KR102740720B1 - 반도체 디바이스들의 적어도 측면들의 검사를 위한 장치, 방법 및 컴퓨터 프로그램 제품 - Google Patents

반도체 디바이스들의 적어도 측면들의 검사를 위한 장치, 방법 및 컴퓨터 프로그램 제품 Download PDF

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KR102740720B1
KR102740720B1 KR1020217024180A KR20217024180A KR102740720B1 KR 102740720 B1 KR102740720 B1 KR 102740720B1 KR 1020217024180 A KR1020217024180 A KR 1020217024180A KR 20217024180 A KR20217024180 A KR 20217024180A KR 102740720 B1 KR102740720 B1 KR 102740720B1
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mirror
semiconductor device
camera
inspecting
side surfaces
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KR20210099172A (ko
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칼 트루옌스
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케이엘에이 코포레이션
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    • H01L22/12—
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • H01L22/24—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/235—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising optical enhancement of defects or not-directly-visible states
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/063—Illuminating optical parts
    • G01N2201/0636—Reflectors

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020217024180A 2015-06-05 2015-07-27 반도체 디바이스들의 적어도 측면들의 검사를 위한 장치, 방법 및 컴퓨터 프로그램 제품 Active KR102740720B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201562171906P 2015-06-05 2015-06-05
US62/171,906 2015-06-05
PCT/US2015/042194 WO2016195726A1 (en) 2015-06-05 2015-07-27 Apparatus, method and computer program product for inspection of at least side faces of semiconductor devices
KR1020187000081A KR102286993B1 (ko) 2015-06-05 2015-07-27 반도체 디바이스들의 적어도 측면들의 검사를 위한 장치, 방법 및 컴퓨터 프로그램 제품

Related Parent Applications (1)

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KR1020187000081A Division KR102286993B1 (ko) 2015-06-05 2015-07-27 반도체 디바이스들의 적어도 측면들의 검사를 위한 장치, 방법 및 컴퓨터 프로그램 제품

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Publication Number Publication Date
KR20210099172A KR20210099172A (ko) 2021-08-11
KR102740720B1 true KR102740720B1 (ko) 2024-12-10

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KR1020217024180A Active KR102740720B1 (ko) 2015-06-05 2015-07-27 반도체 디바이스들의 적어도 측면들의 검사를 위한 장치, 방법 및 컴퓨터 프로그램 제품
KR1020187000081A Active KR102286993B1 (ko) 2015-06-05 2015-07-27 반도체 디바이스들의 적어도 측면들의 검사를 위한 장치, 방법 및 컴퓨터 프로그램 제품

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Country Status (7)

Country Link
US (1) US10190994B2 (https=)
EP (1) EP3281219B1 (https=)
JP (4) JP2018516371A (https=)
KR (2) KR102740720B1 (https=)
CN (2) CN107743583B (https=)
TW (2) TWI746289B (https=)
WO (1) WO2016195726A1 (https=)

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CN107743583B (zh) * 2015-06-05 2023-12-01 科磊股份有限公司 用于至少对半导体装置的侧表面进行检验的设备、方法及计算机程序产品
JP6444909B2 (ja) * 2016-02-22 2018-12-26 東京エレクトロン株式会社 基板処理方法、基板処理装置及びコンピュータ読み取り可能な記録媒体
US11340284B2 (en) 2019-07-23 2022-05-24 Kla Corporation Combined transmitted and reflected light imaging of internal cracks in semiconductor devices
CN112394030A (zh) * 2019-08-15 2021-02-23 京元电子股份有限公司 Ic芯片外观检验模块
US11686690B2 (en) 2020-11-12 2023-06-27 Kla Corporation System and method for inspection and metrology of four sides of semiconductor devices
JP7336814B1 (ja) * 2022-02-15 2023-09-01 株式会社新川 検査装置、実装装置、検査方法、及びプログラム
CN114624245B (zh) * 2022-05-12 2022-09-02 泉州师范学院 实现半导体晶粒两端面与两侧面非同步等光程成像检测的光学装置与方法
CN115791807B (zh) * 2023-01-09 2023-05-30 苏州高视半导体技术有限公司 用于检测晶圆缺陷的装置
WO2024194923A1 (ja) * 2023-03-17 2024-09-26 ヤマハ発動機株式会社 検査装置および検査方法

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US20140104411A1 (en) 2008-12-08 2014-04-17 Samsung Electronics Co., Ltd Apparatus to perform a non-contact test of a semiconductor package

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JP2897754B2 (ja) 1997-03-27 1999-05-31 日本電気株式会社 半導体装置の検査方法
US5909285A (en) * 1997-05-05 1999-06-01 Beaty; Elwin M. Three dimensional inspection system
US6055054A (en) * 1997-05-05 2000-04-25 Beaty; Elwin M. Three dimensional inspection system
JPH1144513A (ja) * 1997-05-29 1999-02-16 Sony Corp 半導体装置の外観検査装置および外観検査方法
US20010048867A1 (en) * 2000-03-29 2001-12-06 Lebar Technology, Inc. Method and apparatus for processing semiconductor wafers
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CN107743583B (zh) * 2015-06-05 2023-12-01 科磊股份有限公司 用于至少对半导体装置的侧表面进行检验的设备、方法及计算机程序产品

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JP2006140391A (ja) 2004-11-15 2006-06-01 Juki Corp 部品認識装置及び部品実装装置
US20140104411A1 (en) 2008-12-08 2014-04-17 Samsung Electronics Co., Ltd Apparatus to perform a non-contact test of a semiconductor package

Also Published As

Publication number Publication date
US10190994B2 (en) 2019-01-29
TWI713533B (zh) 2020-12-21
KR102286993B1 (ko) 2021-08-10
TWI746289B (zh) 2021-11-11
KR20180015220A (ko) 2018-02-12
CN107743583B (zh) 2023-12-01
CN107743583A (zh) 2018-02-27
TW201721132A (zh) 2017-06-16
TW202111313A (zh) 2021-03-16
JP6968221B2 (ja) 2021-11-17
JP2022009508A (ja) 2022-01-14
JP2018516371A (ja) 2018-06-21
EP3281219A1 (en) 2018-02-14
JP2023090913A (ja) 2023-06-29
JP2020091300A (ja) 2020-06-11
KR20210099172A (ko) 2021-08-11
CN117577551A (zh) 2024-02-20
EP3281219A4 (en) 2018-12-19
JP7462095B2 (ja) 2024-04-04
EP3281219B1 (en) 2021-09-29
US20170003231A1 (en) 2017-01-05
WO2016195726A1 (en) 2016-12-08

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