TWI713533B - 用於至少對半導體裝置之側表面檢測之設備、方法及電腦程式產品 - Google Patents

用於至少對半導體裝置之側表面檢測之設備、方法及電腦程式產品 Download PDF

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Publication number
TWI713533B
TWI713533B TW105117764A TW105117764A TWI713533B TW I713533 B TWI713533 B TW I713533B TW 105117764 A TW105117764 A TW 105117764A TW 105117764 A TW105117764 A TW 105117764A TW I713533 B TWI713533 B TW I713533B
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Taiwan
Prior art keywords
mirror
semiconductor device
camera
block
housing
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TW105117764A
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English (en)
Chinese (zh)
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TW201721132A (zh
Inventor
卡爾 楚彥斯
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美商克萊譚克公司
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/235—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising optical enhancement of defects or not-directly-visible states
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/063—Illuminating optical parts
    • G01N2201/0636—Reflectors

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW105117764A 2015-06-05 2016-06-04 用於至少對半導體裝置之側表面檢測之設備、方法及電腦程式產品 TWI713533B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562171906P 2015-06-05 2015-06-05
US62/171,906 2015-06-05

Publications (2)

Publication Number Publication Date
TW201721132A TW201721132A (zh) 2017-06-16
TWI713533B true TWI713533B (zh) 2020-12-21

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TW105117764A TWI713533B (zh) 2015-06-05 2016-06-04 用於至少對半導體裝置之側表面檢測之設備、方法及電腦程式產品
TW109141582A TWI746289B (zh) 2015-06-05 2016-06-04 用於至少對半導體裝置之側表面檢測之設備、方法及電腦程式產品

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TW109141582A TWI746289B (zh) 2015-06-05 2016-06-04 用於至少對半導體裝置之側表面檢測之設備、方法及電腦程式產品

Country Status (7)

Country Link
US (1) US10190994B2 (https=)
EP (1) EP3281219B1 (https=)
JP (4) JP2018516371A (https=)
KR (2) KR102286993B1 (https=)
CN (2) CN107743583B (https=)
TW (2) TWI713533B (https=)
WO (1) WO2016195726A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016195726A1 (en) * 2015-06-05 2016-12-08 Kla-Tencor Corporation Apparatus, method and computer program product for inspection of at least side faces of semiconductor devices
JP6444909B2 (ja) 2016-02-22 2018-12-26 東京エレクトロン株式会社 基板処理方法、基板処理装置及びコンピュータ読み取り可能な記録媒体
US11340284B2 (en) * 2019-07-23 2022-05-24 Kla Corporation Combined transmitted and reflected light imaging of internal cracks in semiconductor devices
CN112394030A (zh) * 2019-08-15 2021-02-23 京元电子股份有限公司 Ic芯片外观检验模块
US11686690B2 (en) 2020-11-12 2023-06-27 Kla Corporation System and method for inspection and metrology of four sides of semiconductor devices
WO2023157061A1 (ja) * 2022-02-15 2023-08-24 株式会社新川 検査装置、実装装置、検査方法、及びプログラム
CN114624245B (zh) * 2022-05-12 2022-09-02 泉州师范学院 实现半导体晶粒两端面与两侧面非同步等光程成像检测的光学装置与方法
CN115791807B (zh) * 2023-01-09 2023-05-30 苏州高视半导体技术有限公司 用于检测晶圆缺陷的装置
WO2024194923A1 (ja) * 2023-03-17 2024-09-26 ヤマハ発動機株式会社 検査装置および検査方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1144513A (ja) * 1997-05-29 1999-02-16 Sony Corp 半導体装置の外観検査装置および外観検査方法
JP2006140391A (ja) * 2004-11-15 2006-06-01 Juki Corp 部品認識装置及び部品実装装置
JP2009276338A (ja) * 2008-04-14 2009-11-26 Ueno Seiki Kk 外観検査装置
TWM461051U (zh) * 2013-05-10 2013-09-01 San Shing Fastech Corp 物件外表面的檢測裝置
WO2015076753A1 (en) * 2013-11-20 2015-05-28 Semiconductor Technologies & Instruments Pte, Ltd Apparatus and method for selectively inspecting component sidewalls

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1068614A (ja) * 1996-08-27 1998-03-10 Copal Co Ltd 撮像装置
JP2897754B2 (ja) 1997-03-27 1999-05-31 日本電気株式会社 半導体装置の検査方法
US5909285A (en) * 1997-05-05 1999-06-01 Beaty; Elwin M. Three dimensional inspection system
US6055054A (en) * 1997-05-05 2000-04-25 Beaty; Elwin M. Three dimensional inspection system
US20010048867A1 (en) * 2000-03-29 2001-12-06 Lebar Technology, Inc. Method and apparatus for processing semiconductor wafers
US20020135757A1 (en) * 2001-01-02 2002-09-26 Robotic Vision Systems, Inc. LCC device inspection module
US20050084137A1 (en) * 2002-01-16 2005-04-21 Kim Dae-Hoon System and method for iris identification using stereoscopic face recognition
US7715595B2 (en) * 2002-01-16 2010-05-11 Iritech, Inc. System and method for iris identification using stereoscopic face recognition
DE602004021240D1 (de) * 2003-03-07 2009-07-09 Ismeca Semiconductor Holding Optische einrichtung und inspektionsmodul
JP2006093588A (ja) * 2004-09-27 2006-04-06 Nec Electronics Corp 表面に突起部を有する半導体装置および半導体パッケージの識別方法。
CN2791639Y (zh) 2005-03-02 2006-06-28 昆明物理研究所 检测半导体材料内部缺陷的红外装置
KR100820811B1 (ko) * 2005-05-30 2008-04-10 엘지전자 주식회사 휴대 단말기에 장착된 카메라의 렌즈 구동 장치
US9022586B2 (en) * 2006-03-28 2015-05-05 Rosco, Inc. Vehicular mirror having a camera for enhanced vision
US7812971B2 (en) * 2007-06-28 2010-10-12 Quality Vision International, Inc. Multi color autofocus apparatus and method
JP2009150837A (ja) * 2007-12-21 2009-07-09 Canon Machinery Inc 外観検査装置
KR101429723B1 (ko) * 2008-12-08 2014-09-24 삼성전자주식회사 패키지를 다양한 각도에서 조명하고 영상으로 획득하며, 색정보를 이용하여 패키지의 결함을 판단하는 반도체 패키지검사장치
SG163442A1 (en) * 2009-01-13 2010-08-30 Semiconductor Technologies & Instruments System and method for inspecting a wafer
JP2012171628A (ja) * 2011-02-17 2012-09-10 Hitachi High-Tech Instruments Co Ltd テーピング装置及びテーピング方法
PL222470B1 (pl) 2012-08-14 2016-07-29 Włodarczyk Władysław Igloo Moduł głowicy do pobierania oraz umieszczania komponentów dedykowanych w technologii SMT
JP5555839B1 (ja) * 2013-09-02 2014-07-23 上野精機株式会社 外観検査装置
WO2016195726A1 (en) * 2015-06-05 2016-12-08 Kla-Tencor Corporation Apparatus, method and computer program product for inspection of at least side faces of semiconductor devices

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1144513A (ja) * 1997-05-29 1999-02-16 Sony Corp 半導体装置の外観検査装置および外観検査方法
JP2006140391A (ja) * 2004-11-15 2006-06-01 Juki Corp 部品認識装置及び部品実装装置
JP2009276338A (ja) * 2008-04-14 2009-11-26 Ueno Seiki Kk 外観検査装置
TWM461051U (zh) * 2013-05-10 2013-09-01 San Shing Fastech Corp 物件外表面的檢測裝置
WO2015076753A1 (en) * 2013-11-20 2015-05-28 Semiconductor Technologies & Instruments Pte, Ltd Apparatus and method for selectively inspecting component sidewalls

Also Published As

Publication number Publication date
US10190994B2 (en) 2019-01-29
JP2022009508A (ja) 2022-01-14
JP2023090913A (ja) 2023-06-29
CN117577551A (zh) 2024-02-20
KR102740720B1 (ko) 2024-12-10
CN107743583B (zh) 2023-12-01
KR102286993B1 (ko) 2021-08-10
CN107743583A (zh) 2018-02-27
JP7462095B2 (ja) 2024-04-04
JP2018516371A (ja) 2018-06-21
KR20210099172A (ko) 2021-08-11
WO2016195726A1 (en) 2016-12-08
EP3281219A4 (en) 2018-12-19
KR20180015220A (ko) 2018-02-12
EP3281219A1 (en) 2018-02-14
US20170003231A1 (en) 2017-01-05
TW201721132A (zh) 2017-06-16
JP2020091300A (ja) 2020-06-11
JP6968221B2 (ja) 2021-11-17
TWI746289B (zh) 2021-11-11
EP3281219B1 (en) 2021-09-29
TW202111313A (zh) 2021-03-16

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