TWI767087B - 用於控制氣溶膠噴注列印系統的列印頭中之氣溶膠的流之方法以及用於沉積氣溶膠之裝備 - Google Patents

用於控制氣溶膠噴注列印系統的列印頭中之氣溶膠的流之方法以及用於沉積氣溶膠之裝備 Download PDF

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TWI767087B
TWI767087B TW107140245A TW107140245A TWI767087B TW I767087 B TWI767087 B TW I767087B TW 107140245 A TW107140245 A TW 107140245A TW 107140245 A TW107140245 A TW 107140245A TW I767087 B TWI767087 B TW I767087B
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aerosol
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庫特Ｋ 克里斯坦森
麥克Ｊ 瑞恩
傑森Ａ 保爾森
約翰Ｄ 哈姆雷
查德 康羅伊
詹姆斯 馮
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美商阿普托麥克股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/07—Ink jet characterised by jet control
    • B41J2/11—Ink jet characterised by jet control for ink spray
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/30—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/02—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling time, or sequence, of delivery
    • B05B12/06—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling time, or sequence, of delivery for effecting pulsating flow
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/16—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
    • B05B12/18—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area using fluids, e.g. gas streams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/0012—Apparatus for achieving spraying before discharge from the apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/12—Spray pistols; Apparatus for discharge designed to control volume of flow, e.g. with adjustable passages

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Abstract

本發明係揭露用於經由氣動遮擋來控制被沉積在一基材上的氣溶膠流之方法及裝備。氣溶膠流係在裝備的列印頭中被一環狀共流覆套氣體所圍繞及聚焦。一增壓氣體在氣溶膠列印期間流到一真空泵。一閥在適當時間將增壓氣體添加到覆套氣體，且兩氣體的一部分係在與氣溶膠流方向呈相反的一方向被偏向以至少部份地防止氣溶膠穿過沉積噴嘴。部分或全部的氣溶膠係與覆套氣體及增壓氣體的該部分作組合並從列印頭排放。藉由精密地平衡進入與外出列印頭的流、將氣溶膠及覆套氣體的流率維持近似恆定、及使增壓氣體在列印及遮擋期間皆保持流動，氣溶膠流的列印以及部份或完全遮擋之間的過渡時間係最小化。氣動遮擋可與一機械遮擋件作組合以供較快速操作。可使用一預覆套氣體，以令中心的氣流與接近列印頭流通路的側邊之氣流之間的延遲達到最小化。

Description

用於控制氣溶膠噴注列印系統的列印頭中之氣溶膠的流之方法以及用於沉積氣溶膠之裝備
本申請案係對於2017年11月13日提申名稱為「內部遮擋技術」、申請號為62/585,449的美國臨時專利申請案主張優先權及利益，其說明書及申請專利範圍以參考方式併入本文。
本發明係有關用於氣動遮擋一氣溶膠流之裝備及方法。氣溶膠流可為一滴粒流、一固體粒子流、或一由滴粒及固體粒子構成之流。
請注意下列討論係可參照一數目的公開文件及參考文件。此等公開文件的討論在此係供科學原理的較完整背景，而無意被詮釋成認可此等公開文件即為可專利性決定用途的先前技藝。
用於在氣溶膠噴注列印中遮擋或轉向氣溶膠流之典型裝備係使用一位於氣溶膠沉積噴嘴下游之遮擋機構，並典型地需要從沉積孔口至基材之一增大的工作距離以容納該機構。一增大的工作距離係可導致處於一非最 佳噴嘴至基材距離之沉積，其中氣溶膠噴注的聚焦係劣化。當列印腔穴內側時、或當往上突件存在於一原本實質扁平表面、諸如一包括所安裝組件之印刷電路板時，外部遮擋機構亦會機械性干擾。反之，內部遮擋係發生在列印頭的內部、沉積噴嘴的孔口之上游、並容許具有一極小的噴嘴至基材距離，其常為氣溶膠流的最適聚焦或準直所需。
在氣溶膠噴注列印中，可利用一用以將一固體刃或匙狀遮擋件放置在氣溶膠流中之機械衝擊遮擋件來達成內部及外部氣溶膠流遮擋，俾使粒子維持原始流方向但衝擊於遮擋件表面上。衝擊遮擋件典型地使用一機電組態，其中一電壓脈衝被施加到一螺線管，其將遮擋件移動至氣溶膠流的路徑中。以衝擊為基礎的遮擋係會隨著遮擋件穿過氣溶膠流而造成粒子流的失焦。隨著過多材料累積在遮擋件表面上且稍後脫位，衝擊遮擋件亦會造成外來材料沉積或流動系統的髒污。以衝擊為基礎的遮擋方案可具有小到2ms或更小的遮擋件啟/閉(on/off)時間。氣溶膠流遮擋可替代性使用一氣動遮擋件以將氣溶膠流從原始流方向轉向並進入一收集腔室中或來到一排放埠。氣動遮擋係為一非衝擊程序，所以沒有可供墨水累積其上之遮擋表面。在列印、轉向(遮擋)期間、且特別在列印與轉向之間的過渡期間使墨水累積達到最小化係為氣動遮擋件設計的一關鍵層面。非衝擊遮擋方案可對於快速移動的氣溶膠流具有低於10ms的遮擋件啟/閉時間。
氣動遮擋的一缺陷在於：比起機械遮擋者而 言，啟與閉之間的過渡會費時更久才發生。既有的氣動遮擋方案由於當在遮擋後恢復列印時氣溶膠流往下傳播經過流胞元的下部分所需之時間、或者當引發遮擋時來自遮擋件的潔淨氣體順著傳播所需之時間而需要長切換時間。尚且，氣溶膠的關閉與開啟並非突然，而是具有一顯著的過渡時間。當氣體在層流(非紊流)條件下傳播經過一圓柱形通路時，沿著通路軸線之流的中心係以兩倍平均速度作移動，且沿著壁的流具有接近零的速度。這導致一拋物線流分佈，其中在接近通路壁處包括氣溶膠之前往基材的完整氣溶膠流係顯著地延遲於初始流之後。同理，當遮擋時，當接近壁處緩慢移動的霧抵達基材時之最終關閉係相距來自流中心之快速移動的氣溶膠被潔淨氣體取代時而言顯著地延後。相較於初始遮擋時間而言，此效應係大幅地增加「完整受遮擋」時間。因此，需要一內部氣動氣溶膠流遮擋系統，其使切換及遮擋過渡時間達到最小化。
本發明的一實施例係為一用於在一氣溶膠沉積系統或氣溶膠噴注列印系統的一列印頭中控制一氣溶膠的流之方法，該方法包含使一氣溶膠流在一原始氣溶膠流方向穿過列印頭；以一覆套氣體圍繞氣溶膠流；使經組合的氣溶膠流及覆套氣體穿過列印頭的一沉積噴嘴；將一增壓氣體添加至覆套氣體以形成一覆套-增壓氣流；將覆套-增壓氣流分成一在與原始氣溶膠流方向相反的一方向流動之第一部分及一在原始氣溶膠流方向流動之第二部分； 及覆套-增壓氣流的第一部分係防止氣溶膠流的一經偏向部分穿過沉積噴嘴。覆套氣體的流率及氣溶膠流的一流率較佳係保持近似恆定。在將增壓氣體添加至覆套氣體之前，增壓氣體較佳流到一真空泵。該方法較佳進一步包含在增加步驟之後從列印頭提取一排放流，排放流包含氣溶膠流的經偏向部分及覆套-增壓氣流的第一部分。提取排放流較佳係包含利用真空泵來吸取排放流。排放流的流率較佳由一質量流控制器作控制。覆套氣體的流率及增壓氣體的流率較佳由一或多個流控制器作控制。氣溶膠流在添加步驟之前的流率加上覆套氣體在添加步驟之前的流率較佳係近似等於覆套-增壓氣流的第二部分之流率加上氣溶膠流的未偏向部分之流率。該方法可較佳以小於近似10毫秒(millisecond)進行。增壓氣體的流率選用性大於氣溶膠流的流率、且更佳位於氣溶膠流的流率之近似1.2倍以及氣溶膠流的流率之近似2倍之間。氣溶膠流的經偏向部分選用性包含整體氣溶膠流，俾沒有氣溶膠流穿過沉積噴嘴。排放流的流率係選用性設定為近似等於增壓氣體的流率。該方法選用性進一步包含在氣溶膠流的全部未偏向部分經過沉積噴嘴離開列印頭之前使增壓氣體轉向以直接流到真空泵。該方法選用性包含在防止步驟之前以一機械遮擋件阻絕一氣溶膠流。增壓氣體的流率可替代性小於或等於氣溶膠流的流率，在該實例中排放流的流率較佳設定為大於增壓氣體的流率。該方法較佳進一步包含在以覆套氣體圍繞氣溶膠流之前以一預覆套氣體圍繞氣溶膠，較佳藉此使覆 套氣體與預覆套氣體作組合。較佳地，利用覆套氣體的近似一半形成預覆套氣體。
本發明的另一實施例係為一用於沉積一氣溶膠之裝備，該裝備包含一氣溶膠供應物；一覆套氣體供應物；一增壓氣體供應物；一真空泵；一閥，其用於將增壓氣體供應物連接至覆套氣體供應物或真空泵；及一列印頭，該列印頭包含一氣溶膠入口以供從氣溶膠供應物接收一氣溶膠；一第一腔室，其包含一覆套氣體入口以供從覆套氣體供應物接收一覆套氣體；第二腔室，其組配為以覆套氣體圍繞氣溶膠；及一第二腔室，其包含一被連接至真空泵之排放氣體出口，第二腔室置設於氣溶膠入口與第一腔室之間；及一沉積噴嘴；其中當增壓器體供應物連接至覆套氣體供應物時覆套氣體入口係接收來自增壓氣體供應物的一增壓氣體與覆套氣體之一組合；及其中第一腔室係組配為將該組合的一部分分成一流往氣溶膠入口之第一部分及一流往沉積噴嘴之第二部分。該裝備較佳包含一被置設於排放氣體出口與真空泵之間的第一質量流控制器且較佳包含一被置設於排放氣體出口與第一質量流控制器之間的濾器。該裝備較佳包含一被置設於覆套氣體供應物與覆套氣體入口之間的第二質量流控制器及一被置設於增壓氣體供應物與閥之間的第三質量流控制器。進入覆套氣體入口之氣流較佳係位於一與列印頭中的一氣溶膠流方向呈垂直之方向。該裝備選用性包含一機械遮擋件。該裝備較佳包含一被置設於氣溶膠入口與第二腔室之間的第三腔室， 第三腔室較佳包含一預覆套氣體入口且較佳組配為以一預覆套氣體圍繞氣溶膠。一流分割器較佳係連接於預覆套氣體入口與覆套氣體供應物之間以供從覆套氣體的近似一半形成預覆套氣體。
本發明之目的、優點及新穎特徵、及可適用性的進一步範圍將連同附圖部份地在下列詳細描述中提出，且部份將由熟悉該技藝者檢閱下文得知，或可藉由實行本發明得知。本發明之目的及優點可藉由附帶的申請專利範圍特別指出的工具手段(instrumentalities)及組合予以實現及達成。
1:沉積噴嘴
2:排放出口
3:噴嘴通路
4:覆套-增壓入口/覆套-增壓輸入
5:中霧管
6:氣溶膠流
7:下霧管
8:霧切換腔室
9:覆套-增壓腔室
10:沉積噴嘴梢端/噴嘴梢端
20:三向閥
22:排放質量流控制器
24:增壓質量流控制器
26:上霧管
32:覆套流/覆套氣流
36:覆套質量流控制器
42:質量流控制器
44:增壓氣流
46:排放流
48:拋物線流輪廓
71:氣溶膠流中的間隙
91:中霧管中的速度分佈
92:下霧管中的速度分佈
93:預覆套腔室
94:預覆套輸入埠
95:預覆套氣體
200:過濾機構
210:真空泵
220:機械遮擋件
B:流速/增壓流/增壓氣體流率
E,N,S:流率
M:氣溶膠流率/霧流率
S:覆套氣流流率
併入說明書且構成其一部份之附圖係繪示本發明實施例的實行且連同文中描述用來解釋本發明原理。圖式僅用來繪示本發明的特定實施例並不被詮釋成限制本發明。圖中：圖1是本發明之一併入有一內部氣動遮擋系統之列印頭的一實施例之示意圖，其顯示列印組態中之流及氣溶膠分佈；圖2是當裝置初始切換至轉向組態時，圖1的裝置中之流及氣溶膠分佈的示意圖；圖3是當經過列印噴嘴的全部氣溶膠流已經停止時，圖1的裝置中之流及氣溶膠分佈的示意圖；圖4是當已經恢復列印組態時，圖1的裝置中之流及氣溶膠分佈的示意圖； 圖5是暫態遮擋之後當恢復列印時，圖1的裝置中之流的示意圖；圖6是部份遮擋(亦即部份轉向)期間，圖1的裝置中之流的示意圖；圖7是圖1的裝置中之氣溶膠流中的速度分佈之示意圖；圖8是類似圖1者的一裝置中之氣溶膠流中的速度分佈之示意圖，但其採用一預覆套氣體。
本發明的實施例係為用於快速遮擋一氣溶膠流或一覆套氣溶膠流之裝備及方法，其可適用但不限於需要協調式遮擋一流體之程序，諸如用於直接寫入式電子件之分立結構之以氣溶膠為基礎的列印，或用於各種不同的三維列印應用。流體流可包含液體懸浮物中的固體粒子、液體滴粒、或其一組合。如本文互換使用的「滴粒」或「粒子」用語係指液體滴粒、具有懸浮中的固體粒子之液體、或其混合物。本發明提供能夠在一氣溶膠流中控制式完整或部份地啟及閉墨水滴粒沉積以供以氣溶膠噴注(Aerosol Jet)®科技在一表面上列印任意圖案之方法及裝備。
在本發明的一或多個實施例中，一內部遮擋件係被併入一裝備中以供利用空氣力學聚焦來高解析無罩式沉積液體墨水。此裝備典型地包含一霧化器以供藉由將液體霧化成細微滴粒來產生一霧。經霧化的霧隨後被一載 體氣體運送至一沉積噴嘴以供導引及聚焦氣溶膠霧流。該裝備亦較佳包含一控制模組，以供自動式控制程序參數及一動作控制模組，其係驅動基材相對於沉積噴嘴的相對動作。液體墨水的氣溶膠化係可由一數目的方法達成，包括使用一超音波霧化器或氣動霧化器。氣溶膠流利用氣溶膠噴注®沉積噴嘴被聚焦，氣溶膠噴注®沉積噴嘴具有一收斂通路及一環狀共流覆套氣體，其係包繞氣溶膠流以保護通路壁不直接接觸於液體墨水滴粒並當加速經過收斂噴嘴通路時將氣溶膠流聚焦成較小直徑。被覆套氣體圍繞的氣溶膠流係離開沉積噴嘴且衝擊基材。具有覆套氣體之經準直的氣溶膠流之高速噴注流係能夠作具有一經延伸的墊高距離以供直接寫入列印之高精密材料沉積。氣溶膠噴注®沉積頭係能夠將一氣溶膠流聚焦至小到噴嘴孔口的十分之一尺寸。可藉由在沉積噴嘴被固定之時以一電腦控制式動作將基材附接至一平台來達成墨水圖案化。替代地，沉積頭可在基材位置保持固定之時在電腦控制下移動，或沉積頭與基材皆可在電腦控制下相對地移動。氣溶膠噴注程序中所使用之氣溶膠化的液體係由任何液體墨水材料組成，包括但不限於：用於一特定材料的液體分子前驅物，顆粒懸浮物，或前驅物與顆粒的一些組合。已利用本發明的內部氣動遮擋裝備及氣溶膠噴注®系統來列印小於10μm寬度之細線。
圖1顯示本發明之一包含內部遮擋的一實施例之列印頭。該列印頭包含內部霧切換腔室8。由一霧化 器產生的氣溶膠流6較佳係經過列印頭頂部進入並在箭頭所示方向移動。霧流率M較佳在氣溶膠流6列印及轉向期間皆保持穩態。在列印期間，氣溶膠流6較佳從頂部進入列印頭並移行經過上霧管26來到霧切換腔室8，隨後經過中霧管5來到覆套-增壓腔室9，其中氣溶膠流6被來自覆套質量流控制器36的覆套氣流32圍繞，經過下霧管7來到沉積噴嘴1且離開噴嘴梢端10。較佳從一諸如壓縮空氣缸筒等氣體供應物被輸送且經由質量流控制器36被控制之具有流率S的覆套氣流32較佳係經過覆套-增壓入口4被導入至列印頭中，以形成一較佳軸對稱環狀共流覆套，其在覆套-增壓腔室9中包繞在氣溶膠流周圍，藉此保護沉積噴嘴1及下霧管7的壁不受氣溶膠的滴粒衝擊。覆套氣體亦用來聚焦氣溶膠流，而能夠沉積小直徑形貌體。在列印期間，三向閥20係組配為令來自增壓質量流控制器24的增壓氣流44不進入覆套-增壓腔室9，而是旁通繞過列印頭並經過排放質量流控制器22離開系統。
如圖2所示，為了達成氣溶膠流的遮擋或轉向，三向閥20係切換使得較佳由一諸如壓縮氣體缸筒等氣體供應物所供應且由質量流控制器24作控制之具有流速B的增壓氣流44與覆套氣流32作組合並經過覆套-增壓入口4進入列印頭。排放流46經過排放出口2離開列印頭且將氣溶膠流6轉向離開中霧管5。當經組合的覆套氣流32及增壓氣流44經過覆套-增壓入口4進入覆套-增壓腔室9時，其在往上(亦即與氣溶膠流6流方向相反之方向)及往下方向皆 分成相等或不等的流。當經組合的覆套及增壓氣流之一部分往下移行朝向噴嘴梢端10時，其在覆套-增壓腔室9與沉積噴嘴梢端10之間推進氣溶膠粒子經過噴嘴梢端10外出。
在殘留的氣溶膠從噴嘴梢端10被清除之後，其可能花費近似5至50毫秒(millisecond)(依據氣體流率而定)，列印係關閉，如圖3所示。當沉積噴嘴1中的氣溶膠流正被清除時，經組合之增壓及覆套氣流的往上部分係將中霧管5中的殘留氣溶膠流6往上推向排放出口2。氣溶膠流6繼續離開上霧管26但被轉向至排放出口2外。具有流率E之來自排放出口2的淨往外排放流較佳係由真空泵210驅動，其較佳以近似七磅真空操作，並由排放質量流控制器22作控制。如說明書與申請專利範圍中所用，「真空泵」用語係指真空泵或任何其他吸力產生裝備。因為流率控制裝置典型含有包括小孔口或小通路之閥，若載有墨水的排放流穿過該等小孔口或小通路則其可能予以污染或損害，霧粒子濾器或其他過濾機構200較佳係實行於排放出口2與排放質量流控制器22之間。
當恢復列印組態時，如圖4所示，增壓氣體及排放流並不穿過頭，且中霧管5中並不發生往上流。在列印組態中，三向閥20係切換使得增壓氣流44旁通繞過列印頭。覆套質量流控制器36繼續將覆套氣流32供應至覆套-增壓入口4。氣溶膠流6的引領邊緣順著列印頭經過霧切換腔室8、第一充填中霧管5恢復一實質拋物線流輪廓48，並隨後被覆套氣流32圍繞，其後，共流氣溶膠流6及覆套 氣流進入沉積噴嘴1且最終經過噴嘴梢端10。當從轉向切換至列印時，在列印將恢復之前，氣溶膠流6往下穿過中霧管5、覆套-增壓腔室9、及沉積噴嘴1。用於中霧管5及下霧管7的小長度與內直徑較佳係使啟/閉延後達到最小化。從轉向切換至列印功能係可在短到10毫秒內發生。從列印切換到轉向可在短到5毫秒內發生，依據噴嘴或孔口尺寸、增壓流率及覆套流率而定。
霧切換腔室8較佳設置成盡可能靠近噴嘴梢端10以使與氣溶膠流6須從霧切換腔室8移行至沉積噴嘴梢端10的距離呈現相關係數之霧流回應時間達到最小化。類似地，中霧管5、下霧管7及沉積噴嘴1的內直徑較佳係最小化以增大流的速度，因此使從霧切換腔室8到噴嘴梢端10的出口之霧過境時間達到最小化。系統中之各不同流的流控制較佳係如圖示般利用質量流控制器來提供生產運轉的長時程之精密流。替代地，孔口型或轉子流量計(rotameter)流控制件對於低成本應用而言可能為較佳。尚且，為了使系統的穩定度達到最大化並使過渡時間達到最小化，M及S較佳各在全部時間維持近似恆定，包括列印及轉向模式期間及遮擋過渡期間皆然。
為了使遮擋過渡時間達到最小化，較佳令列印頭中的壓力在列印、遮擋、及兩者之間的過渡期間保持恆定。若噴嘴通路3中的流具有一流率N，則較佳地M+S+B=E+N。在列印模式中，B=0且E=0，故N=M+S。此外，覆套-增壓腔室9內側的壓力較佳維持恆定以使 遮擋過渡時間達成最小化。因為此壓力取決於來自經過噴嘴梢端10的總流之背壓力，較佳令經過噴嘴梢端10的淨流在全部操作模式及其間的過渡期間皆保持相同。因此，在完全遮擋期間，較佳選擇E及S俾使N=M+S。在遮擋期間，E=M+f(B+S)，其中f是被往上轉向之經組合的增壓及覆套流之比例部分，且N=M+S=(1-f)(B+S)。若裝置中的流滿足這些條件(亦即列印期間之噴嘴通路3中之霧的流率M實質地由轉向期間的(1-f)B-fS取代，俾使凡正離開噴嘴者的總流率N呈現恆定)，噴嘴通路3中的覆套氣流流線較佳係藉由將增壓流B導引經過頭而實質不受擾亂以使列印失能。
對於一完全轉向的流，這些方程式可解得E=B；因此質量流控制器22及24較佳設定成令E=B以供完全流轉向。為了確保氣溶膠流的完全內部遮擋或轉向，增壓氣流44的率B較佳大於氣溶膠流6流率的流率M；較佳近似氣溶膠流流率M的1.2至2倍；且更佳使B等於近似2M以供大部分應用中具有強健、完全的霧切換。
在一理論性範例中，若氣溶膠流6具有流率M=50sccm，且覆套氣流32具有流率S=55sccm，在列印期間，噴嘴通路3中(及因此離開噴嘴梢端10)的流率係為M+S=105sccm。在此模式中，由於增壓氣流44未進入列印頭，且沒有東西離開排放出口2，B=E=0(即使實際上，如上述，為了維持穩定，質量流控制器44設定成提供100sccm的流，其由三向閥20轉向以直接流到質量流控制 器42，其亦設定成將100sccm的流通往真空泵210)。當欲有完全轉向時，較佳選擇增壓氣流44的率B(及如上文衍生，排放流46的率E)使得B=E=2M=100sccm以供霧轉向。在氣溶膠流轉向或遮擋期間，具有總流率S+B=155sccm之經組合的覆套及增壓流係在覆套-增壓腔室9內作分割俾使實質上N=105sccm的組合流往下流過下霧管7及沉積噴嘴1，而取代氣溶膠流6(及覆套流32)，其此時在霧切換腔室8中被轉向。因為E在質量流控制器22中設定為100sccm，50sccm的分割經組合流係往上流，將殘留的氣溶膠流6自中霧管5沖洗並進入切換腔室8中，其在該處與經轉向的氣溶膠流作組合。因此，離開排放出口2的排放流46將等於氣溶膠流流率M加上增壓氣體流率的往上部分、或E=100sccm。進入列印頭的總流(M+B+S=205sccm)等於從列印頭外出之總流(N+E=205sccm)。典型地，平衡的流係容許覆套-增壓腔室9內側之一恆定的壓力，其導致具有最小化遮擋時間之氣溶膠流的完全開啟與關閉(亦即遮擋)。
複合遮擋
藉由將氣溶膠流轉向至排放出口2之內部氣動遮擋係可長時間期間發生而無不利效應，不同於機械遮擋，其中一被插入以阻絕氣溶膠流之機械遮擋件上的墨水累積係會脫位並弄髒基材或列印頭的空氣力學表面。內部氣動遮擋件係可單獨使用、或與諸如機械遮擋等另一遮擋技術作組合使用以利用機械遮擋的較快回應同時使機械遮 擋件臂頂部上的墨水累積達到最小化。在此實施例中，當停止列印時，機械遮擋件係被啟動以阻絕氣溶膠流。如上述的氣動遮擋係在大部分遮擋時程將墨水從機械遮擋件220轉向，藉此降低機械遮擋件上的墨水累積。因為氣動遮擋件相對於較快的機械遮擋件而言係更慢啟動，氣動遮擋件較佳係在令較快的機械遮擋件先關閉、且其後盡可能快地關閉氣動遮擋件之一時間被觸發。為了恢復列印，氣動遮擋件較佳先打開以容許輸出穩定下來，然後機械遮擋件220打開。雖然一機械遮擋件可位居列印頭內的任何地方、或甚至沉積噴嘴外部，機械衝擊遮擋較佳係發生於靠近供氣溶膠流離開沉積噴嘴之處。
暫態遮擋
在本發明的一替代實施例中，內部遮擋件可用來作為一暫態遮擋件，氣溶膠流的轉向發生於一段夠短期間使得列印頭中的氣溶膠分佈沒有時間對於其作均衡。圖2顯示緊接在三向閥20將增壓氣流44添加至覆套-增壓輸入4且從排放埠2拉取排放流46之後的氣溶膠分佈。覆套-增壓腔室9中生成之氣溶膠中的間隙係經過下霧管7往下及經過中霧管5往上擴張。
如圖5所示，當三向閥20快速切換回到將增壓氣流44轉向俾使其不進入列印頭時，中霧管5中的霧再度順著移行橫越覆套-增壓腔室9並進入下霧管7中。氣溶膠流中的間隙71可為很短，具有10ms的級數，且完整關閉及完整開啟的過渡會很快地發生。較佳令往上移動的潔 淨氣體保持在中霧管5內，俾當回復往下流時使其以往上流圖案對稱地往下流。亦即，就如同接近往上流的中心處之較高速度如圖2所示生成中管5中之潔淨氣體的一往上鼓起，回行霧的高速中心流係使該鼓起崩潰並隨著霧從中管5底部浮現而生成一實質平面性的霧前沿。因此，就如同氣溶膠流在轉向開頭被覆套-增壓腔室9中之潔淨氣體流動驟然地切割，當列印恢復時，氣溶膠的往下流較佳係重整以對於覆套-增壓腔室9中作一實質驟然進入，而生成基材處之一短的初始至完整開啟時間。若在轉向之時潔淨氣體的引領表面從中管5頂部浮現進入霧切換腔室8中，潔淨氣體係側向地散佈至腔室中。當氣溶膠流恢復時，潔淨氣體未整體回行至中霧管5，且霧的初始至完整開啟時間係劣化。潔淨氣體在中霧管5中的駐留時間係取決於管的容積對於潔淨氣體的往上流率之關係。典型利用較低的往上流率例如B=E=1.2M來生成緩慢的往上流。中霧管5的長度或直徑可增大以增加潔淨氣體在中管中之駐留時間及可准許轉向的時程。當列印在氣溶膠輸出中具有短間隙、諸如呈現緊密分隔端點的重覆性點或線之圖案時，暫態遮擋係大幅地降低遮擋時間並改良遮擋品質。
部份遮擋
典型係利用高氣溶膠流率M來提供大的墨水質量輸出並生成粗糙的形貌體，且典型則利用低流率來生成細微形貌體。常欲以相同圖案來列印大及細微的形貌體，例如令M保持恆定之時、利用一細束(beam)勾繪一圖 案的周邊且利用一粗束來充填該周邊。在圖6所示的本發明之一替代實施例中，可利用內部遮擋件使氣溶膠流6流部份地轉向，以藉由在列印時使霧的一比例部分轉向至排放出口2來改變朝向沉積噴嘴的霧流率。因此，即使在列印期間，部分的氣溶膠流6總是被轉向出排放埠2外，僅有一部分的霧通入中管5中。可藉由改變排放流率E、增壓氣體流率B、及霧流率M之間的平衡來改變有效霧流率及列印線寬。當完整轉向時，增壓流B較佳大於或等於霧流M，如上述。若B小於M，部分的霧將仍順著中霧管5移行且來到沉積噴嘴1外，且氣溶膠將僅被部份地轉向。
在一理論性範例中，欲使氣溶膠流的一半作轉向且一半作列印。若氣溶膠流6具有流率M=50sccm，且覆套氣流32具有流率S=55sccm，對於部份遮擋，此範例中係選擇增壓氣流44的率B俾使B=½M=25sccm。質量流控制器22設定成令E=65sccm，所以經組合的覆套及增壓流在覆套-增壓腔室9內被相等分割具有總流率S+B=80sccm，俾使40sccm的經組合流往下流過下霧管7及沉積噴嘴1。N因此係為40sccm+(½ M)=65sccm且進入列印頭的總流(50+55+25=130sccm)等於外出列印頭的總流(65+65=130sccm)。替代地，E可設定成等於75sccm，在該實例中，經組合的增壓及覆套流係分割使得50sccm往上流(因為75-25=50)且30sccm往下流。因此，N=30+25=55sccm，且入進流(50+55+25=130sccm)再度等於外出流(75+55=130sccm)。 請注意對於部份遮擋，E>B，且系統係均衡來到一低於完全遮擋期間所發生者(205sccm)、且高於正常列印期間所發生者(105sccm)之壓力(130sccm)，如先前範例所示。
一般而言，利用B>M以供霧作完整轉向或遮擋或是暫態遮擋、而防止列印，且利用B<M或B=M來降低列印期間的霧輸出並生成細微形貌體。各個具有B<M的B將導致一不同霧流離開沉積噴嘴1。因此，若可生成至少兩位準的增壓流，其中一者具有B>M且一者具有B<M，則可以達成降低及完整轉向霧流。可例如藉由快速改變增壓質量流控制器24的設定、或替代地採用一第二增壓質量流控制器予以達成。在後者實例中，一增壓質量流控制器(MFC)可設定在一例如2M的流，以完全關閉霧，且另一者設定在一例如½ M的流，以降低流出噴嘴1的M之比例部分。
因為當M改變時排放及增壓氣流可在短於近似一秒內穩定下來、但一霧化器的輸出則會花費大於10秒穩定下來，利用部份轉向來改變質量輸出及線寬係為改變入進氣溶膠流6率M之較佳方式。替代地，可利用一用以分割一既有的流及控制閥之第二流流束(flow stream)或孔口，以生成具有快速回應時間之變動的霧輸出。
預覆套氣體
在本發明中較佳進行的氣溶膠噴注列印中所正常採用之層流條件下，圓柱形管中的氣體係形成一拋物線速度輪廓，管中心處具有平均速度的兩倍且在接近管 壁處具有接近零速度。圖4顯示氣溶膠流在轉向後被重新建立，其中霧的引領邊緣遵循此拋物線流輪廓48。接近中霧管5壁處之緩慢移動的霧以及中霧管5中心處的快速移動的霧之橫越時間之間的差異係支配著基材處的氣溶膠之初始開啟與完整開啟之間的延後。雖然理論上接近中管壁的零速度霧要花費無限時間量以抵達覆套-增壓腔室，實務上，在遮擋件打開之後(亦即三向閥20切換時)快速移動的霧抵達覆套-增壓腔室所需時間的近似2到3倍之後，即達成實質完整的輸出。圖7顯示中霧管5中的速度分佈91及下霧管7中的速度分佈92。基於下列兩項理由，下管中的霧速度大於中管者：理由一，因為覆套氣流32已在覆套-增壓腔室9中被添加至氣溶膠流6，而較佳形成霧周圍的一軸對稱環狀套筒；理由二，下霧管7中的霧係侷限於流的中央快速移動部分。因此藉由一覆套氣流，正是潔淨覆套氣體的套筒接近於緩慢移動中的管壁；氣溶膠本身係位於氣體速度輪廓的高速區中。因此，霧分佈的中心及邊緣要橫越下霧管7及沉積噴嘴1之時間係僅有相對極小變異。
因為此優點，可在霧進入切換腔室8及/或中霧管5之前添加一圍繞霧流之「預覆套」，以消除接近中霧管5壁處之緩慢移動的霧。圖8顯示經由預覆套輸入埠94進入預覆套腔室93之預覆套氣體95，較佳形成氣溶膠流6周圍之一軸對稱環狀套筒的潔淨氣體。在部分實施例中，總覆套流的近似一半被導引至預覆套輸入埠94中，且另一半被導引至覆套-增壓輸入埠4中。將覆套流的50%供應至 預覆套氣流係導致氣溶膠流的初始與完整開啟之間延後的近似80%降低。隨著預覆套及覆套流在覆套-增壓腔室9中重新組合，採用或不採用一預覆套氣流，基材上的沉積特徵係少有差異。
請注意在說明書與申請專利範圍中，「約」或「近似」係指所述數值量的二十百分點(20%)以內。除非上下文另外明述，本文所用的單數形「一(a/an)」及「該(the)」係包括多數個參照物。因此，例如，提到「一功能群組」係指一或多個功能群組，且提到「方法」係包括指涉將被熟悉該技藝者所瞭解及理解之均等性步驟及方法，依此類推。
雖已特別參照所揭露實施例來詳述本發明，其他實施例可達成相同結果。本發明的變異及修改將被熟悉該技藝者所明顯得知並意圖涵蓋所有此等修改及均等物。所有專利案及公開文件的整體揭示以參考方式併入本文。
1:沉積噴嘴
2:排放出口
4:覆套-增壓入口/覆套-增壓輸入
5:中霧管
6:氣溶膠流
8:霧切換腔室
10:沉積噴嘴梢端/噴嘴梢端
20:三向閥
22:排放質量流控制器
24:增壓質量流控制器
26:上霧管
36:覆套質量流控制器
44:增壓氣流
46:排放流
200:過濾機構
210:真空泵

Claims (31)

  1. 一種用於控制一氣溶膠噴注列印系統的一列印頭中之一氣溶膠的流之方法，該方法包含：使一氣溶膠流在一原始氣溶膠流方向穿過該列印頭；以一覆套氣體圍繞該氣溶膠；使該經組合的氣溶膠流及該覆套氣體穿過該列印頭的一沉積噴嘴；將一增壓氣體添加至該覆套氣體以形成一覆套-增壓氣流；將該覆套-增壓氣流分成在與該原始氣溶膠流方向相反的一方向流動之一第一部分及在該原始氣溶膠流方向流動之一第二部分；及以該覆套-增壓氣流的該第一部分防止該氣溶膠流的一經偏向部分穿過該沉積噴嘴。
  2. 如請求項1之方法，其中該覆套氣體的流率及該氣溶膠流的流率保持近似恆定。
  3. 如請求項1或2之方法，其中在該增壓氣體添加至該覆套氣體之前，該增壓氣體流到一真空泵。
  4. 如請求項1或2之方法，其進一步包含：在分成步驟之後從該列印頭提取一排放流，該排放流包含該氣溶膠流的該經偏向部分及該覆套-增壓氣流的該第一部分。
  5. 如請求項4之方法，其中提取該排放流的步驟係包含：利用真空泵來吸取該排放流。
  6. 如請求項4之方法，其中該排放流的流率由一質量流控制器、一孔口型流控制器，或一轉子流量計所控制。
  7. 如請求項1或2之方法，其中該覆套氣體的流率及該增壓氣體的流率由一或多個流控制器作控制。
  8. 如請求項7之方法，其中該一或多個流控制器係選自由質量流控制器、孔口型流控制器及轉子流量計所組成的群組。
  9. 如請求項1或2之方法，其中該氣溶膠流在該添加步驟之前的流率加上覆套氣體在該添加步驟之前的流率，係近似等於該覆套-增壓氣流的該第二部分之流率加上該氣溶膠流的未偏向部分之流率。
  10. 如請求項1或2之方法，其中該方法以小於近似10毫秒(millisecond)進行。
  11. 如請求項1或2之方法，其中該增壓氣體的流率大於該氣溶膠流的流率。
  12. 如請求項11之方法，其中該增壓氣體的流率係為該氣溶膠流的流率之近似1.2倍以及該氣溶膠流的流率之近似2倍之間。
  13. 如請求項11之方法，其中該氣溶膠流的該經偏向部分包含整體氣溶膠流，以便沒有該氣溶膠流穿過該沉積噴嘴。
  14. 如請求項11之方法，其中該排放流的 流率係設定為近似等於該增壓氣體的流率。
  15. 如請求項11之方法，其進一步包含：在該氣溶膠流的全部未偏向部分經過該沉積噴嘴離開該列印頭之前，使該增壓氣體轉向以直接流到該真空泵。
  16. 如請求項1或2之方法，其進一步包含：在該防止步驟之前，以一機械遮擋件阻絕該氣溶膠的一流。
  17. 如請求項1或2方法，其中該增壓氣體的流率係小於或等於該氣溶膠流的流率。
  18. 如請求項17之方法，其中該排放流的流率設定為大於該增壓氣體的流率。
  19. 如請求項1或2之方法，其進一步包含：在以該覆套氣體圍繞該氣溶膠流之前，以一預覆套氣體圍繞該氣溶膠。
  20. 如請求項19之方法，其中以該覆套氣體圍繞該氣溶膠流的步驟係包含：使該覆套氣體與該預覆套氣體作組合。
  21. 如請求項19之方法，其中利用該覆套氣體的近似一半形成該預覆套氣體。
  22. 一種用於沉積一氣溶膠之裝備，該裝備包含：一氣溶膠供應物；一覆套氣體供應物；一增壓氣體供應物； 一真空泵；一閥，其用於將該增壓氣體供應物連接至該覆套氣體供應物或該真空泵；及一列印頭，該列印頭包含：一氣溶膠入口，用於從該氣溶膠供應物接收一氣溶膠；一第一腔室，其包含一覆套氣體入口以供從該覆套氣體供應物接收一覆套氣體；該第一腔室係組配為以該覆套氣體圍繞該氣溶膠；及一第二腔室，其包含連接至該真空泵之一排放氣體出口，該第二腔室置設於該氣溶膠入口與該第一腔室之間；及一沉積噴嘴；其中當該增壓氣體供應物連接至該覆套氣體供應物時，該覆套氣體入口係接收來自該增壓氣體供應物的一增壓氣體與該覆套氣體之一組合；及其中該第一腔室係組配為將該組合的一部分分成流往該氣溶膠入口之一第一部分及流往該沉積噴嘴之一第二部分。
  23. 如請求項22之裝備，其包含置設於該排放氣體出口與該真空泵之間的一第一流控制器。
  24. 如請求項23之裝備，其中該第一流控制器包含一質量流控制器、一孔口型流控制器或一轉子流量計。
  25. 如請求項23或24之裝備，其包含一被置設於該排放氣體出口與該第一流控制器之間的濾器。
  26. 如請求項22至24中任一項之裝備，其包含置設於該覆套氣體供應物與該覆套氣體入口之間的一第二流控制器，及置設於該增壓氣體供應物與該閥之間的一第三流控制器。
  27. 如請求項26之裝備，其中該第二流控制器及/或該第三流控制器包含一質量流控制器、一孔口型流控制器或一轉子流量計。
  28. 如請求項22至24中任一項之裝備，其中進入該覆套氣體入口之一氣流方向係與該列印頭中的一氣溶膠流方向呈垂直。
  29. 如請求項22至24中任一項之裝備，其包含一機械遮擋件。
  30. 如請求項22至24中任一項之裝備，其包含置設於該氣溶膠入口與該第二腔室之間的一第三腔室，該第三腔室包含一預覆套氣體入口，該第三腔室係組配為以一預覆套氣體圍繞該氣溶膠。
  31. 如請求項30之裝備，其包含連接於該預覆套氣體入口與該覆套氣體供應物之間的一流分割器，該流分割器用於從該覆套氣體的近似一半形成該預覆套氣體。
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DE102020206926A1 (de) 2020-06-03 2021-12-09 Robert Bosch Gesellschaft mit beschränkter Haftung Medienauftragungsvorrichtung, Medienauftragungssystem und Verfahren zu einer gerichteten Ausgabe eines Mediums mittels der Medienauftragungsvorrichtung
EP4214057A4 (en) * 2020-09-21 2024-10-23 Integrated Deposition Solutions Inc HIGH DEFINITION AEROSOL PRINTING USING AN OPTIMIZED AEROSOL DELIVERY SYSTEM AND AERODYNAMIC LENS
KR102419859B1 (ko) * 2020-12-21 2022-07-12 주식회사 프로텍 점성 용액 에어로졸 분사 장치
CN113199776B (zh) * 2021-03-15 2023-04-28 厦门理工学院 一种纳米颗粒气溶胶喷印方法及装置
TW202247905A (zh) * 2021-04-29 2022-12-16 美商阿普托麥克股份有限公司 用於氣溶膠噴射裝置之高可靠性鞘護輸送路徑
CN114985775B (zh) * 2022-06-02 2024-07-16 临沂大学 一种基于气溶胶三维打印的喷头装置
CN114985772A (zh) * 2022-06-02 2022-09-02 临沂大学 一种基于微纳电子制造的复杂曲面打印装置及成形方法
CN115218125B (zh) * 2022-07-20 2024-09-03 广州卓诚智能装备有限公司 换向结构
WO2024118781A1 (en) * 2022-11-29 2024-06-06 Optomec, Inc. High reliability sheathed aerosol flow splitter
KR102670828B1 (ko) * 2023-02-15 2024-05-30 순천향대학교 산학협력단 집속 스프레이 젯 프린팅 시스템

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020100416A1 (en) * 2001-01-30 2002-08-01 Sun James J. Method and apparatus for deposition of particles on surfaces
CN108372036A (zh) * 2016-10-31 2018-08-07 扬州华联涂装机械有限公司 一种空气喷枪

Family Cites Families (351)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3474971A (en) 1967-06-14 1969-10-28 North American Rockwell Two-piece injector
DE1984101U (de) 1968-02-12 1968-04-25 Waltraud Gollong Hygienische schutzhose.
US3590477A (en) 1968-12-19 1971-07-06 Ibm Method for fabricating insulated-gate field effect transistors having controlled operating characeristics
US3808550A (en) 1969-12-15 1974-04-30 Bell Telephone Labor Inc Apparatuses for trapping and accelerating neutral particles
US3642202A (en) 1970-05-13 1972-02-15 Exxon Research Engineering Co Feed system for coking unit
US3808432A (en) 1970-06-04 1974-04-30 Bell Telephone Labor Inc Neutral particle accelerator utilizing radiation pressure
US3715785A (en) 1971-04-29 1973-02-13 Ibm Technique for fabricating integrated incandescent displays
US3846661A (en) 1971-04-29 1974-11-05 Ibm Technique for fabricating integrated incandescent displays
US3777983A (en) 1971-12-16 1973-12-11 Gen Electric Gas cooled dual fuel air atomized fuel nozzle
US3816025A (en) 1973-01-18 1974-06-11 Neill W O Paint spray system
US3854321A (en) 1973-04-27 1974-12-17 B Dahneke Aerosol beam device and method
US3901798A (en) 1973-11-21 1975-08-26 Environmental Research Corp Aerosol concentrator and classifier
US4036434A (en) 1974-07-15 1977-07-19 Aerojet-General Corporation Fluid delivery nozzle with fluid purged face
US3982251A (en) 1974-08-23 1976-09-21 Ibm Corporation Method and apparatus for recording information on a recording medium
US3959798A (en) 1974-12-31 1976-05-25 International Business Machines Corporation Selective wetting using a micromist of particles
DE2517715C2 (de) 1975-04-22 1977-02-10 Hans Behr Verfahren und einrichtung zum mischen und/oder dispergieren und abstrahlen der komponenten eines fliessfaehigen materials zum beschichten von oberflaechen
US4019188A (en) * 1975-05-12 1977-04-19 International Business Machines Corporation Micromist jet printer
US3974769A (en) 1975-05-27 1976-08-17 International Business Machines Corporation Method and apparatus for recording information on a recording surface through the use of mists
US4004733A (en) 1975-07-09 1977-01-25 Research Corporation Electrostatic spray nozzle system
US4016417A (en) 1976-01-08 1977-04-05 Richard Glasscock Benton Laser beam transport, and method
US4046073A (en) 1976-01-28 1977-09-06 International Business Machines Corporation Ultrasonic transfer printing with multi-copy, color and low audible noise capability
US4046074A (en) 1976-02-02 1977-09-06 International Business Machines Corporation Non-impact printing system
US4034025A (en) 1976-02-09 1977-07-05 Martner John G Ultrasonic gas stream liquid entrainment apparatus
US4092535A (en) 1977-04-22 1978-05-30 Bell Telephone Laboratories, Incorporated Damping of optically levitated particles by feedback and beam shaping
US4171096A (en) 1977-05-26 1979-10-16 John Welsh Spray gun nozzle attachment
US4112437A (en) 1977-06-27 1978-09-05 Eastman Kodak Company Electrographic mist development apparatus and method
US4235563A (en) 1977-07-11 1980-11-25 The Upjohn Company Method and apparatus for feeding powder
JPS592617B2 (ja) 1977-12-22 1984-01-19 株式会社リコー インク噴射装置
US4132894A (en) 1978-04-04 1979-01-02 The United States Of America As Represented By The United States Department Of Energy Monitor of the concentration of particles of dense radioactive materials in a stream of air
US4200669A (en) 1978-11-22 1980-04-29 The United States Of America As Represented By The Secretary Of The Navy Laser spraying
GB2052566B (en) 1979-03-30 1982-12-15 Rolls Royce Laser aplication of hard surface alloy
US4323756A (en) 1979-10-29 1982-04-06 United Technologies Corporation Method for fabricating articles by sequential layer deposition
JPS5948873B2 (ja) 1980-05-14 1984-11-29 ペルメレック電極株式会社 耐食性被覆を設けた電極基体又は電極の製造方法
US4453803A (en) 1981-06-25 1984-06-12 Agency Of Industrial Science & Technology Optical waveguide for middle infrared band
US4605574A (en) 1981-09-14 1986-08-12 Takashi Yonehara Method and apparatus for forming an extremely thin film on the surface of an object
US4485387A (en) 1982-10-26 1984-11-27 Microscience Systems Corp. Inking system for producing circuit patterns
US4685563A (en) 1983-05-16 1987-08-11 Michelman Inc. Packaging material and container having interlaminate electrostatic shield and method of making same
US4497692A (en) 1983-06-13 1985-02-05 International Business Machines Corporation Laser-enhanced jet-plating and jet-etching: high-speed maskless patterning method
US4601921A (en) 1984-12-24 1986-07-22 General Motors Corporation Method and apparatus for spraying coating material
US4694136A (en) 1986-01-23 1987-09-15 Westinghouse Electric Corp. Laser welding of a sleeve within a tube
US4689052A (en) 1986-02-19 1987-08-25 Washington Research Foundation Virtual impactor
US4823009A (en) 1986-04-14 1989-04-18 Massachusetts Institute Of Technology Ir compatible deposition surface for liquid chromatography
US4670135A (en) 1986-06-27 1987-06-02 Regents Of The University Of Minnesota High volume virtual impactor
JPS6359195A (ja) 1986-08-29 1988-03-15 Hitachi Ltd 磁気記録再生装置
DE3686161D1 (de) 1986-09-25 1992-08-27 Lucien Diego Laude Vorrichtung zur laserunterstuetzten, elektrolytischen metallabscheidung.
US4733018A (en) 1986-10-02 1988-03-22 Rca Corporation Thick film copper conductor inks
US4927992A (en) 1987-03-04 1990-05-22 Westinghouse Electric Corp. Energy beam casting of metal articles
US4724299A (en) 1987-04-15 1988-02-09 Quantum Laser Corporation Laser spray nozzle and method
US4904621A (en) 1987-07-16 1990-02-27 Texas Instruments Incorporated Remote plasma generation process using a two-stage showerhead
US4893886A (en) 1987-09-17 1990-01-16 American Telephone And Telegraph Company Non-destructive optical trap for biological particles and method of doing same
US4997809A (en) 1987-11-18 1991-03-05 International Business Machines Corporation Fabrication of patterned lines of high Tc superconductors
US4920254A (en) 1988-02-22 1990-04-24 Sierracin Corporation Electrically conductive window and a method for its manufacture
JPH0621335B2 (ja) 1988-02-24 1994-03-23 工業技術院長 レ−ザ溶射法
US4895735A (en) 1988-03-01 1990-01-23 Texas Instruments Incorporated Radiation induced pattern deposition
US4917830A (en) 1988-09-19 1990-04-17 The United States Of America As Represented By The United States Department Of Energy Monodisperse aerosol generator
US4971251A (en) 1988-11-28 1990-11-20 Minnesota Mining And Manufacturing Company Spray gun with disposable liquid handling portion
US5614252A (en) 1988-12-27 1997-03-25 Symetrix Corporation Method of fabricating barium strontium titanate
US6056994A (en) 1988-12-27 2000-05-02 Symetrix Corporation Liquid deposition methods of fabricating layered superlattice materials
US4911365A (en) 1989-01-26 1990-03-27 James E. Hynds Spray gun having a fanning air turbine mechanism
US5043548A (en) 1989-02-08 1991-08-27 General Electric Company Axial flow laser plasma spraying
US5038014A (en) 1989-02-08 1991-08-06 General Electric Company Fabrication of components by layered deposition
US5064685A (en) 1989-08-23 1991-11-12 At&T Laboratories Electrical conductor deposition method
US5017317A (en) 1989-12-04 1991-05-21 Board Of Regents, The Uni. Of Texas System Gas phase selective beam deposition
US5032850A (en) 1989-12-18 1991-07-16 Tokyo Electric Co., Ltd. Method and apparatus for vapor jet printing
US4978067A (en) 1989-12-22 1990-12-18 Sono-Tek Corporation Unitary axial flow tube ultrasonic atomizer with enhanced sealing
DE4000690A1 (de) 1990-01-12 1991-07-18 Philips Patentverwaltung Verfahren zum herstellen von ultrafeinen partikeln und deren verwendung
US5250383A (en) 1990-02-23 1993-10-05 Fuji Photo Film Co., Ltd. Process for forming multilayer coating
DE4006511A1 (de) 1990-03-02 1991-09-05 Krupp Gmbh Einrichtung zum zufuehren pulverfoermiger zusatzwerkstoffe in den bereich einer schweissstelle
US5176328A (en) 1990-03-13 1993-01-05 The Board Of Regents Of The University Of Nebraska Apparatus for forming fin particles
US5126102A (en) 1990-03-15 1992-06-30 Kabushiki Kaisha Toshiba Fabricating method of composite material
CN2078199U (zh) 1990-06-15 1991-06-05 蒋隽 多用途便携式超声雾化器
US5152462A (en) 1990-08-10 1992-10-06 Roussel Uclaf Spray system
JPH04120259A (ja) 1990-09-10 1992-04-21 Agency Of Ind Science & Technol レーザ溶射法による機器・部材の製造方法および装置
FR2667811B1 (fr) 1990-10-10 1992-12-04 Snecma Dispositif d'apport de poudre pour revetement par traitement au faisceau laser.
US5245404A (en) 1990-10-18 1993-09-14 Physical Optics Corportion Raman sensor
US5170890A (en) 1990-12-05 1992-12-15 Wilson Steven D Particle trap
US5634093A (en) 1991-01-30 1997-05-27 Kabushiki Kaisha Toshiba Method and CAD system for designing wiring patterns using predetermined rules
US6175422B1 (en) 1991-01-31 2001-01-16 Texas Instruments Incorporated Method and apparatus for the computer-controlled manufacture of three-dimensional objects from computer data
DE59201161D1 (de) 1991-02-02 1995-02-23 Theysohn Friedrich Fa Verfahren zur Erzeugung einer verschleissmindernden Schicht.
CA2061069C (en) 1991-02-27 1999-06-29 Toshio Kubota Method of electrostatically spray-coating a workpiece with paint
US5292418A (en) 1991-03-08 1994-03-08 Mitsubishi Denki Kabushiki Kaisha Local laser plating apparatus
JPH06509523A (ja) 1991-04-09 1994-10-27 ヘイバー，マイケル・ビー コンピユータによるマクロ構体製造
US5173220A (en) 1991-04-26 1992-12-22 Motorola, Inc. Method of manufacturing a three-dimensional plastic article
US5176744A (en) 1991-08-09 1993-01-05 Microelectronics Computer & Technology Corp. Solution for direct copper writing
US5164535A (en) 1991-09-05 1992-11-17 Silent Options, Inc. Gun silencer
US5314003A (en) 1991-12-24 1994-05-24 Microelectronics And Computer Technology Corporation Three-dimensional metal fabrication using a laser
FR2685922B1 (fr) 1992-01-07 1995-03-24 Strasbourg Elec Buse coaxiale de traitement superficiel sous irradiation laser, avec apport de materiaux sous forme de poudre.
US5495105A (en) 1992-02-20 1996-02-27 Canon Kabushiki Kaisha Method and apparatus for particle manipulation, and measuring apparatus utilizing the same
US5194297A (en) 1992-03-04 1993-03-16 Vlsi Standards, Inc. System and method for accurately depositing particles on a surface
US5378508A (en) 1992-04-01 1995-01-03 Akzo Nobel N.V. Laser direct writing
JPH05283708A (ja) 1992-04-02 1993-10-29 Mitsubishi Electric Corp 不揮発性半導体記憶装置，その製造方法および試験方法
JPH05318748A (ja) 1992-05-21 1993-12-03 Brother Ind Ltd 液滴噴射装置用駆動電極の形成方法
EP0651677B1 (en) 1992-07-08 1997-10-01 Nordson Corporation Apparatus and methods for applying discrete foam coatings
US5335000A (en) 1992-08-04 1994-08-02 Calcomp Inc. Ink vapor aerosol pen for pen plotters
US5294459A (en) 1992-08-27 1994-03-15 Nordson Corporation Air assisted apparatus and method for selective coating
IL107120A (en) 1992-09-29 1997-09-30 Boehringer Ingelheim Int Atomising nozzle and filter and spray generating device
US5344676A (en) 1992-10-23 1994-09-06 The Board Of Trustees Of The University Of Illinois Method and apparatus for producing nanodrops and nanoparticles and thin film deposits therefrom
US5322221A (en) 1992-11-09 1994-06-21 Graco Inc. Air nozzle
JPH08156106A (ja) 1992-11-13 1996-06-18 Japan Atom Energy Res Inst ３次元物体製作法
US5775402A (en) 1995-10-31 1998-07-07 Massachusetts Institute Of Technology Enhancement of thermal properties of tooling made by solid free form fabrication techniques
US5449536A (en) 1992-12-18 1995-09-12 United Technologies Corporation Method for the application of coatings of oxide dispersion strengthened metals by laser powder injection
US5529634A (en) 1992-12-28 1996-06-25 Kabushiki Kaisha Toshiba Apparatus and method of manufacturing semiconductor device
US5359172A (en) 1992-12-30 1994-10-25 Westinghouse Electric Corporation Direct tube repair by laser welding
US5270542A (en) 1992-12-31 1993-12-14 Regents Of The University Of Minnesota Apparatus and method for shaping and detecting a particle beam
US5366559A (en) 1993-05-27 1994-11-22 Research Triangle Institute Method for protecting a substrate surface from contamination using the photophoretic effect
US5733609A (en) 1993-06-01 1998-03-31 Wang; Liang Ceramic coatings synthesized by chemical reactions energized by laser plasmas
IL106803A (en) 1993-08-25 1998-02-08 Scitex Corp Ltd Printable inkjet head
US5398193B1 (en) 1993-08-20 1997-09-16 Alfredo O Deangelis Method of three-dimensional rapid prototyping through controlled layerwise deposition/extraction and apparatus therefor
US5491317A (en) 1993-09-13 1996-02-13 Westinghouse Electric Corporation System and method for laser welding an inner surface of a tubular member
US5403617A (en) 1993-09-15 1995-04-04 Mobium Enterprises Corporation Hybrid pulsed valve for thin film coating and method
US5736195A (en) 1993-09-15 1998-04-07 Mobium Enterprises Corporation Method of coating a thin film on a substrate
US5518680A (en) 1993-10-18 1996-05-21 Massachusetts Institute Of Technology Tissue regeneration matrices by solid free form fabrication techniques
US5554415A (en) 1994-01-18 1996-09-10 Qqc, Inc. Substrate coating techniques, including fabricating materials on a surface of a substrate
US5477026A (en) 1994-01-27 1995-12-19 Chromalloy Gas Turbine Corporation Laser/powdered metal cladding nozzle
US5512745A (en) 1994-03-09 1996-04-30 Board Of Trustees Of The Leland Stanford Jr. University Optical trap system and method
WO1995029501A1 (en) 1994-04-25 1995-11-02 Philips Electronics N.V. Method of curing a film
US5609921A (en) 1994-08-26 1997-03-11 Universite De Sherbrooke Suspension plasma spray
FR2724853B1 (fr) 1994-09-27 1996-12-20 Saint Gobain Vitrage Dispositif de distribution de solides pulverulents a la surface d'un substrat en vue d'y deposer un revetement
US5732885A (en) 1994-10-07 1998-03-31 Spraying Systems Co. Internal mix air atomizing spray nozzle
US5486676A (en) 1994-11-14 1996-01-23 General Electric Company Coaxial single point powder feed nozzle
US5541006A (en) 1994-12-23 1996-07-30 Kennametal Inc. Method of making composite cermet articles and the articles
US5861136A (en) 1995-01-10 1999-01-19 E. I. Du Pont De Nemours And Company Method for making copper I oxide powders by aerosol decomposition
JPH08238784A (ja) * 1995-02-16 1996-09-17 Hewlett Packard Co <Hp> インクジェットプリンタのエアロゾル低減方法及び装置
US5770272A (en) 1995-04-28 1998-06-23 Massachusetts Institute Of Technology Matrix-bearing targets for maldi mass spectrometry and methods of production thereof
US5612099A (en) 1995-05-23 1997-03-18 Mcdonnell Douglas Corporation Method and apparatus for coating a substrate
US5814152A (en) 1995-05-23 1998-09-29 Mcdonnell Douglas Corporation Apparatus for coating a substrate
TW284907B (en) 1995-06-07 1996-09-01 Cauldron Lp Removal of material by polarized irradiation and back side application for radiation
US5882722A (en) 1995-07-12 1999-03-16 Partnerships Limited, Inc. Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds
GB9515439D0 (en) 1995-07-27 1995-09-27 Isis Innovation Method of producing metal quantum dots
EP0848658B1 (en) 1995-08-04 2006-10-11 nGimat Co. Chemical vapor deposition and powder formation using thermal spray with near supercritical and supercritical fluid solutions
US5779833A (en) 1995-08-04 1998-07-14 Case Western Reserve University Method for constructing three dimensional bodies from laminations
US5837960A (en) 1995-08-14 1998-11-17 The Regents Of The University Of California Laser production of articles from powders
US5746844A (en) 1995-09-08 1998-05-05 Aeroquip Corporation Method and apparatus for creating a free-form three-dimensional article using a layer-by-layer deposition of molten metal and using a stress-reducing annealing process on the deposited metal
US5607730A (en) 1995-09-11 1997-03-04 Clover Industries, Inc. Method and apparatus for laser coating
US5653925A (en) 1995-09-26 1997-08-05 Stratasys, Inc. Method for controlled porosity three-dimensional modeling
EP0870075B1 (en) 1995-12-14 2002-06-12 Imperial College Of Science, Technology & Medicine Film or coating deposition and powder formation
US6015083A (en) 1995-12-29 2000-01-18 Microfab Technologies, Inc. Direct solder bumping of hard to solder substrate
US5772106A (en) 1995-12-29 1998-06-30 Microfab Technologies, Inc. Printhead for liquid metals and method of use
US5993549A (en) 1996-01-19 1999-11-30 Deutsche Forschungsanstalt Fuer Luft- Und Raumfahrt E.V. Powder coating apparatus
US5676719A (en) 1996-02-01 1997-10-14 Engineering Resources, Inc. Universal insert for use with radiator steam traps
US5772964A (en) 1996-02-08 1998-06-30 Lab Connections, Inc. Nozzle arrangement for collecting components from a fluid for analysis
CN1093783C (zh) 1996-02-21 2002-11-06 松下电器产业株式会社 液体喷涂喷嘴和液体喷涂喷嘴的制造方法
US5705117A (en) 1996-03-01 1998-01-06 Delco Electronics Corporaiton Method of combining metal and ceramic inserts into stereolithography components
WO1997038810A1 (en) 1996-04-17 1997-10-23 Philips Electronics N.V. Method of manufacturing a sintered structure on a substrate
US5844192A (en) 1996-05-09 1998-12-01 United Technologies Corporation Thermal spray coating method and apparatus
US6116184A (en) 1996-05-21 2000-09-12 Symetrix Corporation Method and apparatus for misted liquid source deposition of thin film with reduced mist particle size
US5854311A (en) 1996-06-24 1998-12-29 Richart; Douglas S. Process and apparatus for the preparation of fine powders
CA2259625A1 (en) 1996-07-08 1998-01-15 Spraychip Systems Corp. Gas-assisted atomizing device
US6046426A (en) 1996-07-08 2000-04-04 Sandia Corporation Method and system for producing complex-shape objects
US5772963A (en) 1996-07-30 1998-06-30 Bayer Corporation Analytical instrument having a control area network and distributed logic nodes
US6544599B1 (en) 1996-07-31 2003-04-08 Univ Arkansas Process and apparatus for applying charged particles to a substrate, process for forming a layer on a substrate, products made therefrom
US5707715A (en) 1996-08-29 1998-01-13 L. Pierre deRochemont Metal ceramic composites with improved interfacial properties and methods to make such composites
JP3867176B2 (ja) 1996-09-24 2007-01-10 アール・アイ・ディー株式会社 粉体質量流量測定装置、およびこれを適用した静電粉体塗装装置
US6143116A (en) 1996-09-26 2000-11-07 Kyocera Corporation Process for producing a multi-layer wiring board
US5742050A (en) 1996-09-30 1998-04-21 Aviv Amirav Method and apparatus for sample introduction into a mass spectrometer for improving a sample analysis
US5578227A (en) 1996-11-22 1996-11-26 Rabinovich; Joshua E. Rapid prototyping system
US6144008A (en) 1996-11-22 2000-11-07 Rabinovich; Joshua E. Rapid manufacturing system for metal, metal matrix composite materials and ceramics
EP1012871A1 (en) 1997-01-03 2000-06-28 MDS Inc. Spray chamber with dryer
US6379745B1 (en) 1997-02-20 2002-04-30 Parelec, Inc. Low temperature method and compositions for producing electrical conductors
US6699304B1 (en) 1997-02-24 2004-03-02 Superior Micropowders, Llc Palladium-containing particles, method and apparatus of manufacture, palladium-containing devices made therefrom
US5936627A (en) 1997-02-28 1999-08-10 International Business Machines Corporation Method and system for performing perspective divide operations on three-dimensional graphical object data within a computer system
US5894403A (en) 1997-05-01 1999-04-13 Wilson Greatbatch Ltd. Ultrasonically coated substrate for use in a capacitor
KR100517263B1 (ko) 1997-05-06 2005-09-28 다까마쯔 겡뀨쇼 금속 페이스트 및 금속막의 제조 방법
US5849238A (en) 1997-06-26 1998-12-15 Ut Automotive Dearborn, Inc. Helical conformal channels for solid freeform fabrication and tooling applications
US6952504B2 (en) 2001-12-21 2005-10-04 Neophotonics Corporation Three dimensional engineering of planar optical structures
US7164818B2 (en) 2001-05-03 2007-01-16 Neophontonics Corporation Integrated gradient index lenses
US6890624B1 (en) 2000-04-25 2005-05-10 Nanogram Corporation Self-assembled structures
US6391494B2 (en) 1999-05-13 2002-05-21 Nanogram Corporation Metal vanadium oxide particles
US5847357A (en) 1997-08-25 1998-12-08 General Electric Company Laser-assisted material spray processing
US6021776A (en) 1997-09-09 2000-02-08 Intertex Research, Inc. Disposable atomizer device with trigger valve system
US6548122B1 (en) 1997-09-16 2003-04-15 Sri International Method of producing and depositing a metal film
US5980998A (en) 1997-09-16 1999-11-09 Sri International Deposition of substances on a surface
EP1027723B1 (en) 1997-10-14 2009-06-17 Patterning Technologies Limited Method of forming an electric capacitor
US6007631A (en) 1997-11-10 1999-12-28 Speedline Technologies, Inc. Multiple head dispensing system and method
US5993416A (en) 1998-01-15 1999-11-30 Medtronic Ave, Inc. Method and apparatus for regulating the fluid flow rate to and preventing over-pressurization of a balloon catheter
US5993554A (en) 1998-01-22 1999-11-30 Optemec Design Company Multiple beams and nozzles to increase deposition rate
US20050097987A1 (en) 1998-02-24 2005-05-12 Cabot Corporation Coated copper-containing powders, methods and apparatus for producing such powders, and copper-containing devices fabricated from same
US6967183B2 (en) 1998-08-27 2005-11-22 Cabot Corporation Electrocatalyst powders, methods for producing powders and devices fabricated from same
US6349668B1 (en) 1998-04-27 2002-02-26 Msp Corporation Method and apparatus for thin film deposition on large area substrates
WO1999060397A1 (en) 1998-05-18 1999-11-25 University Of Washington Liquid analysis cartridge
DE19822674A1 (de) 1998-05-20 1999-12-09 Gsf Forschungszentrum Umwelt Gaseinlaß für eine Ionenquelle
DE19822672B4 (de) 1998-05-20 2005-11-10 GSF - Forschungszentrum für Umwelt und Gesundheit GmbH Verfahren und Vorrichtung zur Erzeugung eines gerichteten Gasstrahls
FR2780170B1 (fr) 1998-06-19 2000-08-11 Aerospatiale Dispositif autonome de limitation du debit d'un fluide dans une canalisation et circuit de carburant pour aeronef comportant un tel dispositif
US6410105B1 (en) 1998-06-30 2002-06-25 Jyoti Mazumder Production of overhang, undercut, and cavity structures using direct metal depostion
US6159749A (en) 1998-07-21 2000-12-12 Beckman Coulter, Inc. Highly sensitive bead-based multi-analyte assay system using optical tweezers
US6149076A (en) 1998-08-05 2000-11-21 Nordson Corporation Dispensing apparatus having nozzle for controlling heated liquid discharge with unheated pressurized air
KR100271208B1 (ko) 1998-08-13 2000-12-01 윤덕용 선택적 용침공정을 이용한 쾌속조형방법및 쾌속조형장치
US7347850B2 (en) 1998-08-14 2008-03-25 Incept Llc Adhesion barriers applicable by minimally invasive surgery and methods of use thereof
US6697694B2 (en) 1998-08-26 2004-02-24 Electronic Materials, L.L.C. Apparatus and method for creating flexible circuits
US7098163B2 (en) 1998-08-27 2006-08-29 Cabot Corporation Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells
DE19841401C2 (de) 1998-09-10 2000-09-21 Lechler Gmbh & Co Kg Zweistoff-Flachstrahldüse
US20040197493A1 (en) * 1998-09-30 2004-10-07 Optomec Design Company Apparatus, methods and precision spray processes for direct write and maskless mesoscale material deposition
US6340216B1 (en) 1998-09-30 2002-01-22 Xerox Corporation Ballistic aerosol marking apparatus for treating a substrate
US6416156B1 (en) 1998-09-30 2002-07-09 Xerox Corporation Kinetic fusing of a marking material
US6511149B1 (en) 1998-09-30 2003-01-28 Xerox Corporation Ballistic aerosol marking apparatus for marking a substrate
US6116718A (en) 1998-09-30 2000-09-12 Xerox Corporation Print head for use in a ballistic aerosol marking apparatus
US7108894B2 (en) 1998-09-30 2006-09-19 Optomec Design Company Direct Write™ System
US6416157B1 (en) 1998-09-30 2002-07-09 Xerox Corporation Method of marking a substrate employing a ballistic aerosol marking apparatus
WO2000023825A2 (en) 1998-09-30 2000-04-27 Board Of Control Of Michigan Technological University Laser-guided manipulation of non-atomic particles
US6454384B1 (en) 1998-09-30 2002-09-24 Xerox Corporation Method for marking with a liquid material using a ballistic aerosol marking apparatus
US7938079B2 (en) 1998-09-30 2011-05-10 Optomec Design Company Annular aerosol jet deposition using an extended nozzle
US6467862B1 (en) 1998-09-30 2002-10-22 Xerox Corporation Cartridge for use in a ballistic aerosol marking apparatus
US6251488B1 (en) 1999-05-05 2001-06-26 Optomec Design Company Precision spray processes for direct write electronic components
US7045015B2 (en) 1998-09-30 2006-05-16 Optomec Design Company Apparatuses and method for maskless mesoscale material deposition
US20030020768A1 (en) 1998-09-30 2003-01-30 Renn Michael J. Direct write TM system
US7294366B2 (en) 1998-09-30 2007-11-13 Optomec Design Company Laser processing for heat-sensitive mesoscale deposition
US6291088B1 (en) 1998-09-30 2001-09-18 Xerox Corporation Inorganic overcoat for particulate transport electrode grid
US6636676B1 (en) 1998-09-30 2003-10-21 Optomec Design Company Particle guidance system
US6136442A (en) 1998-09-30 2000-10-24 Xerox Corporation Multi-layer organic overcoat for particulate transport electrode grid
US6265050B1 (en) 1998-09-30 2001-07-24 Xerox Corporation Organic overcoat for electrode grid
US8110247B2 (en) 1998-09-30 2012-02-07 Optomec Design Company Laser processing for heat-sensitive mesoscale deposition of oxygen-sensitive materials
US20050156991A1 (en) 1998-09-30 2005-07-21 Optomec Design Company Maskless direct write of copper using an annular aerosol jet
US6290342B1 (en) 1998-09-30 2001-09-18 Xerox Corporation Particulate marking material transport apparatus utilizing traveling electrostatic waves
US6151435A (en) 1998-11-01 2000-11-21 The United States Of America As Represented By The Secretary Of The Navy Evanescent atom guiding in metal-coated hollow-core optical fibers
US6001304A (en) 1998-12-31 1999-12-14 Materials Modification, Inc. Method of bonding a particle material to near theoretical density
JP2000238270A (ja) 1998-12-22 2000-09-05 Canon Inc インクジェット記録ヘッド及びインクジェット記録ヘッドの製造方法
KR100284607B1 (ko) 1998-12-31 2001-08-07 하상채 잔류도료 회수장치를 갖춘 정전 분체 도장 시스템
US6280302B1 (en) 1999-03-24 2001-08-28 Flow International Corporation Method and apparatus for fluid jet formation
DE19913451C2 (de) 1999-03-25 2001-11-22 Gsf Forschungszentrum Umwelt Gaseinlaß zur Erzeugung eines gerichteten und gekühlten Gasstrahls
AU4856100A (en) 1999-05-17 2000-12-05 Stephen T Flock Electromagnetic energy driven separation methods
US6405095B1 (en) 1999-05-25 2002-06-11 Nanotek Instruments, Inc. Rapid prototyping and tooling system
US6520996B1 (en) 1999-06-04 2003-02-18 Depuy Acromed, Incorporated Orthopedic implant
US20020128714A1 (en) 1999-06-04 2002-09-12 Mark Manasas Orthopedic implant and method of making metal articles
US6267301B1 (en) 1999-06-11 2001-07-31 Spraying Systems Co. Air atomizing nozzle assembly with improved air cap
US20060003095A1 (en) 1999-07-07 2006-01-05 Optomec Design Company Greater angle and overhanging materials deposition
US6391251B1 (en) 1999-07-07 2002-05-21 Optomec Design Company Forming structures from CAD solid models
US6811744B2 (en) 1999-07-07 2004-11-02 Optomec Design Company Forming structures from CAD solid models
AU6747100A (en) 1999-07-07 2001-01-22 Optomec Design Company Method for providing features enabling thermal management in complex three-dimensional structures
AU6092200A (en) * 1999-07-13 2001-01-30 The Texas A & M University System Pneumatic nebulizing interface, method for making and using same and instruments including same
US6348687B1 (en) 1999-09-10 2002-02-19 Sandia Corporation Aerodynamic beam generator for large particles
JP2003514660A (ja) * 1999-09-13 2003-04-22 シェフィールド ファーマスゥーティカルズ インコーポレイテッド エアロゾル気流制御システムおよび方法
US6293659B1 (en) 1999-09-30 2001-09-25 Xerox Corporation Particulate source, circulation, and valving system for ballistic aerosol marking
US6328026B1 (en) 1999-10-13 2001-12-11 The University Of Tennessee Research Corporation Method for increasing wear resistance in an engine cylinder bore and improved automotive engine
US6486432B1 (en) 1999-11-23 2002-11-26 Spirex Method and laser cladding of plasticating barrels
US6318642B1 (en) 1999-12-22 2001-11-20 Visteon Global Tech., Inc Nozzle assembly
KR20010063781A (ko) 1999-12-24 2001-07-09 박종섭 반도체소자의 제조방법
JP3736607B2 (ja) 2000-01-21 2006-01-18 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
US6423366B2 (en) 2000-02-16 2002-07-23 Roll Coater, Inc. Strip coating method
US6564038B1 (en) 2000-02-23 2003-05-13 Lucent Technologies Inc. Method and apparatus for suppressing interference using active shielding techniques
US6384365B1 (en) 2000-04-14 2002-05-07 Siemens Westinghouse Power Corporation Repair and fabrication of combustion turbine components by spark plasma sintering
KR100442015B1 (ko) 2000-04-18 2004-07-30 안강호 전기수력학적 분사장치를 이용한 초미세입자의 제조장치및 그 제조방법
US20020063117A1 (en) 2000-04-19 2002-05-30 Church Kenneth H. Laser sintering of materials and a thermal barrier for protecting a substrate
US6572033B1 (en) 2000-05-15 2003-06-03 Nordson Corporation Module for dispensing controlled patterns of liquid material and a nozzle having an asymmetric liquid discharge orifice
US7169316B1 (en) 2000-05-24 2007-01-30 Silverbrook Research Pty Ltd Method of manufacture of an ink jet printhead having a moving nozzle with an externally arranged actuator
US6521297B2 (en) 2000-06-01 2003-02-18 Xerox Corporation Marking material and ballistic aerosol marking process for the use thereof
US6576861B2 (en) 2000-07-25 2003-06-10 The Research Foundation Of State University Of New York Method and apparatus for fine feature spray deposition
US20020082741A1 (en) 2000-07-27 2002-06-27 Jyoti Mazumder Fabrication of biomedical implants using direct metal deposition
US6416389B1 (en) 2000-07-28 2002-07-09 Xerox Corporation Process for roughening a surface
JP3686317B2 (ja) 2000-08-10 2005-08-24 三菱重工業株式会社 レーザ加工ヘッド及びこれを備えたレーザ加工装置
DE60118669T2 (de) 2000-08-25 2007-01-11 Asml Netherlands B.V. Lithographischer Projektionsapparat
WO2002035554A1 (fr) 2000-10-25 2002-05-02 Harima Chemicals, Inc. Pate metallique electro-conductrice et procede de production de cette pate
EP1215705A3 (en) 2000-12-12 2003-05-21 Nisshinbo Industries, Inc. Transparent electromagnetic radiation shielding material
US6471327B2 (en) 2001-02-27 2002-10-29 Eastman Kodak Company Apparatus and method of delivering a focused beam of a thermodynamically stable/metastable mixture of a functional material in a dense fluid onto a receiver
US6780368B2 (en) 2001-04-10 2004-08-24 Nanotek Instruments, Inc. Layer manufacturing of a multi-material or multi-color 3-D object using electrostatic imaging and lamination
US6657213B2 (en) 2001-05-03 2003-12-02 Northrop Grumman Corporation High temperature EUV source nozzle
EP1258293A3 (de) 2001-05-16 2003-06-18 Roberit Ag Vorrichtung zum Spritzen einer Mehrkomponentenmischung
US6811805B2 (en) 2001-05-30 2004-11-02 Novatis Ag Method for applying a coating
NO316775B1 (no) 2001-06-11 2004-05-03 Optoplan As Fremgangsmate for belegging av en fiber med fiberoptisk Bragg-Gitter (FBG)
JP2003011100A (ja) 2001-06-27 2003-01-15 Matsushita Electric Ind Co Ltd ガス流中のナノ粒子の堆積方法、並びに表面修飾方法
US7469558B2 (en) 2001-07-10 2008-12-30 Springworks, Llc As-deposited planar optical waveguides with low scattering loss and methods for their manufacture
US6998785B1 (en) 2001-07-13 2006-02-14 University Of Central Florida Research Foundation, Inc. Liquid-jet/liquid droplet initiated plasma discharge for generating useful plasma radiation
US6706234B2 (en) 2001-08-08 2004-03-16 Nanotek Instruments, Inc. Direct write method for polarized materials
US7629017B2 (en) 2001-10-05 2009-12-08 Cabot Corporation Methods for the deposition of conductive electronic features
US7524528B2 (en) 2001-10-05 2009-04-28 Cabot Corporation Precursor compositions and methods for the deposition of passive electrical components on a substrate
US20030108664A1 (en) 2001-10-05 2003-06-12 Kodas Toivo T. Methods and compositions for the formation of recessed electrical features on a substrate
US6832827B2 (en) * 2001-12-26 2004-12-21 Spectra, Inc. Cleaning nozzle
US6780377B2 (en) 2002-01-22 2004-08-24 Dakocytomation Denmark A/S Environmental containment system for a flow cytometer
US6593540B1 (en) 2002-02-08 2003-07-15 Honeywell International, Inc. Hand held powder-fed laser fusion welding torch
US20040029706A1 (en) 2002-02-14 2004-02-12 Barrera Enrique V. Fabrication of reinforced composite material comprising carbon nanotubes, fullerenes, and vapor-grown carbon fibers for thermal barrier materials, structural ceramics, and multifunctional nanocomposite ceramics
CA2374338A1 (en) 2002-03-01 2003-09-01 Ignis Innovations Inc. Fabrication method for large area mechanically flexible circuits and displays
US6705703B2 (en) 2002-04-24 2004-03-16 Hewlett-Packard Development Company, L.P. Determination of control points for construction of first color space-to-second color space look-up table
GB0212062D0 (en) 2002-05-24 2002-07-03 Vantico Ag Jetable compositions
US7601406B2 (en) 2002-06-13 2009-10-13 Cima Nanotech Israel Ltd. Nano-powder-based coating and ink compositions
US7736693B2 (en) 2002-06-13 2010-06-15 Cima Nanotech Israel Ltd. Nano-powder-based coating and ink compositions
US7566360B2 (en) 2002-06-13 2009-07-28 Cima Nanotech Israel Ltd. Nano-powder-based coating and ink compositions
AU2003255254A1 (en) 2002-08-08 2004-02-25 Glenn J. Leedy Vertical system integration
JP4388263B2 (ja) 2002-09-11 2009-12-24 日鉱金属株式会社 珪化鉄スパッタリングターゲット及びその製造方法
US7067867B2 (en) 2002-09-30 2006-06-27 Nanosys, Inc. Large-area nonenabled macroelectronic substrates and uses therefor
JP2004122341A (ja) 2002-10-07 2004-04-22 Fuji Photo Film Co Ltd 成膜方法
US20040080917A1 (en) 2002-10-23 2004-04-29 Steddom Clark Morrison Integrated microwave package and the process for making the same
US20040185388A1 (en) 2003-01-29 2004-09-23 Hiroyuki Hirai Printed circuit board, method for producing same, and ink therefor
US20040151978A1 (en) 2003-01-30 2004-08-05 Huang Wen C. Method and apparatus for direct-write of functional materials with a controlled orientation
JP4244382B2 (ja) 2003-02-26 2009-03-25 セイコーエプソン株式会社 機能性材料定着方法及びデバイス製造方法
US7009137B2 (en) 2003-03-27 2006-03-07 Honeywell International, Inc. Laser powder fusion repair of Z-notches with nickel based superalloy powder
US6921626B2 (en) 2003-03-27 2005-07-26 Kodak Polychrome Graphics Llc Nanopastes as patterning compositions for electronic parts
US7579251B2 (en) 2003-05-15 2009-08-25 Fujitsu Limited Aerosol deposition process
EP1631992A2 (en) 2003-06-12 2006-03-08 Patterning Technologies Limited Transparent conducting structures and methods of production thereof
US6855631B2 (en) 2003-07-03 2005-02-15 Micron Technology, Inc. Methods of forming via plugs using an aerosol stream of particles to deposit conductive materials
US20050002818A1 (en) 2003-07-04 2005-01-06 Hitachi Powdered Metals Co., Ltd. Production method for sintered metal-ceramic layered compact and production method for thermal stress relief pad
KR20070019651A (ko) 2003-09-17 2007-02-15 쓰리엠 이노베이티브 프로퍼티즈 컴파니 실질적으로 균일한 두께를 구비한 코팅층을 형성하기 위한방법 및 다이 코팅기
JP2007507114A (ja) 2003-09-26 2007-03-22 オプトメック・デザイン・カンパニー 感熱性中規模デポジションのレーザ処理
EP1530065B1 (en) 2003-11-06 2008-09-10 Rohm and Haas Electronic Materials, L.L.C. Opticle article with conductive pattern
US20050147749A1 (en) 2004-01-05 2005-07-07 Msp Corporation High-performance vaporizer for liquid-precursor and multi-liquid-precursor vaporization in semiconductor thin film deposition
TW200536638A (en) 2004-02-04 2005-11-16 Ebara Corp Complex nano-particle and manufacturing method thereof
US20050184328A1 (en) 2004-02-19 2005-08-25 Matsushita Electric Industrial Co., Ltd. Semiconductor device and its manufacturing method
JP4593947B2 (ja) 2004-03-19 2010-12-08 キヤノン株式会社 成膜装置および成膜方法
US20050205415A1 (en) 2004-03-19 2005-09-22 Belousov Igor V Multi-component deposition
KR101054129B1 (ko) 2004-03-31 2011-08-03 이스트맨 코닥 캄파니 균일한 미립자 물질층의 침착
US7220456B2 (en) 2004-03-31 2007-05-22 Eastman Kodak Company Process for the selective deposition of particulate material
CA2463409A1 (en) 2004-04-02 2005-10-02 Servo-Robot Inc. Intelligent laser joining head
US7736582B2 (en) 2004-06-10 2010-06-15 Allomet Corporation Method for consolidating tough coated hard powders
JP2006051413A (ja) 2004-08-10 2006-02-23 Konica Minolta Photo Imaging Inc 表面層のスプレー塗布方法、表面層塗布用のスプレー塗布装置、インクジェット記録用紙
EP1625893A1 (en) 2004-08-10 2006-02-15 Konica Minolta Photo Imaging, Inc. Spray coating method, spray coating device and inkjet recording sheet
US7129567B2 (en) 2004-08-31 2006-10-31 Micron Technology, Inc. Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements
US7575999B2 (en) 2004-09-01 2009-08-18 Micron Technology, Inc. Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies
US7235431B2 (en) 2004-09-02 2007-06-26 Micron Technology, Inc. Methods for packaging a plurality of semiconductor dice using a flowable dielectric material
US20060280866A1 (en) 2004-10-13 2006-12-14 Optomec Design Company Method and apparatus for mesoscale deposition of biological materials and biomaterials
US7732349B2 (en) 2004-11-30 2010-06-08 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of insulating film and semiconductor device
US20080013299A1 (en) 2004-12-13 2008-01-17 Optomec, Inc. Direct Patterning for EMI Shielding and Interconnects Using Miniature Aerosol Jet and Aerosol Jet Array
US7674671B2 (en) * 2004-12-13 2010-03-09 Optomec Design Company Aerodynamic jetting of aerosolized fluids for fabrication of passive structures
US7938341B2 (en) 2004-12-13 2011-05-10 Optomec Design Company Miniature aerosol jet and aerosol jet array
US20060163744A1 (en) 2005-01-14 2006-07-27 Cabot Corporation Printable electrical conductors
US8334464B2 (en) 2005-01-14 2012-12-18 Cabot Corporation Optimized multi-layer printing of electronics and displays
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
WO2006076612A2 (en) 2005-01-14 2006-07-20 Cabot Corporation A process for manufacturing application specific printable circuits (aspc’s) and other custom electronic devices
US7178380B2 (en) 2005-01-24 2007-02-20 Joseph Gerard Birmingham Virtual impactor device with reduced fouling
US7393559B2 (en) 2005-02-01 2008-07-01 The Regents Of The University Of California Methods for production of FGM net shaped body for various applications
US8715772B2 (en) 2005-04-12 2014-05-06 Air Products And Chemicals, Inc. Thermal deposition coating method
DK1947010T3 (da) 2005-11-21 2010-05-17 Mannkind Corp Pulverdoserings- og affølingsapparatur samt fremgagnsmåder
US20070154634A1 (en) 2005-12-15 2007-07-05 Optomec Design Company Method and Apparatus for Low-Temperature Plasma Sintering
US20070240454A1 (en) 2006-01-30 2007-10-18 Brown David P Method and apparatus for continuous or batch optical fiber preform and optical fiber production
EP3034119B1 (en) * 2006-03-30 2018-03-21 Vyaire Medical Consumables LLC Nebulizer with pressure-based fluidic-control
WO2007122684A1 (ja) 2006-04-14 2007-11-01 Hitachi Metals, Ltd. 低酸素金属粉末の製造方法
KR100763837B1 (ko) 2006-07-18 2007-10-05 삼성전기주식회사 인쇄회로기판 제조방법
JP2008088451A (ja) * 2006-09-29 2008-04-17 Fujifilm Corp 成膜方法及び成膜装置
US20080099456A1 (en) 2006-10-25 2008-05-01 Schwenke Robert A Dispensing method for variable line volume
DE102007017032B4 (de) 2007-04-11 2011-09-22 MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. Verfahren zur Herstellung von flächigen Größen- oder Abstandsvariationen in Mustern von Nanostrukturen auf Oberflächen
WO2009021123A1 (en) * 2007-08-07 2009-02-12 Tsi Incorporated A size segregated aerosol mass concentration measurement device
TWI482662B (zh) * 2007-08-30 2015-05-01 Optomec Inc 機械上一體式及緊密式耦合之列印頭以及噴霧源
TW200918325A (en) 2007-08-31 2009-05-01 Optomec Inc AEROSOL JET® printing system for photovoltaic applications
TWI538737B (zh) 2007-08-31 2016-06-21 阿普托麥克股份有限公司 材料沉積總成
US8887658B2 (en) * 2007-10-09 2014-11-18 Optomec, Inc. Multiple sheath multiple capillary aerosol jet
US20150273510A1 (en) * 2008-08-15 2015-10-01 Ndsu Research Foundation Method and apparatus for aerosol direct write printing
US8916084B2 (en) 2008-09-04 2014-12-23 Xerox Corporation Ultra-violet curable gellant inks for three-dimensional printing and digital fabrication applications
WO2010068699A2 (en) 2008-12-09 2010-06-17 Vertical Circuits, Inc. Semiconductor die interconnect formed by aerosol application of electrically conductive material
DE102009007800A1 (de) * 2009-02-06 2010-08-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Aerosol-Drucker, dessen Verwendung und Verfahren zur Herstellung von Linienunterbrechungen bei kontinuierlichen Aerosol-Druckverfahren
US9217681B2 (en) 2009-07-16 2015-12-22 Hamidreza Alemohammad Optical fiber sensor and methods of manufacture
JP6335782B2 (ja) 2011-07-13 2018-05-30 ヌボトロニクス、インク． 電子的および機械的な構造を製作する方法
US20130157040A1 (en) * 2011-12-14 2013-06-20 Christopher A. Petorak System and method for utilization of shrouded plasma spray or shrouded liquid suspension injection in suspension plasma spray processes
US9067299B2 (en) 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
US8919899B2 (en) 2012-05-10 2014-12-30 Integrated Deposition Solutions Methods and apparatuses for direct deposition of features on a surface using a two-component microfluidic jet
US9694389B2 (en) 2012-07-24 2017-07-04 Integrated Deposition Solutions, Inc. Methods for producing coaxial structures using a microfluidic jet
US9102099B1 (en) 2014-02-05 2015-08-11 MetaMason, Inc. Methods for additive manufacturing processes incorporating active deposition
US10124602B2 (en) * 2014-10-31 2018-11-13 Integrated Deposition Solutions, Inc. Apparatuses and methods for stable aerosol deposition using an aerodynamic lens system
US10086432B2 (en) 2014-12-10 2018-10-02 Washington State University Three dimensional sub-mm wavelength sub-THz frequency antennas on flexible and UV-curable dielectric using printed electronic metal traces
WO2016130709A1 (en) 2015-02-10 2016-08-18 Optomec, Inc. Fabrication of three-dimensional structures by in-flight curing of aerosols
US20170348903A1 (en) 2015-02-10 2017-12-07 Optomec, Inc. Fabrication of Three-Dimensional Materials Gradient Structures by In-Flight Curing of Aerosols
TW201705834A (zh) 2015-02-18 2017-02-01 阿普托麥克股份有限公司 單層及多層電子電路之附加製造技術
US9811327B2 (en) 2015-12-21 2017-11-07 Quixey, Inc. Dependency-aware transformation of multi-function applications for on-demand execution
US10058881B1 (en) * 2016-02-29 2018-08-28 National Technology & Engineering Solutions Of Sandia, Llc Apparatus for pneumatic shuttering of an aerosol particle stream
US10086622B2 (en) * 2016-07-14 2018-10-02 Integrated Deposition Solutions, Inc. Apparatuses and methods for stable aerosol-based printing using an internal pneumatic shutter

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020100416A1 (en) * 2001-01-30 2002-08-01 Sun James J. Method and apparatus for deposition of particles on surfaces
CN108372036A (zh) * 2016-10-31 2018-08-07 扬州华联涂装机械有限公司 一种空气喷枪

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