TWI775946B - 聚醯亞胺粉體、聚醯亞胺塗料及聚醯亞胺薄膜 - Google Patents

聚醯亞胺粉體、聚醯亞胺塗料及聚醯亞胺薄膜 Download PDF

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TWI775946B
TWI775946B TW107132906A TW107132906A TWI775946B TW I775946 B TWI775946 B TW I775946B TW 107132906 A TW107132906 A TW 107132906A TW 107132906 A TW107132906 A TW 107132906A TW I775946 B TWI775946 B TW I775946B
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polyimide
polyimide powder
powder
mol
weight
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TW107132906A
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Chinese (zh)
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TW201915050A (zh
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田中圭三
山田俊輔
長島豊
清水誠吾
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日商河村產業股份有限公司
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Priority claimed from JP2017184759A external-priority patent/JP6993672B2/ja
Priority claimed from JP2017184760A external-priority patent/JP6993673B2/ja
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Publication of TW201915050A publication Critical patent/TW201915050A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1078—Partially aromatic polyimides wholly aromatic in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Paints Or Removers (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
TW107132906A 2017-09-26 2018-09-19 聚醯亞胺粉體、聚醯亞胺塗料及聚醯亞胺薄膜 TWI775946B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017-184760 2017-09-26
JP2017184759A JP6993672B2 (ja) 2017-09-26 2017-09-26 ポリイミド粉体、ポリイミドワニス及びポリイミドフィルム
JP2017-184759 2017-09-26
JP2017184760A JP6993673B2 (ja) 2017-09-26 2017-09-26 ポリイミド粉体、ポリイミドワニス及びポリイミドフィルム

Publications (2)

Publication Number Publication Date
TW201915050A TW201915050A (zh) 2019-04-16
TWI775946B true TWI775946B (zh) 2022-09-01

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TW107132906A TWI775946B (zh) 2017-09-26 2018-09-19 聚醯亞胺粉體、聚醯亞胺塗料及聚醯亞胺薄膜

Country Status (4)

Country Link
KR (1) KR102520356B1 (ko)
CN (1) CN111133055B (ko)
TW (1) TWI775946B (ko)
WO (1) WO2019065136A1 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2019203037A1 (ja) * 2018-04-16 2021-04-30 コニカミノルタ株式会社 ポリマーブレンド組成物及びポリマーフィルム
CN114599739A (zh) * 2019-10-31 2022-06-07 住友化学株式会社 光学膜和柔性显示装置
US20230279182A1 (en) * 2020-08-07 2023-09-07 Zymergen Inc. Process for polyimide synthesis and polyimides made therefrom
CN112280464B (zh) * 2020-11-11 2022-02-22 住井科技(深圳)有限公司 提高涂料的保存稳定性的方法
CN112876681B (zh) * 2021-02-04 2022-09-23 武汉柔显科技股份有限公司 一种使用撞击流反应器制备聚酰亚胺前驱体及其薄膜的制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011055530A1 (ja) * 2009-11-05 2011-05-12 株式会社アイ．エス．テイ ポリイミド発泡体、ポリイミド粉体混合物、ポリイミド粉体、ポリイミド発泡体の製造方法、積層ポリイミド発泡成形体の製造方法、湾曲ポリイミド発泡成形体の製造方法、積層ポリイミド発泡成形体および湾曲ポリイミド発泡成形体
TW201321431A (zh) * 2011-12-16 2013-06-01 Taimide Technology Inc 由聚醯亞胺粉體構成之消光劑、含有該消光劑之聚醯亞胺膜、及其製造方法
CN104245843A (zh) * 2012-01-26 2014-12-24 日产化学工业株式会社 聚酰亚胺清漆的制备方法、及液晶取向剂

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JPH0710924B2 (ja) * 1990-02-20 1995-02-08 新日本理化株式会社 溶剤可溶型ポリイミド系樹脂粉体の製造方法
JP2816770B2 (ja) 1991-01-11 1998-10-27 日本電信電話株式会社 ポリイミド光導波路の製造方法
JP2000169579A (ja) 1998-12-02 2000-06-20 Teijin Ltd 有機溶剤可溶性ポリイミドおよびその製造方法
US20050164002A1 (en) * 2002-05-09 2005-07-28 Krizan Timothy D. Polymeric particles
JP2004285355A (ja) 2003-03-05 2004-10-14 Kaneka Corp ポリイミド樹脂粉体の製造方法
KR101328838B1 (ko) 2010-03-30 2013-11-13 코오롱인더스트리 주식회사 폴리이미드 필름
WO2017179367A1 (ja) * 2016-04-11 2017-10-19 河村産業株式会社 ポリイミド粉体およびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011055530A1 (ja) * 2009-11-05 2011-05-12 株式会社アイ．エス．テイ ポリイミド発泡体、ポリイミド粉体混合物、ポリイミド粉体、ポリイミド発泡体の製造方法、積層ポリイミド発泡成形体の製造方法、湾曲ポリイミド発泡成形体の製造方法、積層ポリイミド発泡成形体および湾曲ポリイミド発泡成形体
TW201321431A (zh) * 2011-12-16 2013-06-01 Taimide Technology Inc 由聚醯亞胺粉體構成之消光劑、含有該消光劑之聚醯亞胺膜、及其製造方法
CN104245843A (zh) * 2012-01-26 2014-12-24 日产化学工业株式会社 聚酰亚胺清漆的制备方法、及液晶取向剂

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CN111133055A (zh) 2020-05-08
KR102520356B1 (ko) 2023-04-12
TW201915050A (zh) 2019-04-16
WO2019065136A1 (ja) 2019-04-04
CN111133055B (zh) 2022-12-06
KR20200055048A (ko) 2020-05-20

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