TWI730192B - 磨削裝置 - Google Patents

磨削裝置 Download PDF

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Publication number
TWI730192B
TWI730192B TW106137924A TW106137924A TWI730192B TW I730192 B TWI730192 B TW I730192B TW 106137924 A TW106137924 A TW 106137924A TW 106137924 A TW106137924 A TW 106137924A TW I730192 B TWI730192 B TW I730192B
Authority
TW
Taiwan
Prior art keywords
grinding
work
workpiece
wheel
equipment
Prior art date
Application number
TW106137924A
Other languages
English (en)
Chinese (zh)
Other versions
TW201821217A (zh
Inventor
李宰榮
甲斐賢哉
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201821217A publication Critical patent/TW201821217A/zh
Application granted granted Critical
Publication of TWI730192B publication Critical patent/TWI730192B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
TW106137924A 2016-12-08 2017-11-02 磨削裝置 TWI730192B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-238428 2016-12-08
JP2016238428A JP6858539B2 (ja) 2016-12-08 2016-12-08 研削装置

Publications (2)

Publication Number Publication Date
TW201821217A TW201821217A (zh) 2018-06-16
TWI730192B true TWI730192B (zh) 2021-06-11

Family

ID=62545350

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106137924A TWI730192B (zh) 2016-12-08 2017-11-02 磨削裝置

Country Status (4)

Country Link
JP (1) JP6858539B2 (ko)
KR (1) KR102408593B1 (ko)
CN (1) CN108177038A (ko)
TW (1) TWI730192B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7301512B2 (ja) * 2018-09-13 2023-07-03 株式会社岡本工作機械製作所 基板研削装置及び基板研削方法
JP2020066064A (ja) * 2018-10-22 2020-04-30 株式会社ディスコ 被加工物の加工方法及び加工装置
TW202120251A (zh) * 2019-07-17 2021-06-01 日商東京威力科創股份有限公司 基板加工裝置、基板處理系統及基板處理方法
CN113305732B (zh) * 2021-06-22 2022-05-03 北京中电科电子装备有限公司 一种用于半导体设备的多工位全自动减薄磨削方法
CN114639601B (zh) * 2022-02-17 2023-04-28 中环领先半导体材料有限公司 一种提升减薄机稼动率的新型工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05277915A (ja) * 1992-03-31 1993-10-26 Nec Yamagata Ltd ウェーハ裏面研削装置
TW201216344A (en) * 2010-10-12 2012-04-16 Disco Corp Processing apparatus
JP5277915B2 (ja) 2008-12-03 2013-08-28 セイコーエプソン株式会社 点灯装置、光源装置、プロジェクタ及び放電灯の点灯方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2138719B (en) * 1983-04-26 1986-08-13 Marconi Electronic Devices Grinding apparatus
JPS61168462A (ja) * 1985-01-18 1986-07-30 Hitachi Ltd ウエハ研削装置
JPH06143112A (ja) * 1992-10-27 1994-05-24 Koyo Mach Ind Co Ltd 平面研削盤の研削方法
JP3589621B2 (ja) 2000-07-03 2004-11-17 株式会社ミツトヨ 光電式エンコーダ及びそのセンサヘッドの製造方法
JP4455750B2 (ja) * 2000-12-27 2010-04-21 株式会社ディスコ 研削装置
JP4790322B2 (ja) * 2005-06-10 2011-10-12 株式会社ディスコ 加工装置および加工方法
JP2008047696A (ja) * 2006-08-16 2008-02-28 Disco Abrasive Syst Ltd ウエーハ搬送方法および研削装置
JP4348360B2 (ja) * 2006-12-12 2009-10-21 Ｏｋｉセミコンダクタ株式会社 研削ヘッド、研削装置、研削方法、及び、半導体装置の製造方法
JP4818995B2 (ja) * 2007-06-25 2011-11-16 大昌精機株式会社 両頭平面研削盤
JP5149020B2 (ja) * 2008-01-23 2013-02-20 株式会社ディスコ ウエーハの研削方法
JP5342253B2 (ja) 2009-01-28 2013-11-13 株式会社ディスコ 加工装置
KR101297848B1 (ko) * 2011-11-14 2013-08-19 주식회사 엘지실트론 웨이퍼 연마장치
JP2014004663A (ja) * 2012-06-26 2014-01-16 Disco Abrasive Syst Ltd 被加工物の加工方法
JP2014030884A (ja) * 2012-08-06 2014-02-20 Disco Abrasive Syst Ltd 研削装置
JP6087565B2 (ja) * 2012-10-03 2017-03-01 株式会社ディスコ 研削装置および研削方法
JP6425505B2 (ja) * 2014-11-17 2018-11-21 株式会社ディスコ 被加工物の研削方法
JP6441056B2 (ja) * 2014-12-10 2018-12-19 株式会社ディスコ 研削装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05277915A (ja) * 1992-03-31 1993-10-26 Nec Yamagata Ltd ウェーハ裏面研削装置
JP5277915B2 (ja) 2008-12-03 2013-08-28 セイコーエプソン株式会社 点灯装置、光源装置、プロジェクタ及び放電灯の点灯方法
TW201216344A (en) * 2010-10-12 2012-04-16 Disco Corp Processing apparatus

Also Published As

Publication number Publication date
KR102408593B1 (ko) 2022-06-14
CN108177038A (zh) 2018-06-19
KR20180065903A (ko) 2018-06-18
TW201821217A (zh) 2018-06-16
JP2018094636A (ja) 2018-06-21
JP6858539B2 (ja) 2021-04-14

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