TWI737747B - 半導體封裝和用於製造半導體封裝的方法 - Google Patents

半導體封裝和用於製造半導體封裝的方法 Download PDF

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Publication number
TWI737747B
TWI737747B TW106119688A TW106119688A TWI737747B TW I737747 B TWI737747 B TW I737747B TW 106119688 A TW106119688 A TW 106119688A TW 106119688 A TW106119688 A TW 106119688A TW I737747 B TWI737747 B TW I737747B
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TW
Taiwan
Prior art keywords
mask layer
metal particles
semiconductor package
layer
substrate
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TW106119688A
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English (en)
Chinese (zh)
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TW201810466A (zh
Inventor
閔丙國
趙成日
崔宰熏
金時經
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南韓商三星電子股份有限公司
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Publication of TW201810466A publication Critical patent/TW201810466A/zh
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Publication of TWI737747B publication Critical patent/TWI737747B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW106119688A 2016-06-14 2017-06-13 半導體封裝和用於製造半導體封裝的方法 TWI737747B (zh)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US201662349917P 2016-06-14 2016-06-14
US62/349,917 2016-06-14
??10-2016-0115857 2016-09-08
KR10-2016-0115857 2016-09-08
KR20160115857 2016-09-08
KR10-2017-0073395 2017-06-12
??10-2017-0073395 2017-06-12
KR1020170073395A KR102419046B1 (ko) 2016-06-14 2017-06-12 반도체 패키지 및 그 제조 방법

Publications (2)

Publication Number Publication Date
TW201810466A TW201810466A (zh) 2018-03-16
TWI737747B true TWI737747B (zh) 2021-09-01

Family

ID=60936976

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106119688A TWI737747B (zh) 2016-06-14 2017-06-13 半導體封裝和用於製造半導體封裝的方法

Country Status (2)

Country Link
KR (1) KR102419046B1 (ko)
TW (1) TWI737747B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102488873B1 (ko) * 2018-01-18 2023-01-17 삼성전자주식회사 전자파 차폐구조
TWI791769B (zh) * 2018-02-27 2023-02-11 日商迪愛生股份有限公司 電子零件封裝及其製造方法
KR102140554B1 (ko) * 2018-09-12 2020-08-03 삼성전자주식회사 반도체 패키지 및 패키지 실장 기판
KR102513086B1 (ko) * 2018-10-01 2023-03-23 삼성전자주식회사 반도체 패키지
KR102240759B1 (ko) * 2019-05-29 2021-04-16 엔트리움 주식회사 전자 장치 및 그 제조 방법
KR102176570B1 (ko) * 2019-05-29 2020-11-09 엔트리움 주식회사 전자 장치 및 그 제조 방법

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050230767A1 (en) * 2003-12-05 2005-10-20 Park Jung J Fabrication and integration of polymeric bioMEMS
US20090166819A1 (en) * 2007-12-29 2009-07-02 Tsinghua University Chipset package structure
US20110200810A1 (en) * 2010-02-12 2011-08-18 Canon Kabushiki Kaisha Light-shielding film for optical element and optical element having light-shielding film
US8199083B2 (en) * 2007-12-19 2012-06-12 Sony Corporation Display device
US20120300412A1 (en) * 2011-05-25 2012-11-29 In-Sang Song Memory Device and Fabricating Method Thereof
US20130307128A1 (en) * 2012-05-15 2013-11-21 I-Chia Lin Semiconductor packages with thermal dissipation structures and emi shielding
US20160095265A1 (en) * 2013-05-21 2016-03-31 Korea Institute Of Industrial Technology Electromagnetic wave shielding sheet comprising carbon composite fiber manufactured by electrospinning and method for manufacturing same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010123645A (ja) * 2008-11-18 2010-06-03 Jinko Cho 電磁波防止用の微粒子材料
JP2010278325A (ja) * 2009-05-29 2010-12-09 Sanyo Electric Co Ltd 電子部品及びそれを備える回路モジュール
JP2013207213A (ja) * 2012-03-29 2013-10-07 Tdk Corp 電子部品モジュール及びその製造方法
JP5779227B2 (ja) * 2013-03-22 2015-09-16 株式会社東芝 半導体装置の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050230767A1 (en) * 2003-12-05 2005-10-20 Park Jung J Fabrication and integration of polymeric bioMEMS
US8199083B2 (en) * 2007-12-19 2012-06-12 Sony Corporation Display device
US20090166819A1 (en) * 2007-12-29 2009-07-02 Tsinghua University Chipset package structure
US20110200810A1 (en) * 2010-02-12 2011-08-18 Canon Kabushiki Kaisha Light-shielding film for optical element and optical element having light-shielding film
US20120300412A1 (en) * 2011-05-25 2012-11-29 In-Sang Song Memory Device and Fabricating Method Thereof
US20130307128A1 (en) * 2012-05-15 2013-11-21 I-Chia Lin Semiconductor packages with thermal dissipation structures and emi shielding
US20160095265A1 (en) * 2013-05-21 2016-03-31 Korea Institute Of Industrial Technology Electromagnetic wave shielding sheet comprising carbon composite fiber manufactured by electrospinning and method for manufacturing same

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Publication number Publication date
KR102419046B1 (ko) 2022-07-12
KR20170141606A (ko) 2017-12-26
TW201810466A (zh) 2018-03-16

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