TWI717467B - 吸盤台 - Google Patents

吸盤台 Download PDF

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Publication number
TWI717467B
TWI717467B TW106105331A TW106105331A TWI717467B TW I717467 B TWI717467 B TW I717467B TW 106105331 A TW106105331 A TW 106105331A TW 106105331 A TW106105331 A TW 106105331A TW I717467 B TWI717467 B TW I717467B
Authority
TW
Taiwan
Prior art keywords
suction
fixture
holding
base
jig
Prior art date
Application number
TW106105331A
Other languages
English (en)
Chinese (zh)
Other versions
TW201742186A (zh
Inventor
石井茂
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201742186A publication Critical patent/TW201742186A/zh
Application granted granted Critical
Publication of TWI717467B publication Critical patent/TWI717467B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • B28D7/046—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work the supporting or holding device being of the vacuum type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
TW106105331A 2016-03-30 2017-02-17 吸盤台 TWI717467B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016068082A JP2017183484A (ja) 2016-03-30 2016-03-30 チャックテーブル
JP2016-068082 2016-03-30

Publications (2)

Publication Number Publication Date
TW201742186A TW201742186A (zh) 2017-12-01
TWI717467B true TWI717467B (zh) 2021-02-01

Family

ID=60008623

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106105331A TWI717467B (zh) 2016-03-30 2017-02-17 吸盤台

Country Status (4)

Country Link
JP (1) JP2017183484A (ja)
KR (1) KR20170113117A (ja)
CN (1) CN107263755A (ja)
TW (1) TWI717467B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107718332B (zh) * 2017-10-23 2021-02-02 安徽中晶光技术股份有限公司 一种用于晶体线切割的通用装夹工装
CN108447800B (zh) * 2018-01-31 2019-12-10 北京铂阳顶荣光伏科技有限公司 薄膜电池的制造方法
CN108789869A (zh) * 2018-06-15 2018-11-13 蚌埠朝阳玻璃机械有限公司 一种异形玻璃装夹工作台
JP7418271B2 (ja) 2020-04-13 2024-01-19 株式会社ディスコ 治具テーブル及び分割方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11274110A (ja) * 1998-03-20 1999-10-08 Towa Corp 半導体ウェーハの切断方法及び切断装置
JP2009142992A (ja) * 2007-12-11 2009-07-02 Disco Abrasive Syst Ltd パッケージ基板の保持治具
JP2016040060A (ja) * 2014-08-12 2016-03-24 Ｔｏｗａ株式会社 切断装置及び切断方法並びに吸着機構及びこれを用いる装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004153270A (ja) * 1999-03-03 2004-05-27 Hitachi Ltd 半導体素子の分離方法およびその装置並びに半導体素子の搭載方法
JP2004055860A (ja) * 2002-07-22 2004-02-19 Renesas Technology Corp 半導体装置の製造方法
JP2014175602A (ja) * 2013-03-12 2014-09-22 Disco Abrasive Syst Ltd 保持治具
JP6173173B2 (ja) * 2013-11-11 2017-08-02 株式会社ディスコ 切削装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11274110A (ja) * 1998-03-20 1999-10-08 Towa Corp 半導体ウェーハの切断方法及び切断装置
JP2009142992A (ja) * 2007-12-11 2009-07-02 Disco Abrasive Syst Ltd パッケージ基板の保持治具
JP2016040060A (ja) * 2014-08-12 2016-03-24 Ｔｏｗａ株式会社 切断装置及び切断方法並びに吸着機構及びこれを用いる装置

Also Published As

Publication number Publication date
KR20170113117A (ko) 2017-10-12
TW201742186A (zh) 2017-12-01
CN107263755A (zh) 2017-10-20
JP2017183484A (ja) 2017-10-05

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