TWI739017B - 樹脂組成物、配線板用絕緣層及層合體 - Google Patents

樹脂組成物、配線板用絕緣層及層合體 Download PDF

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Publication number
TWI739017B
TWI739017B TW107124731A TW107124731A TWI739017B TW I739017 B TWI739017 B TW I739017B TW 107124731 A TW107124731 A TW 107124731A TW 107124731 A TW107124731 A TW 107124731A TW I739017 B TWI739017 B TW I739017B
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Taiwan
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resin
viscosity
resin composition
compound
aforementioned
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TW107124731A
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English (en)
Chinese (zh)
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TW201910411A (zh
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大澤和弘
松島敏文
本郷孝宏
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日商三井金屬鑛業股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/5399—Phosphorus bound to nitrogen
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/08—Copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
TW107124731A 2017-07-27 2018-07-18 樹脂組成物、配線板用絕緣層及層合體 TWI739017B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017145841 2017-07-27
JP2017-145841 2017-07-27

Publications (2)

Publication Number Publication Date
TW201910411A TW201910411A (zh) 2019-03-16
TWI739017B true TWI739017B (zh) 2021-09-11

Family

ID=65039633

Family Applications (1)

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TW107124731A TWI739017B (zh) 2017-07-27 2018-07-18 樹脂組成物、配線板用絕緣層及層合體

Country Status (6)

Country Link
JP (1) JP7219216B2 (ja)
KR (1) KR102254544B1 (ja)
CN (1) CN110709476A (ja)
MY (1) MY195223A (ja)
TW (1) TWI739017B (ja)
WO (1) WO2019021862A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
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JPWO2022054303A1 (ja) * 2020-09-11 2022-03-17
JP2022099778A (ja) * 2020-12-23 2022-07-05 日鉄ケミカル＆マテリアル株式会社 ポリイミド組成物、樹脂フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板及び回路基板
CN112795169B (zh) * 2020-12-31 2022-07-19 广东生益科技股份有限公司 一种树脂组合物及包含其的树脂膜、预浸料、层压板、覆铜板和印刷电路板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200740902A (en) * 2006-02-23 2007-11-01 Matsushita Electric Works Ltd Flame-retardant resin composition, prepreg, resin sheet and molded product using the same
JP2014001276A (ja) * 2012-06-15 2014-01-09 Asahi Kasei E-Materials Corp 硬化性樹脂組成物

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JP2005112981A (ja) * 2003-10-07 2005-04-28 Hitachi Chem Co Ltd 低誘電率樹脂組成物およびそれを用いたプリプレグ、金属張積層板、印刷配線板
JP2007030326A (ja) * 2005-07-26 2007-02-08 Matsushita Electric Works Ltd 樹脂付銅箔、プリント配線板製造用積層体及び多層プリント配線板
JP2009078209A (ja) * 2007-09-25 2009-04-16 Panasonic Electric Works Co Ltd 樹脂付き金属箔とその製造方法、並びに金属張りフレキシブル積層板
JP5493347B2 (ja) 2008-01-17 2014-05-14 東洋インキＳｃホールディングス株式会社 難燃性樹脂組成物
JP5233710B2 (ja) * 2008-02-12 2013-07-10 三菱瓦斯化学株式会社 樹脂組成物、プリプレグおよび金属箔張り積層板
JP5093059B2 (ja) * 2008-11-06 2012-12-05 日立化成工業株式会社 樹脂組成物、プリプレグ、積層板及びプリント基板
JP2010168487A (ja) * 2009-01-23 2010-08-05 Nippon Zeon Co Ltd 重合性組成物、架橋体および架橋樹脂複合体
KR20120112657A (ko) * 2010-01-28 2012-10-11 미쓰이 가가쿠 가부시키가이샤 금속 수지 복합체
JP2011162615A (ja) * 2010-02-05 2011-08-25 Kyocera Chemical Corp プリプレグおよび金属張り積層板
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TWI609779B (zh) * 2012-01-11 2018-01-01 三井金屬鑛業股份有限公司 具備接著劑層之銅箔、貼銅積層板及印刷配線板
JP5901066B2 (ja) * 2012-04-27 2016-04-06 三井金属鉱業株式会社 樹脂組成物、樹脂層付金属箔、金属張積層板及びプリント配線板
JP6364202B2 (ja) * 2014-02-24 2018-07-25 矢崎総業株式会社 成形機及び成形方法
WO2015133292A1 (ja) 2014-03-06 2015-09-11 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、樹脂シート、金属箔張積層板及びプリント配線板
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TW200740902A (en) * 2006-02-23 2007-11-01 Matsushita Electric Works Ltd Flame-retardant resin composition, prepreg, resin sheet and molded product using the same
JP2014001276A (ja) * 2012-06-15 2014-01-09 Asahi Kasei E-Materials Corp 硬化性樹脂組成物

Also Published As

Publication number Publication date
TW201910411A (zh) 2019-03-16
WO2019021862A1 (ja) 2019-01-31
JP7219216B2 (ja) 2023-02-07
KR102254544B1 (ko) 2021-05-24
JPWO2019021862A1 (ja) 2020-05-28
KR20190133787A (ko) 2019-12-03
CN110709476A (zh) 2020-01-17
MY195223A (en) 2023-01-11

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