CN111530703A - Special glue dispensing needle and glue dispensing method for quartz crystal resonator - Google Patents
Special glue dispensing needle and glue dispensing method for quartz crystal resonator Download PDFInfo
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- CN111530703A CN111530703A CN202010505592.8A CN202010505592A CN111530703A CN 111530703 A CN111530703 A CN 111530703A CN 202010505592 A CN202010505592 A CN 202010505592A CN 111530703 A CN111530703 A CN 111530703A
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- dispensing
- glue
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- needle
- bottom box
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
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- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention relates to a special dispensing needle and a dispensing method of a quartz crystal resonator, which comprises a glue inlet head and a dispensing head connected with the glue inlet head, wherein the dispensing head has the following structure: the glue dispensing device comprises two parallel round needle tubes which are arranged next to each other, and the two round needle tubes form a glue dispensing channel with a gourd-shaped section. The glue dispensing method of the invention utilizes two calabash-shaped glue dispensing points to ensure that two adjacent corners of the wafer can be coated with the silver paste, thereby playing a role in enhancing the adhesive force between the wafer and the ceramic bottom box; the glue dispensing method can effectively avoid the problem of glue cracking or chip dropping even when the glue dispensing method is used by customers who deal with low-frequency products or have special external force processes. Compared with the traditional dispensing process, the invention redesigns the shape of the dispensing needle head, adopts a special 4-dispensing mode, can achieve the external force resistance effect of the traditional 5/6-dispensing, improves the production efficiency of the dispensing and loading process, and simultaneously improves the impedance value performance of the finished product.
Description
Technical Field
The invention relates to the technical field of dispensing of quartz crystal resonators, in particular to a special dispensing needle and a dispensing method of a quartz crystal resonator.
Background
In the prior art, the bonding process of the wafer and the ceramic bottom box used in the crystal resonator industry is as follows: firstly, dispensing silver glue on the conductive boss of the ceramic bottom box, then planting the wafer on the silver glue, then dispensing silver glue on the upper layer of the wafer, overlapping the upper glue point and the lower glue point as much as possible to wrap the wafer (commonly known as a 4-point glue dispensing mode), and then performing glue curing operation, thus completing the bonding of the wafer and the ceramic bottom box.
If the low-frequency product in the mode is subjected to special processes such as ultrasonic wave or falling and the like at a client, the situation that glue is peeled from the bottom box or the wafer is peeled from the glue can occur in the wafer and the ceramic bottom box, and the phenomenon of 'chip falling' or 'glue cracking' is commonly known; at this time, a next dispensing is dispensed on the supporting boss below the right chip to support the chip (commonly known as 5 dispensing method); or dropping 2 glue dots on the ceramic bottom box under the right wafer to support the wafer (commonly called 6-glue-dropping). The purpose of this is to prevent the product from falling off the sheet abnormally under the operation of external force.
Above-mentioned 4 some glue modes if the board is in process of production, the mechanism precision descends the upper and lower gluey point that leads to bordures the effect not good, can appear gluing the situation of splitting, can appear "falling piece" phenomenon seriously, finally lead to finished product electrical property test unusual. If a low-frequency product or a client uses ultrasonic waves or falls and other special processes, the wafer and the ceramic bottom box are stripped from the bottom box or the wafer and the glue; although the 5-point glue mode and the 6-point glue mode can prevent the chip from being broken or cracked, the 5-point glue mode and the 6-point glue mode can increase the impedance value of the finished product crystal oscillator, which leads to the reduction of the production yield and seriously affects the matching use effect of the client; and 5 some glue, 6 some glue modes will reduce the production productivity of some glue upper wafer stations of one time, the production cost is greater.
Disclosure of Invention
The applicant provides a special dispensing needle and a dispensing method of a quartz crystal resonator aiming at the defects in the prior art, so that the phenomenon of poor edge covering effect of upper and lower dispensing points of a 4-dispensing product caused by the precision problem of a dispensing mechanism is solved, and the test yield is improved. The risk of chip falling or glue crack caused by the fact that the client side uses ultrasonic waves or special processes such as falling and the like for low-frequency 4-point glue products is solved. The problems of poor production efficiency caused by more glue dispensing times of a low-frequency 5-glue dispensing/6-glue dispensing product and a glue dispensing and chip loading station in the production process are solved. The problem of the finished product impedance value is bigger because of 5 some glue of low frequency/6 some glue products is solved.
The technical scheme adopted by the invention is as follows:
the utility model provides a needle is glued to special point of quartz crystal syntonizer, glues the head including advancing, with advancing the point of gluing the head and being connected, the structure of point gluing the head is: the glue dispensing device comprises two parallel round needle tubes which are arranged next to each other, and the two round needle tubes form a glue dispensing channel with a gourd-shaped section.
The inner diameters of the two circular needle tubes are M, N respectively, wherein N is less than M, M is more than or equal to 0.1mm and less than or equal to 0.25mm, and N is more than or equal to 0.08mm and less than or equal to 0.2 mm.
A special dispensing method of a quartz crystal resonator comprises the following steps:
and (3) loading operation: the mechanical clamping jaw grabs a raw material bottom box and is arranged at a lower dispensing position on a rotary bearing vacuum platform, a bottom box feeding position, a lower dispensing position, a wafer feeding position, an upper dispensing position, a CCD identification and discharging position are sequentially arranged on the upper surface of the platform along the anticlockwise direction, and a defective product polishing box is arranged at the center of the platform; the mechanical clamping jaw firstly grabs the raw material bottom box and places the raw material bottom box at a bottom box feeding position of a rotary bearing vacuum platform, the platform rotates 90 degrees anticlockwise, and the raw material bottom box is placed at a lower glue dispensing position;
and (3) lower-layer dispensing operation: the two ends of one side edge in the raw material bottom box are respectively provided with an A conductive boss and a B conductive boss, the glue moving mechanism moves the glue dispensing head downwards along the Z direction of the glue dispensing shaft to the A conductive boss, infrared rays are detected to a certain height, a trigger signal is given to the glue dispensing controller, and the glue dispensing controller dispenses a gourd-shaped A glue dispensing point through the control of glue dispensing pressure, speed and time;
the dispensing moving mechanism moves the dispensing head to the B conductive boss along the dispensing axis X direction, drives the dispensing needle to rotate clockwise by 90 degrees, moves the dispensing head downwards to the B conductive boss along the dispensing axis Z direction, and the dispensing controller discharges the B lower dispensing point through the control points of dispensing pressure, speed and time;
and (3) placing the sheets: the platform rotates 60 degrees anticlockwise and is arranged at a wafer feeding position; the clamping jaw grabs the wafer and is placed on the glue dispensing point A and the glue dispensing point B;
and (3) upper-layer dispensing operation: the platform rotates 60 degrees anticlockwise and is placed at an upper dispensing position; the dispensing moving mechanism moves the dispensing head downwards along the dispensing axis Z direction to the conductive boss A, the infrared ray detects the conductive boss A to a certain height, a trigger signal is sent to the dispensing controller, and the dispensing controller outputs a dispensing point A through the control points of the dispensing pressure, speed and time; the dispensing moving mechanism moves the dispensing head to the conductive boss B along the dispensing axis X direction, and the dispensing mechanism drives the dispensing needle to rotate clockwise by 90 degrees; the dispensing moving mechanism moves the dispensing head downwards along the dispensing axis Z direction to the conductive boss B, and the dispensing controller discharges a dispensing point B through the control points of dispensing pressure, speed and time;
CCD detection: the platform rotates 60 degrees anticlockwise, is placed at a CCD identification and material discharge position, and is used for identifying the size and the angle of a glue dot; and performing electronic optical image identification comparison, comparing the glue dispensing templates stored on the matrix, performing fraction comparison according to the sizes and angles of glue spots, and grabbing and throwing the glue spots into a defective product throwing box if the glue spots pass through the target fraction and are smaller than the target fraction.
The invention has the following beneficial effects:
the inner diameters of the two circular needle tubes of the glue dispensing needle are smaller than the inner diameter of the needle tube of the old glue dispensing needle, so that the problem of impedance increase of a finished product caused by the increase of the contact area of the glue dispensing needle can be effectively solved. The glue dispensing method of the invention utilizes two calabash-shaped glue dispensing points, can ensure that two adjacent corners of the wafer can be coated with the silver glue, and has the effect of enhancing the adhesive force between the wafer and the ceramic (raw material) bottom box.
The novel dispensing mode can effectively avoid the problem of glue cracking or chip falling even when the novel dispensing mode is used by customers who deal with low-frequency products or have special external force processes; compared with the traditional dispensing process, the invention redesigns the shape of the dispensing needle head, and by using the special 4-dispensing mode of the invention, the external force resistant effect of the traditional 5/6-dispensing can be achieved, the production efficiency of the dispensing and chip loading process is improved, and the impedance value performance of the finished product is improved.
Drawings
Fig. 1 is a front view of the dispensing needle of the present invention.
Fig. 2 is a side view of the dispensing needle of the present invention.
Fig. 3 is a schematic structural view of a rotary load-bearing vacuum platform used in dispensing according to the present invention.
Fig. 4 is a schematic view of a product structure after lower layer dispensing operation during dispensing according to the present invention.
FIG. 5 is a schematic view of a product structure after a sheet placing operation is performed during dispensing according to the present invention.
Fig. 6 is a schematic view of a product structure after an upper layer dispensing operation is performed during dispensing according to the present invention.
Wherein: 1. feeding a rubber head; 2. a circular needle tube; 3. a, a conductive boss; 4. b, a conductive boss; 5. a, dispensing glue dots; 6. b, dispensing glue dots; 7. a raw material bottom box; 8. a wafer; 9. a, gluing points; 10. b, gluing points; 11. an electrode; 12. and supporting the boss.
Detailed Description
The following describes embodiments of the present invention with reference to the drawings.
As shown in fig. 1 and fig. 2, the special dispensing needle of the quartz crystal resonator of the present embodiment includes a dispensing head 1 and a dispensing head connected to the dispensing head 1, and the dispensing head has a structure that: the glue dispensing device comprises two parallel round needle tubes 2 which are arranged closely, and the two round needle tubes 2 form a glue dispensing channel with a gourd-shaped section.
The inner diameters of the two circular needle tubes 2 are M, N respectively, wherein N is more than M, M is more than or equal to 0.1mm and less than or equal to 0.25mm, and N is more than or equal to 0.08mm and less than or equal to 0.2 mm.
As shown in fig. 3 to fig. 6, the special dispensing method for the quartz crystal resonator of the present embodiment includes the following steps:
and (3) loading operation: the mechanical clamping jaw firstly grabs a raw material bottom box 7 and places the raw material bottom box on a lower glue dispensing position on a rotary bearing vacuum platform, as shown in figure 3, a bottom box feeding position, a lower glue dispensing position, a wafer feeding position, an upper glue dispensing position, a CCD identification and discharging position are sequentially arranged on the upper surface of the platform along the anticlockwise direction, and a defective product polishing box is arranged at the center of the platform; the mechanical clamping jaw firstly grabs the raw material bottom box 7 and places the raw material bottom box at a bottom box feeding position of a rotary bearing vacuum platform, the platform rotates 90 degrees anticlockwise, and the raw material bottom box 7 is placed at a lower glue dispensing position;
and (3) lower-layer dispensing operation: as shown in fig. 4, two ends of one side edge of the raw material bottom box 7 are respectively provided with an a conductive boss 3 and a B conductive boss 4, the glue moving mechanism moves the glue dispensing head downwards along the Z direction of the glue dispensing axis to the a conductive boss 3, infrared rays are detected to a certain height, a trigger signal is given to the glue dispensing controller, and the glue dispensing controller dispenses a gourd-shaped a glue dispensing point 5 through the control of the glue dispensing pressure, speed and time;
the dispensing moving mechanism moves the dispensing head to the B conductive boss 4 along the dispensing axis X direction, drives the dispensing needle to rotate 90 degrees clockwise, moves the dispensing head downwards to the B conductive boss 4 along the dispensing axis Z direction, and the dispensing controller discharges a dispensing point 6B through the control of dispensing pressure, speed and time;
and (3) placing the sheets: as shown in fig. 3 and 5, the platform rotates 60 degrees counterclockwise and is placed at the wafer feeding position; the clamping jaw grabs the wafer 8 and is placed on the glue dropping point A5 and the glue dropping point B6; a layer of dielectric (shown in cross-hatched areas) attached to the wafer 8 is shown as electrode 11;
and (3) upper-layer dispensing operation: as shown in fig. 3 and 6, the platform rotates 60 degrees counterclockwise and is placed at the dispensing position; the dispensing moving mechanism moves the dispensing head downwards along the dispensing axis Z direction to the conductive boss 3A, the infrared ray detects the conductive boss to a certain height, a trigger signal is sent to the dispensing controller, and the dispensing controller outputs a dispensing point 9A through the control points of the dispensing pressure, speed and time; the dispensing moving mechanism moves the dispensing head to the B conductive boss 4 along the dispensing axis X direction, and the dispensing mechanism drives the dispensing needle to rotate clockwise by 90 degrees; the dispensing moving mechanism moves the dispensing head downwards along the dispensing axis Z direction to the conductive boss 4 of the B, and the dispensing controller discharges a dispensing point 10 of the B through the control points of the dispensing pressure, speed and time;
CCD detection: as shown in fig. 3, the platform rotates 60 degrees counterclockwise, is placed at the position where the CCD identifies and discharges the material level, and the glue dot size angle is identified; and performing electronic optical image identification comparison, comparing the glue dispensing templates stored on the matrix, performing fraction comparison according to the sizes and angles of glue spots, and grabbing and throwing the glue spots into a defective product throwing box if the glue spots pass through the target fraction and are smaller than the target fraction.
In the dispensing process, the angle control of the dispensing needle needs to be adjusted according to the structural design of the special dispensing needle, and because the dispensing head of the invention is formed by splicing two circular needle tubes into a gourd-shaped structure in cross section, when the dispensing mechanism is used for installing the dispensing needle, the center line of the dispensing needle needs to form an angle of 45 degrees with the side of the raw material bottom box in the width direction, as shown in fig. 4. The glue dispensing end of the traditional glue dispensing needle is in a single round tube shape, so that angle control is not needed, the inner diameter of the traditional glue dispensing needle is usually 0.15-0.3 mm, the inner diameters of the two round needle tubes of the glue dispensing needle are smaller than the inner diameter of the needle tube of the old glue dispensing needle, and the problem that finished product impedance is increased due to the fact that the contact area of the glue dispensing needle is increased can be effectively solved.
According to the dispensing method, the two calabash-shaped glue points are utilized, so that two adjacent corners of the wafer can be coated with the silver paste, and the effect of enhancing the adhesive force between the wafer and the ceramic bottom box is achieved; the novel dispensing mode can effectively avoid the problem of glue cracking or chip falling even when the novel dispensing mode is used by customers who deal with low-frequency products or have special external force processes; compared with the traditional dispensing process, the novel special 4-point dispensing mode is adopted, the external force resisting effect of 5/6-point dispensing can be achieved, the production efficiency of the chip-on-chip dispensing process is improved, and compared with 5/6-point dispensing, the novel special 4-point dispensing mode is adopted, the impedance value performance of a finished product is improved.
The design principle of the dispensing product of the invention is as follows:
the wafer 8 is the main part of the quartz crystal resonator oscillation, the electrode 11 is a layer of medium (generally silver or gold) attached on the wafer 8, the area and thickness of the electrode determine the different frequencies of the crystal, the silver glue dispensed by the glue dispensing needle fixes the wafer 8 on one hand, and the signal conduction is carried out through the electrode 11 on the wafer 8 and the raw material bottom box 7 (ceramic bottom box) on the other hand. The conductive boss is convenient for the dispenser to judge the image position and grab for accurate dispensing, and the electrode 11, the silver paste and the ceramic bottom box are conducted through signals.
The raw material bottom box 7 is also provided with a supporting boss 12 which can support the 5 th glue point to support the wafer only in a 5 th glue point mode; the ceramic bottom box mainly plays a role in conducting external signals and protecting the internal structure of a product from being leaned against the internal silver colloid and the wafer.
The above description is intended to be illustrative and not restrictive, and the scope of the invention is defined by the appended claims, which may be modified in any manner within the scope of the invention.
Claims (3)
1. A special dispensing needle of a quartz crystal resonator is characterized in that: glue head (1), glue the head with advancing the point that glue head (1) and be connected including advancing, the structure of point glue the head is: the glue dispensing device comprises two parallel round needle tubes (2) which are arranged closely, and the two round needle tubes (2) form a glue dispensing channel with a gourd-shaped section.
2. The special dispensing needle of a quartz crystal resonator as claimed in claim 1, characterized in that: the inner diameters of the two circular needle tubes (2) are M, N respectively, wherein N is less than M, M is more than or equal to 0.1mm and less than or equal to 0.25mm, and N is more than or equal to 0.08mm and less than or equal to 0.2 mm.
3. A special dispensing method for a quartz crystal resonator is characterized in that: the method comprises the following steps:
and (3) loading operation: the mechanical clamping jaw firstly grabs a raw material bottom box (7) and arranges the raw material bottom box on a lower dispensing position on a rotary bearing vacuum platform, the upper surface of the platform is sequentially provided with a bottom box feeding position, a lower dispensing position, a wafer feeding position, an upper dispensing position, a CCD identification and discharging position along the anticlockwise direction, and a defective product polishing box is arranged at the center of the platform; the mechanical clamping jaw firstly grabs the raw material bottom box (7) and places the raw material bottom box (7) at a bottom box feeding position of a rotary bearing vacuum platform, the platform rotates 90 degrees anticlockwise, and the raw material bottom box (7) is placed at a lower glue dispensing position;
and (3) lower-layer dispensing operation: the two ends of one side edge in the raw material bottom box (7) are respectively provided with an A conductive boss (3) and a B conductive boss (4), the glue moving mechanism moves the glue dispensing head downwards along the Z direction of the glue dispensing shaft to the A conductive boss (3), infrared rays are detected to a certain height, a trigger signal is sent to the glue dispensing controller, and the glue dispensing controller dispenses a gourd-shaped A lower glue dispensing point (5) through the control points of glue dispensing pressure, speed and time;
the dispensing moving mechanism moves the dispensing head to the B conductive boss (4) along the X direction of the dispensing axis to drive the dispensing needle to rotate clockwise by 90 degrees, the dispensing head moves downwards to the B conductive boss (4) along the Z direction of the dispensing axis, and the dispensing controller discharges the B lower dispensing point (6) through the control points of dispensing pressure, speed and time;
and (3) placing the sheets: the platform rotates 60 degrees anticlockwise and is arranged at a wafer feeding position; the clamping jaw grabs the wafer (8) and is placed on the glue dropping point A (5) and the glue dropping point B (6);
and (3) upper-layer dispensing operation: the platform rotates 60 degrees anticlockwise and is placed at an upper dispensing position; the dispensing moving mechanism moves the dispensing head downwards along the dispensing axis Z direction to the conductive boss (3) A, the infrared ray detects the conductive boss to a certain height, a trigger signal is sent to the dispensing controller, and the dispensing controller discharges a dispensing point (9) A through the control points of the dispensing pressure, speed and time; the dispensing moving mechanism moves the dispensing head to the conductive boss (4) of the B along the dispensing axis X direction, and the dispensing mechanism drives the glue needle to rotate clockwise by 90 degrees; the dispensing moving mechanism moves the dispensing head downwards along the dispensing axis Z direction to the conductive boss (4) of the B, and the dispensing controller discharges a dispensing point (10) of the B through the control points of the dispensing pressure, speed and time;
CCD detection: the platform rotates 60 degrees anticlockwise, is placed at a CCD identification and material discharge position, and is used for identifying the size and the angle of a glue dot; and performing electronic optical image identification comparison, comparing the glue dispensing templates stored on the matrix, performing fraction comparison according to the sizes and angles of glue spots, and grabbing and throwing the glue spots into a defective product throwing box if the glue spots pass through the target fraction and are smaller than the target fraction.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010505592.8A CN111530703A (en) | 2020-06-05 | 2020-06-05 | Special glue dispensing needle and glue dispensing method for quartz crystal resonator |
| TW110109203A TWI750058B (en) | 2020-06-05 | 2021-03-15 | Crystal device and method for making crystal device |
| US17/329,788 US11764756B2 (en) | 2020-06-05 | 2021-05-25 | Crystal device and method for manufacturing crystal device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010505592.8A CN111530703A (en) | 2020-06-05 | 2020-06-05 | Special glue dispensing needle and glue dispensing method for quartz crystal resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111530703A true CN111530703A (en) | 2020-08-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010505592.8A Pending CN111530703A (en) | 2020-06-05 | 2020-06-05 | Special glue dispensing needle and glue dispensing method for quartz crystal resonator |
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| Country | Link |
|---|---|
| CN (1) | CN111530703A (en) |
| TW (1) | TWI750058B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113996502A (en) * | 2021-11-12 | 2022-02-01 | 杭州鸿星电子有限公司 | Height control method and device for dispensing head in dispensing process of quartz crystal resonator |
| CN114308562A (en) * | 2021-12-28 | 2022-04-12 | 杭州鸿星电子有限公司 | Method and device for measuring adhesive dispensing head position control in adhesive dispensing process of quartz crystal resonator |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3839572B1 (en) * | 2010-05-06 | 2023-10-18 | Immunolight, Llc. | Adhesive bonding composition and method of use |
| TW201626531A (en) * | 2015-01-14 | 2016-07-16 | 鈺橋半導體股份有限公司 | Wiring board with interposer embedded in stiffener and method of making the same |
| US10659664B2 (en) * | 2016-08-01 | 2020-05-19 | Ningbo Sunny Opotech Co., Ltd. | Camera module and molded circuit board assembly and manufacturing method thereof |
| TWM557833U (en) * | 2016-08-01 | 2018-04-01 | Ningbo Sunny Opotech Co Ltd | Camera module, molded photosensitive element, molding die, and its electronic equipment |
-
2020
- 2020-06-05 CN CN202010505592.8A patent/CN111530703A/en active Pending
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2021
- 2021-03-15 TW TW110109203A patent/TWI750058B/en active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113996502A (en) * | 2021-11-12 | 2022-02-01 | 杭州鸿星电子有限公司 | Height control method and device for dispensing head in dispensing process of quartz crystal resonator |
| CN114308562A (en) * | 2021-12-28 | 2022-04-12 | 杭州鸿星电子有限公司 | Method and device for measuring adhesive dispensing head position control in adhesive dispensing process of quartz crystal resonator |
| CN114308562B (en) * | 2021-12-28 | 2022-10-25 | 鸿星科技(集团)股份有限公司 | Method and device for measuring adhesive dispensing head position control in adhesive dispensing process of quartz crystal resonator |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI750058B (en) | 2021-12-11 |
| TW202147542A (en) | 2021-12-16 |
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