CN107743583B - 用于至少对半导体装置的侧表面进行检验的设备、方法及计算机程序产品 - Google Patents

用于至少对半导体装置的侧表面进行检验的设备、方法及计算机程序产品 Download PDF

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Publication number
CN107743583B
CN107743583B CN201580080747.5A CN201580080747A CN107743583B CN 107743583 B CN107743583 B CN 107743583B CN 201580080747 A CN201580080747 A CN 201580080747A CN 107743583 B CN107743583 B CN 107743583B
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mirror
semiconductor device
camera
mirrors
housing
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Chinese (zh)
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CN107743583A (zh
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卡尔·特鲁叶恩斯
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KLA Corp
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KLA Tencor Corp
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Priority to CN202311535411.6A priority Critical patent/CN117577551A/zh
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/235—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising optical enhancement of defects or not-directly-visible states
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/063—Illuminating optical parts
    • G01N2201/0636—Reflectors

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CN201580080747.5A 2015-06-05 2015-07-27 用于至少对半导体装置的侧表面进行检验的设备、方法及计算机程序产品 Active CN107743583B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311535411.6A CN117577551A (zh) 2015-06-05 2015-07-27 用于至少对半导体装置的侧表面进行检验的设备、方法及计算机程序产品

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562171906P 2015-06-05 2015-06-05
US62/171,906 2015-06-05
PCT/US2015/042194 WO2016195726A1 (en) 2015-06-05 2015-07-27 Apparatus, method and computer program product for inspection of at least side faces of semiconductor devices

Related Child Applications (1)

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CN202311535411.6A Division CN117577551A (zh) 2015-06-05 2015-07-27 用于至少对半导体装置的侧表面进行检验的设备、方法及计算机程序产品

Publications (2)

Publication Number Publication Date
CN107743583A CN107743583A (zh) 2018-02-27
CN107743583B true CN107743583B (zh) 2023-12-01

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CN201580080747.5A Active CN107743583B (zh) 2015-06-05 2015-07-27 用于至少对半导体装置的侧表面进行检验的设备、方法及计算机程序产品
CN202311535411.6A Pending CN117577551A (zh) 2015-06-05 2015-07-27 用于至少对半导体装置的侧表面进行检验的设备、方法及计算机程序产品

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Country Status (7)

Country Link
US (1) US10190994B2 (https=)
EP (1) EP3281219B1 (https=)
JP (4) JP2018516371A (https=)
KR (2) KR102286993B1 (https=)
CN (2) CN107743583B (https=)
TW (2) TWI713533B (https=)
WO (1) WO2016195726A1 (https=)

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* Cited by examiner, † Cited by third party
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WO2016195726A1 (en) * 2015-06-05 2016-12-08 Kla-Tencor Corporation Apparatus, method and computer program product for inspection of at least side faces of semiconductor devices
JP6444909B2 (ja) 2016-02-22 2018-12-26 東京エレクトロン株式会社 基板処理方法、基板処理装置及びコンピュータ読み取り可能な記録媒体
US11340284B2 (en) * 2019-07-23 2022-05-24 Kla Corporation Combined transmitted and reflected light imaging of internal cracks in semiconductor devices
CN112394030A (zh) * 2019-08-15 2021-02-23 京元电子股份有限公司 Ic芯片外观检验模块
US11686690B2 (en) 2020-11-12 2023-06-27 Kla Corporation System and method for inspection and metrology of four sides of semiconductor devices
WO2023157061A1 (ja) * 2022-02-15 2023-08-24 株式会社新川 検査装置、実装装置、検査方法、及びプログラム
CN114624245B (zh) * 2022-05-12 2022-09-02 泉州师范学院 实现半导体晶粒两端面与两侧面非同步等光程成像检测的光学装置与方法
CN115791807B (zh) * 2023-01-09 2023-05-30 苏州高视半导体技术有限公司 用于检测晶圆缺陷的装置
WO2024194923A1 (ja) * 2023-03-17 2024-09-26 ヤマハ発動機株式会社 検査装置および検査方法

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US6094263A (en) * 1997-05-29 2000-07-25 Sony Corporation Visual examination apparatus and visual examination method of semiconductor device
JP2006140391A (ja) * 2004-11-15 2006-06-01 Juki Corp 部品認識装置及び部品実装装置
CN100383593C (zh) * 2003-03-07 2008-04-23 伊斯梅卡半导体控股公司 光学装置和检查模件

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JP2897754B2 (ja) 1997-03-27 1999-05-31 日本電気株式会社 半導体装置の検査方法
US5909285A (en) * 1997-05-05 1999-06-01 Beaty; Elwin M. Three dimensional inspection system
US6055054A (en) * 1997-05-05 2000-04-25 Beaty; Elwin M. Three dimensional inspection system
US20010048867A1 (en) * 2000-03-29 2001-12-06 Lebar Technology, Inc. Method and apparatus for processing semiconductor wafers
US20020135757A1 (en) * 2001-01-02 2002-09-26 Robotic Vision Systems, Inc. LCC device inspection module
US20050084137A1 (en) * 2002-01-16 2005-04-21 Kim Dae-Hoon System and method for iris identification using stereoscopic face recognition
US7715595B2 (en) * 2002-01-16 2010-05-11 Iritech, Inc. System and method for iris identification using stereoscopic face recognition
JP2006093588A (ja) * 2004-09-27 2006-04-06 Nec Electronics Corp 表面に突起部を有する半導体装置および半導体パッケージの識別方法。
CN2791639Y (zh) 2005-03-02 2006-06-28 昆明物理研究所 检测半导体材料内部缺陷的红外装置
KR100820811B1 (ko) * 2005-05-30 2008-04-10 엘지전자 주식회사 휴대 단말기에 장착된 카메라의 렌즈 구동 장치
US9022586B2 (en) * 2006-03-28 2015-05-05 Rosco, Inc. Vehicular mirror having a camera for enhanced vision
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JP2009150837A (ja) * 2007-12-21 2009-07-09 Canon Machinery Inc 外観検査装置
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KR101429723B1 (ko) * 2008-12-08 2014-09-24 삼성전자주식회사 패키지를 다양한 각도에서 조명하고 영상으로 획득하며, 색정보를 이용하여 패키지의 결함을 판단하는 반도체 패키지검사장치
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JP2012171628A (ja) * 2011-02-17 2012-09-10 Hitachi High-Tech Instruments Co Ltd テーピング装置及びテーピング方法
PL222470B1 (pl) 2012-08-14 2016-07-29 Włodarczyk Władysław Igloo Moduł głowicy do pobierania oraz umieszczania komponentów dedykowanych w technologii SMT
TWM461051U (zh) * 2013-05-10 2013-09-01 San Shing Fastech Corp 物件外表面的檢測裝置
JP5555839B1 (ja) * 2013-09-02 2014-07-23 上野精機株式会社 外観検査装置
TWI608229B (zh) * 2013-11-20 2017-12-11 聯達科技設備私人有限公司 選擇性檢測組件側壁的裝置和方法
WO2016195726A1 (en) * 2015-06-05 2016-12-08 Kla-Tencor Corporation Apparatus, method and computer program product for inspection of at least side faces of semiconductor devices

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US6094263A (en) * 1997-05-29 2000-07-25 Sony Corporation Visual examination apparatus and visual examination method of semiconductor device
CN100383593C (zh) * 2003-03-07 2008-04-23 伊斯梅卡半导体控股公司 光学装置和检查模件
JP2006140391A (ja) * 2004-11-15 2006-06-01 Juki Corp 部品認識装置及び部品実装装置

Also Published As

Publication number Publication date
US10190994B2 (en) 2019-01-29
JP2022009508A (ja) 2022-01-14
JP2023090913A (ja) 2023-06-29
CN117577551A (zh) 2024-02-20
KR102740720B1 (ko) 2024-12-10
KR102286993B1 (ko) 2021-08-10
CN107743583A (zh) 2018-02-27
JP7462095B2 (ja) 2024-04-04
JP2018516371A (ja) 2018-06-21
KR20210099172A (ko) 2021-08-11
WO2016195726A1 (en) 2016-12-08
EP3281219A4 (en) 2018-12-19
KR20180015220A (ko) 2018-02-12
EP3281219A1 (en) 2018-02-14
US20170003231A1 (en) 2017-01-05
TW201721132A (zh) 2017-06-16
JP2020091300A (ja) 2020-06-11
JP6968221B2 (ja) 2021-11-17
TWI746289B (zh) 2021-11-11
EP3281219B1 (en) 2021-09-29
TWI713533B (zh) 2020-12-21
TW202111313A (zh) 2021-03-16

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