TWI746647B - 熱固性助焊劑組合物及電子基板之製造方法 - Google Patents

熱固性助焊劑組合物及電子基板之製造方法 Download PDF

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Publication number
TWI746647B
TWI746647B TW106132755A TW106132755A TWI746647B TW I746647 B TWI746647 B TW I746647B TW 106132755 A TW106132755 A TW 106132755A TW 106132755 A TW106132755 A TW 106132755A TW I746647 B TWI746647 B TW I746647B
Authority
TW
Taiwan
Prior art keywords
flux composition
thermosetting flux
component
mass
solder
Prior art date
Application number
TW106132755A
Other languages
English (en)
Chinese (zh)
Other versions
TW201835209A (zh
Inventor
喜多村明
飯島紀成
谷口裕亮
Original Assignee
日商田村製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商田村製作所股份有限公司 filed Critical 日商田村製作所股份有限公司
Publication of TW201835209A publication Critical patent/TW201835209A/zh
Application granted granted Critical
Publication of TWI746647B publication Critical patent/TWI746647B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81009—Pre-treatment of the bump connector or the bonding area
    • H01L2224/81024—Applying flux to the bonding area

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW106132755A 2017-03-16 2017-09-25 熱固性助焊劑組合物及電子基板之製造方法 TWI746647B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017050970A JP6557694B2 (ja) 2017-03-16 2017-03-16 熱硬化性フラックス組成物および電子基板の製造方法
JP??2017-050970 2017-03-16

Publications (2)

Publication Number Publication Date
TW201835209A TW201835209A (zh) 2018-10-01
TWI746647B true TWI746647B (zh) 2021-11-21

Family

ID=63705692

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106132755A TWI746647B (zh) 2017-03-16 2017-09-25 熱固性助焊劑組合物及電子基板之製造方法

Country Status (4)

Country Link
JP (1) JP6557694B2 (ja)
KR (1) KR102332799B1 (ja)
CN (1) CN108620768B (ja)
TW (1) TWI746647B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6766087B2 (ja) * 2018-03-23 2020-10-07 株式会社タムラ製作所 熱硬化性フラックス組成物および電子基板の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004202518A (ja) * 2002-12-24 2004-07-22 Nof Corp はんだ付け用フラックス組成物、はんだペースト及びはんだ付け方法
CN102656518A (zh) * 2009-12-14 2012-09-05 太阳控股株式会社 感光性树脂组合物、其干膜以及使用了它们的印刷电路板
CN103289621A (zh) * 2012-02-23 2013-09-11 株式会社田村制作所 热固性树脂组合物
CN105075409A (zh) * 2013-04-23 2015-11-18 太阳控股株式会社 阻焊剂组合物和使用了该阻焊剂组合物的印刷电路板
TW201546828A (zh) * 2014-02-24 2015-12-16 Sekisui Chemical Co Ltd 導電糊、連接構造體及連接構造體之製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7671114B2 (en) * 2004-01-26 2010-03-02 Henkel Corporation Adhesive of substituted oxirane or oxetane compound with silver-based, lead-free solder
JP2005288490A (ja) * 2004-03-31 2005-10-20 Nof Corp はんだ付け用フラックス組成物およびはんだペースト
JP2006015348A (ja) * 2004-06-30 2006-01-19 Nof Corp はんだ付け用フラックス組成物およびはんだペースト
JP4479518B2 (ja) * 2005-01-27 2010-06-09 日油株式会社 はんだ付け用フラックス組成物およびはんだペースト
JP5069731B2 (ja) * 2009-09-17 2012-11-07 パナソニック株式会社 カチオン硬化性樹脂組成物、回路装置及びその製造方法
CN107077912B (zh) * 2014-12-26 2020-01-10 积水化学工业株式会社 导电糊剂、连接结构体及连接结构体的制造方法
JP6138846B2 (ja) * 2015-03-26 2017-05-31 株式会社タムラ製作所 はんだ組成物およびそれを用いた電子基板の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004202518A (ja) * 2002-12-24 2004-07-22 Nof Corp はんだ付け用フラックス組成物、はんだペースト及びはんだ付け方法
CN102656518A (zh) * 2009-12-14 2012-09-05 太阳控股株式会社 感光性树脂组合物、其干膜以及使用了它们的印刷电路板
CN103289621A (zh) * 2012-02-23 2013-09-11 株式会社田村制作所 热固性树脂组合物
CN105075409A (zh) * 2013-04-23 2015-11-18 太阳控股株式会社 阻焊剂组合物和使用了该阻焊剂组合物的印刷电路板
TW201546828A (zh) * 2014-02-24 2015-12-16 Sekisui Chemical Co Ltd 導電糊、連接構造體及連接構造體之製造方法

Also Published As

Publication number Publication date
CN108620768A (zh) 2018-10-09
TW201835209A (zh) 2018-10-01
CN108620768B (zh) 2022-04-08
KR20180106815A (ko) 2018-10-01
JP6557694B2 (ja) 2019-08-07
JP2018157007A (ja) 2018-10-04
KR102332799B1 (ko) 2021-11-30

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