TWI715991B - 用於沉積錫銀合金之水性組合物及用以電解沉積該合金之方法 - Google Patents

用於沉積錫銀合金之水性組合物及用以電解沉積該合金之方法 Download PDF

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Publication number
TWI715991B
TWI715991B TW108119427A TW108119427A TWI715991B TW I715991 B TWI715991 B TW I715991B TW 108119427 A TW108119427 A TW 108119427A TW 108119427 A TW108119427 A TW 108119427A TW I715991 B TWI715991 B TW I715991B
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TW
Taiwan
Prior art keywords
tin
composition
silver
aqueous composition
alkyl
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TW108119427A
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English (en)
Chinese (zh)
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TW202000999A (zh
Inventor
西夢卓拉 賈
瑞夫 施蜜特
克莉絲汀 史瓦茲
瑞希普 科瑟
格里戈里 伐斯寧
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德商德國艾托特克公司
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
TW108119427A 2018-06-08 2019-06-05 用於沉積錫銀合金之水性組合物及用以電解沉積該合金之方法 TWI715991B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP18176788.0A EP3578693B1 (de) 2018-06-08 2018-06-08 Wässrige zusammensetzung zur abscheidung einer zinn-silber-legierung und verfahren zur elektrolytischen abscheidung solch einer legierung
EP18176788.0 2018-06-08

Publications (2)

Publication Number Publication Date
TW202000999A TW202000999A (zh) 2020-01-01
TWI715991B true TWI715991B (zh) 2021-01-11

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TW108119427A TWI715991B (zh) 2018-06-08 2019-06-05 用於沉積錫銀合金之水性組合物及用以電解沉積該合金之方法

Country Status (4)

Country Link
EP (1) EP3578693B1 (de)
PT (1) PT3578693T (de)
TW (1) TWI715991B (de)
WO (1) WO2019234088A1 (de)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW589411B (en) * 1999-09-27 2004-06-01 Ishihara Chemical Co Ltd Alloy plating bath containing tin and copper, plating method for depositing alloy containing and copper, and article having a plated coating of alloy containing tin and copper formed thereon
CN1662679A (zh) * 2002-07-25 2005-08-31 新菱电子株式会社 含有锡－银－铜的电镀液、电镀覆膜及电镀方法
TW201739969A (zh) * 2015-12-28 2017-11-16 三菱綜合材料股份有限公司 ＳｎＡｇ合金鍍敷液
TW201816194A (zh) * 2016-06-13 2018-05-01 石原化學股份有限公司 錫和錫合金電鍍浴、使用該電鍍浴形成電沉積物的電子元件

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3301707B2 (ja) 1997-01-20 2002-07-15 ディップソール株式会社 錫−銀合金酸性電気めっき浴
DE10158227A1 (de) 2001-11-15 2003-06-05 Siemens Ag Elektrolysebad zum galvanischen Abscheiden von Silber-Zinn-Legierungen
JP4756887B2 (ja) 2005-03-22 2011-08-24 石原薬品株式会社 非シアン系のスズ−銀合金電気メッキ浴
EP2221396A1 (de) * 2008-12-31 2010-08-25 Rohm and Haas Electronic Materials LLC Bleifreie Elektroplattierungszusammensetzungen aus Blechlegierung und Verfahren
JP6088295B2 (ja) 2013-03-07 2017-03-01 ローム・アンド・ハース電子材料株式会社 スズ合金めっき液

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW589411B (en) * 1999-09-27 2004-06-01 Ishihara Chemical Co Ltd Alloy plating bath containing tin and copper, plating method for depositing alloy containing and copper, and article having a plated coating of alloy containing tin and copper formed thereon
CN1662679A (zh) * 2002-07-25 2005-08-31 新菱电子株式会社 含有锡－银－铜的电镀液、电镀覆膜及电镀方法
TW201739969A (zh) * 2015-12-28 2017-11-16 三菱綜合材料股份有限公司 ＳｎＡｇ合金鍍敷液
TW201816194A (zh) * 2016-06-13 2018-05-01 石原化學股份有限公司 錫和錫合金電鍍浴、使用該電鍍浴形成電沉積物的電子元件

Also Published As

Publication number Publication date
PT3578693T (pt) 2020-06-16
TW202000999A (zh) 2020-01-01
WO2019234088A1 (en) 2019-12-12
EP3578693A1 (de) 2019-12-11
EP3578693B1 (de) 2020-04-15

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