹脂、烷基酚改性二甲苯樹脂、酚改性可溶酚醛樹脂型二甲苯樹脂、多元醇改性二甲苯樹脂、聚氧乙烯加成二甲苯樹脂等。
金屬非活性化劑:
金屬非活性化劑例如可列舉阻酚系化合物、氮化合物等。
在此所謂之「金屬非活性化劑」係指具有防止金屬因與某種化合物接觸而劣化之功能的化合物。
所謂阻酚系化合物係指在酚之鄰位的至少一者具有體積龐大之取代基(例如第三丁基等之分支狀或環狀烷基)的酚系化合物。
阻酚系化合物並無特別限定,例如可列舉雙[3-(3-第三丁基-4-羥基-5-甲基苯基)丙酸][伸乙基雙(氧基伸乙基)]、N,N’-六亞甲基雙[3-(3,5-二-第三丁基-4-羥基苯基)丙烷醯胺]、1,6-己二醇雙[3-(3,5-二-第三丁基-4-羥基苯基)丙酸酯]、2,2’-亞甲基雙[6-(1-甲基環己基)-對甲酚]、2,2’-亞甲基雙(6-第三丁基-對甲酚)、2,2’-亞甲基雙(6-第三丁基-4-乙基酚)、三乙二醇-雙[3-(3-第三丁基-5-甲基-4-羥基苯基)丙酸酯]、1,6-己二醇-雙-[3-(3,5-二-第三丁基-4-羥基苯基)丙酸酯]、2,4-雙-(正辛基硫)-6-(4-羥基-3,5-二-第三丁基苯胺基)-1,3,5-三嗪、新戊四醇基-肆[3-(3,5-二-第三丁基-4-羥基苯基)丙酸酯]、2,2-硫-二伸乙基雙[3-(3,5-二-第三丁基-4-
羥基苯基)丙酸酯]、十八烷基-3-(3,5-二-第三丁基-4-羥基苯基)丙酸酯、N,N’-六亞甲基雙(3,5-二-第三丁基-4-羥基-氫桂皮醯胺)、3,5-二-第三丁基-4-羥基苯甲基膦酸酯-二乙基酯、1,3,5-三甲基-2,4,6-參(3,5-二-第三丁基-4-羥基苯甲基)苯、N,N’-雙[2-[2-(3,5-二-第三丁基-4-羥基苯基)乙基羰基氧]乙基]草醯胺、以下述化學式所示之化合物等。
(式中,Z係可被取代之伸烷基。R1及R2係分別獨立地為可被取代之烷基、芳烷基、芳基、雜芳基、環烷基或雜環烷基。R3及R4係分別獨立地為可被取代之烷基。)
在金屬非活性化劑中之氮化合物例如可列舉醯肼(hydrazide)系氮化合物、醯胺系氮化合物、三唑系氮化合物、三聚氰胺系氮化合物等。
醯肼系氮化合物只要為具有醯肼骨架之氮化合物即可,可列舉十二烷二酸雙[N2-(2-羥基苯甲醯基)醯肼]、N,N’-雙[3-(3,5-二-第三丁基-4-羥基苯基)丙醯基]肼、癸烷二羧酸二水楊醯基醯肼、N-亞水楊基-N’-水楊醯肼、間硝基苯并醯肼、3-胺基鄰苯二甲醯肼、鄰苯二甲二醯肼、己二醯肼、草雙(2-羥基-5-辛基苯亞甲基醯肼)、N’-苯甲醯基吡咯啶酮羧醯肼、N,N’-雙(3-(3,5-二-第三丁基-4-羥基苯基)丙醯基)肼等。
醯胺系氮化合物只要為具有醯胺骨架之氮化合物即可,可列舉N,N’-雙{2-[3-(3,5-二-第三丁基-4-羥基苯基)丙醯基氧自由基]乙基}草醯胺等。
三唑系氮化合物只要為具有三唑骨架之氮化合物即可,可列舉N-(2H-1,2,4-三唑-5-基)水楊醯胺、3-胺基-1,2,4-三唑、3-(N-水楊醯基)胺基-1,2,4-三唑等。
三聚氰胺系氮化合物只要為具有骨架之氮化合物即可,可列舉三聚氰胺、三聚氰胺衍生物等。更具體而言,例如可列舉參胺基三嗪、烷基化參胺基三嗪、烷氧基烷基化參胺基三嗪、三聚氰胺、烷基化三聚氰胺、烷氧基烷基化三聚氰胺、N2-丁基三聚氰胺、N2,N2-二乙基三聚氰胺、N,N,N’,N’,N”,N”-陸(甲氧基甲基)三聚氰胺等。
界面活性劑:
界面活性劑可列舉非離子系界面活性劑、弱陽離子系界面活性劑等。
非離子系界面活性劑例如可列舉聚乙二醇、聚乙二醇/聚丙二醇共聚物、脂肪族醇聚氧乙烯加成物、芳香族醇聚氧乙烯加成物、多元醇聚氧乙烯加成物。
弱陽離子系界面活性劑例如可列舉末端二胺聚乙二醇、末端二胺聚乙二醇/聚丙二醇共聚物、脂肪族胺聚氧乙烯加成物、芳香族胺聚氧乙烯加成物、多胺聚氧乙烯加成物。
上述以外之界面活性劑例如可列舉聚氧伸烷基乙炔二醇類、聚氧伸烷基甘油基醚、聚氧伸烷基烷基醚、聚氧伸烷基酯、聚氧伸烷基烷基胺、聚氧伸烷基烷基醯胺等。
本實施型態之助銲劑係除了松脂、搖變劑及溶劑以外,尚組合而含有胺與有機磺酸,藉此即使對於經施予各種之表面處理的任一電極,亦可發揮充分的潤濕性,且即使經過複數次之回銲後,亦充分抑制孔洞之發生。
相較於經NiAu鍍敷處理之電極,經Cu-OSP處理之電極、經Sn鍍敷處理之電極由於表面容易被氧化,故不易潤濕。又,此等3種類之電極之中,經Sn鍍敷處理之電極由於表面最容易被氧化,故經Sn鍍敷處理之電極係最不易潤濕。
本實施型態之銲膏係對於經施予NiAu鍍敷、Cu-OSP處理、及Sn鍍敷之處理的電極之任一者,亦發揮充分的潤濕性。
(銲膏)
本實施型態之銲膏係含有銲料合金粉末、及上述之助銲劑。
銲料合金粉末係可以在Sn單獨之銲料的粉體、或、Sn-Ag系、Sn-Cu系、Sn-Ag-Cu系、Sn-Bi系、Sn-In系等、或者在此等之合金中添加有Sb、Bi、In、Cu、Zn、As、Ag、Cd、Fe、Ni、Co、Au、Ge、P等之銲料合金的粉體所構成。
銲料合金粉末係可以Sn-Pb系、或者在Sn-Pb系中添加有Sb、Bi、In、Cu、Zn、As、Ag、Cd、Fe、Ni、Co、Au、Ge、P等之銲料合金的粉體所構成。
銲料合金粉末係以不含有Pb的銲料為較佳。
助銲劑之含量:
在銲膏中,相對於銲膏之全部質量,助銲劑之含量係以5至30質量%為較佳,以5至15質量%為更佳。
本實施型態之銲膏係藉由含有松脂、胺、有機磺酸、搖變劑、及溶劑,即使對於經施予各種之表面處理的任一電極,亦可發揮充分的潤濕性,且即使經過複數次之回銲後,亦充分抑制孔洞之發生。
相較於經NiAu鍍敷處理之電極,經Cu-OSP處理之電極、經Sn鍍敷處理之電極由於表面容易被氧化,故不易潤濕。又,此等3種類之電極之中,經Sn鍍敷處理之電極由於表面最容易被氧化,故經Sn鍍敷處理之電極係最不易潤濕。
本實施型態之銲膏係對於經施予NiAu鍍敷、Cu-OSP處理、及Sn鍍敷之處理的電極之任一者,亦發揮充分的潤濕性。
[實施例]
以下,藉由實施例說明本發明,但本發明係不受以下之實施例所限定。
<助銲劑之調製>
(實施例1至11、比較例1至9)
依以下之表1至表2所示的組成調合實施例及比較例之助銲劑。
松脂:丙烯酸改性氫化松脂、松脂酯
胺:松脂胺、2-苯基-4-甲基咪唑、2-乙基咪唑、1,3-二-鄰甲苯基胍(二甲苯基胍)
有機磺酸:對甲苯磺酸、甲烷磺酸
其他之活性劑:己二酸、二苯基胍氫溴酸鹽
搖變劑:氫化蓖麻油
溶劑:己二醇
<銲膏之調製>
分別混合各例之助銲劑及下述之銲料合金粉末而調合銲膏。經調合之銲膏中,任一者皆助銲劑為10.5質量%、銲料合金粉末為89.5質量%。
銲膏中之銲料合金粉末係由Ag為3質量%、Cu為0.5質量%、殘餘部分為Sn之銲料合金所構成者。
銲料合金粉末係在JIS Z 3284-1:2014中之粉末大小的分類(表2)中,為滿足記號6之大小(粒度分布)。
<潤濕性之評估>
檢驗方法:
對於基板,準備經施予NiAu鍍敷之基板、Cu-OSP處理玻璃環氧基板、及經施予Sn鍍敷之基板。
將占地大小設為8mm×8mm,將遮罩厚度設定為80μm,在各別之基板上印刷經調製之銲膏。
然後,對印刷有銲膏之基板進行回銲處理。
回銲條件係以2℃/秒昇溫至150℃為止,在150至180℃升溫80秒鐘之後,以2℃/秒昇溫至180至240℃為止,同時在220℃以上保持40秒鐘。
回銲係在N2環境下、氧濃度80至150ppm進行。
將顯示回銲時之溫度變化的圖表表示於圖1中。
依據下列所示之判定基準評估回銲後之各別基板的表面狀態。
將實施例1至11、比較例1至9之評估結果表示於表1至2中。
判定基準:
A:在印刷面銲料均勻地潤濕。
B:在印刷外周部產生去濕潤(dewet)。
C:在印刷面之一半以上產生去濕潤。
對於經施予NiAu鍍敷之基板、Cu-OSP處理玻璃環氧基板、及經施予Sn鍍敷之基板印刷銲膏,將顯示回銲後之基板的潤濕狀態之照片及潤濕之判定基準表示於圖2中。圖2中,從左側起為經施予NiAu鍍敷之基板、Cu-OSP處理玻璃環氧基板、及經施予Sn鍍敷之基板,從上方起,潤濕之狀態的評估為A、B、C。
<孔洞發生之評估>
檢驗方法:
使用金屬遮罩(開口徑0.30mm、遮罩厚度80μm),在基板(Cu-OSP處理玻璃環氧基板)上之10個銲墊(直徑0.25mm)印刷銲膏。
對於印刷有銲膏之基板,以與<潤濕性之評估>為相同的條件進行回銲1次。在10個之各銲墊中,分別從基板之垂直方向照射X射線,藉由分析穿透X射線測定孔洞面積。在孔洞面積之測定中,X線通過至少1個之孔洞時,測定為孔洞存在者。孔洞係檢測出直徑5μm以上者。
然後,算出孔洞之總面積相對於銲墊之占地面積的比例。算出所得到的比例之平均值,作為初期孔洞面積率。
初期孔洞面積率之判定基準:
A:初期孔洞面積率為未達10%。
B:初期孔洞面積率為10%以上。
將實施例1至11、比較例1至9之評估結果表示於表1至2中。
繼而,對於初期孔洞面積率之評估為A之印刷有膏劑之各銲墊,進一步以相同的條件進行回銲2次。亦即,對於相同之銲墊進行合計3次之回銲。
然後,在10個之各銲墊中,分別算出孔洞之總面積相對於銲墊之占地面積之比例。算出所得到的比例之平均值,並算出相對於初期孔洞面積率的增加率,作為孔洞面積增加率。
孔洞面積增加率之判定基準:
A:孔洞增加率為未達5%。
B:孔洞面積增加率為5%以上。
將實施例1至11、比較例3至5、7、9之評估結果表示於表1至2中。
含有胺及有機磺酸之實施例1之助銲劑係NiAu鍍敷基板之潤濕為A,Cu-OSP處理玻璃環氧基板之潤濕為A,Sn鍍敷基板之潤濕為B,初期孔洞面積率為A,孔洞面積增加率為A。
相對於此,完全不包含胺及有機磺酸之比較例1的助銲劑係NiAu鍍敷基板之潤濕為A,Cu-OSP處理玻璃環氧基板之潤濕為C,Sn鍍敷基板之潤濕為C,初期孔洞面積率為B。
含有胺及有機磺酸之實施例3之助銲劑係NiAu鍍敷基板之潤濕為A,Cu-OSP處理玻璃環氧基板之潤濕為A,Sn鍍敷基板之潤濕為B,初期孔洞面積率為A,孔洞面積增加率為A。
相對於此,不含有有機磺酸之比較例4的助銲劑係NiAu鍍敷基板之潤濕為A,Cu-OSP處理玻璃環氧基板之潤濕為A,Sn鍍敷基板之潤濕為C,初期孔洞面積率為A,孔洞面積增加率為A。
含有胺及有機磺酸之實施例5的助銲劑係NiAu鍍敷基板之潤濕為A,Cu-OSP處理玻璃環氧基板之潤濕為A,Sn鍍敷基板之潤濕為B,初期孔洞面積率為A,孔洞面積增加率為A。
相對於此,不含有有機磺酸之比較例6的助銲劑係NiAu鍍敷基板之潤濕為A,Cu-OSP處理玻璃環氧基板之潤濕為A,Sn鍍敷基板之潤濕為B,初期孔洞面積率為B。
含有胺及有機磺酸之實施例9的助銲劑係NiAu鍍敷基板之潤濕為A,Cu-OSP處理玻璃環氧基板之潤濕為B,Sn鍍敷基板之潤濕為B,初期孔洞面積率為A,孔洞面積增加率為A。
相對於此,不含有有機磺酸之比較例8的助銲劑係NiAu鍍敷基板之潤濕為A,Cu-OSP處理玻璃環氧基板之潤濕為C,Sn鍍敷基板之潤濕為C,初期孔洞面積率為B。
含有胺及有機磺酸之實施例1的助銲劑係NiAu鍍敷基板之潤濕為A,Cu-OSP處理玻璃環氧基板之潤濕為A,Sn鍍敷基板之潤濕為B,初期孔洞面積率為A,孔洞面積增加率為A。
相對於此,不含有胺之比較例5的助銲劑係NiAu鍍敷基板之潤濕為B,Cu-OSP處理玻璃環氧基板之潤濕為B,Sn鍍敷基板之潤濕為C,初期孔洞面積率為A,孔洞面積增加率為A。
不含有有機酸之比較例2之助銲劑係Sn鍍敷基板之潤濕為C,初期孔洞面積率為B。
己二酸之含量為3質量%,且不含有有機磺酸之比較例4的助銲劑係Sn鍍敷基板之潤濕為C,初期孔洞面積率為A,孔洞面積增加率為A。
又,己二酸之含量為5質量%,且不含有有機磺酸之比較例3的助銲劑係Sn鍍敷基板之潤濕為B,初期孔洞面積率為A,孔洞面積增加率為B。
又,己二酸之含量為5質量%,且不含有有機磺酸之比較例7、9之助銲劑係初期孔洞面積率為A,孔洞面積增加率為B。
另一方面,含有胺及有機磺酸之實施例1至11的助銲劑係NiAu鍍敷基板之潤濕為A,Cu-OSP處理玻璃環氧基板之潤濕為A或B,Sn鍍敷基板之潤濕為B,初期孔洞面積率為A,孔洞面積增加率為A。
本發明之實施例1至11的助銲劑及銲膏係藉由包含胺及有機磺酸,可使對於NiAu鍍敷基板、Cu-OSP處理玻璃環氧基板、及Sn鍍敷基板之潤濕形成為充分者,且可充分降低初期孔洞面積率及孔洞面積增加率。
包含松脂胺或咪唑,且相對於助銲劑之總量,有機磺酸之含量為1質量%以上之本發明的實施例1及實施例3至8的助銲劑,係對於NiAu鍍敷基板、Cu-OSP處理玻璃環氧基板、及Sn鍍敷基板之任一基板,亦可使潤濕形成為優異者。
[產業上之利用可能性]
若依據本發明,可提供一種助銲劑及銲膏,該助銲劑係可對於經施予各種之表面處理的電極提高潤濕性,且即使經過複數次之回銲後,亦可抑制孔洞之發生。該銲膏及助銲劑係可適合使用於伴隨複數次之回銲的銲接。
Claims (5)
- 一種助銲劑,係含有松脂、松脂胺、選自由烷磺酸、烷醇磺酸及芳香族磺酸所組成的群組中之1種以上的有機磺酸、搖變劑及溶劑,相對於助銲劑之總量(100質量%),前述松脂之含量為5質量%以上50質量%以下,相對於助銲劑之總量(100質量%),前述松脂胺之含量為5質量%以上30質量%以下,相對於助銲劑之總量(100質量%),前述有機磺酸之含量為0.2質量%以上10質量%以下,前述松脂胺之含量相對於前述有機磺酸之含量的比例(質量比)為3.33以上10以下。
- 一種助銲劑,係含有松脂、唑類、選自由烷磺酸、烷醇磺酸及芳香族磺酸所組成的群組中之1種以上的有機磺酸、搖變劑及溶劑,相對於助銲劑之總量(100質量%),前述松脂之含量為5質量%以上50質量%以下,相對於助銲劑之總量(100質量%),前述唑類之含量為1質量%以上10質量%以下,相對於助銲劑之總量(100質量%),前述有機磺酸之含量為0.2質量%以上10質量%以下,前述唑類之含量相對於前述有機磺酸之含量的比例(質量比)為1以上3以下。
- 一種助銲劑,係含有松脂、胍類、選自由烷磺酸、烷醇磺酸及芳香族磺酸所組成的群組中之1種以上的有機磺酸、搖變劑及溶劑,相對於助銲劑之總量(100質量%),前述松脂之含量為5質量%以上50質量%以下,相對於助銲劑之總量(100質量%),前述胍類之含量為2質量%以上20質量%以下,相對於助銲劑之總量(100質量%),前述有機磺酸之含量為0.2質量%以上10質量%以下,前述胍類之含量相對於前述有機磺酸之含量的比例(質量比)為1.66以上5以下。
- 如請求項1至3中任一項所述之助銲劑,其中,前述有機磺酸係選自由對甲苯磺酸及甲烷磺酸所組成的群組中之1種以上。
- 一種銲膏,係含有銲料合金粉末、及請求項1至4中任一項所述之助銲劑。
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