TWI715815B - 流體液滴方法及壓印微影設備 - Google Patents
流體液滴方法及壓印微影設備 Download PDFInfo
- Publication number
- TWI715815B TWI715815B TW106139141A TW106139141A TWI715815B TW I715815 B TWI715815 B TW I715815B TW 106139141 A TW106139141 A TW 106139141A TW 106139141 A TW106139141 A TW 106139141A TW I715815 B TWI715815 B TW I715815B
- Authority
- TW
- Taiwan
- Prior art keywords
- fluid
- substrate
- fluid distribution
- pattern
- stroke
- Prior art date
Links
- 239000012530 fluid Substances 0.000 title claims abstract description 442
- 238000000034 method Methods 0.000 title claims abstract description 61
- 238000001459 lithography Methods 0.000 title claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 209
- 239000000463 material Substances 0.000 claims abstract description 119
- 238000009826 distribution Methods 0.000 claims description 215
- 238000006073 displacement reaction Methods 0.000 claims description 73
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000011295 pitch Substances 0.000 description 30
- 230000007547 defect Effects 0.000 description 22
- 238000011049 filling Methods 0.000 description 12
- 238000001125 extrusion Methods 0.000 description 8
- 238000001723 curing Methods 0.000 description 7
- 230000007717 exclusion Effects 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 5
- 238000000151 deposition Methods 0.000 description 4
- 230000005670 electromagnetic radiation Effects 0.000 description 4
- 238000000203 droplet dispensing Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2012—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image using liquid photohardening compositions, e.g. for the production of reliefs such as flexographic plates or stamps
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/375,966 US10634993B2 (en) | 2016-12-12 | 2016-12-12 | Fluid droplet methodology and apparatus for imprint lithography |
| US15/375,966 | 2016-12-12 | ||
| US15/375,912 | 2016-12-12 | ||
| US15/375,912 US10481491B2 (en) | 2016-12-12 | 2016-12-12 | Fluid droplet methodology and apparatus for imprint lithography |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201833668A TW201833668A (zh) | 2018-09-16 |
| TWI715815B true TWI715815B (zh) | 2021-01-11 |
Family
ID=62634796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106139141A TWI715815B (zh) | 2016-12-12 | 2017-11-13 | 流體液滴方法及壓印微影設備 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7079085B2 (enExample) |
| KR (1) | KR102205141B1 (enExample) |
| CN (1) | CN108227373B (enExample) |
| SG (1) | SG10201709153VA (enExample) |
| TW (1) | TWI715815B (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10468247B2 (en) * | 2016-12-12 | 2019-11-05 | Canon Kabushiki Kaisha | Fluid droplet methodology and apparatus for imprint lithography |
| US11209730B2 (en) * | 2019-03-14 | 2021-12-28 | Canon Kabushiki Kaisha | Methods of generating drop patterns, systems for shaping films with the drop pattern, and methods of manufacturing an article with the drop pattern |
| US11762295B2 (en) | 2020-10-28 | 2023-09-19 | Canon Kabushiki Kaisha | Fluid droplet methodology and apparatus for imprint lithography |
| JP7610461B2 (ja) * | 2021-04-08 | 2025-01-08 | キヤノン株式会社 | インプリント装置、インプリント方法、物品の製造方法、決定方法、およびプログラム |
| CN120178595B (zh) * | 2025-05-20 | 2025-07-22 | 普雨科技(苏州)有限公司 | 一种步进式重复纳米压印设备、控制方法及控制系统 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5788385A (en) * | 1991-09-19 | 1998-08-04 | Canon Kabushiki Kaisha | Serial recording system capable of varing resolution |
| US20060051498A1 (en) * | 2002-02-12 | 2006-03-09 | Seiko Epson Corporation | Display device having a color filter |
| US20070035597A1 (en) * | 2002-08-20 | 2007-02-15 | Palo Alto Research Center Incorporated | Digital lithography using real time quality control |
| US20080018875A1 (en) * | 2006-07-18 | 2008-01-24 | Asml Netherlands B.V. | Imprint lithography |
| US20130120485A1 (en) * | 2010-06-30 | 2013-05-16 | Fujifilm Corporation | Liquid application device, liquid application method, and nanoimprint system |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6536883B2 (en) | 2001-02-16 | 2003-03-25 | Eastman Kodak Company | Continuous ink-jet printer having two dimensional nozzle array and method of increasing ink drop density |
| JP4168788B2 (ja) | 2003-03-06 | 2008-10-22 | セイコーエプソン株式会社 | 成膜方法、カラーフィルタ基板の製造方法、エレクトロルミネッセンス装置用基板の製造方法、表示装置の製造方法 |
| JP4337586B2 (ja) | 2004-03-10 | 2009-09-30 | セイコーエプソン株式会社 | 光学被膜の形成方法及びその方法で製造された光学物品 |
| US8001924B2 (en) | 2006-03-31 | 2011-08-23 | Asml Netherlands B.V. | Imprint lithography |
| JP4908369B2 (ja) | 2007-10-02 | 2012-04-04 | 株式会社東芝 | インプリント方法及びインプリントシステム |
| US8187515B2 (en) * | 2008-04-01 | 2012-05-29 | Molecular Imprints, Inc. | Large area roll-to-roll imprint lithography |
| US8586126B2 (en) * | 2008-10-21 | 2013-11-19 | Molecular Imprints, Inc. | Robust optimization to generate drop patterns in imprint lithography which are tolerant of variations in drop volume and drop placement |
| NL2003875A (en) * | 2009-02-04 | 2010-08-05 | Asml Netherlands Bv | Imprint lithography method and apparatus. |
| JP5495767B2 (ja) | 2009-12-21 | 2014-05-21 | キヤノン株式会社 | インプリント装置及び方法、並びに物品の製造方法 |
| NL2007633A (en) * | 2010-11-22 | 2012-05-23 | Asml Netherlands Bv | A positioning system, a lithographic apparatus and a method for positional control. |
| JP5748291B2 (ja) | 2012-02-29 | 2015-07-15 | 富士フイルム株式会社 | 液体吐出装置、ナノインプリントシステム及び液体吐出方法 |
| JP6135119B2 (ja) | 2012-12-19 | 2017-05-31 | 大日本印刷株式会社 | インプリント方法、インプリント樹脂滴下位置決定方法及びインプリント装置 |
| JP6329425B2 (ja) * | 2014-05-02 | 2018-05-23 | キヤノン株式会社 | インプリント装置、インプリント方法、および物品の製造方法 |
| US10620532B2 (en) * | 2014-11-11 | 2020-04-14 | Canon Kabushiki Kaisha | Imprint method, imprint apparatus, mold, and article manufacturing method |
-
2017
- 2017-11-07 SG SG10201709153VA patent/SG10201709153VA/en unknown
- 2017-11-13 TW TW106139141A patent/TWI715815B/zh active
- 2017-12-04 KR KR1020170164864A patent/KR102205141B1/ko active Active
- 2017-12-07 CN CN201711281189.6A patent/CN108227373B/zh active Active
- 2017-12-08 JP JP2017236264A patent/JP7079085B2/ja active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5788385A (en) * | 1991-09-19 | 1998-08-04 | Canon Kabushiki Kaisha | Serial recording system capable of varing resolution |
| US20060051498A1 (en) * | 2002-02-12 | 2006-03-09 | Seiko Epson Corporation | Display device having a color filter |
| US20070035597A1 (en) * | 2002-08-20 | 2007-02-15 | Palo Alto Research Center Incorporated | Digital lithography using real time quality control |
| US20080018875A1 (en) * | 2006-07-18 | 2008-01-24 | Asml Netherlands B.V. | Imprint lithography |
| US20130120485A1 (en) * | 2010-06-30 | 2013-05-16 | Fujifilm Corporation | Liquid application device, liquid application method, and nanoimprint system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018098506A (ja) | 2018-06-21 |
| CN108227373B (zh) | 2022-02-08 |
| KR20180067415A (ko) | 2018-06-20 |
| CN108227373A (zh) | 2018-06-29 |
| SG10201709153VA (en) | 2018-07-30 |
| JP7079085B2 (ja) | 2022-06-01 |
| KR102205141B1 (ko) | 2021-01-20 |
| TW201833668A (zh) | 2018-09-16 |
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