CN106057725B - Chuck table - Google Patents

Chuck table Download PDF

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Publication number
CN106057725B
CN106057725B CN201610230634.5A CN201610230634A CN106057725B CN 106057725 B CN106057725 B CN 106057725B CN 201610230634 A CN201610230634 A CN 201610230634A CN 106057725 B CN106057725 B CN 106057725B
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CN
China
Prior art keywords
mounting surface
suction
magnet
magnetic attraction
chuck table
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Active
Application number
CN201610230634.5A
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Chinese (zh)
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CN106057725A (en
Inventor
福冈武臣
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Disco Corp
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Disco Corp
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Publication of CN106057725A publication Critical patent/CN106057725A/en
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Publication of CN106057725B publication Critical patent/CN106057725B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work
    • B26D7/018—Holding the work by suction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/18—Means for removing cut-out material or waste
    • B26D7/1845—Means for removing cut-out material or waste by non mechanical means
    • B26D7/1863—Means for removing cut-out material or waste by non mechanical means by suction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)

Abstract

A chuck table. Chips and the like are prevented from accumulating on the upper surface of the chuck table so as not to dirty the ring frame. The solution is as follows: the chuck table (10) is provided with: a suction surface (120) which sucks the plate-shaped workpiece (1); a suction hole (122) for connecting the suction surface (120) to a suction source (121); and a frame holding unit (13) that holds the ring frame (2) by magnetic attraction, the frame holding unit (13) comprising: a mounting surface (130) on which the ring frame (2) is mounted; a magnet (131); and a magnetic attraction force generation unit (132) that applies a magnetic attraction force to the mounting surface (130) so that the magnet (131) is not exposed on the mounting surface (130), so that the mounting surface (130) can be configured so that no uneven portion is formed on the upper surface thereof. Therefore, the cutting chips and the like can be prevented from being accumulated on the carrying surface (130), the lower surface of the ring frame (2) is prevented from being polluted, and the magnetic adsorption force of the magnet (131) to the ring frame (2) is prevented from being reduced.

Description

Chuck table
Technical Field
The present invention relates to a chuck table for holding a plate-like workpiece.
Background
In the cutting device, when cutting the plate-shaped workpiece, in order to prevent the chips from being scattered when the plate-shaped workpiece is completely cut, for example, an adhesive tape is attached to a lower surface of a ring frame having an opening at a central portion thereof, and the plate-shaped workpiece is attached to the adhesive tape exposed from the opening, so that the plate-shaped workpiece is supported by the ring frame via the adhesive tape. Further, a plate-like work integrated with the ring frame via an adhesive tape is held by a chuck table (see, for example, patent document 1 below)
Here, when the ring frame is made of a material capable of magnetic attraction, for example, a plate-like workpiece supported by the ring frame can be held by the conventional chuck table 20 shown in fig. 6. The chuck table 20 includes: a disk-shaped frame body 21; a suction holding portion 22 having a rectangular suction surface 22a formed at the center of the frame 21; suction holes 23, as shown in fig. 7, which communicate with the suction surface 22 a; an arc-shaped fixing plate 24 fixed to the periphery of the frame 21 by screws 27; and a plurality of magnets 25 fixed to the fixing plate 24.
The upper end surface of the fixing plate 24 constitutes a mounting surface 26 on which the ring frame is mounted. In the chuck table 20, as shown in fig. 7, the magnets 25 are not fixed to the mounting surface 26 with an adhesive or the like, but the surface of the magnet 25 is exposed by sandwiching the side surface side of the magnet 25 with the 2 fixing plates 24, so that the surface of the mounting surface 26 having a constant height can be formed, and the ring frame can be magnetically attracted to the mounting surface 26 with reliability.
Documents of the prior art
Patent document
Japanese patent application laid-open No. 2005-183586 of patent document 1
However, since the chuck table 20 is configured such that the magnet 25 is fixed by the fixing plate 24 standing on the periphery of the frame 21, the concave surface 28 is formed between the attraction surface 22a of the attraction and holding portion 22 and the placement surface 26 of the fixing plate 24, and the upper surface of the chuck table 20 has a concave-convex shape. Therefore, in the cutting of the plate-shaped workpiece, chips, cutting water, and the like are accumulated on the concave surface 28, and the lower surface of the ring frame placed on the placing surface 26 is contaminated. After the plate-shaped workpiece is cut, the plate-shaped workpiece is carried to the next step with the ring frame, and therefore the chips adhering to the ring frame are also carried.
Further, since there is a possibility that chips may enter the mounting surface 26 during cutting of the plate-shaped workpiece, if the state where chips and the like are deposited on the mounting surface 26 is maintained, there is a problem that the magnetic attraction force with respect to the magnet 25 of the ring frame is reduced.
Disclosure of Invention
The present invention has been made in view of the above problems, and an object of the present invention is to prevent chips and the like from accumulating on an upper surface of a chuck table so as not to dirty a ring frame.
Means for solving the problems
A chuck table according to the present invention is a chuck table for holding a workpiece holder in which an adhesive tape is attached to a ring frame having an opening at a center thereof, and a plate-like workpiece is attached to the adhesive tape exposed from the opening, the chuck table including: a suction surface for sucking the plate-like workpiece; a suction hole for communicating the suction surface with a suction source; and a frame holding unit that holds the ring frame with a magnetic attraction force, the frame holding unit including: a mounting surface on which the ring frame is mounted; a magnet for magnetically attaching the ring frame to the mounting surface; and a magnetic attraction force generating unit that applies a magnetic attraction force to the mounting surface so that the magnet is not exposed on the mounting surface.
Preferably, the chuck table according to the present invention includes a connecting surface extending radially inward from the mounting surface and connected to an outer periphery of the suction surface.
Effects of the invention
In the chuck table of the present invention, since the frame holding unit having the magnetic attraction force is disposed on the mounting surface for mounting the ring frame and the frame holding unit includes the magnetic attraction force generating portion for applying the magnetic attraction force so that the magnet is not exposed on the mounting surface, the uneven portion is not formed on the upper surface of the mounting surface. Therefore, the cutting chips and the like generated when the plate-shaped workpiece is cut are prevented from being accumulated on the carrying surface, the lower surface of the ring frame is not polluted, and the magnetic adsorption force of the magnet is not reduced.
Further, since the chuck table of the present invention includes the connecting surface extending radially inward from the mounting surface and connected to the outer periphery of the suction surface, the accumulation of chips and the like can be suppressed without forming a recess between the mounting surface and the suction surface.
Drawings
Fig. 1 is a plan view showing an example of the structure of the chuck table.
Fig. 2 is a perspective view showing an example of a workpiece set.
Fig. 3 (a) is a sectional view showing the structure of the chuck table in a state before the magnet is inserted into the magnet insertion hole. Fig. 3 (b) is a sectional view showing the structure of the chuck table in a state where the magnet is inserted into the magnet insertion hole.
Fig. 4 is a cross-sectional view showing a state in which a workpiece sleeve is held by a chuck table and a plate-shaped workpiece is cut by using a cutting blade.
Fig. 5 is a sectional view showing a structure of a modification of the chuck table.
Fig. 6 is a plan view showing a structure of a conventional chuck table.
Fig. 7 is a sectional view showing a structure of a conventional chuck table.
Description of the symbols
1: plate-shaped workpiece 2: the ring frame 3: adhesive tape 4: a workpiece sleeve 5: chip and method for manufacturing the same
6: dividing predetermined line
10, 10 a: chuck table 11, 11 a: frame body 12: suction holding part
120: suction surface 120 a: side surface 121: the attraction source 122: suction hole
13: frame holding unit 130: mounting surface 131: magnet 132: magnetic attraction force generating part
133: bottom surface 134: magnet insertion hole 135: snap ring 14: connecting surface
15: the cutting unit 150: main shaft 151: cutting insert 152: nozzle with a nozzle body
16: connecting surface
Detailed Description
The chuck table 10 shown in fig. 1 is an example of a chuck table for holding the plate-like workpiece 1 integrated with the ring frame 2 shown in fig. 2. The chuck table 10 includes: a disk-shaped frame body 11; a rectangular suction holding portion 12 formed at a central portion of the housing 11; and a frame holding unit 13 for magnetically attracting the ring frame 2 placed on the peripheral edge side of the frame 11.
The suction holding portion 12 is formed of a porous member such as porous ceramic, for example. The upper surface of the suction holding portion 12 is provided with a suction surface 120 having an area corresponding to a rectangular plate-shaped workpiece. As shown in fig. 3 (a), a suction hole 122 for connecting the suction surface 120 to the suction source 121 is provided below the suction holding portion 12. When the suction force of the suction source 121 acts on the suction surface 120 through the suction holes 122, the plate-shaped workpiece can be sucked and held on the suction surface 120.
On the other hand, the frame holding unit 13 includes: a mounting surface 130 on which the ring frame 2 is mounted on the peripheral edge side of the frame 11; a magnet 131 that magnetically attaches the ring frame 2 to the mounting surface 130; and a magnetic attraction force generating unit 132 for applying a magnetic attraction force of the magnet 131 to the mounting surface 130. The mounting surface 130 of the illustrated example is lower than the suction surface 120. For example, the height of the mounting surface 130 is set as follows: the upper surface of the ring frame 2 when the ring frame 2 is placed on the placement surface 130 is positioned lower than the suction surface 120.
As shown in fig. 3 (a), the magnetic attraction force generating portion 132 is constituted by a magnet insertion hole 134 having a bottom surface 133 recessed upward from a lower surface 130a on the opposite side of the mounting surface 130 so as not to reach the mounting surface 130, and a snap ring 135 for fixing the magnet 131 inserted into the magnet insertion hole 134. The snap ring 135 may be made of any material that repels the inner peripheral wall of the magnet insertion hole 134. The shape of the snap ring 135 may be a ring shape, and may be a ring-shaped snap ring formed in a polygonal shape (e.g., a triangular shape), for example.
As shown in fig. 3 (b), in order to allow the magnetic attraction force generating portion 132 to function in the chuck table 10, the magnet 131 is inserted into the magnet insertion hole 134, and the snap ring 135 is fitted into the magnet insertion hole 134 from the lower end side of the magnet 131 and fixed. In this way, the magnet 130 is disposed directly below the mounting surface 130 so that the surface of the magnet 131 is not exposed from the mounting surface 130, and the magnetically attractable ring frame is configured by applying a magnetic attraction force to the mounting surface 130.
A planar connection surface 14 extending radially inward from the mounting surface 130 is formed between the mounting surface 130 and the suction surface 120, and the connection surface 14 is connected to the outer periphery of the suction surface 120, for example, to the lower end of a side surface 120a depending from the outer peripheral edge of the suction surface 120.
Next, an operation of holding a rectangular plate-like workpiece by the chuck table 10 will be described. The plate-like workpiece 1 shown in fig. 2 is an example of a rectangular workpiece, and is, for example, a CSP substrate. A plurality of chips 5 divided by a plurality of planned dividing lines 6 that intersect vertically and horizontally are arranged on the plate-like workpiece 1. The plate-like workpiece 1 is held on the chuck table 10 in a state of a workpiece sleeve 4, and the workpiece sleeve 4 is formed by attaching an adhesive tape 3 to a lower end of a ring frame 2 having an opening at the center thereof and attaching the plate-like workpiece 1 to the adhesive tape 3 exposed from the opening.
Specifically, as shown in fig. 4, the plate-like workpiece 1 is placed on the suction surface 120 from the adhesive tape 3 side, and the ring frame 2 is placed on the placement surface 130 from the adhesive tape 3 side. At this time, the magnetic attraction force of the magnet 131 inserted into the magnet insertion hole 134 and fixed acts on the mounting surface 130, and the ring frame 2 is magnetically attracted to the mounting surface 130. The suction source 121 applies a suction force to the suction surface 120 through the suction holes 122, and sucks and holds the lower surface of the plate-shaped workpiece 1. Thus, the workpiece holder 4 is held by the chuck table 10.
Next, an operation of cutting the plate-shaped workpiece 1 by the cutting unit 15 will be described. The cutting unit 15 includes at least: a main shaft 150 having an axial center direction parallel to the surface of the plate-like workpiece 1; a cutting blade 151 detachably attached to the tip of the main shaft 150; and a nozzle 152 for spraying cutting water toward the cutting blade 151.
When the plate-shaped workpiece 1 is cut by the cutting unit 15, the chuck table 10 is moved horizontally in, for example, the X direction while rotating the chuck table 10 in a predetermined direction, the spindle 150 of the cutting unit 15 is rotated, the cutting blade 151 is rotated in, for example, the arrow a direction, and the cutting blade 151 is lowered until it comes into contact with the plate-shaped workpiece 1.
The rotating cutting blade 151 is further lowered to cut into the surface of the plate-like workpiece 1, and cuts along the line to divide 6 shown in fig. 2. During cutting of the plate-shaped workpiece 1, the cutting water is continuously sprayed from the nozzle 152 to the cutting blade 151. Since the mounting surface 130 is formed in a planar shape without forming irregularities, chips generated when the plate-shaped workpiece 1 is cut and cutting water containing the chips can be prevented from accumulating on the mounting surface 130. Further, since the connection surface 14 is also formed to extend from the placement surface 130 to the outer periphery of the suction surface 120, chips and cutting water can be prevented from accumulating on the connection surface 14.
In this way, the plate-shaped workpiece 1 is cut in the longitudinal and transverse directions along all the lines 6 to be divided shown in fig. 2 by the cutting blade 151, and is divided into the individual chips 5. The singulated chips 5 are supported by the adhesive tape 3 and thus do not scatter.
As described above, the chuck table 10 of the present invention includes the magnetic attraction force generating portion 132 for applying the magnetic attraction force so that the surface of the magnet 131 is not exposed on the mounting surface 130 on the peripheral side of the frame 11, and the magnetic attraction force generating portion 132 includes the magnet insertion hole 134 and the snap ring 135 for fixing the magnet 131 inserted into the magnet insertion hole 134, so that the mounting surface 130 is formed in a flat shape and the uneven portion is not formed on the upper surface. This prevents chips and the like from accumulating on the mounting surface 130, and therefore the lower surface of the ring frame 2 is not contaminated, and the magnetic attraction force of the magnet 131 to the ring frame 2 is not reduced. Even if chips or the like adhere to the mounting surface 130, the chips or the like can be easily removed by cleaning.
The chuck table 10a shown in fig. 5 is a modification of the chuck table. The chuck table 10a is the same as the above-described chuck table 10 except for the case of including the frame body 11a having an inclined upper surface. In the chuck table 10a, a connection surface 16 is formed between the mounting surface 130 and the suction surface 120, and the connection surface 16 is inclined so as to rise radially inward from the mounting surface 130. In the chuck table 10a, since the uneven portion is not formed on the upper surface of the frame 11a, chips and the like can be prevented from accumulating on the connection surface 16. Further, since the mounting surface 130 is also formed in a planar shape, chips and the like can be prevented from being accumulated on the mounting surface 130.
In the chuck tables 10 and 10a shown in the embodiment, the case where the rectangular suction surface 120 is provided in accordance with the shape of the rectangular plate-like workpiece 1 has been described, but the present invention is not limited to this configuration. For example, the suction surface may be formed in a disc shape according to the shape of the disc-shaped plate-shaped workpiece.
In the chuck tables 10 and 10a shown in the embodiments, the mounting surface 130 is formed at a position lower than the suction surface 120, but the height of the suction surface may be the same as the height of the mounting surface. When the workpiece holder is held by the chuck table configured as described above, the upper surface of the ring frame placed on the placement surface is higher than the suction surface, and therefore, when cutting a plate-shaped workpiece, it is necessary to prevent the cutting blade from coming into contact with the ring frame, but when forming the workpiece holder 4 shown in fig. 2, for example, the cutting feed operation and the lifting operation of the cutting blade are controlled so that the cutting blade does not come into contact with the inner periphery of the ring frame by setting a predetermined interval between the inner periphery of the ring frame and the outer periphery of the plate-shaped workpiece, and the plate-shaped workpiece is cut.
The magnetic attraction force generating unit is configured such that the magnet is not exposed on the mounting surface 130, but the mounting surface 130 may be configured by a magnetic material. That is, the mounting surface 130 itself may be used as the magnetic attraction force generating unit.

Claims (1)

1. A chuck table for holding a workpiece holder formed by attaching an adhesive tape to a ring frame having an opening at the center thereof and attaching a plate-like workpiece to the adhesive tape exposed from the opening,
this chuck platform includes:
a suction surface for sucking the plate-like workpiece;
a suction hole for communicating the suction surface with a suction source;
a frame holding unit having a mounting surface for holding the ring frame by magnetic attraction on an outer peripheral side of the attraction surface, the mounting surface being formed in a planar shape without forming irregularities; and
a connecting surface formed in a planar shape without forming projections and depressions, the connecting surface being formed in the same plane as the mounting surface and being connected to a lower end of a side surface depending from an outer periphery of the suction surface, or the connecting surface being connected to an outer periphery of the suction surface and an inner periphery of the mounting surface and being inclined so as to rise toward the inner periphery side,
the frame holding unit includes:
the carrying surface;
a magnet for magnetically attaching the ring frame to the mounting surface; and
a magnetic attraction force generating unit for applying a magnetic attraction force to the mounting surface so that the magnet is not exposed to the mounting surface,
the magnetic attraction force generating unit includes:
a magnet insertion hole into which the magnet is inserted; and
and a snap ring for fixing the magnet inserted into the magnet insertion hole so that the magnetic attraction force acts on the mounting surface.
CN201610230634.5A 2015-04-14 2016-04-14 Chuck table Active CN106057725B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015082376A JP6495079B2 (en) 2015-04-14 2015-04-14 Chuck table
JP2015-082376 2015-04-14

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CN106057725B true CN106057725B (en) 2021-11-30

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CN (1) CN106057725B (en)
TW (1) TWI689376B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110491808B (en) * 2019-08-20 2021-08-03 湖南艾凯瑞斯智能科技有限公司 Wafer scribing machine
KR20220162058A (en) * 2021-05-31 2022-12-07 이나리 테크놀로지 에스디엔 비에이치디 A system, process and a jig for forming conformal emi shield on package-level electronics or a portion thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101256951B (en) * 2007-02-28 2010-06-23 万国半导体股份有限公司 Method applied for ultra thin wafer backside processing
JP2013098248A (en) * 2011-10-28 2013-05-20 Disco Abrasive Syst Ltd Holding table

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59123340U (en) * 1983-02-09 1984-08-20 凸版印刷株式会社 Chuck stage for cutting
JP4532895B2 (en) 2003-12-18 2010-08-25 株式会社ディスコ Plate cutting machine
JP2009206166A (en) * 2008-02-26 2009-09-10 Renesas Technology Corp Method of manufacturing semiconductor device
ES2591129T3 (en) 2012-05-21 2016-11-25 Bayer Pharma Aktiengesellschaft Thienopyrimidines
JP2015109416A (en) * 2013-10-21 2015-06-11 東芝機械株式会社 Chuck device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101256951B (en) * 2007-02-28 2010-06-23 万国半导体股份有限公司 Method applied for ultra thin wafer backside processing
JP2013098248A (en) * 2011-10-28 2013-05-20 Disco Abrasive Syst Ltd Holding table

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JP2016198870A (en) 2016-12-01
CN106057725A (en) 2016-10-26
TWI689376B (en) 2020-04-01
TW201707860A (en) 2017-03-01
KR102334121B1 (en) 2021-12-01
JP6495079B2 (en) 2019-04-03
KR20160122638A (en) 2016-10-24

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