CN114308562B - Method and device for measuring adhesive dispensing head position control in adhesive dispensing process of quartz crystal resonator - Google Patents
Method and device for measuring adhesive dispensing head position control in adhesive dispensing process of quartz crystal resonator Download PDFInfo
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Abstract
A quartz crystal resonator dispensing machine comprises a horizontally arranged rotary worktable, a plurality of carriers for carrying a base and a wafer are uniformly distributed in the circumferential direction of a wheel disc, and a base loading station, a first dispensing station, a wafer loading and picking station, a second dispensing station and a discharging station are sequentially arranged along the circumference of the wheel disc; a glue dispenser is arranged at the glue dispensing station; sorting the bases subjected to the first dispensing by a wafer loading and picking station, unloading waste products, and loading wafers on qualified products; a high-speed profile scanner is arranged between every two adjacent stations, so that accurate profiles of the surfaces of the carriers are obtained for dispensing, loading wafers and discharging, and the processing accuracy and the working reliability of the dispenser are improved. The invention also discloses a device for implementing the measuring method for controlling the dispensing head position in the dispensing process of the quartz crystal resonator.
Description
Technical Field
The invention relates to a method and a device for measuring the position control of a dispensing head in a dispensing process of a quartz crystal resonator.
Background
A quartz crystal resonator is an electronic component for generating an oscillation signal, and is widely used in various aspects of life today with advanced information. The miniaturization and high precision of modern electronic components are advancing, which puts higher demands on the manufacturing process of quartz crystal resonators.
The manufacturing process of the quartz crystal resonator comprises cutting, silver plating, glue dispensing, testing, sealing and welding, sealing and checking, aging and marking and packaging. The glue dispensing is a vital procedure in the production of the quartz crystal resonator, the quartz crystal is fixedly connected on the base by the conductive adhesive, meanwhile, the conductive adhesive also plays a role in communicating a plated electrode on the surface of the quartz crystal with a base circuit, and the glue dispensing of the quartz crystal resonator in the prior art is completed by a glue dispenser.
The working schematic diagram of the dispenser is shown in fig. 1, a rotary worktable is arranged on a working base surface of the dispenser, a plurality of carriers symmetrically arranged along the circumference of the rotary worktable are arranged on the rotary worktable, and a concave groove on each carrier is used for carrying a quartz crystal base. Different working units are installed above the rotary working table, the working units are divided into a fixed type (height measuring unit and photographing unit) and a movable type (glue dispensing unit and goods loading and unloading unit), the rotary working table is rotated, and the carriers are rotated to the lower parts of the different working units to complete processing procedures in the working flow of the glue dispenser.
The existing dispenser has the working procedures of carrying a base, measuring height, photographing, dispensing, carrying a wafer, dispensing for the second time, photographing for the second time, checking for the second time and the like, each working procedure is completed by a working unit above a rotary worktable, and a complete working procedure is formed from carrying the base to a carrier to outputting a finished product. Usually, one to three sets of work processes can be completed on one dispenser, and correspondingly, increasing one more set of work process can increase the number of carriers on the rotary table, and in order to arrange so many work units, the diameter of the rotary table is often relatively large.
In the whole processing flow, height measurement and photographing are the basis for dispensing and carrying the wafer, and data information obtained by the height measurement and the photographing influences the processing precision. The height measuring unit measures the distance between the surface of the carrier and the height measuring laser head, the photographing unit photographs the plane arrangement condition of the carrier, and the industrial personal computer calculates the plane distance of the moving unit through the photographed photographs and judges the effects of glue dispensing and carrying units. When the dispensing machine works, the working mode of taking the height measurement and the photographing as the basis for controlling the movement working unit has the following defects:
1. the glue dispenser starts to work, the height is measured after the carrier is carried to the base, the distance from the laser head to a certain point on the surface of the base is measured, and when the base is not carried successfully on the carrier or the base has a certain inclination after being carried, the carrying condition of the base cannot be reflected through the height measurement of one point.
2. After the first dispensing, the dispensing effect is determined according to the photo shot by the photographing unit, the photo can only provide the information of the dispensing position and other planes, and the height information of the dispensing point and other height information is lost. When the two glue points are not parallel in height, the working effect of the resonator is influenced by the wafer inclination phenomenon after the wafer is carried, and the actual glue dispensing effect is not reliable enough according to the photo evaluation.
3. When a wafer is carried on the base, the wafer is carried on the glue points on the base, the contact between the glue points and the wafer is only half of the top surface of the glue points, the glue points are connected with the first glue points by the second glue point to solidify the wafer, as shown in figure 2, the wafer is inclined under the influence of self-weight,
the tilt of the wafer cannot be obtained by photographing alone.
In addition, the rotary worktable can generate errors such as axial movement during working, the height of the rotary worktable is a real-time changing value, the existing dispensing machine is only provided with a height measuring unit, a plurality of working positions are arranged between the dispensing position and the height measuring position, and the dispensing height is distorted due to the fact that the dispensing working unit uses height data measured at the height measuring position.
The high-speed profile scanner uses the laser triangulation principle to perform two-dimensional profile scanning on the surfaces of different measured objects. The laser beam is magnified by a group of special lenses to form a static laser line which is projected on the surface of the measured object. A high quality optical system projects the diffuse reflected light of the laser line onto a highly sensitive sensor photosensitive matrix. In addition to the sensor-to-object distance information (Z-axis), the controller can also calculate the position along the laser line (x-axis) from the set of images. The sensor finally outputs a set of two-dimensional coordinate values, and the origin of the coordinate system is fixed relative to the sensor. By moving the object to be measured or the sensor, a three-dimensional measurement result can be obtained. A schematic view of the measurement of the high-speed profile scanner in the plane of the carrier is shown in fig. 3.
Disclosure of Invention
The present invention overcomes the above-mentioned shortcomings of the prior art, and provides a method and a device for measuring the position control of a dispensing head during dispensing of a quartz crystal resonator.
A quartz crystal resonator glue dispenser comprises a horizontally arranged rotary workbench, the rotary workbench rotates around a vertical central shaft at a constant speed, a plurality of carriers are uniformly distributed in the circumferential direction of a wheel disc, the carriers are used for carrying a base and a wafer, and a base loading station, a first glue dispensing station, a wafer loading and picking station, a second glue dispensing station and a discharging station are sequentially arranged along the circumference of the wheel disc; and a high-speed profile scanner is arranged between every two adjacent stations. The first dispensing station and the second dispensing station are both provided with a dispensing machine, and the dispensing machine comprises a dispensing head and a dispensing arm for driving the dispensing head to move in the vertical direction; sorting the base subjected to the first dispensing by a wafer loading and picking station, unloading waste products and loading wafers on qualified products;
the measuring range of the high-speed profile scanner is set as the distance from the high-speed profile scanner to the surface of the carrier, when the surface of the carrier is away from a laser line of the profile scanner, the surface of the rotary worktable is measured by the profile scanner and is limited by the measuring range of the profile scanner, and no data is measured at the moment; the laser line of the high-speed profile scanner is arranged along the radial direction of the rotary worktable;
when the carrier rotates from a previous station to a next station, the rotation of the rotary worktable rotates at a constant speed, and the high-speed profile scanner is used for measuring the plane arrangement condition and the vertical height of components such as a base or a wafer and the like on the carrier; sorting the base subjected to the first dispensing by a wafer loading and picking station, unloading waste products and loading wafers on qualified products; the control end and the data transmission end of the equipment on each station are connected with an industrial personal computer;
the method comprises the following steps:
step 1) before first dispensing, height information of all points on the upper surface of a carrier is measured by a first high-speed profile scanner, and after processing by an industrial personal computer, the distance between the surface of the carrier and the scanner is obtained and the profile of the upper surface of the carrier is generated, wherein the profile information of a base is included; during dispensing, the distance of the dispensing arm moving up and down, left and right is obtained according to the generated profile information and height information;
step 2) before carrying the wafer, height information of all points on the upper surface of the carrier is measured by a second high-speed profile scanner, and after the height information is processed by an industrial personal computer, the distance between the surface of the carrier and the scanner is obtained and the profile of the upper surface of the carrier is generated, wherein the profile information after base dispensing is included; the industrial personal computer judges whether the dispensing effect meets the standard or not according to the measured information, and the measured information is processed by the industrial personal computer to obtain the distance of the vertical movement of the loading and unloading mechanical arm when the wafer is carried;
and 3) measuring height information of all points on the upper surface of the carrier by using a third high-speed profile scanner before the second dispensing, processing by using an industrial personal computer, obtaining the distance from the surface of the carrier to the scanner and generating the profile of the upper surface of the carrier, wherein the profile information after the wafer is carried by the base is included. The industrial personal computer judges whether the effect carried by the wafer meets the standard or not according to the measured information, and the measured information is processed by the industrial personal computer to obtain the distance of the up-down and left-right movement of the dispensing arm during the second dispensing;
and 4) measuring the height information of all points on the upper surface of the carrier after the second dispensing of the base by using a fourth high-speed contour scanner before unloading, generating contour information according to the measured information and judging the effect of the second dispensing.
Preferably, in the steps (1) to (4), the industrial personal computer corrects the point cloud data acquired by the high-speed laser scanner, eliminates the distortion of the plane profile of the measured object, and specifically comprises:
1) Data of the outer side of the tested piece far away from the axis of the rotary table are reserved, data far away from the side are subjected to multiplying power reduction, the reduction multiplying power is the length ratio of each row of data to the data of the outer side, the length of each row of reserved data is the same as that of the data of the outer side after reduction is finished, and the length of each row of data is the same after reduction is finished;
2) And aligning the reduced data, taking the line data at the middle of the point cloud data as a reference, and aligning the line data far away from the middle line with the other line data one by one from the first data in each line.
By carrying out scaling and alignment processing on the point cloud data, the length of each row and each column of the processed point cloud data can be aligned, and at the moment, a plane contour is regenerated according to the processed point cloud data, and the contour is a measured piece plane contour with real proportion.
The laser profile scanner is used for scanning the carrier, and the generated profile data is influenced by the relative motion between the laser line of the scanner and the tested piece. When the moving direction of the measured piece is vertical to the laser line, the measured data can be directly generated into the profile of the measured object. The measured piece is a carrier positioned on a rotary workbench, the arrangement of a laser line of a profile scanner is overlapped with the radius of a back-loading workbench, and the profile of the measured piece is distorted due to the fact that the profile is directly generated according to data measured by the scanner aiming at the movement mode of the measured piece, and correction processing needs to be carried out on the measured data of the measured piece.
When the dispenser works, the rotary table rotates at a constant speed, the profile scanner is fixed, and after a carrier enters the measurement range of the scanner, the carrier starts to enter the measurement from one corner close to the middle axis of the rotary table. In fig. 5, let s be the distance between the carrier and the middle axis of the rotary table, y be the width of the carrier, x be the length of the carrier, the rotary table rotates at a constant speed, ω be the rotation speed, θ be the angle formed by the side of the carrier near the axis and the center of the rotary table 1 (= 2arctan (y/2 (x + s)), and an angle theta formed by a side line of the carrier far away from the center of the rotary table and the center of the rotary table 1 =2arctan (y/2 s), when one corner of the carrier enters the measuring range, the distance from the measuring point to the axis of the rotary table is s 1 ＝y/2sin(θ 2 And/2), when the carrier is rotated to the width side to be perpendicular to the radius of the rotary table, the distance between the carrier and the center of the rotary table is s, the error of the measured profile of the carrier in the width direction is Δ s, and Δ s = s1-s, when the measurement precision of the laser line (x axis) of the scanner is a, the line data in the middle section in the measured data of the scanner deviates from the line data in the front and the last by Δ s/a. CarrierThe time which is measured from the beginning to the end and is close to one side of the central axis of the rotary table is t 1 ＝θ 1 And omega, the measurement time of the side line of the carrier far away from the middle axis of the rotary table is t 2 ＝θ 2 Omega, the measuring sampling frequency of the high-speed profile scanner is f, and the number of the sampling points on the inner edge and the outer edge of the carrier is t respectively 1 X f and t 2 Xf, the number of samples is gradually reduced along the carrier width direction. Taking the outline scanner 4 as an example, the arrangement of the point cloud data measured by the scanner 4 is shown in fig. 6, in order to make the length of the data in the first row and the last row the same, and to retain the measured data to the maximum extent, the data at the side close to the axis of the rotary table is retained, the data far from this side is reduced in magnification, the reduction magnification is the data length ratio of each row of data to the data at the last side, after reduction, the length of each row of data can be made the same as the length of the data in the last row, after reduction, the length of each row of data is the same, at this time, the data after reduction needs to be aligned, the data at the middle of the point cloud data is used as a reference, the data in the middle of the point cloud data is further aligned with the data in the middle of the other rows, and each row of data is aligned with the data in the middle of the middle row one by one from the first data. By carrying out scaling and alignment processing on the point cloud data, the length of each row and each column of the processed point cloud data can be aligned, and at the moment, a plane contour is regenerated according to the processed point cloud data, and the contour is a real-scale plane contour.
The invention also comprises a device for implementing the measuring method for controlling the dispensing head position in the dispensing process of the quartz crystal resonator, which comprises a horizontally arranged rotary worktable, wherein the rotary worktable rotates around a vertical central shaft at a constant speed, a plurality of carriers are uniformly distributed in the circumferential direction of the wheel disc, the carriers are used for carrying the base and the wafer, and a base loading station, a first dispensing station, a wafer loading and picking station, a second dispensing station and a discharging station are sequentially arranged along the circumference of the wheel disc; and a high-speed profile scanner is arranged between every two adjacent stations. The first dispensing station and the second dispensing station are both provided with a dispensing machine, and the dispensing machine comprises a dispensing head and a dispensing arm for driving the dispensing head to move in the vertical direction; sorting the base subjected to the first dispensing by a wafer loading and picking station, unloading waste products and loading wafers on qualified products;
the measuring range of the high-speed profile scanner is set as the distance from the high-speed profile scanner to the surface of the carrier, when the surface of the carrier is away from a laser line of the profile scanner, the surface of the rotary worktable is measured by the profile scanner and is limited by the measuring range of the profile scanner, and no data is measured at the moment; the laser line of the high-speed profile scanner is arranged along the radial direction of the rotary worktable;
when the carrier rotates from a previous station to a next station, the rotation of the rotary worktable rotates at a constant speed, and the high-speed profile scanner is used for measuring the plane arrangement condition and the vertical height of components such as a base or a wafer and the like on the carrier; sorting the base subjected to the first dispensing by a wafer loading and picking station, unloading waste products and loading wafers on qualified products; the control end and the data transmission end of the equipment on each station are connected with an industrial personal computer;
a first high-speed contour scanner arranged in front of the first dispensing station measures height information of all points on the upper surface of the carrier, and after the height information is processed by an industrial personal computer, the distance between the surface of the carrier and the scanner is obtained and a contour of the upper surface of the carrier is generated, wherein the contour information of the base is included; during dispensing, the distance of the dispensing arm moving up and down, left and right is obtained according to the generated profile information and height information;
a second high-speed profile scanner arranged in front of the wafer loading and picking station measures height information of all points on the upper surface of the carrier, and after the height information is processed by an industrial personal computer, the distance between the surface of the carrier and the scanner is obtained and the profile of the upper surface of the carrier is generated, wherein the profile information after the base is glued is included; the industrial personal computer judges whether the dispensing effect meets the standard or not according to the measured information, and the measured information is processed by the industrial personal computer to obtain the distance of the vertical movement of the loading and unloading mechanical arm when the wafer is carried;
a third high-speed profile scanner arranged in front of the second dispensing station measures height information of all points on the upper surface of the carrier, and the height information is processed by an industrial personal computer to obtain the distance from the surface of the carrier to the scanner and generate the profile of the upper surface of the carrier, wherein the profile information after the wafer is carried by the base is included; the industrial personal computer judges whether the effect carried by the wafer meets the standard or not according to the measured information, and the measured information is processed by the industrial personal computer to obtain the distance of the vertical and horizontal movement of the dispensing arm during the second dispensing;
and a fourth high-speed profile scanner arranged in front of the unloading station measures the height information of all points on the upper surface of the carrier after the second dispensing of the base, generates profile information according to the measured information and judges the effect of the second dispensing.
Preferably, the industrial personal computer comprises a plane profile distortion correction module of the measured piece, and the plane profile distortion correction module of the measured piece performs the following processing on point cloud data transmitted by each high-speed profile scanner:
data of the outer side of the tested piece, which is far away from the axis of the rotary table, is reserved, data far away from the side is subjected to multiplying power reduction, the reduction multiplying power is the length ratio of each row of data to the data of the outer side, the length of each row of reserved data is the same as that of the data of the outer side after reduction, and the length of each row of data is the same after reduction is finished;
and aligning the reduced data, taking the line data at the middle of the point cloud data as a reference, and aligning the other line data far away from the middle line one by one with the middle line data from the first data in each line.
The point cloud data are zoomed and aligned, the length of each row and each column of the processed point cloud data can be aligned, and at the moment, a plane contour is regenerated according to the processed point cloud data, and the contour is the plane contour of the measured piece with the real proportion.
The invention has the advantages that: 1. the distance from each point on the plane information and the base plane carried by the base to the scanner is accurate and knowable, and when the base is inclined, the measured height information also has reference value. 2. After the first dispensing, the positions and heights of the dispensing can be measured, and the wafer inclination caused by the difference of the heights of the two dispensing points can be avoided. 3. Even if the wafer is tilted by its own weight after the wafer is mounted, the scanner can obtain the tilt degree of the wafer, thereby determining whether the wafer is failed due to the tilt. In addition, by combining all the profile scanner information arranged by the invention and comparing the height data of the carrier plane, whether the rotary worktable moves in the working process can be detected, and after certain movement occurs, a mechanical arm or a dispensing arm of the working unit can take certain data compensation measures to eliminate the movement precision error caused by the movement. In conclusion, the arrangement condition of the invention can greatly improve the processing accuracy and the working reliability of the dispenser.
Drawings
Fig. 1 is a schematic view of the working principle of the existing dispenser.
FIG. 2 is a schematic view showing a state where a wafer is mounted on a susceptor.
Fig. 3 is a measurement schematic of a high-speed profile scanner.
Fig. 4 is a layout diagram of the stations of the present invention.
FIG. 5 is a schematic of the calculations of the present invention.
FIG. 6 is a schematic view of the data processing for correcting the plane profile of the measured object according to the present invention.
Detailed Description
The following describes the technical solution of the present invention in detail with reference to fig. 4, 5, and 6.
The quartz crystal resonator glue dispenser comprises a horizontally arranged rotary worktable, wherein the rotary worktable rotates around a vertical central shaft at a constant speed, a plurality of carriers are uniformly distributed on the periphery of the rotary worktable and used for carrying a base and a wafer, and a base loading station, a first glue dispensing station, a wafer loading and picking station, a second glue dispensing station and a discharging station are sequentially arranged along the circumference of a wheel disc; a high-speed profile scanner is arranged between every two adjacent stations; the first dispensing station and the second dispensing station are both provided with a dispensing machine, and the dispensing machine comprises a dispensing head and a dispensing arm for driving the dispensing head to move in the vertical direction; sorting the base subjected to glue dispensing at a loading and picking station, unloading waste products and loading wafers on qualified products; the control end and the data transmission end of the equipment on each station are connected with an industrial personal computer;
the measuring range of the high-speed profile scanner is set as the distance from the high-speed profile scanner to the carrier, when the surface of the carrier is away from the laser line of the profile scanner, the surface of the rotary table is measured by the profile scanner, the measuring range of the profile scanner is limited, and no data can be measured at the moment.
When the carrier rotates from one station to the next station, the rotary worktable rotates at a constant speed, and the contour scanner is used for measuring the plane arrangement condition and the vertical height of components such as a base or a wafer and the like on the carrier; sorting the bases subjected to the first dispensing at a loading and picking station, unloading waste products, and loading wafers on qualified products; the control end and the data transmission end of the equipment on each station are connected with an industrial personal computer;
the implementation of the invention needs to comprise the following steps:
step 1) when a base is carried on a carrier, a first profile scanner is used for measuring the horizontal arrangement condition of the plane of the carrying base on the carrier and the heights of all points on the plane before first dispensing, and the measured information is processed by an industrial personal computer and then used as the distance of horizontal movement and the distance of vertical movement of a dispensing head when dispensing.
Step 2) before carrying the wafer, a second profile scanner is used for measuring the horizontal arrangement condition of the base after dispensing and the heights of all points on the plane, and whether the dispensing effect meets the standard or not is judged according to the measured information; and after the glue dispensing is qualified, the detected information is processed by the industrial personal computer and then is used as a basis for horizontal movement and vertical movement of the loading and unloading mechanical arm during wafer carrying.
Step 3) measuring the horizontal arrangement condition of the base after carrying the wafer and the height of all points on the plane by using a third contour scanner before the second dispensing, and judging whether the carrying condition of the wafer meets the requirement or not according to the measured information; when the carrying effect of the wafer meets the standard, the detected information is processed by the industrial personal computer and then is used as the basis for the horizontal movement and the vertical movement of the dispensing arm during the second dispensing.
And 4) measuring the horizontal arrangement condition of the base after the second dispensing and the height of all points on the plane by using a fourth profile scanner before unloading, and judging whether the effect of the second dispensing meets the standard or not according to the measured information.
When a laser profile scanner is used to scan a carrier, the generated profile data is affected by the relative motion between the scanner laser line and the measured object. When the motion direction of the measured piece is vertical to the laser line, the measured data can be directly generated into the profile of the measured object. The measured piece is a carrier positioned on a rotary worktable, the arrangement of a laser line of a profile scanner is overlapped with the radius of the back-loading worktable, and the profile distortion of the measured piece can be caused by directly generating the profile according to the data measured by the scanner aiming at the movement mode of the measured piece, so that the measured data of the measured piece needs to be processed.
The invention provides a method for processing point cloud data obtained by scanning, which is applied to a quartz crystal resonator dispenser and aims at the phenomenon that a linear laser scanner directly generates profile distortion when scanning a rotary motion object. When the dispenser works, the rotary table rotates at a constant speed, the profile scanner is fixed, and after the carrier enters the measuring range of the scanner, the carrier starts to measure from one corner close to the middle axis of the rotary table. In fig. 5, let s be the distance between the carrier and the middle axis of the rotary table, y be the width of the carrier, x be the length of the carrier, the rotary table rotates at a constant speed, ω be the rotation speed, θ be the angle formed by the side of the carrier near the axis and the center of the rotary table 1 (= 2arctan (y/2 (x + s)), and an angle theta formed by a side line of the carrier far away from the center of the rotary table and the center of the rotary table 1 =2arctan (y/2 s), when one corner of the carrier enters the measuring range, the distance from the measuring point to the axis of the rotary table is s 1 ＝y/2sin(θ 2 And/2), when the carrier is rotated to the width side to be vertical to the radius of the rotary table, the distance from the carrier to the center of the rotary table is s, the error of delta s occurs on the measurement profile of the carrier in the width direction, and delta s = s1-s, when the measurement precision of the laser line (x axis) of the scanner is a, the line data in the middle section in the measurement data of the scanner deviates from the line data in the first and last lines by delta s/a. The time of the carrier from the beginning to the end of measurement, which is close to one side of the central axis of the rotary table, is t 1 ＝θ 1 Omega, the measuring time of the side line of the carrier far away from the middle axis of the rotary table is t 2 ＝θ 2 Omega, high speed profile scannerThe measurement sampling frequency of (1) is f, and the number of sampling points on the inner edge and the outer edge of the carrier is t respectively 1 X f and t 2 Xf, the number of samples is gradually reduced along the width of the carrier. Taking the profile scanner 4 as an example, the arrangement condition of the point cloud data measured by the scanner 4 is shown in fig. 6, in order to make the length of the data in the first row and the length of the data in the last row the same, and under the condition of keeping the measurement data to the maximum extent, the data on one side far away from the axis of the rotary table is kept, and the data on the side far away from the axis of the rotary table is reduced in magnification, wherein the reduction magnification is the data length ratio of the data in each row to the data on the last side, after the reduction, the data length of each row kept in each row can be the same as the data length of the last row, after the reduction is completed, the length of each row of data is the same, at this time, the data after the reduction also needs to be aligned, the data in the middle of the point cloud data is used as a reference, the data in the middle of other rows far away from the middle row are aligned with the data in the middle one by one from the first data in each row. By carrying out scaling and alignment processing on the point cloud data, the length of each row and each column of the processed point cloud data can be aligned, and at the moment, a plane contour is regenerated according to the processed point cloud data, wherein the contour is a real-scale plane contour.
Claims (3)
1. The measuring method for controlling the dispensing head position in the dispensing process of the quartz crystal resonator is characterized by comprising the following steps of: the quartz crystal resonator glue dispenser comprises a horizontally arranged rotary worktable, the rotary worktable rotates around a vertical central shaft at a constant speed, a plurality of carriers are uniformly distributed on the periphery of a wheel disc, the carriers are used for carrying a base and a wafer, and a base loading station, a first glue dispensing station, a wafer loading and picking station, a second glue dispensing station and a discharging station are sequentially arranged along the circumference of the wheel disc; a high-speed profile scanner is arranged between every two adjacent stations; the first dispensing station and the second dispensing station are both provided with a dispensing machine, and the dispensing machine comprises a dispensing head and a dispensing arm for driving the dispensing head to move in the vertical direction; sorting the bases subjected to the first dispensing by a wafer loading and picking station, unloading waste products, and loading wafers on qualified products;
the measuring range of the high-speed profile scanner is set as the distance from the high-speed profile scanner to the surface of the carrier, when the surface of the carrier is away from a laser line of the profile scanner, the surface of the rotary worktable is measured by the profile scanner and is limited by the measuring range of the profile scanner, and no data is measured at the moment; the laser line of the high-speed profile scanner is arranged along the radial direction of the rotary worktable;
when the carrier rotates from a previous station to a next station, the rotation of the rotary worktable is uniform rotation, and the high-speed profile scanner is used for measuring the plane arrangement condition and the vertical height of a base or a wafer on the carrier; the control end and the data transmission end of the equipment on each station are connected with an industrial personal computer;
the method comprises the following steps:
step 1) before first dispensing, height information of all points on the upper surface of a carrier is measured by a first high-speed contour scanner, and after the height information is processed by an industrial personal computer, the distance from the surface of the carrier to the scanner is obtained and a contour of the upper surface of the carrier is generated, wherein the contour information of a base is included; during dispensing, the distance of the dispensing arm moving up and down, left and right is obtained according to the generated profile information and height information;
step 2) before carrying the wafer, height information of all points on the upper surface of the carrier is measured by a second high-speed profile scanner, and after the height information is processed by an industrial personal computer, the distance between the surface of the carrier and the scanner is obtained and the profile of the upper surface of the carrier is generated, wherein the profile information after base dispensing is included; the industrial personal computer judges whether the dispensing effect meets the standard or not according to the measured information, and the measured information is processed by the industrial personal computer to obtain the distance of the vertical movement of the loading and unloading mechanical arm when the wafer is carried;
step 3) before the second dispensing, height information of all points on the upper surface of the carrier is measured by a third high-speed profile scanner, the height information is processed by an industrial personal computer, the distance between the surface of the carrier and the scanner is obtained, and the profile of the upper surface of the carrier is generated, wherein the profile information after the wafer is carried by the base is included; the industrial personal computer judges whether the effect carried by the wafer meets the standard or not according to the measured information, and the measured information is processed by the industrial personal computer to obtain the distance of the up-down and left-right movement of the dispensing arm during the second dispensing;
step 4) measuring height information of all points on the upper surface of the carrier after the second dispensing of the base by using a fourth high-speed contour scanner before unloading, generating contour information according to the measured information and judging the effect of the second dispensing;
in the steps 1) -4), the industrial personal computer firstly corrects point cloud data acquired by the high-speed laser scanner, eliminates the plane profile distortion of the measured piece, and specifically comprises the following steps:
(1) Data of the outer side of the tested piece far away from the axis of the rotary table are reserved, data far away from the side are subjected to multiplying power reduction, the reduction multiplying power is the length ratio of each row of data to the data of the outer side, the length of each row of reserved data is the same as that of the data of the outer side after reduction is finished, and the length of each row of data is the same after reduction is finished;
(2) Aligning the reduced data, taking the data of the most middle line of the point cloud data as a reference, and aligning the data of each line with the data of the middle line one by one from the first data, wherein the data of the most middle line of the point cloud data is far away from the data of other lines of the middle line;
by carrying out scaling and alignment processing on the point cloud data, the length of each row and each column of the processed point cloud data can be aligned, and at the moment, a plane contour is regenerated according to the processed point cloud data, and the contour is a real-scale plane contour of the measured piece.
2. The device for implementing the method for measuring the position control of the dispensing head in the dispensing process of the quartz crystal resonator, which is disclosed by claim 1, is characterized in that: the automatic picking device comprises a horizontally arranged rotary working table, wherein the rotary working table rotates around a vertical central shaft at a constant speed, a plurality of carriers are uniformly distributed on the periphery of a wheel disc, the carriers are used for carrying a base and a wafer, and a base loading station, a first dispensing station, a wafer loading and picking station, a second dispensing station and a discharging station are sequentially arranged along the periphery of the wheel disc; a high-speed profile scanner is arranged between every two adjacent stations; the first dispensing station and the second dispensing station are both provided with a dispensing machine, and the dispensing machine comprises a dispensing head and a dispensing arm for driving the dispensing head to move in the vertical direction;
the measuring range of the high-speed profile scanner is set as the distance from the high-speed profile scanner to the surface of the carrier, when the surface of the carrier is away from a laser line of the profile scanner, the surface of the rotary worktable is measured by the profile scanner and is limited by the measuring range of the profile scanner, and no data is measured at the moment; the laser line of the high-speed profile scanner is arranged along the radial direction of the rotary worktable;
when the carrier rotates from a previous station to a next station, the rotation of the rotary worktable is uniform rotation, and the high-speed profile scanner is used for measuring the plane arrangement condition and the vertical height of a base or a wafer on the carrier; sorting the base subjected to the first dispensing by a wafer loading and picking station, unloading waste products and loading wafers on qualified products; the control end and the data transmission end of the equipment on each station are connected with an industrial personal computer;
a first high-speed contour scanner arranged in front of the first dispensing station measures height information of all points on the upper surface of the carrier, and after the height information is processed by an industrial personal computer, the distance between the surface of the carrier and the scanner is obtained and a contour of the upper surface of the carrier is generated, wherein the contour information of the base is included; during dispensing, the distance of the dispensing arm moving up and down, left and right is obtained according to the generated profile information and height information;
a second high-speed profile scanner arranged in front of the wafer loading and picking station measures height information of all points on the upper surface of the carrier, and after the height information is processed by an industrial personal computer, the distance between the surface of the carrier and the scanner is obtained and a profile of the upper surface of the carrier is generated, wherein the profile information after base dispensing is included; the industrial personal computer judges whether the dispensing effect meets the standard or not according to the measured information, and the measured information is processed by the industrial personal computer to obtain the distance of the vertical movement and the horizontal movement of the vertical mechanical arm when the wafer is carried;
a third high-speed profile scanner arranged in front of the second dispensing station measures height information of all points on the upper surface of the carrier, and after the height information is processed by an industrial personal computer, the distance between the surface of the carrier and the scanner is obtained and the profile of the upper surface of the carrier is generated, wherein the profile information after the wafer is carried by the base is included; the industrial personal computer judges whether the effect carried by the wafer meets the standard or not according to the measured information, and the measured information is processed by the industrial personal computer to obtain the distance of the up-down and left-right movement of the dispensing arm during the second dispensing;
and a fourth high-speed profile scanner arranged in front of the unloading station measures the height information of all points on the upper surface of the carrier after the second dispensing of the base, generates profile information according to the measured information and judges the effect of the second dispensing.
3. The apparatus of claim 2, wherein: the industrial personal computer comprises a plane profile distortion correction module of a measured piece, and the plane profile distortion correction module of the measured piece processes point cloud data transmitted by each high-speed profile scanner as follows:
data of the outer side of the tested piece, which is far away from the axis of the rotary table, is reserved, data far away from the side is subjected to multiplying power reduction, the reduction multiplying power is the length ratio of each row of data to the data of the outer side, the length of each row of reserved data is the same as that of the data of the outer side after reduction, and the length of each row of data is the same after reduction is finished;
aligning the reduced data, taking the data of the most middle row of the point cloud data as a reference, and aligning the data of each row with the data of the middle row one by one from the first data far away from the data of the other rows of the middle row;
by carrying out scaling and alignment processing on the point cloud data, the length of each row and each column of the processed point cloud data can be aligned, and at the moment, a plane contour is regenerated according to the processed point cloud data, and the contour is a real-scale plane contour of the measured piece.
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