MX2023005578A - Fundente y soldadura en pasta. - Google Patents
Fundente y soldadura en pasta.Info
- Publication number
- MX2023005578A MX2023005578A MX2023005578A MX2023005578A MX2023005578A MX 2023005578 A MX2023005578 A MX 2023005578A MX 2023005578 A MX2023005578 A MX 2023005578A MX 2023005578 A MX2023005578 A MX 2023005578A MX 2023005578 A MX2023005578 A MX 2023005578A
- Authority
- MX
- Mexico
- Prior art keywords
- carboxylic acid
- endothermic amount
- flux
- aliphatic carboxylic
- aliphatic
- Prior art date
Links
- 230000004907 flux Effects 0.000 title abstract 2
- 229910000679 solder Inorganic materials 0.000 title 1
- 239000004952 Polyamide Substances 0.000 abstract 4
- 229920002647 polyamide Polymers 0.000 abstract 4
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 abstract 3
- 125000004432 carbon atom Chemical group C* 0.000 abstract 2
- 239000013008 thixotropic agent Substances 0.000 abstract 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 abstract 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract 1
- 239000012190 activator Substances 0.000 abstract 1
- 125000001931 aliphatic group Chemical group 0.000 abstract 1
- 239000007859 condensation product Substances 0.000 abstract 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 abstract 1
- 238000000113 differential scanning calorimetry Methods 0.000 abstract 1
- 238000001938 differential scanning calorimetry curve Methods 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 238000005259 measurement Methods 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Polyamides (AREA)
Abstract
La presente invención utiliza un fundente que contiene colofonia, un solvente, un agente tixotrópico y un activador. El agente tixotrópico contiene una poliamida (PA2). La PA2 es un producto de condensación de un ácido carboxílico alifático, un ácido carboxílico alifático que contiene un grupo hidroxi y una amina alifática que tiene de 3 a 10 átomos de carbono; y el ácido carboxílico alifático incluye un ácido dicarboxílico alifático que tiene de 11 a 20 átomos de carbono. Con respecto a la cantidad endotérmica calculada a partir del área del pico de la curva de calorimetría diferencial de barrido de PA2 obtenida por medición de calorimetría diferencial de barrido, la relación de la cantidad endotérmica dentro del intervalo de 50°C a 190°C a la cantidad endotérmica total dentro del intervalo de 50°C a 200°C es 90% o más.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020192036 | 2020-11-18 | ||
JP2020210556A JP6947998B1 (ja) | 2020-11-18 | 2020-12-18 | フラックス及びソルダペースト |
JP2021090226A JP7137097B2 (ja) | 2020-11-18 | 2021-05-28 | フラックス及びソルダペースト |
PCT/JP2021/042228 WO2022107805A1 (ja) | 2020-11-18 | 2021-11-17 | フラックス及びソルダペースト |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2023005578A true MX2023005578A (es) | 2023-05-29 |
Family
ID=81708022
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2023005577A MX2023005577A (es) | 2020-11-18 | 2021-11-17 | Fundente y soldadura en pasta. |
MX2023005578A MX2023005578A (es) | 2020-11-18 | 2021-11-17 | Fundente y soldadura en pasta. |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2023005577A MX2023005577A (es) | 2020-11-18 | 2021-11-17 | Fundente y soldadura en pasta. |
Country Status (7)
Country | Link |
---|---|
US (2) | US11986909B2 (es) |
EP (2) | EP4230343A4 (es) |
KR (2) | KR102645403B1 (es) |
CN (1) | CN116419816B (es) |
MX (2) | MX2023005577A (es) |
TW (2) | TWI789998B (es) |
WO (2) | WO2022107805A1 (es) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6849934B1 (ja) * | 2020-03-18 | 2021-03-31 | 千住金属工業株式会社 | フラックス及びソルダペースト |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4619715A (en) * | 1984-09-11 | 1986-10-28 | Scm Corporation | Fusible powdered metal paste |
JPH0719932B2 (ja) | 1989-04-12 | 1995-03-06 | 三菱電機株式会社 | レーザダイオードモジュール |
JP2974493B2 (ja) * | 1992-03-26 | 1999-11-10 | 共栄社化学株式会社 | 非水系塗料用流動調整剤 |
JP3350767B2 (ja) * | 1993-09-03 | 2002-11-25 | ニホンハンダ株式会社 | クリームはんだ |
JPH10328882A (ja) | 1997-06-03 | 1998-12-15 | Matsushita Electric Ind Co Ltd | クリームはんだ |
JP4348169B2 (ja) * | 2003-11-18 | 2009-10-21 | 伊藤製油株式会社 | ソルダーペースト用揺変性付与剤及びソルダーペースト |
JP4962150B2 (ja) | 2007-06-08 | 2012-06-27 | 荒川化学工業株式会社 | ハンダ付け用フラックス組成物及びクリームハンダ組成物 |
JP2009154170A (ja) | 2007-12-25 | 2009-07-16 | Arakawa Chem Ind Co Ltd | はんだ用フラックスおよびソルダーペースト |
US8652269B2 (en) * | 2008-10-02 | 2014-02-18 | Nihon Superior Co., Ltd. | Flux composition and soldering paste composition |
JP4920058B2 (ja) * | 2009-06-03 | 2012-04-18 | 株式会社タムラ製作所 | はんだ接合剤組成物 |
JP5486282B2 (ja) | 2009-12-08 | 2014-05-07 | 荒川化学工業株式会社 | はんだペースト用フラックス及びはんだペースト |
JP5400606B2 (ja) | 2009-12-29 | 2014-01-29 | 株式会社タムラ製作所 | ソルダペーストおよびフラックス |
CN102528326B (zh) | 2010-09-24 | 2015-07-22 | 荒川化学工业株式会社 | 焊接用松香类焊剂以及焊料糊剂 |
JP5863966B2 (ja) * | 2012-06-20 | 2016-02-17 | 富士電機株式会社 | はんだ付け用フラックス及びはんだ組成物 |
JP5766668B2 (ja) | 2012-08-16 | 2015-08-19 | 株式会社タムラ製作所 | はんだ組成物およびそれを用いたプリント配線基板 |
JP6601729B2 (ja) | 2014-12-03 | 2019-11-06 | パナソニックIpマネジメント株式会社 | データ生成方法、データ再生方法、データ生成装置及びデータ再生装置 |
JP6444953B2 (ja) * | 2015-09-30 | 2018-12-26 | 株式会社タムラ製作所 | フラックス組成物およびソルダペースト |
JP6801879B2 (ja) * | 2015-10-14 | 2020-12-16 | 共栄社化学株式会社 | フラックス用揺変剤並びにこれを含むフラックス及びソルダペースト |
JP6660018B2 (ja) * | 2016-07-28 | 2020-03-04 | 荒川化学工業株式会社 | 鉛フリーはんだペースト用フラックス及び鉛フリーはんだペースト |
JP6477842B1 (ja) | 2017-11-24 | 2019-03-06 | 千住金属工業株式会社 | フラックス及びソルダペースト |
US20200398383A1 (en) | 2018-03-09 | 2020-12-24 | Origin Company, Limited | Flux, solder paste, soldering process, method for producing soldered product, and method for producing bga package |
CN108274155A (zh) | 2018-04-17 | 2018-07-13 | 深圳市博士达焊锡制品有限公司 | 一种软钎焊用助焊剂及其制备方法以及一种焊锡膏 |
JP7084213B2 (ja) * | 2018-06-08 | 2022-06-14 | 東洋スチレン株式会社 | 押出発泡用スチレン系樹脂組成物、発泡シート、容器、および板状発泡体 |
JP6913064B2 (ja) * | 2018-09-13 | 2021-08-04 | 株式会社タムラ製作所 | はんだ組成物および電子基板の製造方法 |
JP6851352B2 (ja) * | 2018-09-20 | 2021-03-31 | 株式会社タムラ製作所 | レーザーはんだ付け用はんだ組成物および電子基板 |
JP6575706B1 (ja) | 2019-03-05 | 2019-09-18 | 千住金属工業株式会社 | ソルダペースト |
JP6575713B1 (ja) | 2019-03-05 | 2019-09-18 | 千住金属工業株式会社 | フラックス及びソルダペースト |
JP7227490B2 (ja) | 2019-05-27 | 2023-02-22 | タイガー魔法瓶株式会社 | 炊飯器 |
JP6947998B1 (ja) | 2020-11-18 | 2021-10-13 | 千住金属工業株式会社 | フラックス及びソルダペースト |
-
2021
- 2021-11-17 MX MX2023005577A patent/MX2023005577A/es unknown
- 2021-11-17 KR KR1020237017448A patent/KR102645403B1/ko active IP Right Grant
- 2021-11-17 MX MX2023005578A patent/MX2023005578A/es unknown
- 2021-11-17 CN CN202180076793.3A patent/CN116419816B/zh active Active
- 2021-11-17 TW TW110142772A patent/TWI789998B/zh active
- 2021-11-17 EP EP21894679.6A patent/EP4230343A4/en active Pending
- 2021-11-17 US US18/036,940 patent/US11986909B2/en active Active
- 2021-11-17 US US18/036,963 patent/US11986910B2/en active Active
- 2021-11-17 WO PCT/JP2021/042228 patent/WO2022107805A1/ja unknown
- 2021-11-17 KR KR1020237016140A patent/KR20230078816A/ko not_active Application Discontinuation
- 2021-11-17 WO PCT/JP2021/042217 patent/WO2022107802A1/ja active Application Filing
- 2021-11-17 EP EP21894676.2A patent/EP4230342A4/en active Pending
- 2021-11-17 TW TW110142773A patent/TWI800987B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR20230078829A (ko) | 2023-06-02 |
EP4230342A1 (en) | 2023-08-23 |
CN116419816A (zh) | 2023-07-11 |
TW202227557A (zh) | 2022-07-16 |
EP4230343A1 (en) | 2023-08-23 |
WO2022107802A1 (ja) | 2022-05-27 |
WO2022107805A1 (ja) | 2022-05-27 |
MX2023005577A (es) | 2023-05-29 |
TW202231399A (zh) | 2022-08-16 |
US20230321767A1 (en) | 2023-10-12 |
CN116419816B (zh) | 2024-04-30 |
US20230321768A1 (en) | 2023-10-12 |
US11986909B2 (en) | 2024-05-21 |
EP4230343A4 (en) | 2024-05-01 |
TWI800987B (zh) | 2023-05-01 |
EP4230342A4 (en) | 2024-05-01 |
US11986910B2 (en) | 2024-05-21 |
KR20230078816A (ko) | 2023-06-02 |
TWI789998B (zh) | 2023-01-11 |
KR102645403B1 (ko) | 2024-03-11 |
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