TW200808489A - Stage device - Google Patents

Stage device Download PDF

Info

Publication number
TW200808489A
TW200808489A TW096120545A TW96120545A TW200808489A TW 200808489 A TW200808489 A TW 200808489A TW 096120545 A TW096120545 A TW 096120545A TW 96120545 A TW96120545 A TW 96120545A TW 200808489 A TW200808489 A TW 200808489A
Authority
TW
Taiwan
Prior art keywords
pair
platform
linear
guide
linear scale
Prior art date
Application number
TW096120545A
Other languages
Chinese (zh)
Inventor
Tatsuya Kohara
Yuuji Kobayashi
Makoto Harada
Original Assignee
Sumitomo Heavy Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries filed Critical Sumitomo Heavy Industries
Publication of TW200808489A publication Critical patent/TW200808489A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Machine Tool Units (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Numerical Control (AREA)

Abstract

To provide a stage device capable of dispensing with a stone surface plate for supporting a workpiece loading part to ensure precision in position detection. Sliders 32A, 32B are formed into a reverse U-shape so as to oppose to right and left side faces and an upper face of a guide part 14 and have yaw pads 34, 35 opposing to right and left side faces of guide parts 14A, 14B and a lift pad 36 opposing in Z direction. A pair of linear scales 22A, 22B are provided on the right and left side faces of the guide part. The first linear scale measures a traveling position of Y stage 18 for the left side face of the guide part 14A. The second linear scale measures a traveling position of Y stage for the right side face on the opposite side being parallel with the left side face of the guide part on which the first linear scale is arranged.

Description

200808489 九、發明說明 【發明所屬之技術領域】 本發明係有關一種平台裝置，特別是有關 著工作件的大型化，而增大滑動塊的間隔、及: 構成的平台裝置。 【先前技術】 φ 例如，在平台裝置中，用來導引平台的移 引機構，在具有由固定在上述定盤上的石材所 導引軌之同時，於沿著導引軌移動的平台之滑 有介由數至數十μ的間隙，與導引軌的導引 靜壓軸承襯墊，藉由從靜壓軸承襯墊吹向導引 ，使滑動器在上浮的狀態下移動而構成。 在這種平台裝置中，隨著供給做爲工作件 型化，使裝置全體大型化，而亦使平台的移動 • 在以往的機械加工技術中，例如，若全長 lm左右之導引軌，則可以數//的加工精確度 而，隨著平台的移動距離被延長，當導引軌的 2m以上時，難以精密的測量，由於在全長上 的長度時之測量誤差亦變大，因此難以製造出 精確度般具有筆直度的導引軌，更因爲熱膨脹 變化，影響導引軌的畸變或撓曲。 一對的導引軌係設置有用來檢測平台的移 性刻度，安裝在平台側的感測器（例如光斷流 種因應隨 動距離而 動之平台導 構成的一對 動器，設置 面相對向的 面的空氣壓 的基板之犬 距離延長。 爲如以往的 來加工。然 全長變長爲 測量導引軌 如所要求之 而導致尺寸 動位置之線 器）沿著線 -5- 200808489 性刻度移動，並輸出檢測信號（脈衝信號）。 測量來自線性刻度的感測器之信號，運算所移 求出位置。 又，爲了確保平台的直徑精確度、及線性 檢測精確度，當導引軌的全長越長，則必須更 管理一對導引軌之平行度。 爲了減低因這種一對導引軌的筆直度或平 勻之影響，例如藉由在沿著一對導引軌移動的 、和介存板彈簧而連結一對滑動器間的樑之間 施加在導引軌的負擔之構造（例如，參照專利 [專利文獻1]日本特開2000-2 1 4280號公 【發明內容】 [發明所欲解決之課題] 然而，根據上述專利文獻1所揭示的平台 低施加在導引軌的負擔亦有限，例如，在平台 延長到2m至3m的構成中，僅以上述板彈簧 量，難以確保平台的靜及動之穩定性。 再者，因爲平台裝置的大型化而無法確保 精確度時’或導引軌不在定盤上，而成爲被支 的構成時，難以獲得一對導引軌的平行度。 因此’當無法高精確度的管理一對導引軌 ，將使檢測平台的移動位置之一對線性刻度的 降低’而有導致平台的移動控制的精確度降低 然後，藉著 動的距離而 刻度的位置 高精確度的 行度的不均 一對滑動器 ，而有降低 文獻1 )。 報 裝置，可降 的移動距離 的彈性變形 定盤的上面 持在架台上 的平高度時 檢測精確度 之慮。 -6- 200808489 因此，本發明係有鑑於上述問題，而提供一種用來解 決上述課題的平台裝置。 [用以解決課題之手段] 爲了解決上述課題，本發明係具有如下之手段。 本發明係具備有：被支持於固定在床面的架台，而平 行地配置的一對導引部；朝向該一對導引部的延伸方向移 動的平台；驅動前述平台的一對線性電動機；測量與前述 一對導引部中任一方的側面相對的前述平台之移動位置的 第1線性刻度；用來測定與和配設有該第1線性刻度的前 述導引部之側面平行的相反側之側面相對的前述平台的移 動位置之第2線性刻度·，以及依據前述第1線性刻度的測 定値及前述第2線性刻度的測定値，運算前述一對線性刻 度的控制値之運算手段，解決上述課題。 期望前述平台具有：被導引至前述一對導引部的一對 滑動器；以及橫架於該一對滑動器之間的橫架構件。 期望移動配設有前述第1、第2線性刻度的一方之導 引部的一方之滑動器，係具有：與前述導引部的兩側面相 對向的第1、第2之Y方向靜壓空氣軸承、和與該導引部 的上面相對向之Z方向靜壓空氣軸承，移動前述另一方的 導引部之另一方的滑動器，係具有與前述另一方的導引部 之上面相對向的Z方向靜壓空氣軸承。 期望前述第1、第2之Y方向靜壓空氣軸承，係配設 於各個前述第1、第2線性刻度的附近。 200808489 期望將配設有前述一對導引部中之前述第 性刻度的導引部之寬度，設爲比前述另一方的 期望前述運算手段依據前述第1線性刻度 和前述第2線性刻度的測定値之差，運算前述 之γ方向的偏移角，使前述γ方向的偏移角 運算前述一對線性刻度之控制値。 [發明之效果] 根據本發明，由於在一對導引部中一方的 側，設置第1線性刻度，在相同的導引部的另 2線性刻度，即使一對導引部的平高度之精確 亦不會影響一對線性刻度的檢測精確度，可正 平台的移動位置。 又，根據本發明，由於一方的滑動器係具 的兩側面相對向的第1、第2擺動襯墊、和與 上面相對向的升降襯墊，使另一方的導引部移 的滑動器，由於具有與另一方的導引部的上面 降襯墊’因此即使一對的導引部之平行度的精 ’一對的滑動器可不受平行度的不均之影響而 【實施方式】 以下，參照圖面，說明實施本發明的最佳 [實施例1] 1、第2線 導引部寬。 的測定値、 一對滑動器 成爲零，而 導引部的一 一側設置第 度降低時， 確地檢測出 有與導引部 該導引部的 動之另一方 相對向的升 確度降低時 移動。 形態。 -8- 200808489 第1圖係本發明的平台裝置之一實施例的斜視圖。第 2圖係第1圖所示的平台裝置之正面圖。第3圖係第1圖 所示的平台裝置之側面圖。第4圖係第1圖所示的平台裝 置之平面圖。 如第1圖至第4圖所示，平台裝置10係用來移動起 重機部的起重機移動型平台，具備有：固定在混凝土製的 床面之架台12;被支持在架台12上的一對導引部14A、 14B ;被橫架在一對導引部14A、14B之間，將兩端支持 在架台12上的複數根樑16 ;橫架在一對導引部14A、 1 4B間的上方之Y平台1 8 ;使Y平台1 8的兩端部朝向Y 方向驅動的一對線性電動機20A、20B。又，於左側的導 引部1 4 A的上部左右側面，設置有用來檢測Y平台1 8的 位置之一對線性刻度22A、22B。 又，在樑1 6上載置有用來載置平板狀工作件（被加 工物）之吸附板（未圖示）。一對的導引部14A、14B係 加工石材，或加工鐵等金屬材。因此，使工作件的面積大 型化，並延長Y平台18的移動距離時，藉由延長導引部 14A、14B的全長而可對應，例如，比以往因應移動距離 而製作具有面積較工作件面積大的石定盤更爲容易，因此 可低價的製作。 一對線性電動機20A、20B，係依據來自檢測出γ平 台18的移動位置之一對線性刻度22A、22B的位置檢測 信號，而並進驅動加以控制。 如第2圖所示，Y平台1 8係具有：使導引部1 4 A、 200808489 14B的上方橫架於X方向的橫架部（樑）30;以 部30的兩端結合，並沿著導引部14A、14B而 對滑動器3 2 A、3 2 B。 導引部14A、14B中左側之導引部14A，係 器滑動器32A的移動，又，右側的導引部14B 動器32B的移動。滑動器滑動器32A、32B係 1 4的左右側面及上面相對向，而形成倒U字狀 與導引部14A、14B的左右側面相對向之擺動襯 向靜壓空氣軸承）34、35、和在Z方向上相對向 墊（Z方向靜壓空氣軸承）36。因而，滑動器滑 、3 2B係一邊限制X方向及Z方向，一邊被導i 向。 又，在導引滑動器32A的移動之導引部14 右側面設置有：用來檢測單側的滑動器32A的 對線性刻度22A、22B。第1線性刻度22A係測 部14A的左側面相對之滑動器32A的移動位置。 線性刻度22B係測量配置有第1線性刻度22A 1 4 A之左側面、和與平行之相反側的右側面相對 32A的移動位置。 第1、第2部份擺動襯墊34、3 5，係配設名 、第2線性刻度22A、22B附近，以抑制第1、 刻度22A、22B的檢測精確度之不均。 一對線性刻度22A、22B，例如使用光電方 具備：具有發光元件和受光元件的感測器；具窄 及與橫架 移動的一 導引滑動 係導引滑 與導引部 ，而具有 墊（Y方 的升降襯 動器32A Η到Y方 的上部左 位置之一 量與導引 又，第2 的導引部 的滑動器 ΐ各個第1 第2線性 式者，係 一定間距 -10- 200808489 的縫隙之刻度。在本實施例中，感測器設置在滑動器32A 的左右內壁，刻度則安裝在導引部1 4的左右側面。 又，於橫架部30係裝設有與吸附在工作件載置台的 工作件（基板）相對，而進行特定的加公之加工用工具（ 未圖示）等。然後，橫架部30及滑動器32A、32B，係藉 由來自升降襯墊36的空氣壓，與導引部14A、14B相對 浮起，非接觸地移動。因此，Y平台1 8係在大致上沒有 摩擦的狀態下，朝向Y方向移動。 線性電動機20A、20B係由形成〕字狀的固定子（具 有永久磁鐵）40、和從側方插入至固定子40的可動子（ 具有線圈）42所構成，並介由微小的間隙，以非接觸狀 態使可動子42朝向Y方向移動，並控制線圈施加電壓。 可動子42與滑動器滑動器32A、32B的側面結合，藉由 對線圈施加電壓，將與固定子40之間所產生的推力傳達: 到滑動器32A、32B，並使滑動器32A、32B朝向Y方向 驅動。 再者，線性電動機2 0 A、2 0 B的固定子4 0係被線性 電動機支持部46支持。因而，藉由線性電動機20A、20B 的驅動力，使Y平台18朝向Y方向移動時所產生的反彈 力，介由線性電動機支持部46傳達到混凝土床面。 藉此，線性電動機20A、20B所接收的反彈力，在混 凝土床面減弱。因此，傳播到架台1 2的線性電動機2 0 A 、20B的反彈力變爲極小。 第5圖係用來說明線性刻度2 2 A、2 2 B的位置檢測之 200808489 平面圖。如第5圖所示，線性刻度22 A、22B係藉由隨著 Y平台1 8的移動之感測器和刻度之相對變化，檢測出位 置。又，線性刻度22A、22B係從各個X方向的中間點〇 ，設置於距離LA、LB的位置，在導引部14A的X方向之 寬度尺寸的離間距離Lc( = La-Lb)，檢測出滑動器32A、 3 2B的各移動位置。因而，依據線性刻度22 A、22B所檢 測出的位置之差，可運算Y平台18的擺動角0。可求出 φ 滑動器32A、32B的並進動作之Y方向的偏移。此外，線 性刻度22A、22B亦可爲上述光電方式以外的方式（例如 雷射方式、磁性方式等）。 例如，配設於外側的線性刻度22A之檢測位置yA， 係以yA= LA · sin 0求出，配設於內側的線性刻度22B之 檢測位置y b，係以y b = L B · s i η 0求出。然後，滑動器 3 2Α、32Β之Υ方向的實際偏移量Ay，係成爲AysyA. (LA/LB)yB 〇 # 因而，平台裝置10的控制部，係以Δ0成爲零的方 式，運算將Y平台18的線性電動機20A、20B之驅動力 的傾斜輸出至線性電動機20A、20B的控制値，控制滑動 器3 2A、3 2B的Y方向之偏移Ay成爲零。 如此，在平台裝置10中，即使做爲不使用時定盤的 構成，也不會使設置於單側的導引部14a之左右側面的線 性刻度22A、22B的Y方向位置之檢測精確度降低，例如 ，即使導引部14A、14B的平行度降低或翹曲，由於另一 方的導引部14A的左右側面之平行度爲相當高精確度， -12- 200808489 因此可維持藉由線性刻度22A、22B之位置檢測精確度。 在此，說明變形例。第6圖爲表示變形例1的正面圖 。如第6圖所示，導引部14A、14B中左側的導引部14A 之X方向的寬度尺寸Lc，係比右側導引部14B大，比上 述實施例的寬度更大。因此，放大並檢測出線性刻度22A 的檢測位置yA、和線性刻度22B的檢測位置yB之差而構 成。 因此，由於放大從X方向的中間點〇的距離LA、LB 之差，故可容易檢測出Y平台18的擺動角0。 第7圖係表示變形例2的正面圖。如第7圖所示，設 置於橫架部30的右端之貫通孔3 0a，插通有從滑動器3 2B 例起的連結軸50。因此，橫架部30的右端和滑動器32B 之間，介由垂直的連結軸50予以連結，使可朝向擺動方 向旋轉動作。 再者，在右側的滑動器3 2B不設置擺動襯墊34、35 ，而僅設置在Z方向相對向的升降襯墊36。因此，滑動 器3 2B係在僅限制導引部14B的Z方向之浮上位置的狀 態下，朝向Y方向導引。 例如，在導引部14A、14B的平行度之偏移、或導引 部14A、14B的一方具有X方向之翹曲時，或在一對滑動 器3 2A、32B的並進動作產生偏移時，滑動器32B以連結 軸50爲中心，朝向Z軸周圍轉動，可修正移動方向朝向 Y方向。 -13- 200808489 [產業上利用的可能性] 在上述實施例中，雖然舉出以加工由液晶基板等所構 成的工作件之平台裝置爲例進行說明，但做爲平台裝置的 用途不限定於此，當然亦可應用在進行其他的工作件之加 工或檢查之情況。 【圖式簡單說明】 • 第1圖係本發明的平台裝置之一實施例的斜視圖。 第2圖係第1圖所示的平台裝置之正面圖。 第3圖係第1圖所示的平台裝置之側面圖。 第4圖係第1圖所示的平台裝置之平面圖。 第5圖係用來說明線性電動機22A、22B的位置檢測 之平面圖。 第6圖爲表示變形例1的正面圖。 第7圖爲表示變形例2的正面圖。 【主要元件符號說明】 10 :平台裝置 1 2 :架台 14A、14B :導引部 18 : Y平台 20A、20B :線性電動機 22A、22B :線性刻度 32A、32B :滑動器 -14- 200808489 34、 36 ： 46 ： 3 5 :擺動襯墊 升降襯墊 線性電動機支持部BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a platform apparatus, and more particularly to an apparatus for increasing the size of a slider by increasing the size of the workpiece, and: [Prior Art] φ For example, in a platform device, a displacement mechanism for guiding a platform has a platform that moves along a guide rail while having a rail guided by a stone fixed to the above-mentioned fixed plate The slide is provided with a gap of several to several tens of μ, and the guide hydrostatic bearing pad of the guide rail is configured by moving from the hydrostatic bearing pad to guide the slider to move in a floating state. In such a platform device, as the supply is made into a work piece, the entire device is enlarged, and the platform is moved. In the conventional machining technology, for example, if the guide rail is about lm in length, The machining accuracy of the number can be increased, and as the moving distance of the platform is extended, when the guide rail is more than 2 m, it is difficult to perform precise measurement, and since the measurement error in the length over the entire length is also large, it is difficult to manufacture. A guide rail with a straightness that is accurate, and because of thermal expansion changes, affects the distortion or deflection of the guide rail. A pair of guiding rails are provided with a shifting scale for detecting the platform, and a sensor mounted on the platform side (for example, a pair of actuators in which the light interruption type is driven by the follower distance, the setting surface is opposite The distance to the air pressure of the surface of the substrate is prolonged. It is processed as in the past. However, the length of the whole length is measured to measure the guide rail as required, resulting in a dimensional position of the thread) along the line -5 - 200808489 The scale moves and outputs a detection signal (pulse signal). The signal from the sensor of the linear scale is measured and the position is calculated by the shift. Also, in order to ensure the diameter accuracy of the platform and the accuracy of linear detection, the longer the total length of the guide rail, the more the parallelism of the pair of guide rails must be managed. In order to reduce the influence of the straightness or smoothness of the pair of guide rails, for example, by applying a beam spring along a pair of guide rails and interposing a leaf spring to couple between the pair of sliders In the structure of the burden of the guide rails (see, for example, Japanese Patent Application Laid-Open No. Hei No. 2000-2 1 4280) [Problems to be Solved by the Invention] However, according to the above-mentioned Patent Document 1, The burden of the platform being applied to the guide rail is also limited. For example, in the configuration in which the platform is extended to 2 m to 3 m, it is difficult to ensure the stability of the static and dynamic motion of the platform only by the amount of the above-mentioned leaf spring. Moreover, because of the platform device When the size is large and the accuracy cannot be ensured' or the guide rail is not on the fixed plate, it becomes difficult to obtain the parallelism of the pair of guide rails. Therefore, it is difficult to manage a pair of guides with high precision. The rail will reduce the linear position of one of the moving positions of the detecting platform', and the accuracy of the movement control of the platform is lowered. Then, the position of the scale is adjusted by the distance of the movement, and the unevenness of the line is highly accurate. Device And there is a reduction in literature 1). The reporting device can reduce the elastic distance of the moving distance. The upper surface of the fixed plate is held at the flat height on the gantry to detect the accuracy. -6- 200808489 Accordingly, the present invention has been made in view of the above problems, and provides a platform apparatus for solving the above problems. [Means for Solving the Problem] In order to solve the above problems, the present invention has the following means. The present invention is provided with: a pair of guiding portions supported in parallel to the gantry fixed to the bed surface; a platform moving toward the extending direction of the pair of guiding portions; and a pair of linear motors driving the platform; Measuring a first linear scale of a position of movement of the platform opposite to a side surface of one of the pair of guiding portions; and measuring an opposite side parallel to a side surface of the guiding portion on which the first linear scale is disposed The second linear scale of the movement position of the platform opposite to the side surface, and the measurement 値 of the first linear scale and the measurement of the second linear scale are calculated by calculating the control means of the pair of linear scales. The above issues. It is desirable that the aforementioned platform has: a pair of sliders guided to the pair of guiding portions; and a cross member that is transversely disposed between the pair of sliders. It is desirable that one of the sliders that are disposed to guide the one of the first and second linear scales has a first and a second Y-direction static air that face the both side surfaces of the guide portion. a bearing and a Z-side static air bearing opposed to the upper surface of the guiding portion, and the other slider that moves the other guiding portion has a direction opposite to the upper surface of the other guiding portion Z-direction static pressure air bearing. It is desirable that the first and second Y-direction static pressure air bearings are disposed in the vicinity of each of the first and second linear scales. 200808489 It is desirable that the width of the guide portion on which the aforesaid first scale of the pair of guide portions is disposed is determined by the other desired calculation means based on the first linear scale and the second linear scale. The difference between 値 is calculated by calculating the offset angle in the γ direction described above, and the offset angle of the γ direction is used to calculate the control 前述 of the pair of linear scales. [Effect of the Invention] According to the present invention, since one of the pair of guide portions is provided with the first linear scale, and the other linear scale of the same guide portion is used, even if the flat height of the pair of guide portions is accurate It also does not affect the detection accuracy of a pair of linear scales, and can move the position of the platform. Further, according to the present invention, the slider of the other guide portion is moved by the first and second swinging pads facing the opposite sides of one of the slider holders, and the lifting pad facing the upper surface. Since the pair of sliders having the parallelism of the guide portions of the other side are not affected by the unevenness of the parallelism, the sliders of the pair of guide portions are not affected by the unevenness of the parallelism. The best [Embodiment 1] of the present invention will be described with reference to the drawings, and the second line guiding portion is wide. The measurement 値, the pair of sliders become zero, and when one side of the guide portion is set to decrease in degree, when the degree of decrease in the opposite direction to the other side of the guide portion of the guide portion is detected, mobile. form. -8- 200808489 Figure 1 is a perspective view showing an embodiment of the platform apparatus of the present invention. Figure 2 is a front elevational view of the platform apparatus shown in Figure 1. Figure 3 is a side view of the platform unit shown in Figure 1. Figure 4 is a plan view of the platform apparatus shown in Figure 1. As shown in FIGS. 1 to 4, the platform device 10 is a crane moving platform for moving the crane portion, and includes: a stand 12 fixed to a concrete bed surface; and a pair of guides supported on the stand 12 The lead portions 14A, 14B are horizontally supported between the pair of guiding portions 14A, 14B, and support the plurality of beams 16 on the gantry 12 at both ends; the cross frame is above the pair of guiding portions 14A, 14B Y platform 1 8; a pair of linear motors 20A, 20B that drive both end portions of the Y stage 18 in the Y direction. Further, on the left and right side surfaces of the upper portion of the guide portion 1 4 A on the left side, one of the positions for detecting the Y stage 18 is provided with the linear scales 22A and 22B. Further, an adsorption plate (not shown) for placing a flat workpiece (object to be processed) is placed on the beam 16. The pair of guide portions 14A and 14B are processed with stone or processed with a metal such as iron. Therefore, when the area of the work piece is increased and the moving distance of the Y stage 18 is extended, the total length of the guide portions 14A and 14B can be extended, and for example, the area of the work piece can be made larger than the conventional moving distance. Large stone plates are easier to make, so they can be made at a lower price. The pair of linear motors 20A, 20B are controlled in parallel according to the position detection signal from the one of the movement positions at which the gamma stage 18 is detected to the linear scales 22A, 22B. As shown in Fig. 2, the Y-platform 18 has a transverse frame portion (beam) 30 in which the upper portion of the guide portions 1 4 A and 200808489 14B is transversely arranged in the X direction; The guides 14A, 14B are opposed to the sliders 3 2 A, 3 2 B. The guide portion 14A on the left side of the guide portions 14A, 14B, the movement of the system slider 32A, and the movement of the guide portion 14B on the right side. The slider sliders 32A and 32B are opposed to each other on the right and left side surfaces and the upper surface thereof, and are formed in an inverted U shape, and the left and right side surfaces of the guide portions 14A and 14B are opposed to each other so as to oscillate against the static air bearing 34, 35, and The pad (Z direction static air bearing) 36 is opposed in the Z direction. Therefore, the slider slides and the 3 2B is guided in the X direction and the Z direction while being guided. Further, on the right side surface of the guide portion 14 for guiding the movement of the guide slider 32A, paired linear scales 22A, 22B for detecting the slider 32A on one side are provided. The first linear scale 22A is a position at which the left side surface of the measuring portion 14A faces the slider 32A. The linear scale 22B measures the moving position of the left side surface of the first linear scale 22A 1 4 A and the right side surface 32A opposite to the parallel side. The first and second partial oscillating pads 34 and 35 are provided with the names and the vicinity of the second linear scales 22A and 22B to suppress unevenness in detection accuracy of the first and second scales 22A and 22B. A pair of linear scales 22A, 22B, for example, using a photoelectric side, are provided with: a sensor having a light-emitting element and a light-receiving element; a guide sliding guide and a guide portion having a narrow and moving cross-frame, and having a pad ( The Y-side lifting lining 32A is one of the upper left position of the Y-side and the guiding is again, and the second guiding part of the slider ΐ each of the first and second linear-type is a certain distance -10- 200808489 In the present embodiment, the sensors are disposed on the left and right inner walls of the slider 32A, and the scales are mounted on the left and right sides of the guide portion 14. Further, the cross frame portion 30 is attached and adsorbed. The workpiece (substrate) of the workpiece mounting table is opposed to a specific processing tool (not shown), etc. Then, the cross frame portion 30 and the sliders 32A, 32B are supported by the lifting pad. The air pressure of 36 floats relative to the guide portions 14A and 14B and moves in a non-contact manner. Therefore, the Y-platform 18 moves in the Y direction in a state where there is substantially no friction. The linear motors 20A and 20B are formed. 〕 shaped retainer (with permanent magnet) 40, The movable member (having a coil) 42 inserted from the side to the stator 40 is configured to move the movable member 42 in the Y direction in a non-contact state via a minute gap, and controls the coil to apply a voltage. The movable member 42 and the sliding member The side faces of the sliders 32A, 32B are coupled, and by applying a voltage to the coil, the thrust generated between the sliders 32A and 32B is transmitted to the sliders 32A, 32B, and the sliders 32A, 32B are driven in the Y direction. The stators 40 of the linear motors 2 0 A and 2 0 B are supported by the linear motor support unit 46. Therefore, when the Y stage 18 is moved in the Y direction by the driving force of the linear motors 20A and 20B, The rebound force is transmitted to the concrete bed through the linear motor support portion 46. Thereby, the rebound force received by the linear motors 20A, 20B is weakened on the concrete bed surface. Therefore, the linear motor 20A that propagates to the gantry 12, The rebound force of 20B becomes extremely small. Figure 5 is a plan view of the 200808489 used to illustrate the position detection of the linear scale 2 2 A, 2 2 B. As shown in Fig. 5, the linear scales 22 A, 22B are by Y. Platform 1 8 shift The relative position of the sensor and the scale is detected, and the position is detected. Further, the linear scales 22A and 22B are located at intermediate positions in the respective X directions, and are disposed at positions of the distances LA and LB, and the width of the guide portion 14A in the X direction. The displacement distance Lc (= La-Lb) of the size detects the respective movement positions of the sliders 32A, 3 2B. Therefore, the swing angle of the Y stage 18 can be calculated based on the difference in position detected by the linear scales 22 A, 22B. 0. The offset in the Y direction of the parallel operation of the φ sliders 32A and 32B can be obtained. Further, the linear scales 22A and 22B may be other than the above-described photoelectric method (for example, a laser method, a magnetic method, or the like). For example, the detection position yA of the linear scale 22A disposed on the outer side is obtained by yA=LA · sin 0, and the detection position yb of the linear scale 22B disposed on the inner side is obtained by yb = LB · si η 0 . Then, the actual offset amount Ay in the direction of the sliders 3 2 Α and 32 系 is Aysy A. (LA/LB) yB 〇 # Therefore, the control unit of the platform device 10 calculates Y by Δ0. The inclination of the driving force of the linear motors 20A, 20B of the stage 18 is output to the control 値 of the linear motors 20A, 20B, and the shift Ay of the Y direction of the control sliders 3 2A, 3 2B becomes zero. As described above, in the platform device 10, even if the configuration is not used, the detection accuracy of the Y-direction positions of the linear scales 22A and 22B provided on the left and right side faces of the guide portion 14a on one side is not lowered. For example, even if the parallelism of the guiding portions 14A, 14B is lowered or warped, since the parallelism of the left and right sides of the other guiding portion 14A is relatively high precision, -12-200808489 can be maintained by the linear scale 22A , 22B position detection accuracy. Here, a modification will be described. Fig. 6 is a front elevational view showing a first modification. As shown in Fig. 6, the width dimension Lc of the left guide portion 14A in the X direction of the guide portions 14A, 14B is larger than the right guide portion 14B and larger than the width of the above embodiment. Therefore, the difference between the detection position yA of the linear scale 22A and the detection position yB of the linear scale 22B is amplified and detected. Therefore, since the difference between the distances LA and LB from the intermediate point X in the X direction is amplified, the swing angle 0 of the Y stage 18 can be easily detected. Fig. 7 is a front view showing a modification 2. As shown in Fig. 7, the through hole 30a provided at the right end of the horizontal frame portion 30 is inserted with the connecting shaft 50 as exemplified by the slider 3 2B. Therefore, the right end of the horizontal frame portion 30 and the slider 32B are coupled to each other via the vertical connecting shaft 50 so as to be rotatable in the swinging direction. Further, the sliders 34, 35 on the right side are not provided with the swing pads 34, 35, and only the lift pads 36 that face in the Z direction are provided. Therefore, the slider 3 2B is guided in the Y direction in a state where only the floating position of the guide portion 14B in the Z direction is restricted. For example, when the parallelism of the guide portions 14A, 14B is shifted, or when one of the guide portions 14A, 14B has a warp in the X direction, or when the parallel motion of the pair of sliders 3 2A, 32B is shifted, The slider 32B rotates around the Z-axis around the connecting shaft 50, and can correct the moving direction toward the Y direction. -13-200808489 [Probability of Industrial Use] In the above embodiment, a platform device for processing a workpiece composed of a liquid crystal substrate or the like is described as an example. However, the use as a platform device is not limited to Therefore, it can of course be applied to the processing or inspection of other work pieces. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing an embodiment of a platform apparatus of the present invention. Figure 2 is a front elevational view of the platform apparatus shown in Figure 1. Figure 3 is a side view of the platform apparatus shown in Figure 1. Figure 4 is a plan view of the platform apparatus shown in Figure 1. Fig. 5 is a plan view for explaining the positional detection of the linear motors 22A, 22B. Fig. 6 is a front elevational view showing a first modification. Fig. 7 is a front elevational view showing a second modification. [Main component symbol description] 10: Platform device 1 2: Rack 14A, 14B: Guide portion 18: Y platform 20A, 20B: Linear motor 22A, 22B: Linear scale 32A, 32B: Slider-14- 200808489 34, 36 : 46 : 3 5 : Swing pad lifting pad linear motor support

Claims (1)

200808489 十、申請專利範圍 1· 一種平台裝置，其特徵爲具備有： 被支持於固定在床面的架台，而平行地配置的一對導 引部； 朝向該一對導引部的延伸方向移動的平台； 驅動前述平台的一對線性電動機； 測量與前述一對導引部中任一方的側面相對的前述平 φ 台之移動位置的第1線性刻度； 用來測定與和配設有該第1線性刻度的前述導引部之 側面平行的相反側之側面相對的前述平台的移動位置之第 2線性刻度；以及 依據前述第1線性刻度的測定値及前述第2線性刻度 的測定値，運算前述一對線性刻度的控制値之運算手段。 2. 如申請專利範圍第1項之平台裝置，其中，前述 平台係具有： • 被導引至前述一對導引部的一對滑動器；以及 橫架於該一對滑動器之間的橫架構件。 3. 如申請專利範圍第2項之平台裝置，其中，移動 配設有前述第1、第2線性刻度的一方之導引部的一方之 滑動器，係具有：與前述導引部的兩側面相對向的第1、 第2之擺動襯墊、和與該導引部的上面相對向之升降襯墊 移動前述另一方的導引部之另一方的滑動器，係具有 與前述另一方的導引部之上面相對向的升降2襯墊。 -16- 200808489 4. 如申請專利範圍第3項之平台裝置，其中，前述 第1、第2之擺動襯墊，係配設於各個前述第1、第2線 性刻度的附近。 5. 如申請專利範圍第1項之平台裝置，其中，將配 設有前述一對導引部中之前述第1、第2線性刻度的導引 部之寬度，設爲比前述另一方的導引部寬。 6. 如申請專利範圍第1項之平台裝置，其中，前述 運算手段係依據前述第1線性刻度的測定値、和前述第2 線性刻度的測定値之差，運算前述一對滑動器之擺動方向 的偏移角，使前述擺動方向的偏移角成爲零，而運算前述 一對線性電動機之控制値。200808489 X. Patent Application No. 1. A platform device characterized by comprising: a pair of guiding portions supported in parallel to a platform fixed to a bed surface; and moving toward an extending direction of the pair of guiding portions a pair of linear motors that drive the platform; a first linear scale that measures a moving position of the flat φ table opposite to a side surface of one of the pair of guiding portions; a second linear scale of the movement position of the platform facing the side opposite to the side opposite to the side of the guide portion of the linear scale; and the measurement 値 according to the first linear scale and the measurement of the second linear scale The above-mentioned pair of linear scale control means. 2. The platform apparatus of claim 1, wherein the platform has: a pair of sliders guided to the pair of guiding portions; and a transverse cross between the pair of sliders Architecture pieces. 3. The platform device of claim 2, wherein the slider that moves one of the guide portions of the first and second linear scales has a side surface that is opposite to the guide portion The opposite first and second oscillating pads and the other slider of the other of the guiding portions that move toward and from the upper surface of the guiding portion have the other guide The upper and lower sides of the lead portion are lifted and lowered 2 pads. The platform apparatus according to claim 3, wherein the first and second swinging pads are disposed in the vicinity of each of the first and second linear scales. 5. The platform apparatus according to claim 1, wherein a width of the guide portion of the first and second linear scales of the pair of guide portions is set to be larger than the other guide The lead is wide. 6. The platform apparatus according to claim 1, wherein the calculation means calculates the swing direction of the pair of sliders based on a difference between the measurement 値 of the first linear scale and the measurement 値 of the second linear scale The offset angle is such that the offset angle of the aforementioned swing direction becomes zero, and the control 値 of the pair of linear motors is calculated. -17--17-
TW096120545A 2006-06-19 2007-06-07 Stage device TW200808489A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006169421A JP4130838B2 (en) 2006-06-19 2006-06-19 Stage equipment

Publications (1)

Publication Number Publication Date
TW200808489A true TW200808489A (en) 2008-02-16

Family

ID=38931052

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096120545A TW200808489A (en) 2006-06-19 2007-06-07 Stage device

Country Status (4)

Country Link
JP (1) JP4130838B2 (en)
KR (1) KR20070120440A (en)
CN (1) CN101093814A (en)
TW (1) TW200808489A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101149513B1 (en) * 2010-02-11 2012-05-29 삼성중공업 주식회사 Apparatus for measuring linearity and flatness of rail
KR101530953B1 (en) * 2014-09-16 2015-06-23 대우조선해양 주식회사 Inspection apparatus and method for cell guide installation accuracy of container ship
CN104280904A (en) * 2014-09-26 2015-01-14 京东方科技集团股份有限公司 Array substrate detecting head and device and array substrate detecting method
JP7291586B2 (en) * 2019-09-19 2023-06-15 ファスフォードテクノロジ株式会社 Die bonding apparatus and semiconductor device manufacturing method
WO2022123711A1 (en) * 2020-12-10 2022-06-16 Dmg森精機株式会社 Feeding device

Also Published As

Publication number Publication date
JP2007331086A (en) 2007-12-27
CN101093814A (en) 2007-12-26
KR20070120440A (en) 2007-12-24
JP4130838B2 (en) 2008-08-06

Similar Documents

Publication Publication Date Title
US9898000B2 (en) Planar positioning system and method of using the same
TWI326746B (en)
US9979262B2 (en) Positioning device in gantry type of construction having a position-measurement device for measuring the position of a carriage relative to a cross-member
TW200808489A (en) Stage device
JP4402078B2 (en) Stage equipment
JP2006224285A (en) Stage device, gantry-type stage device, and method of controlling stage device
JP2012009023A (en) Error compensation system using encoder feedback, error mapping, and air pressure control
JP3940277B2 (en) Stage equipment
TWI260646B (en) X-Y axis stage device
JP2006287098A (en) Positioning device
JP2008090718A (en) Positioning device
JP2009535632A (en) Measuring apparatus and measuring method for inspection of substrate surface
JP2004317485A (en) X-y stage device
CN108278957B (en) Shape measuring device and moving mechanism
JP3732763B2 (en) Stage equipment
CN210486802U (en) Be used for jumbo size wafer thickness testing platform
JP5122416B2 (en) Air table device and bearing interval correction method
TWI500902B (en) A parallel sliding device device and its control method and measuring device for pressure linear guide mode
KR100909583B1 (en) The movement of table apparatus of the moire measure system
JP5886084B2 (en) Stage equipment
JP5341165B2 (en) STAGE DEVICE, GANTRY TYPE STAGE DEVICE, AND STAGE DEVICE CONTROL METHOD
JP5624916B2 (en) Pneumatic linear guide type parallel slider device, its control method and measuring device
CN110313120B (en) Planar positioning device
JP2006281426A (en) Positioning device
JP2011133937A (en) Moving device