JP2004247660A - Frame fixture - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable transportation of workpieces after grinding that is removed without damage by retaining the workpieces corresponding to sizes and shapes of the individual workpieces when machining the workpieces having individual sizes and shapes. <P>SOLUTION: A frame fixture attached to a chuck table 11 that is composed of a chuck 13 and a chuck body 14 is provided, which is constituted of a frame supporting frame 15, supporting a frame 29 retaining the workpiece 27 via an adhesive tape 28, and a pushing ring 16, pushing the frame 29 supported by this frame supporting frame 15 against the frame 15. The pushing ring 16 is composed of a pushing portion 17, pushing the frame 29, and a portion 18 to be engaged, engaging the frame supporting frame 15, detachably. The frame supporting frame 15 is composed of a fixing portion 19, fixing the pushing ring 16 by engaging the portion 18 to be engaged of the pushing ring 16 to be engaged, and a frame supporting portion 20, supporting the frame 29. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a jig for fixing a frame when a workpiece such as a semiconductor wafer is processed integrally with a frame via an adhesive tape.
[0002]
[Prior art]
A semiconductor wafer on which a plurality of circuits are formed is formed into a predetermined thickness by grinding the back surface by a grinding device, and then divided into semiconductor chips for individual circuits by a dicing device and used for various electronic devices. .
[0003]
A grinding apparatus used for grinding the back surface of a semiconductor wafer includes a chuck table for holding the semiconductor wafer and grinding means for grinding the semiconductor wafer held on the chuck table, and holds the front side of the semiconductor wafer on the chuck table. Then, the back surface is exposed, and the grinding is performed by the action of a grinding wheel constituting the grinding means on the back surface (for example, see Patent Document 1). The chuck table is configured such that a suction area for sucking a workpiece is surrounded by a chuck body (for example, see Patent Document 2).
[0004]
However, when the semiconductor wafer is thinly ground, there is a problem that the semiconductor wafer is easily broken after the grinding, and it is difficult to carry the semiconductor wafer to the next step. Therefore, in order to solve such a problem, a tape is attached to the frame used for dicing from the back side, the surface of the semiconductor wafer is attached to the adhesive surface of the tape, and the semiconductor wafer is held in a state where the frame is held. There has also been proposed a technique of grinding (for example, see Patent Document 3).
[0005]
[Patent Document 1]
JP-A-2002-31959 (page 7, FIG. 1)
[Patent Document 2]
JP-A-2001-38556 (page 5, FIG. 1)
[Patent Document 3]
Japanese Patent No. 3325650 (page 3, FIG. 1)
[0006]
[Problems to be solved by the invention]
However, since the suction area constituting the chuck table is formed in a shape and size corresponding to the size of the workpiece, for example, a workpiece smaller than the suction area or a suction area such as a damaged semiconductor wafer. On the other hand, there is a problem in that a workpiece having an irregular shape cannot be held due to air leakage.
[0007]
In recent years, semiconductor wafers are becoming thinner. For example, when the thickness is extremely thin, such as 100 μm or less and 50 μm or less, when the thinned semiconductor wafer is removed from the chuck table, or transferred to the next step. In this case, there is a problem that the semiconductor wafer may be damaged.
[0008]
On the other hand, as described in Patent Document 3, a semiconductor wafer is stuck to an adhesive tape integrated with a frame, and the frame is fixed and ground so that the upper surface of the frame is lower than the upper surface of the semiconductor wafer. This can be solved, but in order to achieve this, it is necessary to manufacture a chuck table whose surface height decreases toward the outer peripheral direction, which involves technical difficulties and increases costs. There are also problems.
[0009]
The above-mentioned problem is a problem that occurs not only in grinding but also in other processes such as cutting.
[0010]
Therefore, in the case of processing a thinly formed semiconductor wafer or a workpiece having various sizes and shapes, it is possible to hold the workpiece corresponding to each size and shape without increasing the cost. In addition, there is a problem in that the workpiece after grinding can be removed and transported without damaging the workpiece.
[0011]
[Means for Solving the Problems]
As a specific means for solving the above problems, the present invention provides a frame fixing jig mounted on a chuck table including a chuck section having a suction area for holding a workpiece and a chuck body supporting the chuck section. The workpiece is integrated with the frame via an adhesive tape, and the frame fixing jig is fixed to the outer peripheral side of the chuck body and supports the frame, and a frame supporting frame. A pressing ring that presses the supported frame against the frame support frame; the pressing ring includes a pressing portion that presses the frame and an engaged portion that removably engages with the frame support frame; The frame includes a fixing portion for engaging the engaged portion of the pressing ring to fix the pressing ring, and a frame supporting portion for supporting the frame. Providing composed frame fixture from.
[0012]
In this frame support frame, the engaged portion formed on the pressing ring is an engaged groove formed on the inner peripheral side surface, and the fixed portion formed on the frame support frame is engaged with the engaged groove. A mating claw portion, and a claw driving portion for bringing the claw portion into close contact with the engaged groove. The engaged groove has an upper wall and a lower wall, and the lower wall has an inner peripheral side. The claw portion, which is formed by a slope descending toward the bottom and forms a fixing portion of the frame support frame, has a slope portion corresponding to the slope of the lower wall, and the claw portion moves by the claw driving portion and comes into contact with the lower wall. Fixing the pressing ring to the frame supporting frame and pressing the frame against the frame supporting frame, a chuck table for holding the workpiece, and a grinding device having at least a grinding means for grinding the workpiece held on the chuck table This is to be mounted on the chuck table of the device. It is referred to as additional requirements.
[0013]
According to the frame fixing jig configured as described above, the frame is fixed at a position below the chuck portion of the chuck table, so that the frame does not hinder the processing, and the workpiece is placed on the adhesive tape. By being held in the chuck portion in a state of being stuck, a work of any size and shape can be stably held within a range not exceeding the suction area of the chuck table.
[0014]
Further, even when the workpiece is a semiconductor wafer having a thickness of 100 μm or less and extremely thin as 50 μm or less, since the thinned semiconductor wafer is integrated with the frame via the adhesive tape, Therefore, there is no risk of being damaged when detached from the chuck table or when transported to the next step.
[0015]
Further, the frame fixing jig can be fixed to the chuck table by attaching the frame to a chuck table having no mechanism for fixing the frame, so that there is no need to modify an existing chuck table.
[0016]
BEST MODE FOR CARRYING OUT THE INVENTION
An example of an embodiment of the present invention will be described with reference to the drawings. The frame fixing jig 10 shown in FIG. 1 is used by being mounted on a chuck table 11 composed of a chuck section 13 having a suction area 12 for holding a workpiece and a chuck body 14 supporting the chuck section 13. Things.
[0017]
The frame fixing jig 10 is fixed to the outer peripheral side of the chuck body 14 and includes a frame support frame 15 that supports a frame described later, and a pressing ring 16 that presses the frame supported by the frame support frame 15 against the frame support frame 15. Be composed.
[0018]
The pressing ring 16 includes a brim-shaped pressing portion 17 for pressing the frame, and an engaged portion 18 detachably engaged with the frame support frame 15.
[0019]
On the other hand, the frame support frame 15 includes a fixing portion 19 that engages with the engaged portion 18 of the pressing ring 16 to fix the pressing ring 16, a frame supporting portion 15 a that supports the frame, and a ring that supports the pressing ring 16. And a support portion 15b.
In the illustrated example, two fixing portions 19 are provided at opposing positions, but three or more fixing portions 19 may be provided. The frame support frame 15 is fitted on the outer peripheral side of the chuck main body 14 at a predetermined interval, and is fixed to the base 11a supporting the chuck main body 14 with the screws 21 to be in a state shown in FIG. . The head of the screw 21 is buried so as not to protrude from the frame support 15a.
[0020]
FIG. 3 is a cross-sectional view taken along the line AA of FIG. 1. The engaged portion 18 of the pressing ring 16 is an engaged groove formed on the inner peripheral side surface in the illustrated example. The engaged groove 18 includes an upper wall 18a and a lower wall 18b. The upper wall 18a is formed in a horizontal plane, and the lower wall 18b is a slope descending toward the inner peripheral side.
[0021]
4 shows a cross section taken along the line BB of FIG. 1, the fixing portion 19 of the frame support frame 15 moves the claw portion 22 engaging with the engaged portion 18 of the pressing ring 16 and the claw portion 22 in the horizontal direction. And a claw driving section 23 having a function of bringing the claw section 22 into close contact with the engaged groove 18. The lower surface 22a of the claw portion 22 has a slope corresponding to the slope of the lower wall 18b of the engaged groove shown in FIG.
[0022]
The claw driving unit 23 has a screw 25 connected to the knob 24, and the screw 25 penetrates through a through hole 15 c formed in a side portion of the ring support portion 15 b which supports the pressing ring 16, and the claw is inserted into the screw 25. The base 26 of the part 22 is screwed. A space 20 for accommodating the claw portion 22, the base portion 26, and the screw 25 is formed inside the frame support portion 15a and the ring support portion 15b, and by rotating the knob 24, the base portion 26 moves the space 20 in the horizontal direction. , And accordingly, the claw portion 22 also moves in the same direction in the space 20.
[0023]
When the workpiece, for example, the surface of the work 27 shown in FIG. 5 is to be ground, the work 27 is adhered to the adhesive surface of the adhesive tape 28, thereby forming a ring shape having the adhesive tape 28 adhered to the back surface. Frame 29 and an adhesive tape 28. The inner diameter of the frame 29 is larger than the outer diameter of the chuck body 14, and this frame 29 is placed on the frame supporting portion 15a of the frame supporting frame 15 as shown in FIG. It is pressed downward by the part 17.
[0024]
In the state shown in FIG. 6, the frame 29 is held between the frame supporting portion 15 a of the frame supporting frame 15 and the pressing portion 17 of the pressing ring 16. In this state, the claw portion 22 and the engaged portion 18 are not yet engaged, and the frame support frame 15 and the pressing ring 16 are not fixed, so that the support state of the frame 29 is unstable.
[0025]
Next, when the knob 24 is rotated in the direction of arrow A to move the claw portion 22 rightward in FIG. 6, the lower surface 22 a of the claw portion 22 comes into close contact with the lower wall 18 b of the engaged portion 18. Since the claw portion 22 and the engaged portion 18 are engaged, the pressing ring 16 is fixed to the frame support frame 15. As a result, the frame 29 is firmly held and fixed by the frame support frame 15 and the pressing ring 16. In this state, the frame 29 is fixed at a position below the suction surface of the chuck portion 13, and the upper surface of the pressing portion 17 constituting the pressing ring 16 is flush with the suction surface of the chuck portion 13 or slightly. It is fixed so as to be at a position below 13. Therefore, the frame fixing frame 15 and the pressing ring 16 are attached to the chuck body 14 so that the frame 29 and the pressing portion 17 do not hinder the processing when the work 27 is processed.
[0026]
The frame fixing jig 10 configured as described above is used, for example, by being mounted on a grinding device 30 shown in FIG. The grinding device 30 includes a chuck table 11 for holding a workpiece, and a grinding unit 31 for grinding the workpiece held on the chuck table 11.
[0027]
The grinding means 31 is integrated with a support plate 32, and the support plate 32 is slidably engaged with a pair of rails 34 provided in a direction perpendicular to the wall 33. A ball screw 35 is disposed between the pair of rails 34 in the vertical direction. A nut (not shown) disposed inside the support plate 32 is screwed to the ball screw 35, and the ball screw 35 A pulse motor 36 is connected to the distal end of 35, and the support plate 32 and the grinding means 31 integrated therewith are moved up and down as the ball screw 35 is rotated by being driven by the pulse motor 36. ing.
[0028]
The grinding means 31 has a configuration in which a grinding wheel 39 is mounted on a mounter 38 at a tip end of a spindle 37 disposed in a vertical direction, and a grinding wheel 40 is fixed to a lower surface of the grinding wheel 39. .
[0029]
The frame fixing jig 10 described with reference to FIGS. 1 to 6 is mounted on the chuck table 11. Then, as shown in FIG. 5, the adhesive tape 28 having the work 27 adhered to the adhesive surface is adhered to the lower surface of the frame 29, and the frame 29 is fixed by the frame fixing jig 10 as shown in FIG. When the work 27 is fixed to the chuck table 11, the work 27 is held by the chuck section 13 of the chuck table 11 via the adhesive tape 28.
[0030]
When the frame 29 is fixed to the chuck table 11 by the frame fixing jig 10 and the work 27 is held in this manner, the chuck table 11 moves in the horizontal direction and is positioned immediately below the grinding means 31, and the chuck table 11 is moved at about 300 RPM. The grinding wheel 39 rotates at about 6000 RPM, the grinding means 31 descends, and the rotating grinding wheel 40 comes into contact with the rotating upper surface of the work 27 and the pressing force is added thereto. Is ground.
[0031]
When the grinding is performed in this manner, the frame 29 is fixed at a position below the suction surface of the chuck portion 13 of the chuck table 11, so that the frame 29 does not hinder the grinding. Further, since the pressing portion 17 constituting the pressing ring 16 is also fixed at a position below the suction surface of the chuck portion 13, the pressing ring 16 does not hinder the grinding. Then, by holding the work in the state where the work is stuck to the adhesive tape 28 in the chuck portion 13, the work of any size and shape can be performed within a range not exceeding the suction area 12 of the chuck portion 13 of the chuck table 11. That is, since the workpiece can be stably held in accordance with the size and shape of the workpiece, it is possible to remove the irregular workpiece without changing the shape and size of the chuck table 11. Can be ground.
[0032]
Further, in addition to the above effects, even when the work 27 is a semiconductor wafer that is extremely thinly ground, such as a thickness of 100 μm or less and 50 μm or less, the thinned semiconductor wafer can be attached to the frame 29 via the adhesive tape 28. Since it is integrated with the chuck table 11, there is no risk of damage when it is removed from the chuck table 11 or when it is transported to the next step.
[0033]
Furthermore, since the frame fixing jig 10 can fix the frame 29 by being mounted on a chuck table having no mechanism for fixing the frame 29, the existing chuck table can be easily modified and is economical.
[0034]
In the present embodiment, the case where the frame fixing jig 10 is used by being mounted on a chuck table of a grinding device has been described, but the frame fixing jig 10 can also be used for other devices such as a dicing device. Further, a frame for dicing may be used as the frame 29.
[0035]
【The invention's effect】
As described above, according to the frame fixing jig according to the present invention, the frame is fixed at a position below the suction surface of the chuck portion of the chuck table, so that the frame does not hinder processing, Workpieces of any size and shape are stable, as long as they do not exceed the suction area of the chuck part of the chuck table by being held in the chuck part with the work piece adhered to the adhesive tape. Therefore, an irregular workpiece can be ground without changing the shape and size of the chuck table in accordance with the size and shape of the workpiece.
[0036]
Further, even when the workpiece is a semiconductor wafer having a thickness of 100 μm or less and extremely thin as 50 μm or less, since the thinned semiconductor wafer is integrated with the frame via the adhesive tape, Therefore, there is no risk of being damaged when detached from the chuck table or when transported to the next step.
[0037]
Further, the frame fixing jig can fix the frame by being mounted on a chuck table having no mechanism for fixing the frame, so that the existing chuck table can be easily modified and is economical.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing a frame fixing jig according to the present invention.
FIG. 2 is a perspective view showing a state where a frame supporting frame constituting the frame fixing jig is mounted on a chuck table.
FIG. 3 is a sectional view taken along line AA of FIG. 1;
FIG. 4 is a sectional view taken along line BB of FIG. 1;
FIG. 5 is an exploded perspective view showing a state in which a frame is fixed to a chuck table by a frame fixing jig.
FIG. 6 is a partially enlarged sectional view showing a state in which the frame is fixed to the chuck table by a frame fixing jig.
FIG. 7 is a perspective view showing a grinding device provided with a chuck table on which the frame fixing jig is mounted.
[Explanation of symbols]
REFERENCE SIGNS LIST 10 frame fixing jig 11 chuck table 12 suction area 13 chuck section 14 chuck body 15 frame support frame 15 a frame support section 15 b ring support section 15 c through hole 16 pressing ring 17 pressing section 18 … Engaged part (engaged groove)
18a ... upper wall 18b ... lower wall 19 ... fixed part 20 ... space 21 ... screw 22 ... claw part 23 ... claw drive part 24 ... knob 25 ... screw 26 ... base 27 ... work 28 ... adhesive tape 29 ... frame 30 ... grinding device DESCRIPTION OF SYMBOLS 31 ... Grinding means 32 ... Support plate 33 ... Wall part 34 ... Rail 35 ... Ball screw 36 ... Pulse motor 37 ... Spindle 38 ... Mounter 39 ... Grinding wheel 40 ... Grinding wheel

Claims (4)

A frame fixing jig attached to a chuck table including a chuck portion having a suction area for holding a workpiece and a chuck body supporting the chuck portion,
The workpiece is integrated with the frame via the adhesive tape,
The frame fixing jig includes a frame supporting frame fixed to the outer peripheral side of the chuck body and supporting the frame, and a pressing ring for pressing the frame supported by the frame supporting frame against the frame supporting frame,
The pressing ring includes a pressing portion for pressing the frame, and an engaged portion detachably engaged with the frame support frame,
A frame fixing jig comprising: a fixing portion that engages with an engaged portion of the pressing ring to fix the pressing ring; and a frame supporting portion that supports the frame. The engaged portion formed on the pressing ring is an engaged groove formed on the inner peripheral side surface,
2. The fixing unit according to claim 1, wherein the fixing unit formed on the frame support frame includes a claw that engages with the engaged groove, and a claw driving unit that makes the claw adhere to the engaged groove. 3. Frame fixing jig. The engaged groove has an upper wall and a lower wall,
The lower wall is formed by a slope descending toward the inner peripheral side,
The claw portion forming the fixing portion of the frame support frame has an inclined portion corresponding to the slope of the lower wall, and the claw portion is moved by a claw driving portion and abuts against the lower wall to press the pressing ring into the frame. The frame fixing jig according to claim 2, wherein the frame is fixed to the support frame and the frame is pressed against the frame support frame. 4. The grinding table according to claim 1, 2 or 3, which is mounted on a chuck table of a grinding apparatus including at least a chuck table for holding a workpiece and a grinding unit for grinding the workpiece held on the chuck table. Frame fixing jig.

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