TWI762628B - 加工裝置及加工方法 - Google Patents
加工裝置及加工方法 Download PDFInfo
- Publication number
- TWI762628B TWI762628B TW107114704A TW107114704A TWI762628B TW I762628 B TWI762628 B TW I762628B TW 107114704 A TW107114704 A TW 107114704A TW 107114704 A TW107114704 A TW 107114704A TW I762628 B TWI762628 B TW I762628B
- Authority
- TW
- Taiwan
- Prior art keywords
- light beam
- workpiece
- intensity distribution
- processing apparatus
- optical system
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/0344—Observing the speed of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
- B23K26/0861—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane in at least in three axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/705—Beam measuring device
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
- B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work for planar work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
- B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
- B23K37/0461—Welding tables
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/18—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for positioning only
- B23Q3/186—Aligning devices
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
- Machine Tool Units (AREA)
- Electronic Switches (AREA)
- Use Of Switch Circuits For Exchanges And Methods Of Control Of Multiplex Exchanges (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ??PCT/JP2017/017119 | 2017-05-01 | ||
| WOPCT/JP2017/017119 | 2017-05-01 | ||
| PCT/JP2017/017119 WO2018203362A1 (ja) | 2017-05-01 | 2017-05-01 | 加工装置及び加工方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201841709A TW201841709A (zh) | 2018-12-01 |
| TWI762628B true TWI762628B (zh) | 2022-05-01 |
Family
ID=64016988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107114704A TWI762628B (zh) | 2017-05-01 | 2018-04-30 | 加工裝置及加工方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US11691217B2 (enExample) |
| EP (2) | EP3639967B1 (enExample) |
| JP (7) | JP7014226B2 (enExample) |
| CN (4) | CN115519240B (enExample) |
| TW (1) | TWI762628B (enExample) |
| WO (2) | WO2018203362A1 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6959073B2 (ja) * | 2017-08-30 | 2021-11-02 | 株式会社ディスコ | レーザー加工装置 |
| JP6570592B2 (ja) * | 2017-09-29 | 2019-09-04 | 株式会社牧野フライス製作所 | 工作機械の機上測定方法および制御装置 |
| CN109623172B (zh) * | 2019-01-31 | 2020-10-23 | 大族激光科技产业集团股份有限公司 | 一种滤光片的激光切割方法及装置 |
| CN118789112A (zh) * | 2019-03-13 | 2024-10-18 | 株式会社 尼康 | 加工系统以及加工方法 |
| KR20200111421A (ko) * | 2019-03-19 | 2020-09-29 | 삼성전자주식회사 | 레이저 장치 및 이를 이용한 기판 다이싱 장치 및 방법 |
| JP7428492B2 (ja) * | 2019-08-26 | 2024-02-06 | 株式会社ミツトヨ | 検査方法および補正方法 |
| JP7485014B2 (ja) * | 2020-04-15 | 2024-05-16 | 株式会社ニコン | 加工システム及び計測部材 |
| CN111650034B (zh) * | 2020-06-24 | 2023-06-27 | 湖北工程学院 | 一种载流摩擦磨损试验机及试验系统 |
| JP7601100B2 (ja) * | 2020-07-29 | 2024-12-17 | 株式会社ニコン | 加工システム |
| JP7650140B2 (ja) * | 2020-09-04 | 2025-03-24 | 株式会社ディスコ | 加工装置 |
| JP7620377B2 (ja) * | 2020-10-15 | 2025-01-23 | 株式会社ディスコ | レーザー加工装置 |
| WO2022128284A1 (en) * | 2020-12-14 | 2022-06-23 | Asml Netherlands B.V. | Micromirror arrays |
| GB2602351B (en) * | 2020-12-24 | 2023-11-15 | Ansible Motion Ltd | Motion platform apparatus and method of supporting a payload platform |
| JP7702368B2 (ja) * | 2022-02-25 | 2025-07-03 | 住友重機械工業株式会社 | アクチュエータ、ステージ装置、露光装置、検査装置 |
| CN117620473A (zh) * | 2022-08-23 | 2024-03-01 | 环球晶圆股份有限公司 | 非晶相化改质机及单晶材料的加工方法 |
| DE102022134959A1 (de) * | 2022-12-29 | 2024-07-04 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Verfahren zum laserbasierten Materialabtrag mit definiertem Kantenwinkel |
| US20250107700A1 (en) * | 2023-09-28 | 2025-04-03 | Cilag Gmbh International | Optical assemblies for endoscopic stereo visualization |
| US12090590B1 (en) | 2023-10-10 | 2024-09-17 | Wuxi Xivi Science And Technology Co., Ltd. | Six-degree-of-freedom air-floating moving apparatus |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10314965A (ja) * | 1997-05-14 | 1998-12-02 | Nikon Corp | 光加工装置および光加工方法 |
| JP2003334674A (ja) * | 2002-03-13 | 2003-11-25 | Sony Corp | レーザ加工方法 |
| TW200928601A (en) * | 2007-08-24 | 2009-07-01 | Nikon Corp | Movable body drive method and movable body drive system, pattern formation method and apparatus, and device manufacturing method |
Family Cites Families (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5271953A (en) * | 1991-02-25 | 1993-12-21 | Delco Electronics Corporation | System for performing work on workpieces |
| JPH07185863A (ja) * | 1993-12-28 | 1995-07-25 | Nikon Corp | レーザ加工装置 |
| JPH1062157A (ja) * | 1996-08-13 | 1998-03-06 | Kubota Corp | 円形ワークにおける形状認識方法およびその装置 |
| JPH10293220A (ja) * | 1997-04-19 | 1998-11-04 | Taiyo Yuden Co Ltd | 光導波路の製造方法及びその装置 |
| JP3348345B2 (ja) * | 1997-08-29 | 2002-11-20 | 株式会社豊田中央研究所 | レーザによる溝加工方法 |
| JPH11221690A (ja) * | 1998-02-09 | 1999-08-17 | Mitsubishi Electric Corp | レーザ加工装置およびレーザ加工方法 |
| JP2000071086A (ja) | 1998-08-31 | 2000-03-07 | Yasuoka:Kk | レーザ光による形状加工方法及び装置 |
| JP3469111B2 (ja) * | 1998-12-21 | 2003-11-25 | シャープ株式会社 | 光導波路素子の加工方法 |
| JP4590660B2 (ja) * | 1999-08-26 | 2010-12-01 | 日本ビクター株式会社 | 光ピックアップ装置 |
| AU5653699A (en) | 1999-09-20 | 2001-04-24 | Nikon Corporation | Parallel link mechanism, exposure system and method of manufacturing the same, and method of manufacturing devices |
| JP3429463B2 (ja) * | 1999-10-22 | 2003-07-22 | サンクス株式会社 | レーザマーカ |
| US20020041377A1 (en) | 2000-04-25 | 2002-04-11 | Nikon Corporation | Aerial image measurement method and unit, optical properties measurement method and unit, adjustment method of projection optical system, exposure method and apparatus, making method of exposure apparatus, and device manufacturing method |
| JP3686317B2 (ja) | 2000-08-10 | 2005-08-24 | 三菱重工業株式会社 | レーザ加工ヘッド及びこれを備えたレーザ加工装置 |
| JP4401060B2 (ja) | 2001-06-01 | 2010-01-20 | エーエスエムエル ネザーランズ ビー.ブイ. | リトグラフ装置、およびデバイス製造方法 |
| FI112279B (fi) * | 2001-11-21 | 2003-11-14 | Mapvision Oy Ltd | Menetelmä vastinpisteiden määrittämiseksi |
| US20040089642A1 (en) * | 2002-01-15 | 2004-05-13 | Christensen C. Paul | Method and system for laser marking a gemstone |
| US7009717B2 (en) | 2002-08-14 | 2006-03-07 | Metris N.V. | Optical probe for scanning the features of an object and methods therefor |
| ES2358102T3 (es) * | 2002-10-16 | 2011-05-05 | Bioject, Inc. | Conjunto de cartucho para medicamentos y procedimiento de fabricación. |
| EP1721695A4 (en) * | 2004-03-05 | 2009-04-01 | Olympus Corp | LASER PROCESSING FACILITY |
| JP2005279659A (ja) * | 2004-03-26 | 2005-10-13 | Toshiba Corp | レーザマーキング方法、レーザマーキング装置、マーク読取方法 |
| CN100481337C (zh) * | 2004-12-08 | 2009-04-22 | 雷射先进科技株式会社 | 被分割体的分割起点形成方法、被分割体的分割方法 |
| CN100510785C (zh) * | 2005-06-03 | 2009-07-08 | 索尼株式会社 | 蝇眼透镜片及制造方法、透射型屏幕、背投型图像显示装置 |
| JP4879619B2 (ja) * | 2006-03-20 | 2012-02-22 | オリンパス株式会社 | レーザ加工装置 |
| JP2008119716A (ja) | 2006-11-10 | 2008-05-29 | Marubun Corp | レーザ加工装置およびレーザ加工装置における焦点維持方法 |
| DE102008022014B3 (de) * | 2008-05-02 | 2009-11-26 | Trumpf Laser- Und Systemtechnik Gmbh | Dynamische Strahlumlenkung eines Laserstrahls |
| CN105606344B (zh) | 2008-05-28 | 2019-07-30 | 株式会社尼康 | 照明光学系统、照明方法、曝光装置以及曝光方法 |
| EP2202580B1 (en) * | 2008-12-23 | 2011-06-22 | Carl Zeiss SMT GmbH | Illumination system of a microlithographic projection exposure apparatus |
| DE102009050638B4 (de) * | 2009-10-20 | 2012-04-26 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung zur Laserbearbeitung von Werkstücken |
| CN102712060A (zh) * | 2010-02-08 | 2012-10-03 | 三菱电机株式会社 | 控制装置及激光加工机 |
| JP2012004558A (ja) * | 2010-06-17 | 2012-01-05 | Nikon Corp | 照明光学系、露光装置、およびデバイス製造方法 |
| WO2012057008A1 (en) | 2010-10-27 | 2012-05-03 | Nikon Corporation | Profile measuring apparatus, method for manufacturing structure, and structure manufacturing system |
| JP4891445B1 (ja) | 2011-03-17 | 2012-03-07 | パナソニック電工株式会社 | 超精密複合加工装置および超精密複合加工方法 |
| CN102229466B (zh) * | 2011-06-03 | 2013-02-13 | 深圳光韵达光电科技股份有限公司 | 一种纳秒激光切割玻璃的方法及装置 |
| JP5860228B2 (ja) * | 2011-06-13 | 2016-02-16 | 株式会社ディスコ | レーザー加工装置 |
| CN202297373U (zh) * | 2011-09-28 | 2012-07-04 | 深圳市木森科技有限公司 | 玻璃加工设备 |
| JP5931537B2 (ja) * | 2012-03-28 | 2016-06-08 | 東レエンジニアリング株式会社 | レーザの光軸アライメント方法およびそれを用いたレーザ加工装置 |
| JP5863568B2 (ja) | 2012-06-01 | 2016-02-16 | 株式会社日本製鋼所 | レーザ光照射方法およびレーザ光照射装置 |
| JP6099908B2 (ja) | 2012-09-13 | 2017-03-22 | キヤノン株式会社 | 2次元アブソリュートエンコーダおよびスケール |
| JP6026246B2 (ja) | 2012-11-28 | 2016-11-16 | トリニティ工業株式会社 | 車両用加飾部品の製造方法、車両用加飾部品 |
| JP2014133248A (ja) * | 2013-01-10 | 2014-07-24 | Mitsubishi Heavy Ind Ltd | 三次元レーザ加工機 |
| EP2883647B1 (de) * | 2013-12-12 | 2019-05-29 | Bystronic Laser AG | Verfahren zur Konfiguration einer Laserbearbeitungsvorrichtung |
| CN109212748B (zh) * | 2014-04-28 | 2021-05-18 | 株式会社尼康 | 光束扫描装置及光束扫描方法 |
| JP6439297B2 (ja) | 2014-07-04 | 2018-12-19 | 富士電機株式会社 | 不純物導入方法、不純物導入装置及び半導体素子の製造方法 |
| WO2016075803A1 (ja) * | 2014-11-14 | 2016-05-19 | 株式会社ニコン | 造形装置及び造形方法 |
| EP3766608A1 (en) * | 2014-11-14 | 2021-01-20 | Nikon Corporation | Shaping apparatus and shaping method |
| KR102283654B1 (ko) * | 2014-11-14 | 2021-07-29 | 가부시키가이샤 니콘 | 조형 장치 및 조형 방법 |
| CN104625429A (zh) * | 2014-12-22 | 2015-05-20 | 中国矿业大学 | 一种对金属厚板的激光切割工艺 |
| DE102015201689A1 (de) * | 2015-01-30 | 2016-08-04 | Mahle International Gmbh | Vorrichtung zum Laserstrukturieren von Naben von Ventiltriebbauteilen |
| CN205684910U (zh) * | 2016-04-28 | 2016-11-16 | 北京万恒镭特机电设备有限公司 | 一种内部多层激光切划装置 |
-
2017
- 2017-05-01 JP JP2019516303A patent/JP7014226B2/ja active Active
- 2017-05-01 WO PCT/JP2017/017119 patent/WO2018203362A1/ja not_active Ceased
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10314965A (ja) * | 1997-05-14 | 1998-12-02 | Nikon Corp | 光加工装置および光加工方法 |
| JP2003334674A (ja) * | 2002-03-13 | 2003-11-25 | Sony Corp | レーザ加工方法 |
| TW200928601A (en) * | 2007-08-24 | 2009-07-01 | Nikon Corp | Movable body drive method and movable body drive system, pattern formation method and apparatus, and device manufacturing method |
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| US12296404B2 (en) | 2025-05-13 |
| WO2018203362A1 (ja) | 2018-11-08 |
| JP7070560B2 (ja) | 2022-05-18 |
| US20250196259A1 (en) | 2025-06-19 |
| TW201841709A (zh) | 2018-12-01 |
| JP2025120232A (ja) | 2025-08-15 |
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| CN115533303A (zh) | 2022-12-30 |
| JP7347554B2 (ja) | 2023-09-20 |
| CN110709205A (zh) | 2020-01-17 |
| EP3639967A4 (en) | 2021-06-23 |
| JPWO2018203362A1 (ja) | 2020-03-12 |
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| US11691217B2 (en) | 2023-07-04 |
| JP7014226B2 (ja) | 2022-02-01 |
| JP2024038448A (ja) | 2024-03-19 |
| CN115519240A (zh) | 2022-12-27 |
| EP3639967A1 (en) | 2020-04-22 |
| US20230256536A1 (en) | 2023-08-17 |
| US20200164463A1 (en) | 2020-05-28 |
| JP2022105133A (ja) | 2022-07-12 |
| JP2022036306A (ja) | 2022-03-04 |
| CN115519240B (zh) | 2025-08-22 |
| EP3639967B1 (en) | 2024-03-27 |
| CN115519241A (zh) | 2022-12-27 |
| WO2018203508A1 (ja) | 2018-11-08 |
| CN110709205B (zh) | 2022-11-25 |
| EP4400248A1 (en) | 2024-07-17 |
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