JP7291586B2 - ダイボンディング装置および半導体装置の製造方法 - Google Patents

ダイボンディング装置および半導体装置の製造方法 Download PDF

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Publication number
JP7291586B2
JP7291586B2 JP2019170339A JP2019170339A JP7291586B2 JP 7291586 B2 JP7291586 B2 JP 7291586B2 JP 2019170339 A JP2019170339 A JP 2019170339A JP 2019170339 A JP2019170339 A JP 2019170339A JP 7291586 B2 JP7291586 B2 JP 7291586B2
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Japan
Prior art keywords
linear scale
die
guide
bonding apparatus
semiconductor device
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JP2019170339A
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English (en)
Japanese (ja)
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JP2021048285A5 (https=
JP2021048285A (ja
Inventor
浩 牧
政幸 望月
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Fasford Technology Co Ltd
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Fasford Technology Co Ltd
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Priority to JP2019170339A priority Critical patent/JP7291586B2/ja
Priority to TW109123687A priority patent/TWI743887B/zh
Priority to KR1020200111635A priority patent/KR102430824B1/ko
Priority to CN202010988125.5A priority patent/CN112530839B/zh
Publication of JP2021048285A publication Critical patent/JP2021048285A/ja
Publication of JP2021048285A5 publication Critical patent/JP2021048285A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7428—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

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  • Die Bonding (AREA)
JP2019170339A 2019-09-19 2019-09-19 ダイボンディング装置および半導体装置の製造方法 Active JP7291586B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019170339A JP7291586B2 (ja) 2019-09-19 2019-09-19 ダイボンディング装置および半導体装置の製造方法
TW109123687A TWI743887B (zh) 2019-09-19 2020-07-14 晶粒接合裝置及半導體裝置的製造方法
KR1020200111635A KR102430824B1 (ko) 2019-09-19 2020-09-02 다이 본딩 장치 및 반도체 장치의 제조 방법
CN202010988125.5A CN112530839B (zh) 2019-09-19 2020-09-18 芯片贴装装置以及半导体器件的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019170339A JP7291586B2 (ja) 2019-09-19 2019-09-19 ダイボンディング装置および半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2021048285A JP2021048285A (ja) 2021-03-25
JP2021048285A5 JP2021048285A5 (https=) 2022-07-14
JP7291586B2 true JP7291586B2 (ja) 2023-06-15

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JP2019170339A Active JP7291586B2 (ja) 2019-09-19 2019-09-19 ダイボンディング装置および半導体装置の製造方法

Country Status (4)

Country Link
JP (1) JP7291586B2 (https=)
KR (1) KR102430824B1 (https=)
CN (1) CN112530839B (https=)
TW (1) TWI743887B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115770947B (zh) * 2021-09-06 2026-02-10 源卓微纳科技(苏州)股份有限公司 一种重布线电路图形的处理系统及处理方法
JP2023042403A (ja) * 2021-09-14 2023-03-27 ファスフォードテクノロジ株式会社 実装装置および半導体装置の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001267335A (ja) 2000-03-21 2001-09-28 Matsushita Electric Ind Co Ltd 電子部品搭載装置および電子部品搭載方法
JP2006313839A (ja) 2005-05-09 2006-11-16 Juki Corp 部品実装装置
JP2010135363A (ja) 2008-12-02 2010-06-17 Panasonic Corp 部品実装装置および部品実装装置におけるツール配列データ作成方法
US20130298391A1 (en) 2012-05-11 2013-11-14 Yamaha Hatsudoki Kabushiki Kaisha Working apparatus for component or board and component mounting apparatus

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JPH0951007A (ja) * 1995-08-09 1997-02-18 Mitsubishi Electric Corp ダイボンド装置および半導体装置の製造方法
JP4080149B2 (ja) * 2000-07-11 2008-04-23 松下電器産業株式会社 作業ヘッドの移動装置
KR100326757B1 (en) * 2001-08-09 2002-03-13 Justek Corp Method for correcting error of scaler according to variation of temperature in linear motor
KR20070016098A (ko) * 2004-06-03 2007-02-07 마츠시타 덴끼 산교 가부시키가이샤 부품 실장 방법 및 장치
JP2006041260A (ja) * 2004-07-28 2006-02-09 Juki Corp 電子部品搭載装置のノズル位置補正方法
JP4130838B2 (ja) * 2006-06-19 2008-08-06 住友重機械工業株式会社 ステージ装置
JP2008117968A (ja) * 2006-11-06 2008-05-22 Tokyo Seimitsu Co Ltd プローバ
KR20130117191A (ko) * 2012-04-18 2013-10-25 한미반도체 주식회사 작업유닛 이송장치
JP5996979B2 (ja) * 2012-09-07 2016-09-21 ヤマハ発動機株式会社 電子部品実装装置および実装位置補正データ作成方法
TWI545663B (zh) * 2014-05-07 2016-08-11 新川股份有限公司 接合裝置以及接合方法
JP6510838B2 (ja) * 2015-03-11 2019-05-08 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
WO2016158588A1 (ja) * 2015-03-31 2016-10-06 株式会社新川 ワイヤボンディング装置及びワイヤボンディング方法
JP6573813B2 (ja) * 2015-09-30 2019-09-11 ファスフォードテクノロジ株式会社 ダイボンダおよび半導体装置の製造方法
JP6667326B2 (ja) * 2016-03-17 2020-03-18 ファスフォードテクノロジ株式会社 ダイボンダおよびボンディング方法
KR102383298B1 (ko) * 2016-11-09 2022-04-06 도쿄엘렉트론가부시키가이샤 접합 장치, 접합 시스템, 접합 방법 및 컴퓨터 기억 매체
TWI684235B (zh) * 2017-07-12 2020-02-01 日商新川股份有限公司 相對於第二物體來定位第一物體的裝置和方法
JP6952368B2 (ja) * 2017-08-28 2021-10-20 株式会社新川 対象物に対して第１移動体及び第２移動体を直線移動させる装置及び方法
JP7033878B2 (ja) * 2017-10-16 2022-03-11 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001267335A (ja) 2000-03-21 2001-09-28 Matsushita Electric Ind Co Ltd 電子部品搭載装置および電子部品搭載方法
JP2006313839A (ja) 2005-05-09 2006-11-16 Juki Corp 部品実装装置
JP2010135363A (ja) 2008-12-02 2010-06-17 Panasonic Corp 部品実装装置および部品実装装置におけるツール配列データ作成方法
US20130298391A1 (en) 2012-05-11 2013-11-14 Yamaha Hatsudoki Kabushiki Kaisha Working apparatus for component or board and component mounting apparatus

Also Published As

Publication number Publication date
TW202114105A (zh) 2021-04-01
JP2021048285A (ja) 2021-03-25
CN112530839A (zh) 2021-03-19
KR102430824B1 (ko) 2022-08-09
CN112530839B (zh) 2024-03-08
TWI743887B (zh) 2021-10-21
KR20210033896A (ko) 2021-03-29

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