CN113008643A - Method for removing laminated packaging above chip - Google Patents
Method for removing laminated packaging above chip Download PDFInfo
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- CN113008643A CN113008643A CN202110269108.0A CN202110269108A CN113008643A CN 113008643 A CN113008643 A CN 113008643A CN 202110269108 A CN202110269108 A CN 202110269108A CN 113008643 A CN113008643 A CN 113008643A
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- sample
- chip
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- sandpaper
- stack
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/34—Purifying; Cleaning
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/44—Sample treatment involving radiation, e.g. heat
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
- G01N2001/2866—Grinding or homogeneising
Abstract
The invention relates to a method for removing an upper laminated package of a chip, which comprises the following steps: providing a base plate, and adhering the sample to the base plate; grinding one side of the sample away from the bottom plate, and stopping grinding when the outline of the chip to be analyzed is exposed; the sample is cleaned and dried, thereby removing the stack package above the chip for analysis. The invention effectively solves the problem that the laminated packaged chips are difficult to separate, and the sample is adhered to the bottom plate to prevent the sample from warping in the grinding process, so that the sample is uniformly stressed, the chips are prevented from cracking, and the influence on the chip verification and analysis in the later period is reduced.
Description
Technical Field
The invention relates to the field of chip packaging, in particular to a method for removing an upper laminated package of a chip.
Background
With the increasing integration of chips, microelectronic packages are developed in a lighter, thinner and smaller manner, wherein a stacked chip package (stacked die package) is the most common package, a plurality of chips are vertically and upwardly stacked and then packaged, due to the structural particularity, the distance between the chips is small, the thickness of the chips is reduced compared with that of other packaged chips, when the chips are verified or analyzed, the chips are easily warped, so that analysis and verification results are affected, and the chip is easily cracked in a conventional chip separation manner, so that chip analysis is affected.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a method for removing an upper laminated package of a chip, which solves the problem that the chip of the laminated package is difficult to separate.
The technical scheme for realizing the purpose is as follows:
the invention provides a method for removing an upper laminated package of a chip, which comprises the following steps:
providing a base plate, and adhering the sample to the base plate;
grinding one side of the sample away from the bottom plate, and stopping grinding when the outline of the chip to be analyzed is exposed;
the sample is cleaned and dried, thereby removing the stack package above the chip for analysis.
According to the method for removing the laminated package above the chip, the sample is adhered to the bottom plate, so that the sample is prevented from warping during grinding, the sample is uniformly stressed, the sample is prevented from cracking, the problem that the laminated packaged chip is difficult to separate is effectively solved, the sample is adhered to the bottom plate, the sample is prevented from warping during grinding, the sample is uniformly stressed, the chip is prevented from cracking, and the influence on chip verification and analysis in the later period is reduced.
The method for removing the stack package above the chip is further improved in that when grinding a sample, the method further comprises the following steps:
the sample was ground with coarse sandpaper, and when ground to a position close to the chip, the surface of the sample was coated with a molten hot melt adhesive to prevent excessive grinding, and the sample was continuously ground by replacing the fine sandpaper.
The method for removing the chip upper lamination packaging is further improved in that the coarse sandpaper is P320 sandpaper, and the fine sandpaper is P2500 sandpaper.
The method for removing the stack package above the chip is further improved in that before the sample is washed, the method further comprises the following steps:
and (3) dripping corrosive liquid on the surface of the sample, heating, and washing the sample by using acetone to remove residual hot melt adhesive on the sample.
The method for removing the chip upper lamination packaging is further improved in that the corrosive liquid is mixed acid.
The method for removing the chip upper lamination packaging is further improved in that the sample is heated to 150 ℃ after the corrosive liquid is dripped, and the sample is heated for 10 s.
The method for removing the stack package above the chip is further improved in that when the sample is cleaned, the method further comprises the following steps:
putting the sample into a beaker filled with anhydrous ethylenediamine, and putting the beaker filled with the sample into an ultrasonic cleaner for cleaning;
taking out the sample, putting the sample into a beaker filled with clear water, and putting the beaker filled with the sample into an ultrasonic cleaner for cleaning;
the sample was removed and rinsed with acetone.
The method for removing the laminated package above the chip is further improved in that the time for cleaning by using an ultrasonic cleaner is 2-5 s.
The method for removing the laminated package above the chip is further improved in that when a sample is pasted, the method further comprises the following steps:
and coating glue on the top surface of the bottom plate, placing the sample on the glue, pressing the sample to discharge air bubbles at the bottom of the sample, and further heating the sample so that the sample is adhered to the bottom plate.
The method for removing the laminated packaging above the chip is further improved in that the dimension of the dried sample is 100 ℃.
Drawings
FIG. 1 is a flowchart of a method for removing a stack-on-chip package according to the present invention.
Detailed Description
The invention is further described with reference to the following figures and specific examples.
Referring to fig. 1, the invention provides a method for removing an upper stacked package of a chip, which comprises the steps of adhering a sample to a bottom plate to prevent the sample from warping during grinding, enabling the sample to be stressed uniformly, preventing the sample from cracking, effectively solving the problem that the chip packaged in a stacked manner is difficult to separate, and adhering the sample to the bottom plate to prevent the sample from warping during grinding, enabling the sample to be stressed uniformly, preventing the chip from cracking, and reducing the influence on chip verification and analysis in the later period. The method for removing the stack package over the chip according to the present invention will be described with reference to the accompanying drawings.
Referring to fig. 1, fig. 1 is a flowchart illustrating a method for removing a chip over stack package according to the present invention. The method for removing the stack-on-chip package according to the present invention will be described with reference to fig. 1.
As shown in fig. 1, the method for removing the stack package over the chip of the present invention includes the following steps:
providing a base plate, and adhering the sample to the base plate;
grinding one side of the sample away from the bottom plate, and stopping grinding when the outline of the chip to be analyzed is exposed;
the sample is cleaned and dried, thereby removing the stack package above the chip for analysis.
Preferably, the base plate may be a slide.
Specifically, when washing the sample, still include:
putting the sample into a beaker filled with anhydrous ethylenediamine, and putting the beaker filled with the sample into an ultrasonic cleaner for cleaning;
taking out the sample, putting the sample into a beaker filled with clear water, and putting the beaker filled with the sample into an ultrasonic cleaner for cleaning;
the sample was removed and rinsed with acetone.
Preferably, the time for cleaning by the ultrasonic cleaner is 2-5 s.
Further, when pasting the sample, still include:
and coating glue on the top surface of the bottom plate, placing the sample on the glue, pressing the sample to discharge air bubbles at the bottom of the sample, and further heating the sample so that the sample is adhered to the bottom plate.
Specifically, the glue can be AB glue, and can be double-component epoxy resin AB glue, wherein the agent A and the agent B are mixed according to the weight ratio of 1:10, stirred uniformly and kept stand to obtain the prepared glue.
Preferably, the dimension of the dried sample is 100 ℃.
As a preferred embodiment of the present invention, the method for grinding a sample further comprises:
the sample was ground with coarse sandpaper, and when ground to a position close to the chip, the surface of the sample was coated with a molten hot melt adhesive to prevent excessive grinding, and the sample was continuously ground by replacing the fine sandpaper.
Preferably, can paste the bottom plate and paste in operating personnel's finger, and then through rubbing sample and abrasive paper on in order to realize grinding, the hot melt adhesive can only be paintd in the position of too much grinding in addition, prevents to grind the in-process excessively and destroy the sample.
Preferably, the coarse sandpaper is P320 sandpaper and the fine sandpaper is P2500 sandpaper.
Further, before washing the sample, the method further comprises:
and (3) dripping corrosive liquid on the surface of the sample, heating, and washing the sample by using acetone to remove residual hot melt adhesive on the sample.
Preferably, the corrosive liquid is mixed acid.
Specifically, the sample was heated to 150 ℃ after dropping the etchant, and heated for 10 seconds.
The specific embodiment of the invention is as follows:
coating glue on the top surface of the bottom plate, placing a sample on the glue, pressing the sample to discharge air bubbles at the bottom of the sample, and further heating the sample to enable the sample to be adhered to the bottom plate;
adhering the bottom plate to the fingers of an operator, pressing the sample on the abrasive paper for friction so as to grind the sample on the abrasive paper, coating molten hot melt adhesive at positions where the sample is more ground when the sample is ground to a position close to the chip so as to prevent the position from being continuously ground and the chip from being damaged, and stopping grinding after the chip is ground to be exposed;
dripping 3-6 drops of corrosive liquid on the surface of the sample, heating to 150 ℃, and heating for 10s to enable the hot melt adhesive to be corroded;
putting the sample into a beaker filled with clear water, putting the beaker filled with the sample into an ultrasonic cleaner for cleaning for 2-5 s, taking out the sample and putting the sample into the beaker filled with the clear water, putting the beaker filled with the sample into the ultrasonic cleaner for cleaning for 2-5 s, taking out the sample, and washing the sample with acetone;
the sample is dried at 100 ℃, the packages above the chip are completely removed, the chip can be analyzed, and the sample is adhered to the bottom plate, so that the chip can be prevented from warping and cracking.
While the present invention has been described in detail and with reference to the embodiments thereof as illustrated in the accompanying drawings, it will be apparent to one skilled in the art that various changes and modifications can be made therein. Therefore, certain details of the embodiments are not to be interpreted as limiting, and the scope of the invention is to be determined by the appended claims.
Claims (10)
1. A method for removing an upper laminated package of a chip is characterized by comprising the following steps:
providing a base plate to which a sample is adhered;
grinding one side of the sample, which is far away from the bottom plate, and stopping grinding when the outline of the chip to be analyzed is exposed;
the sample is cleaned and dried, thereby removing the stack package over the chip for analysis.
2. The method of removing a stack-on-chip package according to claim 1, wherein grinding the sample further comprises:
grinding the sample with coarse sandpaper, applying molten hot melt adhesive to the surface of the sample when the sample is ground to a position close to the chip to prevent excessive grinding, and replacing fine sandpaper to continue grinding the sample.
3. The method of claim 2, wherein the coarse sandpaper is P320 sandpaper and the fine sandpaper is P2500 sandpaper.
4. The method of removing a stack-on-chip package according to claim 2, further comprising, before washing the sample:
and (3) dripping corrosive liquid on the surface of the sample and heating, and further washing the sample by using acetone to remove residual hot melt adhesive on the sample.
5. The method of claim 4, wherein the etching solution is mixed acid.
6. The method of claim 4, wherein the sample is heated to 150 ℃ for 10s after the etching solution is dropped.
7. The method of removing a stack-on-chip package according to claim 1, wherein the cleaning the sample further comprises:
putting the sample into a beaker filled with anhydrous ethylenediamine, and putting the beaker filled with the sample into an ultrasonic cleaner for cleaning;
taking out the sample, putting the sample into a beaker filled with clear water, and putting the beaker filled with the sample into the ultrasonic cleaner for cleaning;
the sample was removed and rinsed with acetone.
8. The method for removing the chip over package according to claim 7, wherein the time for cleaning by the ultrasonic cleaner is 2-5 s.
9. The method of removing a stack-on-chip package according to claim 1, wherein the attaching the sample further comprises:
and coating glue on the top surface of the bottom plate, placing the sample on the glue, pressing the sample to discharge air bubbles at the bottom of the sample, and further heating the sample so that the sample is adhered to the bottom plate.
10. The method of claim 1, wherein the sample is dried at a temperature of 100 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110269108.0A CN113008643A (en) | 2021-03-12 | 2021-03-12 | Method for removing laminated packaging above chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110269108.0A CN113008643A (en) | 2021-03-12 | 2021-03-12 | Method for removing laminated packaging above chip |
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| Publication Number | Publication Date |
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| CN113008643A true CN113008643A (en) | 2021-06-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110269108.0A Pending CN113008643A (en) | 2021-03-12 | 2021-03-12 | Method for removing laminated packaging above chip |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113514300A (en) * | 2021-07-09 | 2021-10-19 | 长鑫存储技术有限公司 | Semiconductor structure processing jig and manufacturing method thereof |
| WO2024040804A1 (en) * | 2022-08-23 | 2024-02-29 | 闻泰通讯股份有限公司 | Method for extracting part in packaging structure, and grinding fixture |
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| US7067332B1 (en) * | 2004-03-16 | 2006-06-27 | Altera Corporation | Method for die removal from plastic packages |
| CN103358223A (en) * | 2012-03-26 | 2013-10-23 | 上海唯环网络科技有限公司 | Chip grinding method |
| CN103969569A (en) * | 2013-01-25 | 2014-08-06 | 上海华虹宏力半导体制造有限公司 | Preparation method and analytical method for back optical failure positioning sample of integrated circuit |
| CN104810243A (en) * | 2014-01-24 | 2015-07-29 | 北大方正集团有限公司 | Method for decapsulating encapsulated device |
| CN111613524A (en) * | 2020-05-21 | 2020-09-01 | 深圳宜特检测技术有限公司 | Grinding structure and grinding method for packaging wafer back |
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2021
- 2021-03-12 CN CN202110269108.0A patent/CN113008643A/en active Pending
Patent Citations (6)
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| US7067332B1 (en) * | 2004-03-16 | 2006-06-27 | Altera Corporation | Method for die removal from plastic packages |
| CN103358223A (en) * | 2012-03-26 | 2013-10-23 | 上海唯环网络科技有限公司 | Chip grinding method |
| CN103969569A (en) * | 2013-01-25 | 2014-08-06 | 上海华虹宏力半导体制造有限公司 | Preparation method and analytical method for back optical failure positioning sample of integrated circuit |
| CN104810243A (en) * | 2014-01-24 | 2015-07-29 | 北大方正集团有限公司 | Method for decapsulating encapsulated device |
| CN111613524A (en) * | 2020-05-21 | 2020-09-01 | 深圳宜特检测技术有限公司 | Grinding structure and grinding method for packaging wafer back |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113514300A (en) * | 2021-07-09 | 2021-10-19 | 长鑫存储技术有限公司 | Semiconductor structure processing jig and manufacturing method thereof |
| WO2024040804A1 (en) * | 2022-08-23 | 2024-02-29 | 闻泰通讯股份有限公司 | Method for extracting part in packaging structure, and grinding fixture |
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