TWI743887B - 晶粒接合裝置及半導體裝置的製造方法 - Google Patents

晶粒接合裝置及半導體裝置的製造方法 Download PDF

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Publication number
TWI743887B
TWI743887B TW109123687A TW109123687A TWI743887B TW I743887 B TWI743887 B TW I743887B TW 109123687 A TW109123687 A TW 109123687A TW 109123687 A TW109123687 A TW 109123687A TW I743887 B TWI743887 B TW I743887B
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Taiwan
Prior art keywords
linear scale
die
aforementioned
guide
moving object
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TW109123687A
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English (en)
Chinese (zh)
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TW202114105A (zh
Inventor
牧浩
望月政幸
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日商捷進科技有限公司
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7428—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

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  • Die Bonding (AREA)
TW109123687A 2019-09-19 2020-07-14 晶粒接合裝置及半導體裝置的製造方法 TWI743887B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019170339A JP7291586B2 (ja) 2019-09-19 2019-09-19 ダイボンディング装置および半導体装置の製造方法
JP2019-170339 2019-09-19

Publications (2)

Publication Number Publication Date
TW202114105A TW202114105A (zh) 2021-04-01
TWI743887B true TWI743887B (zh) 2021-10-21

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TW109123687A TWI743887B (zh) 2019-09-19 2020-07-14 晶粒接合裝置及半導體裝置的製造方法

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JP (1) JP7291586B2 (https=)
KR (1) KR102430824B1 (https=)
CN (1) CN112530839B (https=)
TW (1) TWI743887B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115770947B (zh) * 2021-09-06 2026-02-10 源卓微纳科技(苏州)股份有限公司 一种重布线电路图形的处理系统及处理方法
JP2023042403A (ja) * 2021-09-14 2023-03-27 ファスフォードテクノロジ株式会社 実装装置および半導体装置の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201724287A (zh) * 2015-09-30 2017-07-01 捷進科技有限公司 黏晶機及半導體裝置的製造方法
TW201810457A (zh) * 2016-03-17 2018-03-16 捷進科技有限公司 黏晶機（ｄｉｅ ｂｏｎｄｅｒ）及接合（ｂｏｎｄｉｎｇ）方法
WO2019013274A1 (ja) * 2017-07-12 2019-01-17 株式会社新川 第１物体を第２物体に対して位置決めする装置及び方法
TW201921521A (zh) * 2017-08-28 2019-06-01 日商新川股份有限公司 相對於對象物使第一移動體和第二移動體直線移動的裝置以及方法
CN109923640A (zh) * 2016-11-09 2019-06-21 东京毅力科创株式会社 接合装置、接合系统、接合方法和计算机存储介质

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0951007A (ja) * 1995-08-09 1997-02-18 Mitsubishi Electric Corp ダイボンド装置および半導体装置の製造方法
JP3482935B2 (ja) 2000-03-21 2004-01-06 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
JP4080149B2 (ja) * 2000-07-11 2008-04-23 松下電器産業株式会社 作業ヘッドの移動装置
KR100326757B1 (en) * 2001-08-09 2002-03-13 Justek Corp Method for correcting error of scaler according to variation of temperature in linear motor
KR20070016098A (ko) * 2004-06-03 2007-02-07 마츠시타 덴끼 산교 가부시키가이샤 부품 실장 방법 및 장치
JP2006041260A (ja) * 2004-07-28 2006-02-09 Juki Corp 電子部品搭載装置のノズル位置補正方法
JP2006313839A (ja) 2005-05-09 2006-11-16 Juki Corp 部品実装装置
JP4130838B2 (ja) * 2006-06-19 2008-08-06 住友重機械工業株式会社 ステージ装置
JP2008117968A (ja) * 2006-11-06 2008-05-22 Tokyo Seimitsu Co Ltd プローバ
JP2010135363A (ja) 2008-12-02 2010-06-17 Panasonic Corp 部品実装装置および部品実装装置におけるツール配列データ作成方法
KR20130117191A (ko) * 2012-04-18 2013-10-25 한미반도체 주식회사 작업유닛 이송장치
JP5918622B2 (ja) 2012-05-11 2016-05-18 ヤマハ発動機株式会社 部品または基板の作業装置および部品実装装置
JP5996979B2 (ja) * 2012-09-07 2016-09-21 ヤマハ発動機株式会社 電子部品実装装置および実装位置補正データ作成方法
TWI545663B (zh) * 2014-05-07 2016-08-11 新川股份有限公司 接合裝置以及接合方法
JP6510838B2 (ja) * 2015-03-11 2019-05-08 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
WO2016158588A1 (ja) * 2015-03-31 2016-10-06 株式会社新川 ワイヤボンディング装置及びワイヤボンディング方法
JP7033878B2 (ja) * 2017-10-16 2022-03-11 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201724287A (zh) * 2015-09-30 2017-07-01 捷進科技有限公司 黏晶機及半導體裝置的製造方法
TW201810457A (zh) * 2016-03-17 2018-03-16 捷進科技有限公司 黏晶機（ｄｉｅ ｂｏｎｄｅｒ）及接合（ｂｏｎｄｉｎｇ）方法
CN109923640A (zh) * 2016-11-09 2019-06-21 东京毅力科创株式会社 接合装置、接合系统、接合方法和计算机存储介质
WO2019013274A1 (ja) * 2017-07-12 2019-01-17 株式会社新川 第１物体を第２物体に対して位置決めする装置及び方法
TW201921521A (zh) * 2017-08-28 2019-06-01 日商新川股份有限公司 相對於對象物使第一移動體和第二移動體直線移動的裝置以及方法

Also Published As

Publication number Publication date
TW202114105A (zh) 2021-04-01
JP2021048285A (ja) 2021-03-25
JP7291586B2 (ja) 2023-06-15
CN112530839A (zh) 2021-03-19
KR102430824B1 (ko) 2022-08-09
CN112530839B (zh) 2024-03-08
KR20210033896A (ko) 2021-03-29

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