TWI770930B - 定位裝置及方法、樹脂成形系統及樹脂成形品的製造方法 - Google Patents

定位裝置及方法、樹脂成形系統及樹脂成形品的製造方法 Download PDF

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Publication number
TWI770930B
TWI770930B TW110112588A TW110112588A TWI770930B TW I770930 B TWI770930 B TW I770930B TW 110112588 A TW110112588 A TW 110112588A TW 110112588 A TW110112588 A TW 110112588A TW I770930 B TWI770930 B TW I770930B
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TW
Taiwan
Prior art keywords
workpiece
range
center position
resin molding
displacement amount
Prior art date
Application number
TW110112588A
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English (en)
Chinese (zh)
Other versions
TW202208140A (zh
Inventor
谷内口洸
法兼一貴
Original Assignee
日商Ｔｏｗａ股份有限公司
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Publication of TW202208140A publication Critical patent/TW202208140A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14008—Inserting articles into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/008—Handling preformed parts, e.g. inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
    • B29C31/08—Feeding of the material to be moulded, e.g. into a mould cavity of preforms to be moulded, e.g. tablets, fibre reinforced preforms, extruded ribbons, tubes or profiles; Manipulating means specially adapted for feeding preforms, e.g. supports conveyors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5875—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW110112588A 2020-04-24 2021-04-07 定位裝置及方法、樹脂成形系統及樹脂成形品的製造方法 TWI770930B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020077173A JP7291663B2 (ja) 2020-04-24 2020-04-24 位置決め装置、位置決め方法、樹脂成形システムおよび樹脂成形品の製造方法
JP2020-077173 2020-04-24

Publications (2)

Publication Number Publication Date
TW202208140A TW202208140A (zh) 2022-03-01
TWI770930B true TWI770930B (zh) 2022-07-11

Family

ID=78101725

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110112588A TWI770930B (zh) 2020-04-24 2021-04-07 定位裝置及方法、樹脂成形系統及樹脂成形品的製造方法

Country Status (4)

Country Link
JP (1) JP7291663B2 (ja)
KR (1) KR102397599B1 (ja)
CN (1) CN113547691B (ja)
TW (1) TWI770930B (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW315504B (ja) * 1995-03-20 1997-09-11 Tokyo Electron Co Ltd

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JPS5864043A (ja) * 1981-10-13 1983-04-16 Nippon Telegr & Teleph Corp <Ntt> 円板形状体の位置決め装置
JPS62237743A (ja) * 1986-04-09 1987-10-17 Hitachi Ltd ウエハ整合装置
JPH04268746A (ja) * 1991-02-25 1992-09-24 Canon Inc オリフラ検知ステージ
JPH06310587A (ja) * 1993-04-22 1994-11-04 Hitachi Ltd ウエハ整合装置
JPH08274205A (ja) * 1995-03-31 1996-10-18 Toshiba Corp 半導体装置及びその製造方法
JPH11145253A (ja) * 1997-11-10 1999-05-28 Toshiba Corp 半導体ウエハのセンタ合わせ装置および半導体ウエハのセンタ合わせ方法
JP3957413B2 (ja) * 1998-10-08 2007-08-15 松下電器産業株式会社 ウェーハ位置検出方法及びその検出装置
JP4268746B2 (ja) 2000-09-08 2009-05-27 株式会社リコー 反発型磁気浮上軸受および光偏向走査装置
US7315373B2 (en) * 2001-11-14 2008-01-01 Rorze Corporation Wafer positioning method and device, wafer process system, and wafer seat rotation axis positioning method for wafer positioning device
US6836690B1 (en) * 2002-07-19 2004-12-28 Nanometrics Incorporated High precision substrate prealigner
JP4250931B2 (ja) * 2002-08-30 2009-04-08 日本電気株式会社 外観検査装置および外観検査方法
JP4399494B2 (ja) * 2006-12-28 2010-01-13 シャープ株式会社 欠陥検出装置、欠陥検出方法、イメージセンサデバイスおよびイメージセンサモジュール
KR101353042B1 (ko) * 2007-01-04 2014-01-20 (주)소슬 반도체 기판의 위치 보정 방법 및 장치, 상기 장치를 갖는척, 및 상기 척을 이용해서 반도체 기판을 식각하는 방법및 장치
US7796804B2 (en) * 2007-07-20 2010-09-14 Kla-Tencor Corp. Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
CN101436004B (zh) * 2008-12-01 2011-12-21 上海微电子装备有限公司 硅片预对准的方法
JP5544585B2 (ja) * 2010-07-13 2014-07-09 アピックヤマダ株式会社 樹脂モールド装置及びワーク板厚測定装置
TWI523164B (zh) * 2010-11-25 2016-02-21 山田尖端科技股份有限公司 樹脂模塑裝置
JP5864043B2 (ja) 2011-04-12 2016-02-17 シャープ株式会社 表示装置、操作入力方法、操作入力プログラム、及び記録媒体
JP5676419B2 (ja) * 2011-11-24 2015-02-25 株式会社日立ハイテクノロジーズ 欠陥検査方法およびその装置
JP2014150170A (ja) * 2013-02-01 2014-08-21 Renesas Electronics Corp 電気特性測定装置および方法
JP6143665B2 (ja) * 2013-12-26 2017-06-07 Ｔｏｗａ株式会社 半導体封止方法及び半導体封止装置
JP2019087576A (ja) * 2017-11-02 2019-06-06 東京エレクトロン株式会社 成膜装置、及び成膜方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW315504B (ja) * 1995-03-20 1997-09-11 Tokyo Electron Co Ltd

Also Published As

Publication number Publication date
KR20210131867A (ko) 2021-11-03
CN113547691B (zh) 2023-06-13
JP7291663B2 (ja) 2023-06-15
JP2021173618A (ja) 2021-11-01
CN113547691A (zh) 2021-10-26
KR102397599B1 (ko) 2022-05-16
TW202208140A (zh) 2022-03-01

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