TWI784056B - 聚醯亞胺樹脂、聚醯亞胺清漆及聚醯亞胺薄膜 - Google Patents
聚醯亞胺樹脂、聚醯亞胺清漆及聚醯亞胺薄膜 Download PDFInfo
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- TWI784056B TWI784056B TW107133711A TW107133711A TWI784056B TW I784056 B TWI784056 B TW I784056B TW 107133711 A TW107133711 A TW 107133711A TW 107133711 A TW107133711 A TW 107133711A TW I784056 B TWI784056 B TW I784056B
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- polyimide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Paints Or Removers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Wire Bonding (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017191918 | 2017-09-29 | ||
JP2017-191918 | 2017-09-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201920371A TW201920371A (zh) | 2019-06-01 |
TWI784056B true TWI784056B (zh) | 2022-11-21 |
Family
ID=65903310
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107133711A TWI784056B (zh) | 2017-09-29 | 2018-09-26 | 聚醯亞胺樹脂、聚醯亞胺清漆及聚醯亞胺薄膜 |
Country Status (5)
Country | Link |
---|---|
JP (2) | JPWO2019065523A1 (ja) |
KR (1) | KR20200052308A (ja) |
CN (1) | CN111133033B (ja) |
TW (1) | TWI784056B (ja) |
WO (1) | WO2019065523A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7304338B2 (ja) | 2018-03-30 | 2023-07-06 | 株式会社カネカ | ポリイミド膜の製造方法および電子デバイスの製造方法 |
JP7371621B2 (ja) * | 2018-04-10 | 2023-10-31 | 三菱瓦斯化学株式会社 | ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム |
WO2021065509A1 (ja) | 2019-09-30 | 2021-04-08 | 三菱瓦斯化学株式会社 | ポリイミド樹脂組成物、ポリイミドワニス及びポリイミドフィルム |
WO2021193568A1 (ja) * | 2020-03-27 | 2021-09-30 | 三菱瓦斯化学株式会社 | ポリイミドフィルム及び積層体 |
WO2022091814A1 (ja) * | 2020-10-26 | 2022-05-05 | 三菱瓦斯化学株式会社 | ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム |
CN112646183A (zh) * | 2020-12-22 | 2021-04-13 | 宁波长阳科技股份有限公司 | 聚酰亚胺材料及其制备方法和应用 |
WO2022133722A1 (zh) * | 2020-12-22 | 2022-06-30 | 宁波长阳科技股份有限公司 | 聚酰亚胺材料及其制备方法和应用 |
CN113429785B (zh) * | 2021-06-16 | 2022-05-20 | 浙江中科玖源新材料有限公司 | 一种低双折射聚酰亚胺薄膜及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104508009A (zh) * | 2012-05-28 | 2015-04-08 | 宇部兴产株式会社 | 聚酰亚胺前体和聚酰亚胺 |
CN105814116A (zh) * | 2013-10-11 | 2016-07-27 | 宇部兴产株式会社 | 聚酰亚胺前体、聚酰亚胺、聚酰亚胺薄膜、清漆和基板 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5392247B2 (ja) | 2008-02-25 | 2014-01-22 | 日立化成デュポンマイクロシステムズ株式会社 | ポリイミド前駆体組成物、ポリイミドフィルム及び透明フレキシブルフィルム |
JP5412933B2 (ja) | 2008-08-01 | 2014-02-12 | 新日本理化株式会社 | ポリイミド樹脂 |
JPWO2011033751A1 (ja) | 2009-09-18 | 2013-02-07 | 三井化学株式会社 | 透明熱可塑性ポリイミド、およびそれを含む透明基板 |
EP2535341B1 (en) | 2010-02-09 | 2015-08-26 | JX Nippon Oil & Energy Corporation | Norbornane-2-spiro- a-cycloalkanone-a '-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic dianhydride, norbornane-2-spiro- a-cycloalkanone-a '-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic acid and ester thereof, method for producing norbornane-2-spiro- a-cycloalkanone-a '-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic dianhydride, polyimide obtained using same, and method for producing polyimide |
CN107573506B (zh) | 2012-09-18 | 2020-06-30 | 宇部兴产株式会社 | 聚酰亚胺前体,聚酰亚胺,聚酰亚胺膜,清漆以及基板 |
KR20140139367A (ko) * | 2013-05-27 | 2014-12-05 | 삼성전자주식회사 | 광학 필름의 제조 방법, 및 상기 제조 방법에 의해 제조되는 광학 필름 |
JP6293457B2 (ja) | 2013-11-12 | 2018-03-14 | 学校法人東邦大学 | ポリイミドおよび耐熱性フィルム |
CN106164178B (zh) * | 2014-03-31 | 2019-07-26 | 日产化学工业株式会社 | 树脂薄膜的制造方法和树脂薄膜形成用组合物 |
JP2016102147A (ja) * | 2014-11-27 | 2016-06-02 | Jxエネルギー株式会社 | ポリイミドフィルム、それを用いた基板、及び、ポリイミドフィルムの製造方法 |
US9718033B2 (en) * | 2014-12-23 | 2017-08-01 | Chevron U.S.A. Inc. | Uncrosslinked, high molecular weight, polyimide polymer containing a small amount of bulky diamine |
JP6492934B2 (ja) * | 2015-04-27 | 2019-04-03 | 宇部興産株式会社 | ポリアミック酸溶液組成物およびポリイミドフィルム |
JP2016204569A (ja) * | 2015-04-27 | 2016-12-08 | 宇部興産株式会社 | ポリアミック酸溶液組成物およびポリイミドフィルム |
-
2018
- 2018-09-21 CN CN201880062391.6A patent/CN111133033B/zh active Active
- 2018-09-21 KR KR1020207008744A patent/KR20200052308A/ko active IP Right Grant
- 2018-09-21 JP JP2019545072A patent/JPWO2019065523A1/ja active Pending
- 2018-09-21 WO PCT/JP2018/035129 patent/WO2019065523A1/ja active Application Filing
- 2018-09-26 TW TW107133711A patent/TWI784056B/zh active
-
2020
- 2020-12-09 JP JP2020204231A patent/JP6996609B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104508009A (zh) * | 2012-05-28 | 2015-04-08 | 宇部兴产株式会社 | 聚酰亚胺前体和聚酰亚胺 |
CN105814116A (zh) * | 2013-10-11 | 2016-07-27 | 宇部兴产株式会社 | 聚酰亚胺前体、聚酰亚胺、聚酰亚胺薄膜、清漆和基板 |
Also Published As
Publication number | Publication date |
---|---|
CN111133033B (zh) | 2022-06-28 |
JPWO2019065523A1 (ja) | 2020-04-30 |
CN111133033A (zh) | 2020-05-08 |
WO2019065523A1 (ja) | 2019-04-04 |
JP6996609B2 (ja) | 2022-01-17 |
JP2021059731A (ja) | 2021-04-15 |
KR20200052308A (ko) | 2020-05-14 |
TW201920371A (zh) | 2019-06-01 |
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