TWI782756B - 成像元件，堆疊式成像元件及固態成像裝置 - Google Patents

成像元件，堆疊式成像元件及固態成像裝置 Download PDF

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TWI782756B
TWI782756B TW110138480A TW110138480A TWI782756B TW I782756 B TWI782756 B TW I782756B TW 110138480 A TW110138480 A TW 110138480A TW 110138480 A TW110138480 A TW 110138480A TW I782756 B TWI782756 B TW I782756B
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photoelectric conversion
electrode
charge storage
imaging element
layer
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TW110138480A
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Chinese (zh)
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TW202205658A (zh
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古川明
安藤良洋
富樫秀晃
古閑史彦
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日商索尼股份有限公司
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    • H10F39/80—Constructional details of image sensors
    • H10F39/803—Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
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    • H10F39/182—Colour image sensors
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    • H10F39/186—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors having arrangements for blooming suppression
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    • H10H20/822—Materials of the light-emitting regions
    • H10H20/823—Materials of the light-emitting regions comprising only Group II-VI materials, e.g. ZnO
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TW110138480A 2016-11-22 2017-11-15 成像元件，堆疊式成像元件及固態成像裝置 TWI782756B (zh)

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JP2016226658A JP6926450B2 (ja) 2016-11-22 2016-11-22 撮像素子、積層型撮像素子及び固体撮像装置
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JP6926450B2 (ja) * 2016-11-22 2021-08-25 ソニーグループ株式会社 撮像素子、積層型撮像素子及び固体撮像装置
JP6884647B2 (ja) * 2017-06-19 2021-06-09 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置および電子機器
WO2019198385A1 (ja) * 2018-04-09 2019-10-17 ソニーセミコンダクタソリューションズ株式会社 撮像装置およびその製造方法、電子機器
CN112189259B (zh) * 2018-06-08 2024-03-22 索尼半导体解决方案公司 成像元件、层叠型成像元件和固态成像装置
TWI891386B (zh) * 2018-06-15 2025-07-21 日商索尼股份有限公司 固體攝像元件
EP3813116B1 (en) * 2018-06-15 2024-05-22 Sony Semiconductor Solutions Corporation Imaging device and method for manufacturing same, and electronic apparatus
WO2020008801A1 (ja) * 2018-07-03 2020-01-09 ソニーセミコンダクタソリューションズ株式会社 撮像素子及び固体撮像装置
CN112369011B (zh) * 2018-07-03 2024-04-19 索尼半导体解决方案公司 固态摄像装置
TWI840387B (zh) 2018-07-26 2024-05-01 日商索尼股份有限公司 固態攝像元件、固態攝像裝置及固態攝像元件之讀出方法
TWI840383B (zh) * 2018-07-26 2024-05-01 日商索尼半導體解決方案公司 固體攝像裝置
JP2020017688A (ja) 2018-07-27 2020-01-30 ソニーセミコンダクタソリューションズ株式会社 撮像素子、電子機器
JP7256808B2 (ja) * 2018-07-30 2023-04-12 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子及び電子装置
CN122318332A (zh) 2018-07-31 2026-06-30 索尼半导体解决方案公司 摄像元件和摄像装置
TW202035577A (zh) * 2018-09-06 2020-10-01 日商富士軟片股份有限公司 結構體、光感測器及圖像顯示裝置
WO2021001719A1 (ja) * 2019-07-04 2021-01-07 株式会社半導体エネルギー研究所 撮像装置および電子機器
CN114402451B (zh) * 2019-11-01 2025-08-22 索尼集团公司 光电转换元件和摄像元件
JP7531272B2 (ja) * 2019-11-15 2024-08-09 ソニーセミコンダクタソリューションズ株式会社 撮像装置
AU2021208557A1 (en) * 2020-01-14 2022-09-01 Quantum-Si Incorporated Sensor for lifetime plus spectral characterization
JP7414569B2 (ja) * 2020-02-12 2024-01-16 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子
TW202147591A (zh) 2020-03-02 2021-12-16 美商寬騰矽公司 用於多維信號分析之整合感應器
CN116491127A (zh) * 2020-12-15 2023-07-25 松下知识产权经营株式会社 摄像装置
JP2022190538A (ja) * 2021-06-14 2022-12-26 株式会社ジャパンディスプレイ 検出装置
JP2023005880A (ja) * 2021-06-29 2023-01-18 ソニーセミコンダクタソリューションズ株式会社 光電変換素子、光検出装置、および電子機器
TWI825846B (zh) * 2022-07-13 2023-12-11 力成科技股份有限公司 封裝結構及其製造方法

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