TWI770930B - Positioning device and method, resin molding system, and manufacturing method of resin molded product - Google Patents

Abstract

A positioning device and method, a resin molding system, and a resin molding method capable of detecting a straight portion and a notch of a workpiece are desired. The positioning device of the present invention includes: a measuring device for measuring the displacement amount of the peripheral edge portion of the workpiece for every fixed rotation angle of the rotating workpiece; and a control portion for controlling the measuring device to detect the center position of the notch portion of the workpiece, and the control portion The manner of detecting the center position of the notch portion of the workpiece is controlled based on the number of measurement points in at least a part of the first range that monotonically decreases and the second range that monotonically increases in the measurement result.

Description

Positioning device and method, resin molding system, and resin molded product manufacturing method

The present invention relates to a positioning device, a positioning method, a resin molding system, and a method for manufacturing a resin molded product.

Patent Document 1 discloses a method for detecting the position of an orientation flat (hereinafter, referred to as "orientation flat") of a semiconductor wafer including a straight portion in plan view. In the detection method described with reference to FIG. 8 of this document, in the trajectory of the orientation plane portion shown in FIG. 8( a ), the opposite-side outer edge position data corresponding to the outer edge position data is detected from the data of both end parts. , and find the average value of each. The mode is detected from the average value, and the alignment of the semiconductor wafer is performed based on the center position of the orientation flat portion.

[Prior Art Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 4-268746

The aforementioned Patent Document 1 describes the detection of the orientation flat portion of the semiconductor wafer, but does not describe the detection of the notch. on the other hand, A technique that can detect straight portions and notches of workpieces is desired.

In order to solve the above-mentioned problems, the positioning device of the present invention includes: a measuring device for measuring the displacement amount of the peripheral edge portion of the workpiece for every fixed rotation angle of the rotating workpiece; and a control unit for controlling the measuring device to detect the The center position of the notch of the workpiece. The control unit is configured to detect the notch of the workpiece as the number of measurement points in at least a part of a first range that is monotonically decreasing and a second range that is monotonically increasing based on the measurement result the center position of the control.

The positioning method of the present invention includes: a measuring step of rotating a workpiece, and measuring the displacement amount of the peripheral edge portion of the workpiece every fixed rotation angle; The number of measurement points in at least a part of a range and a monotonically increasing second range is used to detect the center position of the notch portion of the workpiece.

The resin molding system of the present invention includes a resin molding device that performs resin molding by arranging the workpiece positioned by the positioning device.

The manufacturing method of the resin molded product of this invention performs resin molding on the said workpiece|work using the said resin molding system.

According to the present invention, there can be provided a positioning device, a positioning method, a resin molding system, and a manufacturing method of a resin molded product capable of detecting the center position of a notch portion of a workpiece including a straight portion and a notch in plan view.

10: Resin molding system

20: Positioning device

30: Resin molding device

40: Control Department

21: Rotary table

22: Measuring device

A: Average value of displacement

C: Central measuring point

E: Measuring range

P: Rotary axis

R: third range

S1~S8, C1~C6: Steps

W: workpiece

s, t, u, v: measuring points

FIG. 1 is a diagram schematically showing the configuration of a resin molding system according to the present embodiment.

FIGS. 2( a ) and 2 ( b ) are a plan view and a side view schematically showing the positioning device of the present embodiment.

FIG. 3 is a flowchart showing a workpiece positioning method according to the present embodiment.

FIGS. 4( a ) and 4 ( b ) are diagrams showing measurement data based on the workpiece positioning method of the present embodiment and the comparative example.

FIG. 5 is a flowchart showing a positioning method of a workpiece according to a comparative example.

FIGS. 6( a ) and 6 ( b ) are diagrams showing measurement data based on the workpiece positioning method of the present embodiment and the comparative example.

<One Embodiment of the Present Invention>

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same code|symbol is attached|subjected to the same or corresponding part in a figure, and the description is not repeated.

<Configuration of Resin Molding System 10 >

Hereinafter, the basic structure of resin molding of the resin molding system 10 of the present embodiment will be described.

FIG. 1 is a diagram schematically showing the configuration of a resin molding system 10 according to the present embodiment. This resin molding system 10 is configured to manufacture a resin molding by using a so-called compression molding method. As shown in FIG. 1 , the resin molding system 10 includes a positioning device 20 , a resin molding device 30 , and a control unit 40 .

The positioning device 20 includes a rotary table 21 and a measuring device 22 . In the positioning device 20, the workpiece W is positioned, for example, as described later. Examples of the workpiece W include semiconductor substrates such as silicon wafers, lead frames, printed wiring boards, metal substrates, resin substrates, glass substrates, ceramic substrates, and the like. In addition, the substrate W may also be a carrier for Fan Out Wafer Level Packaging (Fan Out Wafer Level Packaging, FOWLP) or Fan Out Panel Level Packaging (Fan Out Panel Level Packaging, FOPLP). Furthermore, it may be a work that has already been wired or a work that is not wired.

The resin molding apparatus 30 includes a molding die (not shown) and a clamping mechanism (not shown) for clamping the molding die. In the resin molding device 30 , for example, the workpiece W positioned by the positioning device 20 is resin-molded.

The control unit 40 includes a central processing unit (CPU), a random access memory (RAM), a read only memory (ROM), etc., and is configured to perform various structures according to information processing element control. The control unit 40 is configured to control at least the positioning device 20, and is configured to also control the resin molding device 30 in this embodiment.

<Operation of the resin molding system 10>

Hereinafter, the basic operation of resin molding by the resin molding system 10 of the present embodiment will be described.

The workpiece W carried into the resin molding system is placed on the turntable 21 of the positioning device by a robot hand or the like (not shown). The workpiece W positioned by the positioning device is transferred to a conveying mechanism (not shown) by a robot or the like, and is The conveying mechanism conveys the workpiece W to the molding die of the resin molding apparatus, and the molding die is clamped by the clamping mechanism to perform resin molding, thereby producing a resin molded product.

<Configuration of the positioning portion 20 of the workpiece W>

FIGS. 2( a ) and 2 ( b ) are diagrams schematically showing the positioning device 20 , FIG. 2( a ) is a plan view, and FIG. 2( b ) is a side view. As shown in FIGS. 2( a ) and 2 ( b ), the positioning device 20 includes a rotary table 21 and a measuring device 22 .

The turntable 21 is configured to rotate about the rotation axis P as the center. The workpiece W is arranged on the upper part of the rotating part 21 . The turntable 21 can be rotated by, for example, a motor. The rotary table 21 can attract and fix the workpiece W, for example.

The measuring device 22 is configured to measure the displacement amount of the peripheral edge portion of the workpiece W placed on the turntable 21 . An example of the measuring device 22 includes an optical sensor, and more specifically, a laser displacement meter.

<Operation of the positioning device 20 of the workpiece W>

Hereinafter, the basic operation of the positioning device 20 of the present embodiment will be described.

FIG. 3 is a flowchart of the positioning operation of the workpiece W by the positioning device 20 . The processing shown in this flowchart is executed by, for example, the control unit 40 included in the resin molding system 10 . Furthermore, the positioning device 20 may be configured to include the control unit 40 .

Referring to FIGS. 2( a ) and 2 ( b ), the control unit 40 arranges the workpiece W on the turntable 21 using a robot or the like, obtains the rotation center position of the workpiece W, and matches the rotation axis of the turntable 21 Center alignment is performed by matching P (step S1). For this purpose, a known method can be used. For example, the workpiece W is placed on the turntable 21 and rotated at a fixed rotational speed in an eccentric state, and the displacement of the measuring device 22 is performed according to the displacement of the measuring device 22 . The amount of eccentricity between the center of the workpiece W and the rotation axis P of the turntable 21 is obtained from the output of the amount. Based on this eccentric amount, the workpiece W is rearranged on the turntable 21 .

The control unit 40 starts the rotation of the turntable 21 at a fixed rotational speed (step S2). In addition, the rotation speed here is slower than the rotation speed of the above-mentioned center alignment step S1.

The control part 40 acquires the displacement amount of the peripheral edge part of the workpiece|work W arrange|positioned on the turntable 21 from the measuring device 22 every fixed time (step S3). After obtaining the displacement amount, the control unit 40 stops the turntable 21 (step S4). In addition, the measurement range E which acquires the displacement amount from the measuring device 22 in step S3 can be set based on the result in step S1 of the said center alignment.

FIGS. 4( a ) and 4 ( b ) are diagrams graphing the output from the measuring device 22 in step S3 . In step S3 , the displacement amount of the positioning operation of the workpiece W by the positioning device 20 is obtained. In this graph, the vertical axis represents the displacement amount obtained from the measuring device 22, the horizontal axis represents the rotation angle calculated from the rotational speed of the turntable 21, and the units of the vertical axis and the horizontal axis are arbitrary. Here, as the workpiece W, a workpiece W including a linear portion in a plan view is used, and the measurement range E is set in advance so as to include the center position of the linear portion. Fig. 4(b) is an enlarged view of the vicinity of the center position of the linear portion of the workpiece W in Fig. 4(a) . The displacement amount of the vertical axis of FIGS. 4( a ) and 4 ( b ) is a value corresponding to the distance from the rotation center of the workpiece W to the peripheral portion.

In the graphs shown in FIG. 4( a ) and FIG. 4( b ), A represents the average value of the displacement amount obtained from the measuring device 22 , N represents the number of measurement points, and C represents the average value A of the displacement amount. Among the following measurement points, the measurement point is located in the center. Again, in The central measurement point C is a point where the numbers of N1 and N2 are the same.

4( a ) and 4 ( b ), the control unit 40 calculates the average value A of all the data of the displacement amount acquired from the measuring device 22 by the process of step S3 of acquiring the displacement amount (step S5 ). The control part 40 extracts the measurement point which becomes the displacement amount below the calculated average value A (step S6). Based on the extracted measurement points, the control unit 40 calculates a central measurement point C that is the center for the rotation angle (step S7 ), and detects the central measurement point C as the center position of the notch portion of the workpiece W (step S8 ). When the number of measurement points below the average value A is odd, the central measurement point C is 1 point, and when the number of measurement points below the average value A is even, the central measurement point C is 2 points. The point is detected as the center position, and the center position may also be detected between the two points.

4( a ) and 4 ( b ) show data obtained when the center position of the linear portion of the workpiece W including the linear portion is detected in plan view, but the same steps S1 to S8 may be used. Processed to detect the center position of the notch of the workpiece W. In addition, in the example of FIG. 4(a) and FIG. 4(b), the center is obtained from the measurement points below the average value A, but in FIG. 4(a), the output value may be cross-cut. (Measured value) The range below the straight line in the horizontal direction of both the monotonically decreasing curve and the monotonically increasing curve is obtained, and the central measurement point C serving as the center is obtained.

In addition, in the example of FIG.4(a) and FIG.4(b), the 3rd range R exists between the 1st range which monotonically decreases the output value (measurement value), and the 2nd range which monotonically increases. In this case, the central measurement point is obtained from the measurement points at or below a fixed value such as the average value A of the first range and the second range, and the measurement points in the third range R. Just point C. In addition, the range shown in FIG.4(b) is a 3rd range R. As shown in FIG.

After the above-described operation of the positioning device 20 on the workpiece W, as described above, the positioned workpiece W is transferred to the conveying mechanism by a robot or the like, and the workpiece W is conveyed by the conveying mechanism to the molding die of the resin molding apparatus. Then, the molding die is clamped using the mold clamping mechanism, and resin molding is performed to manufacture a resin molded product.

<Comparative example>

FIG. 5 is a flowchart of the positioning operation of the workpiece W according to the comparative example, and corresponds to FIG. 3 . Furthermore, the basic structure of the positioning device is the same as that of the present invention.

In FIG. 5 , the steps C1 to C3 are the same as the steps S1 to S3 of FIG. 3 , and thus the description is omitted. In the comparative example, the output of the displacement amount from the measuring device 22 is sequentially acquired, and the displacement amount comparison process is performed between the measurement points acquired after the second time and the measurement points acquired immediately before. In the following description, the expression "this time" is used for the measurement point or displacement amount acquired just before, and the expression "last time" is used for the measurement point or displacement amount acquired immediately before.

The control unit 40 compares the displacement amount of the peripheral edge portion of the workpiece W acquired from the measuring device 22 with the previous displacement amount for the measurement points acquired after the second time, and if the displacement amount acquired this time is larger than the previous displacement amount If the amount is small, return to step C3. (step C4)

In step C4, if the displacement amount acquired this time is greater than or equal to the previous displacement amount, the control unit 40 regards the previous displacement amount as the minimum displacement amount and stops the turntable 21 (step C5). The control unit 40 detects the measurement point of the minimum displacement amount as the workpiece The center position of the notch portion of W (step C6). In addition, in step C2 and step C5, you may stop rotation after rotating by a preset angle. In addition, step C6 may be detected without waiting for the rotation stop of step C5.

FIGS. 6( a ) and 6 ( b ) correspond to FIGS. 4 ( a ) and 4 ( b ), and are signals from the measuring device 22 in step C3 of the positioning operation for the workpiece W of the comparative example. Output a graphed graph. Fig. 6(b) is an enlarged view of the vicinity of the center position of the notch of the workpiece W in Fig. 6(a) .

In steps C3 to C4 of the positioning operation of the workpiece W of the comparative example, when the center position of the notch is detected, the following processing is performed. Referring to FIG. 6( b ), the control unit 40 acquires the measurement point t from the measuring device 22 . When comparing the previous measurement point s with the measurement point t acquired this time, the measurement point t acquired this time is equal to the previous measurement point s, so the previous measurement point s is regarded as the minimum displacement, and the measurement The point s is detected as the center position of the notch of the workpiece W.

In the positioning operation of the workpiece W of the comparative example, for example, as shown in FIG. 6( b ), when three points are arranged with the minimum displacement amount, the measurement point s measured first is detected as the notch portion of the workpiece W the center position. Therefore, the position of the measurement point t, which is slightly deviated from the center position of the notch portion of the original workpiece W, is regarded as the center position of the notch portion of the workpiece W. FIG.

In addition, in the case where the center position of the orientation flat portion is detected by the positioning operation of the workpiece W of the comparative example, the following processing is performed. Referring to FIG. 4( b ), the control unit 40 acquires the measurement point v from the measuring device 22 . When the control unit 40 compares the previous measurement point u with the measurement point v acquired this time, the measurement point v acquired this time is smaller than the previous measurement point v. Since the measurement point u is large, the previous measurement point u is regarded as the minimum displacement amount, and the measurement point u is detected as the center position of the notch portion of the workpiece W. Therefore, the measurement and acquisition of the displacement amount and the rotation angle information are completed before the actual center position of the notch portion, that is, the central measurement point C is detected.

Therefore, although the accuracy of the positioning operation of the workpiece W of the comparative example is lower than that of the present embodiment described above, the detection of the center position of the notch can be performed, but the detection of the center position of the linear portion is difficult.

On the other hand, when processing is performed by the positioning operation of the workpiece W of the present invention, as described above, the center position of the notch portion of the workpiece W including the straight portion and the notch in plan view can be detected. In the example shown in FIG. 6 , when the present invention is applied, the measurement point t can be detected as the center position of the notch, and detection can be performed with higher accuracy than the comparative example.

<Other Embodiments>

The idea of the above-described embodiment is not limited to the above-described embodiment. Hereinafter, an example of another embodiment to which the idea of the above-described embodiment can be applied will be described.

In the resin molding system 10 according to the above-described embodiment, the control unit 40 performs the control of the positioning device 10 and the resin molding device 20 . However, the control of the positioning device 10 and the resin molding device 20 does not necessarily need to be performed by the common control unit 40 . For example, the positioning device 10 and the resin molding device 20 may each have a dedicated control unit.

In addition, in the control unit 40 according to the above-described embodiment, step S6 is performed ~ In the process of step S8, the center position of the notch portion of the workpiece W is detected. However, the center position of the notch portion of the workpiece W may be detected by calculating the median C of the rotational angle information of the workpiece W without calculating the average value. For example, control may be performed to detect the center position of the notch portion of the workpiece W based on the number of measurement points in the monotonically decreasing range and the monotonically increasing range of the measurement result acquired from the measuring device 22 .

<Effects of the present embodiment>

The positioning device according to the present embodiment includes: a measuring device for measuring the displacement amount of the peripheral portion of the workpiece W for every fixed rotation angle of the rotating workpiece; , the control unit controls to detect the center position of the notch portion of the workpiece W based on the number of measurement points in at least a part of the first range that monotonically decreases and the second range that monotonically increases of the measurement result. According to this positioning device, the center position of the notch portion of the workpiece W including the straight portion and the notch in plan view can be detected.

As a specific configuration of the positioning device, it is desirable to include a control unit that, when a third range exists between the first range and the second range, is based on at least a part of the first range and the second range. The number of measurement points in the third range is controlled so that the center position of the notch portion of the workpiece W is detected.

As a specific configuration of the positioning device, it is desirable to include a control unit that calculates the average value of the measurement results and detects the median of all the measurement results below the average value as the center position. By making it equal to or less than the average value, it is possible to detect with high accuracy regardless of the size of the workpiece.

In addition, the resin molding system of the present embodiment includes the arrangement by the above-mentioned positioning A resin molding device that performs resin molding by positioning the workpiece. According to such a resin molding system, the center position of the notch portion of the workpiece including the straight portion and the notch in plan view can be detected, and the resin molding of the workpiece with high precision positioning can be performed.

Furthermore, in the manufacturing method of the resin molded article of the present embodiment, the workpiece is resin-molded using the above-described resin molding system. According to the manufacturing method of such a resin molded product, since resin molding of a workpiece with high precision positioning can be performed, a high-quality resin molded product can be manufactured.

Further, the positioning method of the present embodiment includes: a measuring step of rotating the workpiece, and measuring the displacement amount of the peripheral portion of the workpiece every fixed rotation angle; and a detection step of monotonically decreasing based on the measurement result measured in the measuring step The number of measurement points in at least a part of the first range and the monotonically increasing second range detects the center position of the notch portion of the workpiece. With such a positioning method, the center position of the notch portion of the workpiece including the straight portion and the notch in plan view can be detected.

The embodiments of the present invention have been described above as examples. That is, the detailed description and the drawings are disclosed for the illustrative description. Therefore, among the components described in the detailed description and the drawings, components that are not necessary in order to solve the problem may be included. Therefore, since these unnecessary structural elements are described in the detailed description and drawings, it cannot be directly recognized that these unnecessary structural elements are essential.

In addition, the above-mentioned embodiment is only an illustration of this invention in every respect. The above-described embodiments can be variously improved or changed within the scope of the present invention. That is, in carrying out the present invention, a specific structure can be appropriately adopted according to the embodiment.

S1~S8: Steps

Claims (6)

A positioning device, comprising: a measuring device that, in a state where a rotation center position of a workpiece and a rotation axis of a turntable for rotating the workpiece are aligned and centered, the workpiece is rotated at every fixed rotation angle measuring a displacement amount of a peripheral edge portion of the workpiece; and a control portion that controls the measuring device to detect a center position of a notch portion of the workpiece in a first range that decreases monotonically based on the measurement result and the number of measurement points in at least a part of a second range that monotonically increases, the method for detecting the center position of the notch portion of the workpiece is controlled to The range of the displacement amount is decreased, and the monotonically increasing second range is a range in which the displacement amount increases with respect to the increase of the rotation angle. The positioning device of claim 1, wherein there is a third range between the first range and the second range that decreases or increases with respect to the rotation angle without decreasing or increasing the displacement amount In the case of the range, the control unit controls to detect the center position of the notch portion of the workpiece based on at least a part of the first range and the second range and the number of measurement points in the third range . The positioning device according to claim 1, wherein the control unit calculates an average value of the measurement results, and detects a median of all the measurement results below the average value as the center position. A resin molding system includes a resin molding part configured to perform resin molding with the workpiece positioned by the positioning device according to claim 1 or claim 2. A method for producing a resin molded product, wherein the workpiece is resin molded using the resin molding system according to claim 4. A positioning method comprising: a measuring step of rotating the workpiece in a state where the rotation center position of the workpiece and the rotation axis of a turntable for rotating the workpiece are aligned and aligned, and measuring every fixed rotation angle a displacement amount of the peripheral portion of the workpiece; and a detecting step of detecting the workpiece based on the number of measurement points in at least a part of a first range that monotonically decreases and a second range that monotonically increases of the measurement results measured in the measuring step The center position of the notch portion of An increase in the rotation angle increases the range of the displacement amount.

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