TWI717467B - Suction table - Google Patents

Abstract

The subject of the present invention is to make it easier to handle the holding jig even if the package substrate becomes larger.

The solution of the present invention is that the suction table (3) is provided with a holding fixture (33) formed of a thin-plate-shaped metal plate (331) holding the package substrate (P) on the surface (331a), and the holding fixture can be freely The jig base (34) detachably held on the upper surface (34a) can attract and hold the package substrate on the upper surface. The holding jig is formed with a plurality of holding jig suction holes (333) that penetrate the front and back of the metal plate to suck and hold each device (D). The jig base has a smaller diameter than the holding jig suction hole, and a plurality of jig base suction ports (341) are formed. If a holding fixture is placed on the fixture base, each holding fixture suction hole is connected to the fixture base suction port. The package substrate is sucked and held by the holding jig through the suction opening of the jig base by the attractive force acting from the holding jig suction hole.

Description

Suction table

The present invention relates to a suction table for sucking and holding a package substrate.

Packaging devices such as CSP (Chip Size Package) are formed by cutting predetermined dividing lines of the package substrate with a cutter. This cutting system is implemented by a cutting device that cuts into the package substrate along a predetermined dividing line with a cutting blade having a cutting edge on the outer periphery. On the holding table of the cutting device, during cutting of the package substrate by the cutting blade, holding jigs capable of individually holding a plurality of devices of the package substrate are provided (for example, refer to Patent Document 1).

On the surface of the holding jig, a recess for accommodating the cutting edge of the cutter and a fine hole for suction are formed. When the package substrate is placed on the surface of the holding jig, the attractive force acting on the pores attracts and holds each device, and each device divided by cutting is not scattered and held.

However, the size of the package substrate is various, and the size of each device formed by the package substrate also varies according to the package substrate. Therefore, in the cutting device, a holding jig corresponding to each package substrate is prepared, and the holding jig is exchanged every time the package substrate to be cut is changed.

[Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Application Publication No. 2006-261525

However, in the aforementioned cutting device, if the package substrate becomes larger (for example, one side is 300 mm or more), there is a problem in that the holding jig is also enlarged and heavy. Therefore, the work involving disposal and maintenance becomes a large burden, and it is difficult to exchange the holding jig with one operator.

The present invention was made in view of the related problems, and its purpose is to provide easy handling of holding fixtures even if the packaging substrate becomes larger.

The chuck table of the present invention is a chuck table which sucks and holds a package substrate of a plurality of package devices formed by dividing by a predetermined dividing line on the upper surface, and is characterized in that it is provided with a holding jig, which is a metal that holds a thin plate of the package substrate on the surface The plate is formed and is configured to be freely detachable; and the jig base is attached to the top to hold and hold the jig; the holding jig is equipped with: an undercut groove formed on the surface of the metal plate corresponding to the predetermined dividing line of the package substrate The position; plural holding fixture suction holes, which penetrate the front and back of the metal plate, shape It is formed in the area divided by the retreat groove, and attracts and maintains each package device; and the resin layer is coated on the surface of the metal plate; the fixture base is equipped with: a plurality of fixture base suction ports, which open at The upper surface of the flat surface has a smaller diameter than the suction hole of the holding jig and forms a large number of them; and the suction path connects the suction port of the jig base and the suction source; if the holding jig is placed on the jig base, each holder The jig suction hole is connected to the suction port of the plurality of jig bases; the package substrate is attracted and held by the holding jig by the attraction connected from the suction port of the jig base.

According to this structure, the holding jig is placed on the jig base, and the holding jig suction hole communicates with the jig base suction port by the placement, and the package substrate can be sucked and held. Therefore, the thickness of the holding jig can be reduced, and the weight of the holding jig for a larger package substrate can be reduced. Thereby, the work load of the handling and maintenance of the holding jig can be reduced, and the work of exchanging the holding jig can be easily performed.

In addition, in the suction table of the present invention, it is preferable that the holding fixture is freely detachably held on the fixture base by the fixing member or the attraction from the suction opening of the fixture base.

According to the present invention, the thickness and weight of the holding jig can be reduced, and even if the package substrate is large, the work of handling the holding jig can be easily performed.

3‧‧‧Suction table

33‧‧‧Maintenance fixture

331‧‧‧Metal plate

331a‧‧‧Surface (top)

331b‧‧‧Back

332‧‧‧Knife Retreat

333‧‧‧Holding fixture suction hole

334‧‧‧Resin layer

34‧‧‧Fixture base

34a‧‧‧top

341‧‧‧Fixture base suction port

342‧‧‧Attraction source

343‧‧‧Attraction path

D‧‧‧device (packaged device)

L‧‧‧predetermined dividing line

P‧‧‧Packaging substrate

[Fig. 1] A perspective view of the cutting device of this embodiment.

[Fig. 2] A perspective view of the cutting device of this embodiment.

[Fig. 3] An exploded perspective view of Fig. 2.

[Fig. 4] Fig. 4A is an explanatory view during etching for producing a holding jig, Fig. 4B is an explanatory view after the aforementioned etching, and Fig. 4C is an explanatory cross-sectional view of the suction table.

Hereinafter, with reference to the drawings, the cutting device provided with the chuck table of the present embodiment will be described. Fig. 1 is a perspective view of the cutting device of this embodiment. In addition, the cutting device of this embodiment is not limited to the structure shown in FIG. 1, and here, the cutting device provided with a pair of cutting blades is illustrated.

As shown in FIG. 1, the cutting device 1 includes a base 2, a suction table 3, and a pair of cutting means 5 for cutting a package substrate P held by the suction table 3.

Here, when describing the package substrate P to be cut, the package substrate P is formed in a substantially rectangular plate shape, and is divided into a grid by a plurality of predetermined dividing lines L arranged on the surface. A device (encapsulation device) D is formed in each area divided into a grid shape, and each device D is sealed by a stamper resin from the back side. The package substrate P is cut along a predetermined dividing line L and divided into individual wafer-like devices D. In addition, the packaging substrate P is not limited to CSP as long as it has a structure that can be divided into a plurality of wafers. Also, as the device D of the package substrate P, a semiconductor device is also provided Yes, it can be equipped with LED (Light Emitting Diode) device.

The chuck table 3 is provided with a θ table 31 fixed on the upper surface of the X-axis table 42 described later and rotatable around the Z axis, and a rectangular holding jig 33 and jig base 34 provided on the upper portion of the θ table 31, The specific structures of the holding fixture 33 and the fixture base 34 will be described later.

The suction table 3 is processed and fed in the X-axis direction by the processing and feeding means 4 provided on the upper surface of the base 2. The machining feeding means 4 has a pair of guide rails 41 parallel to the X-axis direction arranged on the upper surface of the base 2, and an X-axis table 42 driven by a motor provided slidably on the pair of guide rails 41. On the upper part of the X-axis table 42, a suction table 3 is provided. In addition, a nut portion (not shown) is formed on the lower surface side of the X-axis base 42, and the ball screw 43 is screwed to the nut portion. Then, the drive motor 44 is connected to one end of the ball screw 43. The ball screw 43 is rotationally driven by the drive motor 44, and the suction table 3 moves in the X-axis direction along the guide rail 41.

In addition, on the upper surface of the base 2, there is provided a gate-shaped column 21 that is erected so as to straddle the opening extending in the X-axis direction. The gate-shaped column portion 21 is provided with an indexing means 7 for moving the pair of cutting means 5 in the Y-axis direction, and a cutting means 8 for moving the pair of cutting means 5 in the Z-axis direction. The index calibration means 7 has a pair of guide rails 71 parallel to the Y-axis direction arranged on the front face of the pillar 21, and a pair of Y-axis tables 72 driven by a motor provided slidably on the pair of guide rails 71. The feeding means 8 has a pair of guide rails 81 parallel to the Z-axis direction arranged on the front of each Y-axis table 72, and a motor-driven Z-axis table 82 that is provided slidably on the pair of guide rails 81.

A cutting means 5 for cutting the package substrate P is provided at the lower part of each Z-axis table 82. Moreover, a nut part not shown in the figure is formed on the back side of each Y-axis base 72, and the ball screw 73 is screwed in these nut parts. In addition, a nut part (not shown) is formed on the back side of each Z-axis base 82, and a ball screw 83 is screwed to these nut parts. The ball screw 73 for the Y-axis base 72 and the ball screw 83 for the Z-axis base 82 are connected to one end of the drive motors 74 and 84, respectively. By rotating and driving the ball screws 73 and 83 by the drive motors 74 and 84, the pair of cutting means 5 move along the guide rails 71 and 81 in the Y-axis direction and the Z-axis direction.

A pair of cutting means 5 are attached to the front end of a main shaft (not shown) protruding from the housing 51, and a cutting blade 52 is rotatably mounted. The cutting blade 52 is formed into a disc shape by fixing diamond abrasive grains by resin bonding, for example.

Next, the specific structure of the suction table 3 will be described with reference to FIGS. 2 and 4. Fig. 2 is a perspective view of the suction table of this embodiment, and Fig. 3 is an exploded view of Fig. 2. As shown in FIGS. 2 and 3, in the suction table 3, the holding jig 33 is placed and held on the upper surface of the jig base 34.

The holding jig 33 is formed of a thin plate-shaped metal plate 331 made of stainless steel or the like, and the metal plate 331 is formed of, for example, an SUS plate with a thickness of 0.5 to 1 mm. The holding jig 33 is attached to the surface (upper surface) 331a of the metal plate 331 to form a plurality of relief grooves 332 in a lattice shape. The relief groove 332 is formed at a position corresponding to the predetermined dividing line L (refer to FIG. 1) of the package substrate P, and is provided to accommodate the cutting edge of the cutting blade 52 (refer to FIG. 1) during cutting. Therefore, when the package substrate P is cut, it is not necessary to The cutter 52 is damaged to the holding jig 33.

In addition, in the holding jig 33, in the area corresponding to the plurality of devices D (refer to FIG. 1) divided by the predetermined dividing line L, that is, the area divided by the relief groove 332, there is an opening to attract and hold each device D The plural holding fixture suction holes 333. Each holding jig suction hole 333 is formed by having a diameter of Φ5 mm, for example, and penetrating from the surface 331a of the metal plate 331 to the back surface (lower surface) 331b.

Here, the manufacturing method of the holding jig will be described with reference to FIG. 4. FIG. 4A is an explanatory diagram during etching for making a holding jig, and FIG. 4B is an explanatory diagram after the aforementioned etching. Fig. 4C is a cross-sectional view for explaining the suction table. As shown in FIG. 4A, in the production of the holding jig 33, a metal plate 331 made of stainless steel whose surface 331a and back surface 331b are flat is prepared, and coated photoresistors R1 and R2 are formed on each surface. In the photoresist R1 on the surface 331a, the surface 331a is exposed at the positions where the relief groove 332 and the holding fixture suction hole 333 are formed. In the photoresist R2 of the back surface 331b, the back surface 331b is exposed at the position where the holding jig suction hole 333 is formed. In this state, the front surface 331a and the back surface 331b of the metal plate 331 are etched by spraying an etching solution E such as sulfuric acid and nitric acid from the nozzle N. As a result, as shown in FIG. 4B, the relief groove 332 reaching the middle portion in the thickness direction from the surface 331 a of the metal plate 331 and the holding jig suction hole 333 penetrating the surface 331 a and the back surface 331 b are formed at predetermined positions. The photoresists R1 and R2 are peeled off by a chemical solution or the like after the etching is completed.

As shown in FIG. 4C, the surface of the metal plate 331 holding the jig 33 is covered with a resin layer 334. As the resin layer 334, for example, Urethane can be coated by spraying urethane resin material. The resin layer 334 covers at least the part in contact with the package substrate P, and prevents positional deviation when the package substrate P is held.

Returning to FIG. 3, the jig base 34 is provided with a plurality of jig base suction ports 341 formed in a plurality of openings on the upper surface 34a of the flat surface. The suction port 341 of the jig base is set to have a diameter size of, for example, Φ1~Φ2 mm, the diameter is smaller than the holding jig suction hole 333, and the number is formed to be larger than the holding jig suction hole 333. Therefore, the formation interval of the suction openings 341 of the jig base is formed to be smaller than the formation interval of the holding jig suction holes 333. When the holding jig 33 is placed on the upper surface 34a of the jig base 34, each holding jig suction hole 333 is connected to a plurality of jig base suction openings 341, or at least one of all holding jig suction holes 333 The base suction port 341 communicates. Furthermore, in FIGS. 3 and 4C, for the convenience of the illustration, there are also cases where the fixture base suction port 341 and the holding fixture suction hole 333 are not connected, but in fact, these are as described above. Connected.

As shown in FIG. 4C, a suction path 343 connected to the suction source 342 is formed inside the fixture base 34, and the suction path 343 communicates with the suction port 341 of the fixture base and the suction source 342. Thereby, the suction force communicating from the fixture base suction port 341 acts on the back surface of the package substrate P through the retention fixture suction hole 333 of the retention fixture 33, and the package substrate P is attracted and held by the retention fixture 33. In addition, in most of the fixture base suction ports 341, the fixture base suction ports 341 are not connected to the holding jig suction hole 333 and are blocked by the holding jig 33, and the attraction of the fixture base suction port 341 On the back of the holding fixture 33. Suction port from the base of the fixture With the attraction of 341, the holding fixture 33 is installed on the fixture base 34.

When cutting the package substrate P, the package substrate P is placed on the holding jig 33 of the chuck table 3 through a conveying device not shown. At this time, the predetermined dividing line L of the package substrate P and the relief groove 332 of the holding jig 33 are aligned. Then, after the cutting blade 52 (see FIG. 1) is positioned at the predetermined dividing line L, the cutting blade 52 is lowered to a height capable of cutting the package substrate P, and the cutting blade 52 is cut into the chuck table 3. At this time, the peripheral edge portion of the cutting blade 52 is housed in the recess 332.

With repeated cutting and feeding, the package substrate P on the chuck table 3 is cut along each predetermined dividing line L and divided into each device D. At this time, the holding jig 33 is formed with holding jig suction holes 333 corresponding to the respective devices D. Therefore, the device D separated from the package substrate P during cutting is individually sucked and held by the holding jig suction holes 333, and the device D is not removed from the holding jig. Gu 33 left.

When the size of the package substrate P to be cut and the size of the device D are changed, the holding jig 33 is exchanged in the suction table 3. This exchange system blocks the suction force from the suction source 342 through a valve etc. not shown, and releases the suction force acting on the holding jig 33 from the jig base suction port 341 on the jig base 34. Thereby, the holding jig 33 can be detached from the jig base 34 and removed by the operator handling the holding jig 33. Then, the operator carries the other prepared holding jig 33 and places it on the jig base 34, and supplies suction from the suction source 342, and the holding jig 33 is sucked and installed by the jig base 34 to complete the holding jig 33 Exchange. In this way, the holding fixture 33 is detachably held by the fixture base 34, and the holding fixture 33 can be The change corresponds to the size change of the package substrate P and the device D.

According to the foregoing embodiment, the fixture base suction port 341 is formed on the fixture base 34, so that the related fixture base suction port 341 communicates with the holding fixture suction hole 333 of the holding fixture 33, so that the fixture can be The upper surface 34a of the base 34 has rigidity, and the thickness of the holding jig 33 can be reduced. As a result, one side of the package substrate P becomes 300 mm or more and becomes larger in size. Even in response to this situation, the size of the holding jig 33 becomes larger, and it can be handled by one operator. As a result, the exchange and maintenance of the holding jig 33 can be easily performed by the operator, and the work load can be reduced. In addition, in the foregoing embodiment, the jig base suction opening 341 has a smaller diameter than the holding jig suction hole 333, and is formed more than the holding jig suction hole 333. Thereby, when the holding jig 33 is changed (same type and different types together), the positioning that connects the jig base suction port 341 and the holding jig suction hole 333 is not required, and the holding jig 33 can be easily exchanged.

In addition, the present invention is not limited to the aforementioned embodiment, and can be implemented with various modifications. In the foregoing embodiment, the size, shape, direction, etc. shown on the attached drawing surface are not limited to these, and can be appropriately changed within the range where the effects of the present invention can be exhibited. Moreover, as long as it does not deviate from the objective range of this invention, it can change suitably and implement.

For example, for fixing the holding jig 33 of the jig base 34, a fixing member such as a screw member or the like may be used, or the jig base 34 and the holding jig 33 may be made of magnetic bodies and fixed by magnetic force. The holding jig 33 is detachably held by the jig base 34, and various changes can be made. Also, it is combined with the loading and unloading caused by the attraction and release of the foregoing embodiment It is also possible to provide a structure for such fixing.

In addition, the relief groove 332 is formed by cutting in with a cutter, and the holding jig suction hole 333 may be formed by a drill or die-cutting. As mentioned above, it can be easily etched. Corresponds to subtle shapes.

[Possibility of industrial use]

As described above, the present invention has the effect that the holding jig can be easily exchanged even if the packaging substrate to be sucked and held becomes larger, and it is particularly useful for sucking and holding the suction table of each packaging device.

3‧‧‧Suction table

33‧‧‧Maintenance fixture

34‧‧‧Fixture base

34a‧‧‧top

331‧‧‧Metal plate

331a‧‧‧Surface (top)

331b‧‧‧Back

332‧‧‧Knife Retreat

333‧‧‧Holding fixture suction hole

341‧‧‧Fixture base suction port

Claims (2)

A chuck table is a chuck table that sucks and holds a package substrate of a plurality of package devices formed by dividing by a predetermined dividing line on the suction table. The chuck table is provided with a holding fixture formed by a metal plate that holds a thin plate shape of the package substrate on the surface, It is configured to be freely attachable and detachable; and a jig base, which holds the holding jig; the holding jig is provided with: an undercut groove formed on the surface of the metal plate corresponding to the predetermined dividing line of the package substrate A plurality of holding fixture suction holes, which penetrate through the front and back of the metal plate, are formed in the area divided by the relief groove, and attract and hold each package device; and the resin layer is coated on the metal plate Surface; the fixture base is provided with: a plurality of fixture base suction ports, which are open on the flat surface, have a diameter smaller than the holding fixture suction hole and form a plurality; and the suction path connects the fixture The base suction port and the suction source; if the holding fixture is placed on the fixture base, each holding fixture suction hole is connected to a plurality of the fixture base suction openings; the packaging substrate is obtained from the The attractive force connected with the suction port of the fixture is attracted and maintained by the holding fixture; all plural suction ports of the fixture base are individually penetrated through the upper and lower sides of the fixture base; The resin layer also covers a plurality of suction holes of the holding fixture. Such as the suction cup table described in item 1 of the scope of patent application, wherein the holding fixture is detachably held on the fixture base by means of a fixing member or an attraction from the suction port of the fixture base .

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