CN110709476A - 树脂组合物、布线板用绝缘层及层叠体 - Google Patents

树脂组合物、布线板用绝缘层及层叠体 Download PDF

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Publication number
CN110709476A
CN110709476A CN201880037125.8A CN201880037125A CN110709476A CN 110709476 A CN110709476 A CN 110709476A CN 201880037125 A CN201880037125 A CN 201880037125A CN 110709476 A CN110709476 A CN 110709476A
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CN
China
Prior art keywords
resin
compound
viscosity
resin composition
compounds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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CN201880037125.8A
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English (en)
Chinese (zh)
Inventor
大泽和弘
松岛敏文
本乡孝宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MITSUI METAL MINING CO Ltd
Mitsui Mining and Smelting Co Ltd
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MITSUI METAL MINING CO Ltd
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Publication of CN110709476A publication Critical patent/CN110709476A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/5399—Phosphorus bound to nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/08—Copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
CN201880037125.8A 2017-07-27 2018-07-13 树脂组合物、布线板用绝缘层及层叠体 Pending CN110709476A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017145841 2017-07-27
JP2017-145841 2017-07-27
PCT/JP2018/026513 WO2019021862A1 (ja) 2017-07-27 2018-07-13 樹脂組成物、配線板用絶縁層及び積層体

Publications (1)

Publication Number Publication Date
CN110709476A true CN110709476A (zh) 2020-01-17

Family

ID=65039633

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880037125.8A Pending CN110709476A (zh) 2017-07-27 2018-07-13 树脂组合物、布线板用绝缘层及层叠体

Country Status (6)

Country Link
JP (1) JP7219216B2 (ja)
KR (1) KR102254544B1 (ja)
CN (1) CN110709476A (ja)
MY (1) MY195223A (ja)
TW (1) TWI739017B (ja)
WO (1) WO2019021862A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114656874A (zh) * 2020-12-23 2022-06-24 日铁化学材料株式会社 聚酰亚胺组合物、树脂膜、层叠体、覆盖膜、带树脂的铜箔、覆金属层叠板及电路基板
WO2022141814A1 (zh) * 2020-12-31 2022-07-07 广东生益科技股份有限公司 一种树脂组合物及包含其的树脂膜、预浸料、层压板、覆铜板和印刷电路板

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022054303A1 (ja) * 2020-09-11 2022-03-17

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JP2010111758A (ja) * 2008-11-06 2010-05-20 Hitachi Chem Co Ltd 樹脂組成物、プリプレグ、積層板及びプリント基板
JP2014001276A (ja) * 2012-06-15 2014-01-09 Asahi Kasei E-Materials Corp 硬化性樹脂組成物
WO2017029917A1 (ja) * 2015-08-19 2017-02-23 東洋紡株式会社 低誘電接着剤組成物
WO2017094489A1 (ja) * 2015-11-30 2017-06-08 ナミックス株式会社 熱硬化性樹脂組成物、熱硬化性樹脂フィルム、プリント配線板、および半導体装置

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JP2005112981A (ja) * 2003-10-07 2005-04-28 Hitachi Chem Co Ltd 低誘電率樹脂組成物およびそれを用いたプリプレグ、金属張積層板、印刷配線板
JP2007030326A (ja) * 2005-07-26 2007-02-08 Matsushita Electric Works Ltd 樹脂付銅箔、プリント配線板製造用積層体及び多層プリント配線板
JP2007224162A (ja) * 2006-02-23 2007-09-06 Matsushita Electric Works Ltd 難燃性樹脂組成物、プリプレグ、樹脂シート、成形品
JP2009078209A (ja) * 2007-09-25 2009-04-16 Panasonic Electric Works Co Ltd 樹脂付き金属箔とその製造方法、並びに金属張りフレキシブル積層板
JP5493347B2 (ja) 2008-01-17 2014-05-14 東洋インキＳｃホールディングス株式会社 難燃性樹脂組成物
JP5233710B2 (ja) * 2008-02-12 2013-07-10 三菱瓦斯化学株式会社 樹脂組成物、プリプレグおよび金属箔張り積層板
JP2010168487A (ja) * 2009-01-23 2010-08-05 Nippon Zeon Co Ltd 重合性組成物、架橋体および架橋樹脂複合体
KR20120112657A (ko) * 2010-01-28 2012-10-11 미쓰이 가가쿠 가부시키가이샤 금속 수지 복합체
JP2011162615A (ja) * 2010-02-05 2011-08-25 Kyocera Chemical Corp プリプレグおよび金属張り積層板
JP5791983B2 (ja) * 2011-07-07 2015-10-07 三井化学株式会社 樹脂組成物、これを用いたポリイミド金属積層体、及び電子回路用基板
TWI609779B (zh) * 2012-01-11 2018-01-01 三井金屬鑛業股份有限公司 具備接著劑層之銅箔、貼銅積層板及印刷配線板
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JP2014001276A (ja) * 2012-06-15 2014-01-09 Asahi Kasei E-Materials Corp 硬化性樹脂組成物
WO2017029917A1 (ja) * 2015-08-19 2017-02-23 東洋紡株式会社 低誘電接着剤組成物
WO2017094489A1 (ja) * 2015-11-30 2017-06-08 ナミックス株式会社 熱硬化性樹脂組成物、熱硬化性樹脂フィルム、プリント配線板、および半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114656874A (zh) * 2020-12-23 2022-06-24 日铁化学材料株式会社 聚酰亚胺组合物、树脂膜、层叠体、覆盖膜、带树脂的铜箔、覆金属层叠板及电路基板
WO2022141814A1 (zh) * 2020-12-31 2022-07-07 广东生益科技股份有限公司 一种树脂组合物及包含其的树脂膜、预浸料、层压板、覆铜板和印刷电路板

Also Published As

Publication number Publication date
TWI739017B (zh) 2021-09-11
TW201910411A (zh) 2019-03-16
WO2019021862A1 (ja) 2019-01-31
JP7219216B2 (ja) 2023-02-07
KR102254544B1 (ko) 2021-05-24
JPWO2019021862A1 (ja) 2020-05-28
KR20190133787A (ko) 2019-12-03
MY195223A (en) 2023-01-11

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