TWI747389B - 工件轉印裝置及工件轉印卡盤、以及工件轉印方法 - Google Patents

工件轉印裝置及工件轉印卡盤、以及工件轉印方法 Download PDF

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Publication number
TWI747389B
TWI747389B TW109124562A TW109124562A TWI747389B TW I747389 B TWI747389 B TW I747389B TW 109124562 A TW109124562 A TW 109124562A TW 109124562 A TW109124562 A TW 109124562A TW I747389 B TWI747389 B TW I747389B
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TW
Taiwan
Prior art keywords
substrate
plate
adhesive
transfer member
shaped workpieces
Prior art date
Application number
TW109124562A
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English (en)
Chinese (zh)
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TW202119507A (zh
Inventor
横田道也
稲葉亮一
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日商信越工程股份有限公司
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Publication of TW202119507A publication Critical patent/TW202119507A/zh
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Publication of TWI747389B publication Critical patent/TWI747389B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68363—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
TW109124562A 2019-08-01 2020-07-21 工件轉印裝置及工件轉印卡盤、以及工件轉印方法 TWI747389B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019142332A JP6696036B1 (ja) 2019-08-01 2019-08-01 ワーク転写装置及びワーク転写チャック並びにワーク転写方法
JP2019-142332 2019-08-01

Publications (2)

Publication Number Publication Date
TW202119507A TW202119507A (zh) 2021-05-16
TWI747389B true TWI747389B (zh) 2021-11-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW109124562A TWI747389B (zh) 2019-08-01 2020-07-21 工件轉印裝置及工件轉印卡盤、以及工件轉印方法

Country Status (4)

Country Link
JP (1) JP6696036B1 (ja)
KR (1) KR102362669B1 (ja)
CN (1) CN112309907B (ja)
TW (1) TWI747389B (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170133257A1 (en) * 2015-11-06 2017-05-11 Au Optronics Corporation Method of transferring micro-device
TW201834133A (zh) * 2016-11-15 2018-09-16 愛爾蘭商艾克斯瑟樂普林特有限公司 微轉印可印刷覆晶結構及方法
US20190027639A1 (en) * 2017-07-18 2019-01-24 Samsung Electronics Co., Ltd. Apparatus and method for manufacturing led module

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JP4491948B2 (ja) * 2000-10-06 2010-06-30 ソニー株式会社 素子実装方法および画像表示装置の製造方法
JP2003209346A (ja) * 2002-01-16 2003-07-25 Sony Corp 部品の実装方法及び電子装置
US6817854B2 (en) * 2002-05-20 2004-11-16 Stmicroelectronics, Inc. Mold with compensating base
JP4616793B2 (ja) * 2006-05-17 2011-01-19 株式会社新川 多段加圧コレット
WO2010059781A1 (en) * 2008-11-19 2010-05-27 Semprius, Inc. Printing semiconductor elements by shear-assisted elastomeric stamp transfer
JP2010177604A (ja) * 2009-02-02 2010-08-12 Renesas Electronics Corp 半導体製造方法及び製造装置
JP5337620B2 (ja) * 2009-08-05 2013-11-06 信越エンジニアリング株式会社 ワーク粘着保持装置及び真空貼り合わせ機
JP4785995B1 (ja) * 2011-02-28 2011-10-05 信越エンジニアリング株式会社 ワーク粘着チャック装置及びワーク貼り合わせ機
US9412727B2 (en) * 2011-09-20 2016-08-09 Semprius, Inc. Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion
JP2013197146A (ja) * 2012-03-16 2013-09-30 Renesas Electronics Corp 半導体装置の製造方法及び半導体製造装置
CN104937652A (zh) * 2013-12-04 2015-09-23 信越工程株式会社 贴合器件的制造装置
MY182253A (en) * 2014-07-20 2021-01-18 X Celeprint Ltd Apparatus and methods for micro-transfer-printing
JP5816388B1 (ja) * 2015-05-07 2015-11-18 信越エンジニアリング株式会社 貼合デバイスの製造方法及び貼合デバイスの製造装置
KR101901028B1 (ko) * 2016-11-28 2018-11-08 세메스 주식회사 본딩 헤드 및 이를 포함하는 다이 본딩 장치
JP6364537B2 (ja) * 2017-12-15 2018-07-25 株式会社写真化学 デバイスチップを用いた電子デバイスの製造装置
JP6518372B1 (ja) * 2018-08-09 2019-05-22 信越エンジニアリング株式会社 ワーク転写用チャック及びワーク転写方法
KR102125261B1 (ko) * 2018-11-09 2020-07-07 주식회사 어드밴스드파워텍 마이크로 칩 이송 장치용 이송 플레이트

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170133257A1 (en) * 2015-11-06 2017-05-11 Au Optronics Corporation Method of transferring micro-device
TW201834133A (zh) * 2016-11-15 2018-09-16 愛爾蘭商艾克斯瑟樂普林特有限公司 微轉印可印刷覆晶結構及方法
US20190027639A1 (en) * 2017-07-18 2019-01-24 Samsung Electronics Co., Ltd. Apparatus and method for manufacturing led module

Also Published As

Publication number Publication date
TW202119507A (zh) 2021-05-16
CN112309907B (zh) 2024-04-26
KR102362669B1 (ko) 2022-02-11
KR20210015662A (ko) 2021-02-10
JP2021027098A (ja) 2021-02-22
CN112309907A (zh) 2021-02-02
JP6696036B1 (ja) 2020-05-20

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