CN113547691B

CN113547691B - Positioning device and method, resin molding system, and method for manufacturing resin molded product

Info

Publication number: CN113547691B
Application number: CN202110332590.8A
Authority: CN
Inventors: 谷内口洸; 法兼一贵
Original assignee: Towa Corp
Current assignee: Towa Corp
Priority date: 2020-04-24
Filing date: 2021-03-29
Publication date: 2023-06-13
Anticipated expiration: 2041-03-29
Also published as: TW202208140A; TWI770930B; KR102397599B1; CN113547691A; KR20210131867A; JP7291663B2; JP2021173618A

Abstract

A positioning device and method capable of detecting a straight portion and a notch of a work, a resin molding system, and a method of manufacturing a resin molded product are desired. The positioning device of the present invention comprises: a measuring device for measuring the displacement of the peripheral edge of the workpiece at fixed rotation angles; and a control unit that controls the measuring device to detect the center position of the notch of the workpiece, and controls the measuring device to detect the center position of the notch of the workpiece based on the number of measurement points of at least a part of the monotonically decreasing first region and the monotonically increasing second region of the measurement result.

Description

Positioning device and method, resin molding system, and method for manufacturing resin molded product

Technical Field

The present invention relates to a positioning device, a positioning method, a resin molding system, and a method for manufacturing a resin molded product.

Background

Patent document 1 discloses a method for detecting a position of an orientation flat (hereinafter, referred to as an "orientation flat") of a semiconductor wafer including a straight line portion in a plan view. In the detection method described with reference to fig. 8 of this document, the opposite side outer edge position data corresponding to the outer edge position data is detected from the data of both end portions in the trajectory of the orientation flat portion shown in fig. 8 (a), and each average value is obtained. A mode is detected from the average value, and the alignment of the semiconductor wafer is performed with reference to the center position of the orientation flat.

[ Prior Art literature ]

[ patent literature ]

[ patent document 1] Japanese patent laid-open No. 4-268746

Disclosure of Invention

[ problem to be solved by the invention ]

In patent document 1, detection of an orientation flat portion of a semiconductor wafer is described, but detection of a notch (notch) is not described. On the other hand, a technique capable of detecting a straight portion and a notch of a workpiece is desired.

[ means of solving the problems ]

In order to solve the above problems, a positioning device of the present invention includes: a measuring device for measuring a displacement amount of a peripheral edge portion of a rotating workpiece at fixed rotation angles; and a control unit that controls the measuring device to detect a center position of the notch portion of the workpiece. The control unit is configured to: the center position of the notch of the workpiece is detected and controlled so that the number of measurement points of at least a part of the first area and the second area which monotonically decrease based on the measurement result is increased.

The positioning method of the invention comprises the following steps: a measurement step of rotating a workpiece and measuring a displacement amount of a peripheral edge portion of the workpiece at fixed rotation angles; and a detection step of detecting the center position of the notch of the workpiece based on the number of measurement points of at least a part of the monotonically decreasing first region and the monotonically increasing second region of the measurement result measured in the measurement step.

The resin molding system of the present invention includes a resin molding device that performs resin molding by disposing the work positioned by the positioning device.

In the method for producing a resin molded article of the present invention, the work is resin molded using the resin molding system.

[ Effect of the invention ]

According to the present invention, a positioning device, a positioning method, a resin molding system, and a method for manufacturing a resin molded article, which are capable of detecting the center position of a notch portion of a workpiece including a straight portion and a notch in a plan view, can be provided.

Drawings

Fig. 1 is a diagram schematically showing the structure of a resin molding system according to the present embodiment.

Fig. 2 (a) and 2 (b) are a plan view and a side view schematically showing the positioning device of the present embodiment.

Fig. 3 is a flowchart showing a method for positioning a workpiece according to the present embodiment.

Fig. 4 (a) and 4 (b) are diagrams showing measurement data of the positioning method of the workpiece according to the present embodiment and the comparative example.

Fig. 5 is a flowchart showing a method of positioning a workpiece in the comparative example.

Fig. 6 (a) and 6 (b) are diagrams showing measurement data of the positioning method of the workpiece according to the present embodiment and the comparative example.

[ description of symbols ]

10: resin molding system

20: positioning device

30: resin molding device

40: control unit

21: rotary table

22: measuring device

A: average value of displacement

C: center measuring point

E: measurement range

P: rotary shaft

R: third region

S1-S8, C1-C6: step (a)

W: workpiece

s, t, u, v: measuring point

Detailed Description

< one embodiment of the invention >

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Moreover, the same or corresponding portions in the drawings are denoted by the same reference numerals and the description thereof will not be repeated.

Structure of resin Molding System 10

The basic structure of resin molding of the resin molding system 10 according to the present embodiment will be described below.

Fig. 1 is a diagram schematically showing the structure of a resin molding system 10 according to the present embodiment. The resin molding system 10 is configured to manufacture a resin molded article by using a so-called compression molding method (compression mold). As shown in fig. 1, the resin molding system 10 includes a positioning device 20, a resin molding device 30, and a control unit 40.

The positioning device 20 includes a rotary table 21 and a measuring instrument 22. The positioning device 20 positions the workpiece W, for example, as will be described later. Examples of the work W include a semiconductor substrate such as a silicon wafer, a lead frame, a printed wiring board, a metal substrate, a resin substrate, a glass substrate, and a ceramic substrate. The substrate W may be a carrier for a fan-out wafer level package (Fan Out Wafer Level Packaging, FOWLP) or a fan-out panel level package (Fan Out Panel Level Packaging, FOPLP). Further, the work may be a work to which wiring has been already performed, or may be a work to which wiring has not been performed.

The resin molding apparatus 30 includes a molding die (not shown) and a clamping mechanism (not shown) for clamping the molding die. In the resin molding device 30, for example, the work W positioned by the positioning device 20 is resin molded.

The control unit 40 includes a central processing unit (Central Processing Unit, CPU), a random access Memory (Random Access Memory, RAM), a Read Only Memory (ROM), and the like, and is configured to control each component according to information processing. The control unit 40 is configured to control at least the positioning device 20, and in the present embodiment, is also configured to control the resin molding device 30.

Operation of resin Molding System 10

The basic operation of resin molding in the resin molding system 10 according to the present embodiment will be described below.

The work W carried into the resin molding system is placed on the turntable 21 of the positioning device by a robot hand or the like (not shown). The work W positioned by the positioning device is transferred to a conveying mechanism (not shown) by a robot or the like, the work W is conveyed to a molding die of a resin molding device by the conveying mechanism, and the molding die is clamped by a clamping mechanism to perform resin molding, thereby producing a resin molded product.

Structure of positioning portion 20 of workpiece W

Fig. 2 (a) and 2 (b) are diagrams schematically showing the positioning device 20, fig. 2 (a) is a plan view, and fig. 2 (b) is a side view. As shown in fig. 2 (a) and 2 (b), the positioning device 20 includes a turntable 21 and a measuring instrument 22.

The turntable 21 is configured to rotate around a rotation axis P. A workpiece W is disposed above the rotating portion 21. The turntable 21 can be rotated by a motor, for example. The turntable 21 can, for example, adsorb and fix the workpiece W.

The measuring device 22 is configured to measure the displacement of the peripheral edge portion of the workpiece W disposed on the turntable 21. An example of the measuring instrument 22 includes an optical sensor, and more specifically, a laser displacement meter.

< action of positioning device 20 of workpiece W >

The basic operation of the positioning device 20 according to the present embodiment will be described below.

Fig. 3 is a flowchart of the positioning operation of the workpiece W by the positioning device 20. The processing shown in this flowchart is executed by the control unit 40 included in the resin molding system 10, for example. The positioning device 20 may include a control unit 40.

Referring to fig. 2 (a) and 2 (b), the control unit 40 aligns the workpiece W with the rotation axis P of the turntable 21 by locating the rotation center position of the workpiece W on the turntable 21 by a robot or the like (step S1). For this, a known method can be used. For example, the workpiece W is placed on the turntable 21 and rotated at a fixed rotation speed in an eccentric state, and the eccentric amount between the center of the workpiece W and the rotation axis P of the turntable 21 is obtained from the output of the displacement amount of the measuring instrument 22. Based on this amount of eccentricity, the workpiece W is rearranged on the turntable 21.

The control unit 40 starts rotation of the turntable 21 at a fixed rotation speed (step S2). The rotational speed is lower than the rotational speed in the step S1 of centering.

The control unit 40 acquires the displacement amount of the peripheral edge portion of the workpiece W placed on the turntable 21 from the measuring instrument 22 at fixed time intervals (step S3). After the completion of the displacement acquisition, the control unit 40 stops the turntable 21 (step S4). The measurement range E of the displacement amount obtained from the measuring instrument 22 in step S3 may be set based on the result in step S1 of the above-described centering.

Fig. 4 (a) and 4 (b) are diagrams showing the output from the measuring instrument 22 in step S3, and step S3 obtains the displacement amount of the positioning operation performed by the positioning device 20 on the workpiece W. In the graph, the vertical axis represents the displacement amount obtained from the measuring device 22, the horizontal axis represents the rotation angle calculated from the rotation speed of the turntable 21, and the units of the vertical axis and the horizontal axis are arbitrary. Here, as the workpiece W, a workpiece W including a straight line portion in a plan view is used, and as the measurement range E, a center position of the straight line portion is set in advance. Fig. 4 (b) is an enlarged view of the vicinity of the center position of the straight portion of the workpiece W in fig. 4 (a). The displacement amounts of the vertical axes in fig. 4 (a) and 4 (b) are values corresponding to the distance from the rotation center of the workpiece W to the peripheral edge portion.

In the graphs shown in fig. 4 (a) and 4 (b), a represents an average value of the displacement amounts obtained from the measuring device 22, N represents the number of measurement points, and C represents a measurement point located at the center among measurement points equal to or smaller than the average value a of the displacement amounts. The center measurement point C is the same number of points as N1 and N2.

Referring to fig. 4 (a) and 4 (b), the control unit 40 calculates an average value a of all data of the displacement amount obtained from the measuring instrument 22 by the process of step S3 of obtaining the displacement amount (step S5). The control unit 40 extracts a measurement point of the displacement amount equal to or smaller than the calculated average value a (step S6). The control unit 40 calculates a center measurement point C at which the rotation angle is centered on the extracted measurement point (step S7), and detects the center measurement point C as the center position of the notch of the workpiece W (step S8). In the case where the measurement points below the average value a are odd, the central measurement point C is 1 point, and in the case where the measurement points below the average value a are even, the central measurement point C is 2 points, and therefore any 1 point can be detected as the central position, or the central position between the 2 points can be detected as the central position.

In fig. 4 (a) and 4 (b), data for detecting the center position of the straight portion of the workpiece W including the straight portion in plan view is shown, but the center position of the notch of the workpiece W may be detected by the same processing of steps S1 to S8. In the example of fig. 4 (a) and 4 (b), the center is obtained from the measurement point below the average value a, but in fig. 4 (a), the center measurement point C serving as the center may be obtained in a region below a straight line intersecting both the horizontal direction of the curve in which the output value (measurement value) monotonically decreases and the curve in which the output value monotonically increases.

In the examples of fig. 4 (a) and 4 (b), a third region R exists between the first region where the output value (measured value) monotonically decreases and the second region where the output value monotonically increases. In this case, the center measurement point C may be obtained from a measurement point of a fixed value or less such as the average value a of the first and second regions and a measurement point of the third region R. The region shown in fig. 4 (b) is a third region R.

After the above-described operation of the positioning device 20 on the workpiece W, the workpiece W after positioning is transferred to the conveying mechanism by the robot or the like, and the workpiece W is conveyed to the molding die of the resin molding device by the conveying mechanism, as described above. Then, the molding die is clamped by a clamping mechanism and resin molding is performed, whereby a resin molded article can be produced.

Comparative example >

Fig. 5 is a flowchart of the positioning operation of the workpiece W of the comparative example, and corresponds to fig. 3. Furthermore, the basic structure of the positioning device is the same as that of the present invention.

In fig. 5, steps C1 to C3 are the same as steps S1 to S3 in fig. 3, and therefore, the description thereof is omitted. In the comparative example, the output of the displacement amount from the measuring instrument 22 is sequentially obtained, and the displacement amount is compared between the measurement points obtained after the second time and the measurement points obtained immediately before the second time. In the following description, the expression "this time" is used for the measurement point or the displacement amount that has just been obtained, and the expression "last time" is used for the measurement point or the displacement amount that has been obtained immediately before.

The control unit 40 compares the displacement amount of the peripheral edge portion of the workpiece W acquired from the measuring instrument 22 with the previous displacement amount for the measurement points acquired after the second time, and returns to step C3 if the displacement amount acquired this time is smaller than the previous displacement amount. (step C4)

In step C4, if the current acquired displacement is equal to or larger than the previous displacement, the control unit 40 sets the previous displacement as the minimum displacement, and stops the turntable 21 (step C5). The control unit 40 detects the point of measurement of the minimum displacement as the center position of the notch of the workpiece W (step C6). In step C2 and step C5, the rotation may be stopped after the rotation by a predetermined angle. In addition, step C6 may be performed without waiting for the rotation of step C5 to stop.

Fig. 6 (a) and 6 (b) correspond to fig. 4 (a) and 4 (b), and are diagrams of the output from the measuring instrument 22 in step C3 of the positioning operation of the workpiece W in the comparative example. Fig. 6 (b) is an enlarged view of the vicinity of the center position of the notch of the workpiece W in fig. 6 (a).

In steps C3 to C4 of the positioning operation of the workpiece W of the comparative example, when the center position of the notch is detected, the processing is performed as follows. Referring to fig. 6 (b), the control unit 40 obtains a measurement point t from the measuring instrument 22. When comparing the last measurement point s with the measurement point t obtained this time, the measurement point t obtained this time is equal to the last measurement point s, and therefore the last measurement point s is regarded as the minimum displacement amount, and the measurement point s is detected as the center position of the notch portion of the workpiece W.

In the positioning operation of the workpiece W of the comparative example, for example, as shown in fig. 6 (b), when the minimum displacement amount is 3 points, the measurement point s measured first is detected as the center position of the notch portion of the workpiece W. Therefore, a position slightly away from the original center position of the notch portion of the workpiece W, that is, the position of the measurement point t is regarded as the center position of the notch portion of the workpiece W.

In addition, when the center position of the orientation flat is detected by the positioning operation of the workpiece W of the comparative example, the processing is performed as follows. Referring to fig. 4 (b), the control unit 40 obtains a measurement point v from the measuring instrument 22. When the control unit 40 compares the previous measurement point u with the measurement point v acquired this time, the measurement point v acquired this time is larger than the previous measurement point u, and therefore the previous measurement point u is regarded as the minimum displacement amount, and the measurement point u is detected as the center position of the notch portion of the workpiece W. Therefore, measurement and acquisition of the displacement amount and rotation angle information are completed before the center measurement point C, which is the center position of the true notch, is detected.

Therefore, although the positioning operation of the workpiece W of the comparative example is inferior to the above-described present embodiment in accuracy, the detection of the center position of the notch can be performed, but it is difficult to perform the detection of the center position of the straight line portion.

On the other hand, when processing is performed by the positioning operation of the workpiece W according to the present invention, as described above, the center position of the notch portion of the workpiece W including the straight portion and the notch in a plan view can be detected. In the case of the example shown in fig. 6, when the present invention is applied, the measurement point t can be detected as the center position of the notch, and detection with higher accuracy can be performed than in the comparative example.

< other embodiments >

The idea of the above embodiment is not limited to the above-described embodiment. Hereinafter, an example of another embodiment to which the idea of the above embodiment can be applied will be described.

In the resin molding system 10 according to the above embodiment, the control unit 40 controls the positioning device 10 and the resin molding device 20. However, the control of the positioning device 10 and the resin molding device 20 does not necessarily need to be performed by the common control unit 40. For example, the positioning device 10 and the resin molding device 20 may each have a dedicated control unit.

In the control unit 40 according to the above embodiment, the processing from step S6 to step S8 is performed, and the center position of the notch of the workpiece W is detected. However, the center position of the notch portion of the workpiece W may be detected by calculating the median C of the rotation angle information of the workpiece W without calculating the average value. For example, control may be performed as follows: the center position of the notch of the workpiece W is detected based on the number of monotonically decreasing areas and monotonically increasing measurement points of the measurement result obtained from the measuring device 22.

Effect of the present embodiment >

The positioning device of the present embodiment includes: a measuring device for measuring the displacement of the peripheral edge of the workpiece at fixed rotation angles of the rotating workpiece W; and a control unit that controls the measuring device to detect the center position of the notch of the workpiece W, the control unit controlling the measuring device in the following manner: the center position of the notch portion of the workpiece W is detected based on the number of measurement points of at least a part of the monotonically decreasing first region and the monotonically increasing second region of the measurement result. In the case of this positioning device, the center position of the notch portion of the workpiece W including the straight portion and the notch in a plan view can be detected.

As a specific configuration of the positioning device, it is preferable that the positioning device includes a control unit that controls the center position of the notch of the workpiece W so as to be detected based on the number of measurement points of at least a part of the first region and the second region and the third region when the third region exists between the first region and the second region.

As a specific configuration of the positioning device, it is preferable to include a control unit that calculates an average value of measurement results and detects a median of all measurement results equal to or less than the average value as a center position. By setting the average value or less, it is possible to detect the workpiece with high accuracy regardless of the size of the workpiece.

The resin molding system according to the present embodiment includes a resin molding device for performing resin molding by disposing the work positioned by the positioning device. With such a resin molding system, the center position of the notch portion of the work including the straight portion and the notch in a plan view can be detected, and resin molding of the work can be performed with high accuracy.

Further, in the case of the method for producing a resin molded article according to the present embodiment, the workpiece is resin molded using the resin molding system described above. In the case of such a method for producing a resin molded article, since resin molding of a work piece can be performed with high accuracy in positioning, a high-quality resin molded article can be produced.

In addition, the positioning method of the present embodiment includes: a measurement step of rotating the workpiece and measuring the displacement of the peripheral edge of the workpiece at fixed rotation angles; and a detection step of detecting the center position of the notch of the workpiece based on the number of measurement points of at least a part of the monotonically decreasing first region and the monotonically increasing second region of the measurement result measured in the measurement step. With this positioning method, the center position of the notch portion of the workpiece including the straight portion and the notch in a plan view can be detected.

The embodiments of the present invention have been described above by way of example. That is, the detailed description and the accompanying drawings are disclosed for illustrative purposes. Therefore, the components described in the detailed description and the drawings may include unnecessary components in order to solve the problem. Therefore, these unnecessary components are not described in the detailed description and drawings, but are not directly considered to be necessary.

The above-described embodiments are merely examples of the present invention in all aspects. The above-described embodiments can be variously modified or changed within the scope of the present invention. That is, in carrying out the present invention, a specific structure may be appropriately adopted according to the embodiment.

Claims

1. A positioning device, comprising:

a measuring device for measuring a displacement amount of a peripheral edge portion of a workpiece at fixed rotation angles of the rotating workpiece in a state where a rotation center position of the workpiece is aligned with a rotation axis of a turntable for rotating the workpiece; and

a control part for controlling the measuring device to detect the center position of the notch part of the workpiece, and

the control unit controls the number of measurement points of at least a part of the first area and the second area which monotonically decrease based on the measurement result of the measuring device to detect the center position of the notch of the workpiece,

the control unit calculates an average value of the measurement results, and detects a median of all the measurement results equal to or less than the average value as the center position.

2. The positioning device according to claim 1, wherein when a third region is present between the first region and the second region, the control unit controls the positioning device so as to detect a center position of the notch of the workpiece based on the number of measurement points of at least a part of the first region and the second region and the third region.

3. A resin molding system comprising a resin molding portion that performs resin molding by disposing the work positioned by the positioning device according to claim 1 or 2.

4. A method for producing a resin molded article, wherein the workpiece is resin molded using the resin molding system according to claim 3.

5. A positioning method, comprising:

a measurement step of rotating a work in a state where a rotation center position of the work is aligned with a rotation axis of a turntable that rotates the work, and measuring a displacement amount of a peripheral edge portion of the work at fixed rotation angles; and

and a detection step of detecting a center position of a notch of the workpiece based on the number of measurement points of at least a part of the monotonically decreasing first region and the monotonically increasing second region of the measurement result measured in the measurement step, calculating an average value of the measurement result, and detecting a median of all the measurement results equal to or less than the average value as the center position.