TWI800987B - 助焊劑及焊膏 - Google Patents

助焊劑及焊膏 Download PDF

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Publication number
TWI800987B
TWI800987B TW110142773A TW110142773A TWI800987B TW I800987 B TWI800987 B TW I800987B TW 110142773 A TW110142773 A TW 110142773A TW 110142773 A TW110142773 A TW 110142773A TW I800987 B TWI800987 B TW I800987B
Authority
TW
Taiwan
Prior art keywords
flux
solder paste
solder
paste
Prior art date
Application number
TW110142773A
Other languages
English (en)
Other versions
TW202227557A (zh
Inventor
井上剣太
宮城奈菜子
永井智子
髙木和順
髙木晶子
Original Assignee
日商千住金屬工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2021090226A external-priority patent/JP7137097B2/ja
Application filed by 日商千住金屬工業股份有限公司 filed Critical 日商千住金屬工業股份有限公司
Publication of TW202227557A publication Critical patent/TW202227557A/zh
Application granted granted Critical
Publication of TWI800987B publication Critical patent/TWI800987B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Polyamides (AREA)
TW110142773A 2020-11-18 2021-11-17 助焊劑及焊膏 TWI800987B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020192036 2020-11-18
JP2020-192036 2020-11-18
JP2021090226A JP7137097B2 (ja) 2020-11-18 2021-05-28 フラックス及びソルダペースト
JP2021-090226 2021-05-28

Publications (2)

Publication Number Publication Date
TW202227557A TW202227557A (zh) 2022-07-16
TWI800987B true TWI800987B (zh) 2023-05-01

Family

ID=81708022

Family Applications (2)

Application Number Title Priority Date Filing Date
TW110142772A TWI789998B (zh) 2020-11-18 2021-11-17 助焊劑及焊膏
TW110142773A TWI800987B (zh) 2020-11-18 2021-11-17 助焊劑及焊膏

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW110142772A TWI789998B (zh) 2020-11-18 2021-11-17 助焊劑及焊膏

Country Status (7)

Country Link
US (2) US11986909B2 (zh)
EP (2) EP4230343A4 (zh)
KR (2) KR102645403B1 (zh)
CN (1) CN116419816B (zh)
MX (2) MX2023005577A (zh)
TW (2) TWI789998B (zh)
WO (2) WO2022107805A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6849934B1 (ja) * 2020-03-18 2021-03-31 千住金属工業株式会社 フラックス及びソルダペースト

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110919180A (zh) * 2018-09-20 2020-03-27 株式会社田村制作所 激光焊接用焊料组合物、电子基板、以及电子基板的制造方法

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JP2974493B2 (ja) * 1992-03-26 1999-11-10 共栄社化学株式会社 非水系塗料用流動調整剤
JP3350767B2 (ja) * 1993-09-03 2002-11-25 ニホンハンダ株式会社 クリームはんだ
JPH10328882A (ja) 1997-06-03 1998-12-15 Matsushita Electric Ind Co Ltd クリームはんだ
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JP4962150B2 (ja) 2007-06-08 2012-06-27 荒川化学工業株式会社 ハンダ付け用フラックス組成物及びクリームハンダ組成物
JP2009154170A (ja) 2007-12-25 2009-07-16 Arakawa Chem Ind Co Ltd はんだ用フラックスおよびソルダーペースト
US8652269B2 (en) * 2008-10-02 2014-02-18 Nihon Superior Co., Ltd. Flux composition and soldering paste composition
JP4920058B2 (ja) * 2009-06-03 2012-04-18 株式会社タムラ製作所 はんだ接合剤組成物
JP5486282B2 (ja) 2009-12-08 2014-05-07 荒川化学工業株式会社 はんだペースト用フラックス及びはんだペースト
JP5400606B2 (ja) 2009-12-29 2014-01-29 株式会社タムラ製作所 ソルダペーストおよびフラックス
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JP5863966B2 (ja) * 2012-06-20 2016-02-17 富士電機株式会社 はんだ付け用フラックス及びはんだ組成物
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CN108274155A (zh) 2018-04-17 2018-07-13 深圳市博士达焊锡制品有限公司 一种软钎焊用助焊剂及其制备方法以及一种焊锡膏
JP7084213B2 (ja) * 2018-06-08 2022-06-14 東洋スチレン株式会社 押出発泡用スチレン系樹脂組成物、発泡シート、容器、および板状発泡体
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CN110919180A (zh) * 2018-09-20 2020-03-27 株式会社田村制作所 激光焊接用焊料组合物、电子基板、以及电子基板的制造方法

Also Published As

Publication number Publication date
KR20230078829A (ko) 2023-06-02
EP4230342A1 (en) 2023-08-23
CN116419816A (zh) 2023-07-11
TW202227557A (zh) 2022-07-16
EP4230343A1 (en) 2023-08-23
WO2022107802A1 (ja) 2022-05-27
MX2023005578A (es) 2023-05-29
WO2022107805A1 (ja) 2022-05-27
MX2023005577A (es) 2023-05-29
TW202231399A (zh) 2022-08-16
US20230321767A1 (en) 2023-10-12
CN116419816B (zh) 2024-04-30
US20230321768A1 (en) 2023-10-12
US11986909B2 (en) 2024-05-21
EP4230343A4 (en) 2024-05-01
EP4230342A4 (en) 2024-05-01
US11986910B2 (en) 2024-05-21
KR20230078816A (ko) 2023-06-02
TWI789998B (zh) 2023-01-11
KR102645403B1 (ko) 2024-03-11

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