TWI746289B - 用於至少對半導體裝置之側表面檢測之設備、方法及電腦程式產品 - Google Patents

用於至少對半導體裝置之側表面檢測之設備、方法及電腦程式產品 Download PDF

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Publication number
TWI746289B
TWI746289B TW109141582A TW109141582A TWI746289B TW I746289 B TWI746289 B TW I746289B TW 109141582 A TW109141582 A TW 109141582A TW 109141582 A TW109141582 A TW 109141582A TW I746289 B TWI746289 B TW I746289B
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Taiwan
Prior art keywords
mirror
semiconductor device
camera
motor
block
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TW109141582A
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English (en)
Chinese (zh)
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TW202111313A (zh
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卡爾 楚彥斯
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美商克萊譚克公司
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/235—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising optical enhancement of defects or not-directly-visible states
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/063—Illuminating optical parts
    • G01N2201/0636—Reflectors

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW109141582A 2015-06-05 2016-06-04 用於至少對半導體裝置之側表面檢測之設備、方法及電腦程式產品 TWI746289B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562171906P 2015-06-05 2015-06-05
US62/171,906 2015-06-05

Publications (2)

Publication Number Publication Date
TW202111313A TW202111313A (zh) 2021-03-16
TWI746289B true TWI746289B (zh) 2021-11-11

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TW109141582A TWI746289B (zh) 2015-06-05 2016-06-04 用於至少對半導體裝置之側表面檢測之設備、方法及電腦程式產品
TW105117764A TWI713533B (zh) 2015-06-05 2016-06-04 用於至少對半導體裝置之側表面檢測之設備、方法及電腦程式產品

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Country Status (7)

Country Link
US (1) US10190994B2 (https=)
EP (1) EP3281219B1 (https=)
JP (4) JP2018516371A (https=)
KR (2) KR102740720B1 (https=)
CN (2) CN107743583B (https=)
TW (2) TWI746289B (https=)
WO (1) WO2016195726A1 (https=)

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CN107743583B (zh) * 2015-06-05 2023-12-01 科磊股份有限公司 用于至少对半导体装置的侧表面进行检验的设备、方法及计算机程序产品
JP6444909B2 (ja) * 2016-02-22 2018-12-26 東京エレクトロン株式会社 基板処理方法、基板処理装置及びコンピュータ読み取り可能な記録媒体
US11340284B2 (en) 2019-07-23 2022-05-24 Kla Corporation Combined transmitted and reflected light imaging of internal cracks in semiconductor devices
CN112394030A (zh) * 2019-08-15 2021-02-23 京元电子股份有限公司 Ic芯片外观检验模块
US11686690B2 (en) 2020-11-12 2023-06-27 Kla Corporation System and method for inspection and metrology of four sides of semiconductor devices
JP7336814B1 (ja) * 2022-02-15 2023-09-01 株式会社新川 検査装置、実装装置、検査方法、及びプログラム
CN114624245B (zh) * 2022-05-12 2022-09-02 泉州师范学院 实现半导体晶粒两端面与两侧面非同步等光程成像检测的光学装置与方法
CN115791807B (zh) * 2023-01-09 2023-05-30 苏州高视半导体技术有限公司 用于检测晶圆缺陷的装置
WO2024194923A1 (ja) * 2023-03-17 2024-09-26 ヤマハ発動機株式会社 検査装置および検査方法

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JPH1144513A (ja) * 1997-05-29 1999-02-16 Sony Corp 半導体装置の外観検査装置および外観検査方法
JP2006140391A (ja) * 2004-11-15 2006-06-01 Juki Corp 部品認識装置及び部品実装装置
JP2009276338A (ja) * 2008-04-14 2009-11-26 Ueno Seiki Kk 外観検査装置
CN101924053A (zh) * 2009-01-13 2010-12-22 联达科技设备私人有限公司 检测晶片的系统和方法
TWM461051U (zh) * 2013-05-10 2013-09-01 San Shing Fastech Corp 物件外表面的檢測裝置
WO2015076753A1 (en) * 2013-11-20 2015-05-28 Semiconductor Technologies & Instruments Pte, Ltd Apparatus and method for selectively inspecting component sidewalls

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JP2897754B2 (ja) 1997-03-27 1999-05-31 日本電気株式会社 半導体装置の検査方法
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WO2004079427A1 (fr) * 2003-03-07 2004-09-16 Ismeca Semiconductor Holding Sa Dispositif optique et module d'inspection
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KR100820811B1 (ko) * 2005-05-30 2008-04-10 엘지전자 주식회사 휴대 단말기에 장착된 카메라의 렌즈 구동 장치
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CN107743583B (zh) * 2015-06-05 2023-12-01 科磊股份有限公司 用于至少对半导体装置的侧表面进行检验的设备、方法及计算机程序产品

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1144513A (ja) * 1997-05-29 1999-02-16 Sony Corp 半導体装置の外観検査装置および外観検査方法
JP2006140391A (ja) * 2004-11-15 2006-06-01 Juki Corp 部品認識装置及び部品実装装置
JP2009276338A (ja) * 2008-04-14 2009-11-26 Ueno Seiki Kk 外観検査装置
CN101924053A (zh) * 2009-01-13 2010-12-22 联达科技设备私人有限公司 检测晶片的系统和方法
CN101924053B (zh) 2009-01-13 2014-06-25 联达科技设备私人有限公司 检测晶片的系统和方法
TWM461051U (zh) * 2013-05-10 2013-09-01 San Shing Fastech Corp 物件外表面的檢測裝置
WO2015076753A1 (en) * 2013-11-20 2015-05-28 Semiconductor Technologies & Instruments Pte, Ltd Apparatus and method for selectively inspecting component sidewalls

Also Published As

Publication number Publication date
US10190994B2 (en) 2019-01-29
TWI713533B (zh) 2020-12-21
KR102286993B1 (ko) 2021-08-10
KR20180015220A (ko) 2018-02-12
CN107743583B (zh) 2023-12-01
CN107743583A (zh) 2018-02-27
TW201721132A (zh) 2017-06-16
TW202111313A (zh) 2021-03-16
JP6968221B2 (ja) 2021-11-17
JP2022009508A (ja) 2022-01-14
KR102740720B1 (ko) 2024-12-10
JP2018516371A (ja) 2018-06-21
EP3281219A1 (en) 2018-02-14
JP2023090913A (ja) 2023-06-29
JP2020091300A (ja) 2020-06-11
KR20210099172A (ko) 2021-08-11
CN117577551A (zh) 2024-02-20
EP3281219A4 (en) 2018-12-19
JP7462095B2 (ja) 2024-04-04
EP3281219B1 (en) 2021-09-29
US20170003231A1 (en) 2017-01-05
WO2016195726A1 (en) 2016-12-08

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