JP4130838B2 - ステージ装置 - Google Patents
ステージ装置 Download PDFInfo
- Publication number
- JP4130838B2 JP4130838B2 JP2006169421A JP2006169421A JP4130838B2 JP 4130838 B2 JP4130838 B2 JP 4130838B2 JP 2006169421 A JP2006169421 A JP 2006169421A JP 2006169421 A JP2006169421 A JP 2006169421A JP 4130838 B2 JP4130838 B2 JP 4130838B2
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- JP
- Japan
- Prior art keywords
- pair
- stage
- linear
- guide portion
- guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Machine Tool Units (AREA)
- Details Of Measuring And Other Instruments (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Numerical Control (AREA)
Description
12 架台
14A,14B ガイド部
18 Yステージ
20A,20B リニアモータ
22A,22B リニアスケール
32A,32B スライダ
34,35 ヨーパッド
36 リフトパッド
46 リニアモータ支持部
Claims (6)
- 床面に固定された架台に支持されて平行に配された一対のガイド部と、
該一対のガイド部の延在方向に移動するステージと、
前記ステージを駆動する一対のリニアモータと、
前記一対のガイド部のうち何れか一方の側面に対する前記ステージの移動位置を測定する第1のリニアスケールと、
該第1のリニアスケールが配された前記ガイド部の側面と平行な反対側の側面に対する前記ステージの移動位置を測定する第2のリニアスケールと、
前記第1のリニアスケールの測定値及び前記第2のリニアスケールの測定値に基づいて前記一対のリニアモータの制御値を演算する演算手段と、
を備えたことを特徴とするステージ装置。 - 前記ステージは、前記一対のガイド部にガイドされる一対のスライダと、
該一対のスライダ間に横架された横架部材と、
を有することを特徴とする請求項1に記載のステージ装置。 - 前記第1、第2のリニアスケールが配された一方のガイド部を移動する一方のスライダは、前記ガイド部の両側面に対向する第1、第2のヨーパッドと当該ガイド部の上面に対向するリフトパッドを有し、
前記他方のガイド部を移動する他方のスライダは、前記他方のガイド部の上面に対向するリフトパッドを有することを特徴とする請求項2に記載のステージ装置。 - 前記第1、第2のヨーパッドは、夫々前記第1、第2のリニアスケールの近傍に配されたことを特徴とする請求項3に記載のステージ装置。
- 前記一対のガイド部のうち前記第1、第2のリニアスケールが配されたガイド部を前記他方のガイド部よりも幅広としたことを特徴とする請求項1に記載のステージ装置。
- 前記演算手段は、前記第1のリニアスケールの測定値と前記第2のリニアスケールの測定値との差に基づいて前記一対のスライダのヨー方向のずれ角を演算し、前記ヨー方向のずれ角がゼロとなるように前記一対のリニアモータの制御値を演算することを特徴とする請求項1に記載のステージ装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006169421A JP4130838B2 (ja) | 2006-06-19 | 2006-06-19 | ステージ装置 |
TW096120545A TW200808489A (en) | 2006-06-19 | 2007-06-07 | Stage device |
KR1020070059426A KR20070120440A (ko) | 2006-06-19 | 2007-06-18 | 스테이지장치 |
CNA2007101100539A CN101093814A (zh) | 2006-06-19 | 2007-06-19 | 平台装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006169421A JP4130838B2 (ja) | 2006-06-19 | 2006-06-19 | ステージ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007331086A JP2007331086A (ja) | 2007-12-27 |
JP4130838B2 true JP4130838B2 (ja) | 2008-08-06 |
Family
ID=38931052
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006169421A Expired - Fee Related JP4130838B2 (ja) | 2006-06-19 | 2006-06-19 | ステージ装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4130838B2 (ja) |
KR (1) | KR20070120440A (ja) |
CN (1) | CN101093814A (ja) |
TW (1) | TW200808489A (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101149513B1 (ko) * | 2010-02-11 | 2012-05-29 | 삼성중공업 주식회사 | 레일의 직선도 및 평탄도 측정장치 |
KR101530953B1 (ko) * | 2014-09-16 | 2015-06-23 | 대우조선해양 주식회사 | 컨테이너 선의 셀 가이드 설치 정도 검사장치 및 검사방법 |
CN104280904A (zh) * | 2014-09-26 | 2015-01-14 | 京东方科技集团股份有限公司 | 阵列基板检测头及检测装置、阵列基板检测方法 |
JP7291586B2 (ja) * | 2019-09-19 | 2023-06-15 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
US20240017365A1 (en) * | 2020-12-10 | 2024-01-18 | Dmg Mori Co., Ltd. | Feed apparatus |
-
2006
- 2006-06-19 JP JP2006169421A patent/JP4130838B2/ja not_active Expired - Fee Related
-
2007
- 2007-06-07 TW TW096120545A patent/TW200808489A/zh unknown
- 2007-06-18 KR KR1020070059426A patent/KR20070120440A/ko not_active Application Discontinuation
- 2007-06-19 CN CNA2007101100539A patent/CN101093814A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
TW200808489A (en) | 2008-02-16 |
KR20070120440A (ko) | 2007-12-24 |
CN101093814A (zh) | 2007-12-26 |
JP2007331086A (ja) | 2007-12-27 |
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