TWI761614B - 薄膜狀半導體密封材 - Google Patents

薄膜狀半導體密封材 Download PDF

Info

Publication number
TWI761614B
TWI761614B TW107137121A TW107137121A TWI761614B TW I761614 B TWI761614 B TW I761614B TW 107137121 A TW107137121 A TW 107137121A TW 107137121 A TW107137121 A TW 107137121A TW I761614 B TWI761614 B TW I761614B
Authority
TW
Taiwan
Prior art keywords
film
component
sealing material
semiconductor sealing
compound
Prior art date
Application number
TW107137121A
Other languages
English (en)
Chinese (zh)
Other versions
TW201925338A (zh
Inventor
福原佳英
齊藤裕美
発地豊和
Original Assignee
日商納美仕有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商納美仕有限公司 filed Critical 日商納美仕有限公司
Publication of TW201925338A publication Critical patent/TW201925338A/zh
Application granted granted Critical
Publication of TWI761614B publication Critical patent/TWI761614B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C08K5/3437—Six-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
    • C08K5/353—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
TW107137121A 2017-11-27 2018-10-22 薄膜狀半導體密封材 TWI761614B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-226724 2017-11-27
JP2017226724 2017-11-27

Publications (2)

Publication Number Publication Date
TW201925338A TW201925338A (zh) 2019-07-01
TWI761614B true TWI761614B (zh) 2022-04-21

Family

ID=66631546

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107137121A TWI761614B (zh) 2017-11-27 2018-10-22 薄膜狀半導體密封材

Country Status (5)

Country Link
JP (1) JP7210031B2 (ja)
KR (1) KR102558125B1 (ja)
CN (1) CN111372994B (ja)
TW (1) TWI761614B (ja)
WO (1) WO2019102719A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110527046A (zh) * 2019-08-19 2019-12-03 湖北三选科技有限公司 改质双胺型苯并恶嗪树脂及制备方法、及其在液态晶圆级封装材料中作为应力释放剂的应用
JP7298450B2 (ja) * 2019-11-20 2023-06-27 味の素株式会社 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板、フレキシブル基板及び半導体装置
JP7562944B2 (ja) * 2019-11-28 2024-10-08 住友ベークライト株式会社 基材付き樹脂膜、プリント配線基板および電子装置
KR102691391B1 (ko) * 2021-12-29 2024-08-05 주식회사 케이씨씨 과립형 에폭시 수지 조성물
KR102696698B1 (ko) * 2021-12-30 2024-08-21 주식회사 케이씨씨 과립형 에폭시 수지 조성물
KR102696699B1 (ko) * 2021-12-30 2024-08-21 주식회사 케이씨씨 과립형 에폭시 수지 조성물

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201430087A (zh) * 2012-12-27 2014-08-01 Toray Industries 接著劑、接著膜、半導體裝置及其製造方法
WO2016157259A1 (ja) * 2015-03-31 2016-10-06 パナソニックＩｐマネジメント株式会社 封止用樹脂組成物と、この封止用樹脂組成物を用いた半導体装置、この封止用樹脂組成物を用いる半導体装置の製造方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0959333A (ja) * 1995-08-21 1997-03-04 Hitachi Chem Co Ltd フェノール化合物及びその製造方法並びに熱硬化性樹脂組成物
JP2001223227A (ja) * 2000-02-08 2001-08-17 Nitto Denko Corp 半導体封止用樹脂組成物および半導体装置
JP4752107B2 (ja) 2000-11-29 2011-08-17 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
MY139328A (en) * 2002-05-20 2009-09-30 Nitto Denko Corp Thermosetting resin composition and semiconductor device obtained with the same
JP2008231287A (ja) * 2007-03-22 2008-10-02 Toray Ind Inc 半導体装置用接着剤組成物、それを用いた接着剤シート、半導体用接着剤付きテープおよび銅張り積層板
JP2009097014A (ja) * 2007-09-27 2009-05-07 Hitachi Chem Co Ltd 封止用液状樹脂組成物、電子部品装置及びウエハーレベルチップサイズパッケージ
JP5088146B2 (ja) * 2008-01-11 2012-12-05 横浜ゴム株式会社 封止剤用液状エポキシ樹脂組成物
JP5581576B2 (ja) * 2008-04-02 2014-09-03 日立化成株式会社 フラックス活性剤、接着剤樹脂組成物、接着ペースト、接着フィルム、半導体装置の製造方法、及び半導体装置
JP5195454B2 (ja) * 2009-01-22 2013-05-08 味の素株式会社 樹脂組成物
JP5584047B2 (ja) * 2010-08-11 2014-09-03 Ｊｘ日鉱日石エネルギー株式会社 ベンゾオキサジン樹脂組成物及び繊維強化複合材料
CN103222040B (zh) * 2010-09-30 2015-12-02 日立化成株式会社 粘接剂组合物、半导体装置的制造方法以及半导体装置
US9504168B2 (en) * 2011-09-30 2016-11-22 Intel Corporation Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process
JP2013256584A (ja) * 2012-06-12 2013-12-26 Panasonic Corp 熱硬化性樹脂組成物およびフラックス組成物とそれを用いた半導体装置
CN105073854A (zh) * 2013-03-29 2015-11-18 吉坤日矿日石能源株式会社 预浸料、纤维强化复合材料以及含有颗粒的树脂组合物
TWI674972B (zh) * 2013-08-23 2019-10-21 日商味之素股份有限公司 零件封裝用薄膜之製造方法
JP6560617B2 (ja) * 2013-10-29 2019-08-14 株式会社カネカ 貯蔵安定性の改善されたポリマー微粒子含有硬化性樹脂組成物
JP2015137299A (ja) * 2014-01-21 2015-07-30 住友ベークライト株式会社 樹脂組成物、接着シート、ダイシングテープ一体型接着シート、バックグラインドテープ一体型接着シート、バックグラインドテープ兼ダイシングテープ一体型接着シート、および電子装置
CN106459558B (zh) * 2014-06-13 2019-03-08 Dic株式会社 固化性树脂组合物、其固化物、半导体密封材料、半导体装置、预浸料、电路基板、积层膜
US10294324B2 (en) * 2015-03-31 2019-05-21 Namics Corporation Resin composition, conductive resin composition, adhesive, conductive adhesive, paste for forming electrodes, and semiconductor device
JP6536281B2 (ja) * 2015-08-18 2019-07-03 日立化成株式会社 半導体用接着剤、並びに、半導体装置及びその製造方法
US11053382B2 (en) * 2016-05-31 2021-07-06 Mitsubishi Gas Chemical Company, Inc. Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device
CN106700548B (zh) * 2016-12-30 2019-04-30 广东生益科技股份有限公司 一种含有苯并噁嗪树脂组合物的制备方法及由其制成的预浸料和层压板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201430087A (zh) * 2012-12-27 2014-08-01 Toray Industries 接著劑、接著膜、半導體裝置及其製造方法
WO2016157259A1 (ja) * 2015-03-31 2016-10-06 パナソニックＩｐマネジメント株式会社 封止用樹脂組成物と、この封止用樹脂組成物を用いた半導体装置、この封止用樹脂組成物を用いる半導体装置の製造方法

Also Published As

Publication number Publication date
WO2019102719A1 (ja) 2019-05-31
JPWO2019102719A1 (ja) 2020-12-17
CN111372994B (zh) 2023-03-14
TW201925338A (zh) 2019-07-01
JP7210031B2 (ja) 2023-01-23
KR102558125B1 (ko) 2023-07-20
CN111372994A (zh) 2020-07-03
KR20200085784A (ko) 2020-07-15

Similar Documents

Publication Publication Date Title
TWI761614B (zh) 薄膜狀半導體密封材
JP5991335B2 (ja) 接着フィルム、ダイシングシート一体型接着フィルム、バックグラインドテープ一体型接着フィルム、バックグラインドテープ兼ダイシングシート一体型接着フィルム、積層体、積層体の硬化物、および半導体装置、並び半導体装置の製造方法
TWI552237B (zh) A semiconductor wafer bonding method, a semiconductor wafer bonding method, a semiconductor device manufacturing method, and a semiconductor device
US10023775B2 (en) Film adhesive and semiconductor device including the same
JPWO2010079831A1 (ja) 半導体パッケージの製造方法、半導体封止方法及び溶剤型半導体封止エポキシ樹脂組成物
TWI827512B (zh) 半導體用膜狀接著劑、半導體裝置的製造方法及半導體裝置
JP7079964B2 (ja) フィルム状半導体封止材
TWI807135B (zh) 半導體用膜狀接著劑、半導體裝置及其製造方法
JP7276105B2 (ja) アンダーフィル用のシート状樹脂組成物、及びそれを用いた半導体装置
TW202242057A (zh) 膜狀接著劑、切割晶粒接合一體型膜、以及半導體裝置及其製造方法
JP6660771B2 (ja) フィルム状樹脂組成物
KR102545377B1 (ko) 가압 실장용 ncf, 그 경화물 및 이를 사용한 반도체 장치
JP6656050B2 (ja) フィルム状半導体封止剤
WO2022059640A1 (ja) 半導体用接着剤、並びに、半導体装置及びその製造方法
TW202237786A (zh) 接著劑組成物、膜狀接著劑、切割晶粒接合一體型膜、以及半導體裝置及其製造方法
JP2023030494A (ja) エポキシ樹脂組成物、フィルム、半導体装置及び半導体装置の製造方法
TW202414631A (zh) 半導體裝置之製造方法及半導體晶圓加工用接著膜
TW202431447A (zh) 半導體裝置之製造方法及半導體晶圓加工用接著膜
CN116195040A (zh) 制造半导体装置的方法及膜状黏合剂
JP2020136398A (ja) 半導体用接着剤
JP2012195372A (ja) 半導体チップ実装体の製造方法、積層シート及び半導体チップ実装体