TWI737382B - 工件搬入裝置、樹脂塑封裝置 - Google Patents

工件搬入裝置、樹脂塑封裝置 Download PDF

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Publication number
TWI737382B
TWI737382B TW109122402A TW109122402A TWI737382B TW I737382 B TWI737382 B TW I737382B TW 109122402 A TW109122402 A TW 109122402A TW 109122402 A TW109122402 A TW 109122402A TW I737382 B TWI737382 B TW I737382B
Authority
TW
Taiwan
Prior art keywords
workpiece
mold
resin
molding
sleeve block
Prior art date
Application number
TW109122402A
Other languages
English (en)
Chinese (zh)
Other versions
TW202103886A (zh
Inventor
中山英雄
Original Assignee
日商山田尖端科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商山田尖端科技股份有限公司 filed Critical 日商山田尖端科技股份有限公司
Publication of TW202103886A publication Critical patent/TW202103886A/zh
Application granted granted Critical
Publication of TWI737382B publication Critical patent/TWI737382B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0003—Discharging moulded articles from the mould
    • B29C37/0007—Discharging moulded articles from the mould using means operable from outside the mould for moving between mould parts, e.g. robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/20—Opening, closing or clamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/30—Mounting, exchanging or centering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0003—Discharging moulded articles from the mould
    • B29C37/0007—Discharging moulded articles from the mould using means operable from outside the mould for moving between mould parts, e.g. robots
    • B29C37/001—Discharging moulded articles from the mould using means operable from outside the mould for moving between mould parts, e.g. robots combined with means for loading preforms to be moulded or inserts, e.g. preformed layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14008—Inserting articles into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/20—Injection nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2602—Mould construction elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW109122402A 2019-07-22 2020-07-02 工件搬入裝置、樹脂塑封裝置 TWI737382B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-134704 2019-07-22
JP2019134704A JP7160770B2 (ja) 2019-07-22 2019-07-22 樹脂モールド装置

Publications (2)

Publication Number Publication Date
TW202103886A TW202103886A (zh) 2021-02-01
TWI737382B true TWI737382B (zh) 2021-08-21

Family

ID=74421134

Family Applications (2)

Application Number Title Priority Date Filing Date
TW110121943A TWI766729B (zh) 2019-07-22 2020-07-02 工件搬出裝置、樹脂塑封裝置
TW109122402A TWI737382B (zh) 2019-07-22 2020-07-02 工件搬入裝置、樹脂塑封裝置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW110121943A TWI766729B (zh) 2019-07-22 2020-07-02 工件搬出裝置、樹脂塑封裝置

Country Status (4)

Country Link
JP (1) JP7160770B2 (ko)
KR (2) KR102325513B1 (ko)
CN (1) CN112289690B (ko)
TW (2) TWI766729B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7447050B2 (ja) 2021-04-21 2024-03-11 Ｔｏｗａ株式会社 成形型、樹脂成形装置及び樹脂成形品の製造方法
TWI817277B (zh) * 2021-12-03 2023-10-01 日商山田尖端科技股份有限公司 樹脂供給機構及具備其的樹脂封裝裝置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201230211A (en) * 2011-01-11 2012-07-16 Apic Yamada Corp Method for resin molding, resin molding apparatus and feeding handler
JP2015051557A (ja) * 2013-09-06 2015-03-19 アピックヤマダ株式会社 モールド金型及び樹脂モールド装置並びに樹脂モールド方法
TW201801212A (zh) * 2016-06-29 2018-01-01 萬潤科技股份有限公司 基板檢查之搬送方法及裝置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4017265B2 (ja) 1998-10-08 2007-12-05 アピックヤマダ株式会社 樹脂封止装置
JP2009096086A (ja) * 2007-10-17 2009-05-07 Towa Corp 電子部品の樹脂封止成形方法及び金型
JP5193609B2 (ja) * 2008-01-17 2013-05-08 アピックヤマダ株式会社 金型装置
JP5771865B2 (ja) 2011-05-23 2015-09-02 アピックヤマダ株式会社 モールド金型
JP5906528B2 (ja) * 2011-07-29 2016-04-20 アピックヤマダ株式会社 モールド金型及びこれを用いた樹脂モールド装置
TWI565105B (zh) * 2012-07-09 2017-01-01 山田尖端科技股份有限公司 樹脂模塑裝置以及樹脂模塑方法
JP5934139B2 (ja) 2013-04-19 2016-06-15 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
JP6218549B2 (ja) * 2013-10-17 2017-10-25 Ｔｏｗａ株式会社 半導体封止型への半導体基板供給方法及び半導体基板供給装置
KR101848967B1 (ko) * 2014-12-30 2018-04-13 세메스 주식회사 반도체 소자 몰딩 장치
JP6560498B2 (ja) 2015-01-27 2019-08-14 Ｔｏｗａ株式会社 樹脂封止方法及び樹脂成形品の製造方法
JP6020667B1 (ja) * 2015-06-19 2016-11-02 第一精工株式会社 トランスファー成形機および電子部品を製造する方法
JP6506680B2 (ja) * 2015-11-09 2019-04-24 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
JP6655150B1 (ja) * 2018-10-19 2020-02-26 Ｔｏｗａ株式会社 搬送装置、樹脂成形装置、搬送方法、及び樹脂成形品の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201230211A (en) * 2011-01-11 2012-07-16 Apic Yamada Corp Method for resin molding, resin molding apparatus and feeding handler
JP2015051557A (ja) * 2013-09-06 2015-03-19 アピックヤマダ株式会社 モールド金型及び樹脂モールド装置並びに樹脂モールド方法
TW201801212A (zh) * 2016-06-29 2018-01-01 萬潤科技股份有限公司 基板檢查之搬送方法及裝置

Also Published As

Publication number Publication date
CN112289690A (zh) 2021-01-29
JP7160770B2 (ja) 2022-10-25
KR20210011326A (ko) 2021-02-01
CN112289690B (zh) 2024-07-09
KR20210060403A (ko) 2021-05-26
JP2021017013A (ja) 2021-02-15
TW202136014A (zh) 2021-10-01
TWI766729B (zh) 2022-06-01
KR102325516B1 (ko) 2021-11-12
KR102325513B1 (ko) 2021-11-12
TW202103886A (zh) 2021-02-01

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