CN107263755A - 卡盘工作台 - Google Patents

卡盘工作台 Download PDF

Info

Publication number
CN107263755A
CN107263755A CN201710187022.7A CN201710187022A CN107263755A CN 107263755 A CN107263755 A CN 107263755A CN 201710187022 A CN201710187022 A CN 201710187022A CN 107263755 A CN107263755 A CN 107263755A
Authority
CN
China
Prior art keywords
holding jig
tool pedestal
package substrate
holding
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710187022.7A
Other languages
English (en)
Chinese (zh)
Inventor
石井茂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN107263755A publication Critical patent/CN107263755A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • B28D7/046—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work the supporting or holding device being of the vacuum type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
CN201710187022.7A 2016-03-30 2017-03-27 卡盘工作台 Pending CN107263755A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016068082A JP2017183484A (ja) 2016-03-30 2016-03-30 チャックテーブル
JP2016-068082 2016-03-30

Publications (1)

Publication Number Publication Date
CN107263755A true CN107263755A (zh) 2017-10-20

Family

ID=60008623

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710187022.7A Pending CN107263755A (zh) 2016-03-30 2017-03-27 卡盘工作台

Country Status (4)

Country Link
JP (1) JP2017183484A (ja)
KR (1) KR20170113117A (ja)
CN (1) CN107263755A (ja)
TW (1) TWI717467B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107718332A (zh) * 2017-10-23 2018-02-23 安徽中晶光技术股份有限公司 一种用于晶体线切割的通用装夹工装
CN108447800A (zh) * 2018-01-31 2018-08-24 北京铂阳顶荣光伏科技有限公司 薄膜电池的制造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108789869A (zh) * 2018-06-15 2018-11-13 蚌埠朝阳玻璃机械有限公司 一种异形玻璃装夹工作台
JP7418271B2 (ja) 2020-04-13 2024-01-19 株式会社ディスコ 治具テーブル及び分割方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11274110A (ja) * 1998-03-20 1999-10-08 Towa Corp 半導体ウェーハの切断方法及び切断装置
US20040038510A1 (en) * 2002-07-22 2004-02-26 Hitachi, Ltd. Method of manufacturing a semiconductor device
JP2009142992A (ja) * 2007-12-11 2009-07-02 Disco Abrasive Syst Ltd パッケージ基板の保持治具
JP2014175602A (ja) * 2013-03-12 2014-09-22 Disco Abrasive Syst Ltd 保持治具
CN104626376A (zh) * 2013-11-11 2015-05-20 株式会社迪思科 切削装置
JP2016040060A (ja) * 2014-08-12 2016-03-24 Ｔｏｗａ株式会社 切断装置及び切断方法並びに吸着機構及びこれを用いる装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004153270A (ja) * 1999-03-03 2004-05-27 Hitachi Ltd 半導体素子の分離方法およびその装置並びに半導体素子の搭載方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11274110A (ja) * 1998-03-20 1999-10-08 Towa Corp 半導体ウェーハの切断方法及び切断装置
US20040038510A1 (en) * 2002-07-22 2004-02-26 Hitachi, Ltd. Method of manufacturing a semiconductor device
JP2009142992A (ja) * 2007-12-11 2009-07-02 Disco Abrasive Syst Ltd パッケージ基板の保持治具
JP2014175602A (ja) * 2013-03-12 2014-09-22 Disco Abrasive Syst Ltd 保持治具
CN104626376A (zh) * 2013-11-11 2015-05-20 株式会社迪思科 切削装置
JP2016040060A (ja) * 2014-08-12 2016-03-24 Ｔｏｗａ株式会社 切断装置及び切断方法並びに吸着機構及びこれを用いる装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107718332A (zh) * 2017-10-23 2018-02-23 安徽中晶光技术股份有限公司 一种用于晶体线切割的通用装夹工装
CN108447800A (zh) * 2018-01-31 2018-08-24 北京铂阳顶荣光伏科技有限公司 薄膜电池的制造方法

Also Published As

Publication number Publication date
KR20170113117A (ko) 2017-10-12
TW201742186A (zh) 2017-12-01
TWI717467B (zh) 2021-02-01
JP2017183484A (ja) 2017-10-05

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SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20171020

RJ01 Rejection of invention patent application after publication