TWI714336B - 研磨層用聚胺基甲酸酯、研磨層及研磨墊 - Google Patents
研磨層用聚胺基甲酸酯、研磨層及研磨墊 Download PDFInfo
- Publication number
- TWI714336B TWI714336B TW108140211A TW108140211A TWI714336B TW I714336 B TWI714336 B TW I714336B TW 108140211 A TW108140211 A TW 108140211A TW 108140211 A TW108140211 A TW 108140211A TW I714336 B TWI714336 B TW I714336B
- Authority
- TW
- Taiwan
- Prior art keywords
- polyurethane
- polishing layer
- polishing
- layer
- group
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 228
- 229920002635 polyurethane Polymers 0.000 title claims abstract description 126
- 239000004814 polyurethane Substances 0.000 title claims abstract description 126
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 43
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 43
- 125000001183 hydrocarbyl group Chemical group 0.000 claims abstract description 19
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 16
- 125000005842 heteroatom Chemical group 0.000 claims abstract description 11
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 77
- -1 polytetramethylene Polymers 0.000 claims description 39
- 150000001875 compounds Chemical class 0.000 claims description 28
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 27
- 238000010521 absorption reaction Methods 0.000 claims description 23
- 229920005862 polyol Polymers 0.000 claims description 22
- 150000003077 polyols Chemical class 0.000 claims description 22
- 229920006395 saturated elastomer Polymers 0.000 claims description 21
- 229920000642 polymer Polymers 0.000 claims description 17
- 239000005056 polyisocyanate Substances 0.000 claims description 14
- 229920001228 polyisocyanate Polymers 0.000 claims description 14
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 12
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 11
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 10
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 10
- 125000001931 aliphatic group Chemical group 0.000 claims description 9
- 229910052757 nitrogen Inorganic materials 0.000 claims description 9
- 239000004970 Chain extender Substances 0.000 claims description 8
- 125000003277 amino group Chemical group 0.000 claims description 8
- 239000007795 chemical reaction product Substances 0.000 claims description 2
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 claims 1
- 239000010410 layer Substances 0.000 description 115
- 125000006353 oxyethylene group Chemical group 0.000 description 32
- 230000000052 comparative effect Effects 0.000 description 30
- 230000002393 scratching effect Effects 0.000 description 21
- 239000000203 mixture Substances 0.000 description 20
- 235000012431 wafers Nutrition 0.000 description 15
- 239000002994 raw material Substances 0.000 description 13
- 239000002002 slurry Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 11
- 239000002202 Polyethylene glycol Substances 0.000 description 11
- 229920001223 polyethylene glycol Polymers 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 9
- 230000007423 decrease Effects 0.000 description 9
- 229910003460 diamond Inorganic materials 0.000 description 9
- 239000010432 diamond Substances 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 229910052814 silicon oxide Inorganic materials 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 7
- 238000000227 grinding Methods 0.000 description 7
- 239000000178 monomer Substances 0.000 description 7
- 239000004745 nonwoven fabric Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 6
- 229920002582 Polyethylene Glycol 600 Polymers 0.000 description 6
- 150000002009 diols Chemical class 0.000 description 6
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 6
- 229920005749 polyurethane resin Polymers 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 239000006260 foam Substances 0.000 description 4
- 238000005187 foaming Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 230000008961 swelling Effects 0.000 description 4
- 229920002725 thermoplastic elastomer Polymers 0.000 description 4
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 125000002511 behenyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 3
- 230000002209 hydrophobic effect Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 3
- 125000005702 oxyalkylene group Chemical group 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 229920000570 polyether Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- ROHUXHMNZLHBSF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1CCC(CN=C=O)CC1 ROHUXHMNZLHBSF-UHFFFAOYSA-N 0.000 description 2
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 2
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 2
- 238000010146 3D printing Methods 0.000 description 2
- WXAIEIRYBSKHDP-UHFFFAOYSA-N 4-phenyl-n-(4-phenylphenyl)-n-[4-[4-(4-phenyl-n-(4-phenylphenyl)anilino)phenyl]phenyl]aniline Chemical compound C1=CC=CC=C1C1=CC=C(N(C=2C=CC(=CC=2)C=2C=CC=CC=2)C=2C=CC(=CC=2)C=2C=CC(=CC=2)N(C=2C=CC(=CC=2)C=2C=CC=CC=2)C=2C=CC(=CC=2)C=2C=CC=CC=2)C=C1 WXAIEIRYBSKHDP-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical group N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 125000000219 ethylidene group Chemical group [H]C(=[*])C([H])([H])[H] 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- CKFGINPQOCXMAZ-UHFFFAOYSA-N methanediol Chemical compound OCO CKFGINPQOCXMAZ-UHFFFAOYSA-N 0.000 description 2
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 229930195734 saturated hydrocarbon Natural products 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- XBTRYWRVOBZSGM-UHFFFAOYSA-N (4-methylphenyl)methanediamine Chemical compound CC1=CC=C(C(N)N)C=C1 XBTRYWRVOBZSGM-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- DFPJRUKWEPYFJT-UHFFFAOYSA-N 1,5-diisocyanatopentane Chemical compound O=C=NCCCCCN=C=O DFPJRUKWEPYFJT-UHFFFAOYSA-N 0.000 description 1
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- GHSZVIPKVOEXNX-UHFFFAOYSA-N 1,9-diisocyanatononane Chemical compound O=C=NCCCCCCCCCN=C=O GHSZVIPKVOEXNX-UHFFFAOYSA-N 0.000 description 1
- 125000004973 1-butenyl group Chemical group C(=CCC)* 0.000 description 1
- ICLCCFKUSALICQ-UHFFFAOYSA-N 1-isocyanato-4-(4-isocyanato-3-methylphenyl)-2-methylbenzene Chemical group C1=C(N=C=O)C(C)=CC(C=2C=C(C)C(N=C=O)=CC=2)=C1 ICLCCFKUSALICQ-UHFFFAOYSA-N 0.000 description 1
- RQBUVIFBALZGPC-UHFFFAOYSA-N 1-isocyanato-4-(4-isocyanatophenyl)benzene Chemical group C1=CC(N=C=O)=CC=C1C1=CC=C(N=C=O)C=C1 RQBUVIFBALZGPC-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- WTPYFJNYAMXZJG-UHFFFAOYSA-N 2-[4-(2-hydroxyethoxy)phenoxy]ethanol Chemical compound OCCOC1=CC=C(OCCO)C=C1 WTPYFJNYAMXZJG-UHFFFAOYSA-N 0.000 description 1
- 125000004974 2-butenyl group Chemical group C(C=CC)* 0.000 description 1
- GNDOBZLRZOCGAS-JTQLQIEISA-N 2-isocyanatoethyl (2s)-2,6-diisocyanatohexanoate Chemical compound O=C=NCCCC[C@H](N=C=O)C(=O)OCCN=C=O GNDOBZLRZOCGAS-JTQLQIEISA-N 0.000 description 1
- SDQROPCSKIYYAV-UHFFFAOYSA-N 2-methyloctane-1,8-diol Chemical compound OCC(C)CCCCCCO SDQROPCSKIYYAV-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- FJSUFIIJYXMJQO-UHFFFAOYSA-N 3-methylpentane-1,5-diamine Chemical compound NCCC(C)CCN FJSUFIIJYXMJQO-UHFFFAOYSA-N 0.000 description 1
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- BMRWNKZVCUKKSR-UHFFFAOYSA-N butane-1,2-diol Chemical compound CCC(O)CO BMRWNKZVCUKKSR-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- SSJXIUAHEKJCMH-UHFFFAOYSA-N cyclohexane-1,2-diamine Chemical compound NC1CCCCC1N SSJXIUAHEKJCMH-UHFFFAOYSA-N 0.000 description 1
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- GKGXKPRVOZNVPQ-UHFFFAOYSA-N diisocyanatomethylcyclohexane Chemical compound O=C=NC(N=C=O)C1CCCCC1 GKGXKPRVOZNVPQ-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 235000019256 formaldehyde Nutrition 0.000 description 1
- PWSKHLMYTZNYKO-UHFFFAOYSA-N heptane-1,7-diamine Chemical compound NCCCCCCCN PWSKHLMYTZNYKO-UHFFFAOYSA-N 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 229920001477 hydrophilic polymer Polymers 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 125000002463 lignoceryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001117 oleyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])/C([H])=C([H])\C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920000921 polyethylene adipate Polymers 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B25/08—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/12—Layered products comprising a layer of natural or synthetic rubber comprising natural rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/14—Layered products comprising a layer of natural or synthetic rubber comprising synthetic rubber copolymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/16—Layered products comprising a layer of natural or synthetic rubber comprising polydienes homopolymers or poly-halodienes homopolymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/20—Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/065—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/022—Non-woven fabric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/022—Mechanical properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/2805—Compounds having only one group containing active hydrogen
- C08G18/2815—Monohydroxy compounds
- C08G18/283—Compounds containing ether groups, e.g. oxyalkylated monohydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
- C08G18/3203—Polyhydroxy compounds
- C08G18/3206—Polyhydroxy compounds aliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4804—Two or more polyethers of different physical or chemical nature
- C08G18/4808—Mixtures of two or more polyetherdiols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4825—Polyethers containing two hydroxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4833—Polyethers containing oxyethylene units
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
- C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
- C08G18/6666—Compounds of group C08G18/48 or C08G18/52
- C08G18/667—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38
- C08G18/6674—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
- C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
- C08G18/7671—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/06—Other polishing compositions
- C09G1/14—Other polishing compositions based on non-waxy substances
- C09G1/16—Other polishing compositions based on non-waxy substances on natural or synthetic resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/02—2 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2266/00—Composition of foam
- B32B2266/02—Organic
- B32B2266/0214—Materials belonging to B32B27/00
- B32B2266/0278—Polyurethane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2274/00—Thermoplastic elastomer material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/536—Hardness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Textile Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polyurethanes Or Polyureas (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
一種研磨層用聚胺基甲酸酯、使用其之研磨層及研磨墊，該研磨層用聚胺基甲酸酯具有下列式(I)所示之末端基：
R-(OX)n
-･･･(I)
[式(I)中，R表示可經雜原子取代、亦可有雜原子介於其間的碳數1~30之一價烴基，X表示90~100%為伸乙基的碳數2~4之伸烷基，n表示8~120之數值]。
Description
本發明係關於一種可較佳地用作研磨墊之研磨層材料的聚胺基甲酸酯(polyurethane)、使用其之研磨層及使用該等之研磨墊。
以往，為了將半導體或矽晶圓等的基板材料或硬碟、液晶顯示器、透鏡材料之玻璃進行鏡面加工，或者將半導體裝置之製造步驟中因絕緣膜或金屬膜所導致之凹凸進行平坦化，而使用化學機械研磨法(CMP)，其係使用研磨漿液並以研磨墊來研磨被研磨面。在CMP中係尋求高精度化、低成本化。因此，尋求確保高於以往的平坦化性、平滑性，並且減少表面的刮痕、提升研磨速度或其穩定性、以及可長時間使用等之進一步的高性能化。特別是在半導體裝置的製造中，伴隨著近年來的高積體化及多層配線化的進展，而強烈要求提升平坦化性及低刮傷性，其中平坦化性係以較少研磨量或較短研磨時間使被研磨材的表面(以下亦稱為被研磨面)平坦化的性能，低刮傷性係在研磨時不易對被研磨面造成損傷的性能。
作為研磨墊，使用不織布型研磨層之研磨墊或使用發泡聚胺基甲酸酯型研磨層之研磨墊已為人所知，其中該不織布型研磨層係使聚胺基甲酸酯樹脂含浸於不織布而成；該發泡聚胺基甲酸酯型研磨層係使二液硬化型聚胺基甲酸酯澆注發泡成形後，藉由適當研削或切片而製造。一般而言，不織布型研磨層為低彈性且軟質，發泡聚胺基甲酸酯型研磨層為高彈性且高剛性。
以往的使用不織布型研磨層之研磨墊，相較於使用發泡聚胺基甲酸酯型研磨層之研磨墊，其與被研磨面接觸之面(以下亦稱為研磨面)柔軟，故低刮傷性優異。其之反面，由於為低彈性，故平坦化性低劣。又，由於含浸於不織布之聚胺基甲酸酯樹脂容易在厚度方向上不均勻地存在，因此亦有伴隨著研磨層的磨耗而研磨特性隨著時間變化的情況。
另一方面，使用發泡聚胺基甲酸酯型研磨層之研磨墊為高剛性，故平坦化性高。其之反面，由於在研磨時容易對被研磨面的凸部局部性地施加載重，而且氣孔中容易堆積研磨屑，因此低刮傷性低劣。又，由於發泡聚胺基甲酸酯在製造時的反應及發泡不均勻，故發泡結構容易不均。發泡結構的不均，會使研磨速度或平坦化性等的研磨特性產生不均。
目前正尋求一種解決不織布型研磨層及發泡聚胺基甲酸酯型研磨層各自的問題、且兼具優異之平坦化性與低刮傷性的研磨層。然而，以往的發泡聚胺基甲酸酯型研磨層或不織布型研磨層難以滿足此要求。為了進一步提升發泡聚胺基甲酸酯型研磨層的平坦化性，需要更高的硬度。然而，若提高研磨墊的硬度，一般而言，則低刮傷性降低。因此，在發泡聚胺基甲酸酯型研磨層中，高平坦化性與優異之低刮傷性成為權衡(trade-off)關係，故難以得到充分兼具優異之平坦化性與低刮傷性的研磨層。
作為解決這種問題的技術，下述專利文獻1及下述專利文獻2揭示一種研磨層，其使用使水溶性物質分散於非水溶性熱塑性聚合物中而成之片材。又，下述專利文獻3揭示一種研磨層，其使用使水溶性粒子分散於含有交聯聚合物之非水溶性基質材料中而成之片材。然而，此等研磨層對於兼具高平坦化性與優異之低刮傷性並不充分。又，由於此等研磨層包含水溶性物質，因此亦有在研磨中此等物質溶出而對研磨特性造成不良影響的疑慮。再者，水溶性物質在作為基質的非水溶性聚合物中容易不均勻地分散，故亦有研磨特性不均的疑慮。
又，下述專利文獻4揭示一種研磨墊，其係使聚胺基甲酸酯組成物發泡硬化而得；其中該聚胺基甲酸酯組成物含有使聚乙二醇等具有親水性基之多元醇進行共聚合而成的胺基甲酸酯樹脂，且含有特定的親水劑。再者，下述專利文獻5揭示一種研磨墊，其具有包含聚胺基甲酸酯樹脂發泡體的研磨層，該聚胺基甲酸酯樹脂發泡體含有具有氧伸乙基(oxyethylene)單元之親水性高分子多元醇成分作為原料成分，並具有細微氣泡。又，下述專利文獻6揭示一種研磨墊，其係具有包含聚胺基甲酸酯樹脂發泡體的研磨層的研磨墊，該聚胺基甲酸酯樹脂發泡體具有細微氣泡，其中聚胺基甲酸酯樹脂發泡體係含有疏水性異氰酸酯末端預聚物(A)、親水性異氰酸酯末端預聚物(B)及鏈伸長劑作為原料成分而成；該疏水性異氰酸酯末端預聚物(A)係含有不具有羥基以外之親水性基的疏水性高分子量多元醇成分與異氰酸酯成分作為原料成分而成；該親水性異氰酸酯末端預聚物(B)係含有具有氧伸乙基單元(-CH2
CH2
O-)之親水性高分子量多元醇成分與異氰酸酯成分作為原料成分而成。
[先前技術文獻]
[專利文獻]
專利文獻1 日本特開2000-34416號公報
專利文獻2 日本特開2001-47355號公報
專利文獻3 日本特開2001-334455號公報
專利文獻4 日本特開2003-128910號公報
專利文獻5 日本特開2004-42250號公報
專利文獻6 日本特開2005-68175號公報
[發明所欲解決之課題]
本發明之目的在於提供一種兼具高研磨速度與優異之低刮傷性、且平坦化性亦優異的研磨層。
[用於解決課題之手段]
本發明之一層面係一種研磨層用聚胺基甲酸酯，其具有下列式(I)所示之末端基：
R-(OX)n
-･･･(I)
[式(I)中，R表示可經雜原子取代、亦可有雜原子介於其間的碳數1~30之一價烴基，X表示90~100%為伸乙基的碳數2~4之伸烷基，n表示8~120之數值]。
將這種聚胺基甲酸酯用作材料的研磨層，兼具高研磨速度與優異之低刮傷性，且平坦化性亦優異。
研磨層用聚胺基甲酸酯於分子鏈末端具有聚氧伸烷基(polyoxyalkylene)，該聚氧伸烷基之氧伸烷基的90~100%為氧伸乙基。這種鍵結於分子鏈末端的聚氧伸烷基，與兩側具有胺基甲酸酯鍵並因聚胺基甲酸酯的硬鏈段而運動性受限且通常源自聚乙二醇之聚氧伸乙基不同，聚胺基甲酸酯與水或水性漿液接觸時，容易在聚胺基甲酸酯的表面移動。因此，為了使研磨層的表面容易局部性地親水化及軟化，藉由提升與研磨面之水性漿液的親和性來提升漿液保持性，而呈現高研磨速度，又，藉由僅使與水性漿液接觸之研磨面軟化，可抑制刮痕的產生。
又，從末端基充分維持親水性之點來看，較佳係式(I)所示之末端基中包含的R為碳數1~22之脂肪族烴基。
又，從高親水性與生產性的平衡優異之點來看，較佳係式(I)所示之末端基的氧伸烷基之重複數n為15~100。
又，從親水性與耐水性的平衡優異之點來看，較佳為含有0.005~0.05mmol/g的式(I)所示之末端基或含有1~10質量%的式(I)所示之末端基。
又，聚胺基甲酸酯較佳為有機聚異氰酸酯(A)、高分子多元醇(B)、鏈伸長劑(C)及下列式(II)所示之化合物(D)的反應生成物：
R-(OX)n
-AH
･･･(II)
[式(II)中，R、X及n與式(I)相同，AH
為羥基、胺基、或包含該等的碳數1~4之一價烴基]。
又，從可得到平坦化性、低刮傷性特別優異之研磨層之點來看，聚胺基甲酸酯較佳係有機聚異氰酸酯(A)的源自異氰酸酯基之氮原子的比例為4.6~6.8質量%。
又，從容易得到平坦化性與低刮傷性特別優異、並且透明性亦優異之聚胺基甲酸酯之點來看，較佳係高分子多元醇(B)含有70質量%以上的聚四亞甲二醇。
又，從在研磨時研磨層不易軟化，平坦化性、經時穩定性特別優異之點來看，較佳係聚胺基甲酸酯於50℃的溫水中飽和膨潤時的吸水率為3%以下。
又，從可藉由擠製成形等的熱成形連續地生產用作研磨層之成形體之點來看，較佳係聚胺基甲酸酯具有熱塑性。
又，本發明之另一層面係上述任一聚胺基甲酸酯之成形體的研磨層。再者，研磨層較佳為非多孔性。若根據這種研磨層，可得到兼具高研磨速度、優異之平坦化性及低刮傷性的研磨墊。
研磨墊為了保持高平坦化性，較佳係就研磨層整體而言為高硬度。然而使研磨層整體為高硬度的情況下，變得容易對被研磨面的凸部局部性地施加載重而低刮傷性降低。另一方面，為了提升研磨速度，親水性高的研磨層係有利。然而，以往的高親水性研磨層的情況，由於研磨層吸水，硬度隨著時間降低而平坦化性降低或研磨速度降低。若根據上述研磨層，就研磨層整體而言，即使吸水硬度亦不易降低，藉由僅在研磨面的附近具有高運動性之鍵結於聚胺基甲酸酯之分子鏈末端的聚氧化伸烷基(polyalkylene oxide)移動，容易使研磨面親水化及軟化。藉此，就研磨層整體而言維持高硬度，並且僅使與水性漿液接觸之研磨面的彈性模數降低，藉此可維持高研磨速度、平坦化性，並且高度保持低刮傷性。
從高平坦化性與低刮傷性特別優異之點來看，較佳係研磨層在浸漬於50℃的溫水中72小時後，於23℃的JIS-D硬度為55~75。
又，本發明之另一層面係一種研磨墊，其包含：研磨層，包含上述任一研磨層用聚胺基甲酸酯；及緩衝層，具有比研磨層之硬度更低的硬度。
[發明之效果]
若根據本發明，可得到一種兼具高研磨速度與優異之低刮傷性、且平坦化性優異的研磨層。
[用以實施發明之形態]
以下，詳細說明本發明之一實施形態的研磨層用聚胺基甲酸酯(以下亦僅稱為聚胺基甲酸酯)、研磨層及研磨墊。
本實施形態之聚胺基甲酸酯具有下列式(I)所示之末端基：
R-(OX)n
-･･･(I)
[式(I)中，R表示可經雜原子取代、亦可有雜原子介於其間的碳數1~30之一價烴基，X表示90~100%為伸乙基的碳數2~4之伸烷基，n表示8~120之數值]。
如上述的聚胺基甲酸酯，係使有機聚異氰酸酯(A)、高分子多元醇(B)、鏈伸長劑(C)及下列化學式(II)所示之化合物(D)反應而得的聚胺基甲酸酯：
R-(OX)n
-AH
･･･(II)
[式(II)中，R、X及n與式(I)相同，AH
為羥基、胺基、或包含該等的碳數1~4之一價烴基]。
作為有機聚異氰酸酯(A)，可無特別限定地使用以往用於製造聚胺基甲酸酯的有機聚異氰酸酯。作為其具體例，可列舉例如：四亞甲基二異氰酸酯、五亞甲基二異氰酸酯、六亞甲基二異氰酸酯、九亞甲基二異氰酸酯、異佛爾酮二異氰酸酯、4,4'-二環己基甲烷二異氰酸酯、離胺酸二異氰酸酯、伸環己基二異氰酸酯、1,3-或1,4-雙(異氰酸基甲基)環己烷等的脂肪族或脂環式二異氰酸酯；2,4'-或4,4'-二苯甲烷二異氰酸酯、2,4-或2,6-甲苯二異氰酸酯、間或對苯二異氰酸酯、間或對伸茬基二異氰酸酯、1,5-伸萘基二異氰酸酯、4,4'-二異氰酸基聯苯、3,3'-二甲基-4,4'-二異氰酸基聯苯、3,3'-二甲基-4,4'-二異氰酸基二苯甲烷、氯伸苯基(clorophenylene)-2,4-二異氰酸酯、四甲基伸茬基二異氰酸酯等的芳香族二異氰酸酯；離胺酸三異氰酸酯、聚亞甲基聚苯基聚異氰酸酯等的三官能以上之聚異氰酸酯。此等可單獨使用，亦可組合2種以上使用。此等之中，從容易得到高硬度且平坦化性優異之研磨層之點來看，特佳為芳香族或脂環式二異氰酸酯。又，從容易得到耐磨耗性優異之研磨層之點來看，較佳為選自4,4'-二苯甲烷二異氰酸酯、2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、異佛爾酮二異氰酸酯、1,4-雙(異氰酸基甲基)環己烷的至少1種，特別是4,4'-二苯甲烷二異氰酸酯。
作為高分子多元醇(B)，可無特別限定地使用以往用於製造聚胺基甲酸酯的高分子多元醇。作為其具體例，可列舉例如：聚乙二醇、聚丙二醇、聚四亞甲二醇、聚甲基四亞甲二醇等的聚醚多元醇；聚己二酸伸乙酯二醇(polyethylene adipate diol)、聚己二酸伸丁酯二醇、聚己二酸六亞甲酯二醇、聚己內酯二醇等的聚酯多元醇；聚碳酸五亞甲酯二醇、聚碳酸六亞甲酯二醇等的聚碳酸酯多元醇等。此等可單獨使用，亦可組合2種以上使用。此等之中，較佳為聚醚二醇或聚酯二醇，特別是從容易得到研磨速度、低刮傷性優異之研磨層之點來看，較佳為聚醚二醇，特別是選自聚乙二醇及聚四亞甲二醇的至少1種。
從聚胺基甲酸酯的硬度、彈性模數為適度，研磨層之平坦化性與低刮傷性的平衡優異之點來看，高分子多元醇(B)的數量平均分子量較佳為400~2000，再佳為500~1500，再佳為600~1200。此外，高分子多元醇的數量平均分子量太高的情況下，所得到之聚胺基甲酸酯中的軟鏈段與硬鏈段的相分離變得太大而在研磨中光學性地檢測終點時所要求的透光性有變得容易降低的傾向。特別是從容易得到平坦化性與低刮傷性的平衡優異、並且透光性亦優異之聚胺基甲酸酯之點來看，較佳係高分子多元醇(B)的70質量%以上為數量平均分子量600~1500的聚四亞甲二醇，再佳係高分子多元醇(B)的80質量%以上為數量平均分子量700~1200的聚四亞甲二醇。又，為了維持研磨層的耐磨耗性並進一步提高親水性，高分子多元醇(B)的一部分可為數量平均分子量400~2000的聚乙二醇，較佳為600~1500的聚乙二醇。此外，高分子二醇的數量平均分子量係基於依據JIS K 1557所測定之羥價而算出的數量平均分子量。
作為鏈伸長劑(C)，可列舉以往用於製造聚胺基甲酸酯的下述低分子化合物：分子中具有2個以上可與異氰酸酯基反應之活性氫，較佳為分子量250以下。作為其具體例，可列舉例如：乙二醇、二乙二醇、丙二醇、1,2-丁二醇、1,3-丁二醇、1,4-丁二醇、1,5-戊二醇、新戊二醇、1,6-己二醇、3-甲基-1,5-戊二醇、1,4-雙(β-羥基乙氧基)苯、1,4-環己二醇、1,8-辛二醇、1,9-壬二醇、2-甲基-1,8-辛二醇、1,10-癸二醇、間伸茬二醇、對伸茬二醇等的二醇類；乙二胺、四亞甲二胺、六亞甲二胺、七亞甲二胺、八亞甲二胺、九亞甲二胺、十亞甲二胺、十二亞甲二胺、2,2',4-或2,4,4'-三甲基六亞甲二胺、3-甲基五亞甲二胺、1,2-環己二胺、1,3-或1,4-環己二胺、伸茬二胺、異佛爾酮二胺、哌
、甲苯二胺、二甲苯二胺、4,4'-二胺二苯甲烷、4,4'-二胺二苯基醚、4,4'-二胺基二苯基碸等的二胺類、三羥甲基丙烷、二伸乙三胺等的三官能化合物等。此等可單獨使用，亦可組合2種以上使用。此等之中，較佳為分子量60~250的有機二醇，特別是從容易得到研磨速度、平坦化性優異之研磨層之點來看，較佳為選自1,4-丁二醇、1,5-戊二醇、3-甲基-1,5-戊二醇、1,6-己二醇、1,8-辛二醇、1,9-壬二醇、2-甲基-1,8-辛二醇、1,10-癸二醇的至少1種。
化合物(D)係化學式(II)所示之化合物：
R-(OX)n
-AH
･･･(II)
[式(II)中，R、X及n與式(I)相同，AH
為羥基、胺基、經羥基或胺基取代的碳數1~4之一價烴基]。
烴基R為可經雜原子取代、亦可有雜原子介於其間的碳數1~30之一價烴基，其包含直鏈狀、分支狀或環狀的一價飽和或不飽和之烴基。
烴基R的碳數為1~30，較佳為1~24。烴基的碳數超過30的情況下，烴基R的疏水性變高，將聚胺基甲酸酯用作研磨層時與水性漿液的親水性變得不充分，式(I)所示之末端基變得難以在聚胺基甲酸酯的表面移動。作為這種烴基R的具體例，可列舉例如：甲基(碳數1)、乙基(碳數2)、丙基(碳數3)、丁基(碳數4)、戊基(碳數5)、己基(碳數6)、庚基(碳數7)、辛基(碳數8)、2-乙基己基(碳數8)、壬基(碳數9)、2-甲基辛基(碳數9)、癸基(碳數10)、異癸基(碳數10)、十二基(碳數12，別名：月桂基)、十三基(碳數13)、十四基(碳數14，別名：肉豆蔻基)、十六基(碳數16，別名：鯨蠟基)、十八基(碳數18，別名：硬脂基)、2-辛基十二基(碳數20)、二十二基(碳數22，別名：山萮基(behenyl))、二十四基(碳數24)、二十八基(碳數28)等的飽和脂肪族烴基；乙烯基(碳數2)、烯丙基(碳數3)、1-丁烯基(碳數4)、2-丁烯基(碳數4)、油基(碳數18)等的不飽和脂肪族烴基；環丙基(碳數3)、環丁基(碳數4)、環戊基(碳數5)、環己基(碳數6)等的環式飽和烴；苯基(碳數6)、苄基(碳數7)、萘基(碳數10)、辛基苯基(碳數14)、壬基苯基(碳數15)、十二基苯基(碳數16)等的芳香族烴基等。又，此等基團可經氧原子、氮原子、硫原子等的雜原子所取代，或者有雜原子介於其間。此等之中，從聚胺基甲酸酯之親水性與耐水性的平衡優異，容易得到研磨速度及平坦化性、低刮傷性特別優異之研磨層之點來看，較佳係烴基R為碳數1~22之脂肪族烴基。
又，X表示90~100%為伸乙基的碳數2~4之伸烷基，具體而言，氧伸烷基(OX)的90~100%為氧伸乙基(O-CH2
CH2
)，且可在0~10%的範圍內包含氧伸丙基(O-CH2
CH2
CH2
)或(O-CH2
CH(CH3
))或者氧伸丁基(O-CH2
CH2
CH2
CH2
)或(O-CH2
CH(CH2
CH3
))等。氧伸乙基(O-CH2
CH2
)小於90%的情況下，親水性的提升效果降低。此外，X的比例係基於X的個數。
(OX)的重複數n為8~120，較佳為15~100。重複數n大於120的情況下，親水性基的分子量太大而有與有機聚異氰酸酯(A)的反應性降低的疑慮。又，氧伸乙基的重複數n小於8的情況下，親水性變低，研磨速度、低刮傷性的改善效果變小。
又，AH
係具有與異氰酸酯基反應之活性氫的基團，其為羥基、胺基、經羥基或胺基取代的碳數1~4之一價烴基。從反應性之點來看，AH
較佳為羥基或胺基。
作為化合物(D)，特別是從化合物(D)即使為少量亦可使聚胺基甲酸酯的表面充分親水化而容易得到研磨速度及平坦化性、低刮傷性優異之研磨層之點來看，較佳係烴基R為碳數1~22之脂肪族烴基，且(OX)的重複數n為15~100。又，更佳係烴基R為碳數1~16之飽和脂肪族烴基，且(OX)的重複數n為18~60。又，再佳係烴基R為碳數1~13之飽和脂肪族烴基，且(OX)的重複數n為20~50。
從親水性與耐水性之平衡優異之點來看，聚胺基甲酸酯係以較佳為0.005~0.05mmol/g、再佳為0.006~0.046mmol/g、特佳為0.008~0.042mmol/g的比例包含式(I)所示之末端基。式(I)所示之末端基太少的情況下，有親水性的提升效果變小的傾向。又，式(I)所示之末端基太多的情況下，有耐水性變得不充分或分子量降低而耐磨耗性變低的疑慮。
又，從可得到平坦化性、低刮傷性特別優異之研磨層之點來看，聚胺基甲酸酯中，有機聚異氰酸酯(A)的源自異氰酸酯基之氮原子的比例較佳為4.6~6.8質量%，再佳為4.8~6.5質量%，特佳為5.0~6.2質量%。氮原子的比例太低的情況下，有硬度變低的傾向。又，氮原子的比例太高的情況下，有式(I)所示之末端基變得難以在聚胺基甲酸酯的表面移動的傾向。
又，從可得到平坦化性、低刮傷性特別優異之研磨層之點來看，聚胺基甲酸酯中的式(I)所示之末端基的比例較佳為1~10質量%，再佳為1.2~9.5質量%，特佳為1.4~9質量%。式(I)所示之末端基的比例太低的情況下，有親水性的改善效果變小的傾向。又，式(I)所示之末端基的比例太高的情況下，有耐水性變得容易降低的傾向。
又，使用聚乙二醇作為高分子多元醇(B)的情況下，聚胺基甲酸酯中，式(I)所示之末端基的聚氧伸乙基及源自聚乙二醇之聚氧伸乙基的含有比例之總計較佳為1.5~20質量%，再佳為2~15質量%，特佳為3~10質量%。
從在研磨時研磨層不易軟化，且平坦化性、經時穩定性特別優異之點來看，聚胺基甲酸酯在50℃的溫水中飽和膨潤時的吸水率較佳為3%以下，再佳為2.7%以下，特佳為2.4%以下。
本實施形態之聚胺基甲酸酯可將包含有機聚異氰酸酯(A)、高分子多元醇(B)、鏈伸長劑(C)及化合物(D)之單體作為原料並藉由習知的聚胺基甲酸酯之製造方法進行製造。具體而言，例如，藉由預聚合物法或一步法(one-shot method)等習知的熔融聚合方法或溶液聚合方法等進行製造。作為熔融聚合方法，例如，可藉由在實質上不存在溶劑下使此等單體的混合物以既定的比例進行熔融捏合並聚合而製造。作為熔融捏合，可列舉例如使用多軸螺桿型擠製機進行連續熔融聚合的方法。又，作為溶液聚合方法，例如，可藉由在有機溶劑中使此等單體的混合物以既定的比例混合並聚合而製造。
以此方式所得到的本實施形態之聚胺基甲酸酯可為熱塑性聚胺基甲酸酯，亦可為熱固性聚胺基甲酸酯，但從低刮傷性更優異之點來看，較佳為熱塑性。此外，熱塑性意指可藉由擠製成形、射出成形、壓延成形、3D列印等的加熱步驟進行熔融而成形的特性。本實施形態之聚胺基甲酸酯可利用經由此等加熱步驟之成形方法而成形為片狀成形體等。特別是若利用使用T字模之擠製成形，則從可簡便地得到均勻厚度之片狀成形體之點來看為較佳。
從因硬度變高而發揮特別優異之平坦化性之點、因表面上無氣孔而不會引起研磨屑的堆積故低刮傷性優異之點、研磨層的磨耗速度小而可長時間使用之點來看，用作本實施形態之研磨層的聚胺基甲酸酯成形體較佳為非多孔性(非發泡體)。
又，從平坦化性、研磨速度及低刮傷性特別優異之點來看，研磨層在50℃的溫水中浸漬72小時後，於23℃的JIS-D硬度較佳為45~75，再佳為48~72，特佳為51~69。
又，從研磨速度變高、低刮傷性亦優異之點來看，研磨層與水接觸15分鐘後的接觸角越低越佳。具體而言，與水接觸15分鐘後的接觸角較佳為44°以下，再佳為42°以下，特佳為40°以下。研磨層與水的接觸角為44°以下的情況下，研磨漿液通常除了水、研磨粒以外，還包含水溶性低分子化合物，故研磨面的潤濕性高於水，有與研磨漿液的接觸角變得非常小的傾向。
本實施形態之聚胺基甲酸酯可用於各種用途，但特別是可較佳地作為用以研磨半導體晶圓、半導體裝置、矽晶圓、硬碟、玻璃基板、光學製品或各種金屬等的研磨墊之研磨層使用。研磨層的厚度並無特別限定，可因應研磨墊的層構成、用途而適當調整。具體而言，例如，較佳為0.8~3.0mm，再佳為1.0~2.5mm，特佳為1.2~2.0mm。又，藉由擠製成形、射出成形、壓延成形、3D列印等的成形方法，而將用於製造研磨層的片狀聚胺基甲酸酯成形體予以成形的情況下，片狀聚胺基甲酸酯成形體可為非多孔性，亦可為多孔性，但特佳為非多孔性。
研磨層係將以上述方式所得到之片狀聚胺基甲酸酯成形體藉由切削、切片、拋光、衝孔加工等來調整尺寸、形狀、厚度等而製造。又，為了對研磨面均勻且充分地供給漿液，較佳係於研磨層的研磨面上形成如溝槽或孔的凹部。這種凹部亦有助於將成為刮痕產生原因的研磨屑排出、防止因研磨墊的吸附所導致的晶圓破損。
本實施形態之研磨墊可為僅包含研磨層的單層型研磨墊，亦可為於研磨層的背面進一步積層緩衝層而成的多層型研磨墊。就緩衝層而言，為具有比研磨層硬度更低之硬度的層體時，從可維持平坦化性並提升研磨均勻性之點來看為較佳。
作為用作緩衝層之材料的具體例，可列舉：使聚胺基甲酸酯含浸於不織布而成的複合體(例如，「Suba400」(Nitta Haas(股)製))；天然橡膠、腈橡膠、聚丁二烯橡膠、聚矽氧橡膠等的橡膠；聚酯系熱塑性彈性體、聚醯胺系熱塑性彈性體、氟系熱塑性彈性體等的熱塑性彈性體；發泡塑膠；聚胺基甲酸酯等。此等之中，從容易得到作為緩衝層之較佳柔軟性之點來看，特佳為具有發泡結構之聚胺基甲酸酯。
本實施形態所得到之研磨墊可特佳地用於半導體基板或玻璃基板或者形成於半導體基板上之如氧化矽膜的絕緣膜或如銅膜的金屬膜的化學機械研磨等。
[實施例]
以下，藉由實施例進一步具體說明本發明。此外，本發明之範圍並不受此等實施例任何限定。
首先，關於本實施例中用於製造聚胺基甲酸酯的有機聚異氰酸酯(A)、高分子多元醇(B)、鏈伸長劑(C)、化合物(D)，彙整顯示於以下。
>聚異氰酸酯(A)>
･4,4‘-二苯甲烷二異氰酸酯 (MDI)
>高分子多元醇(B)>
･數量平均分子量850的聚四亞甲二醇 (PTG850)
･數量平均分子量1000的聚四亞甲二醇 (PTG1000)
･數量平均分子量600的聚乙二醇 (PEG600)
･數量平均分子量2000的聚乙二醇 (PEG2000)
>鏈伸長劑(C)>
･1,4-丁二醇 (BD)
･1,9-壬二醇 (ND)
>化合物(D)>
･MePOE4：R為甲基、(OX)100%為(O-CH2
CH2
)、n=4
･MePOE9：R為甲基、(OX)100%為(O-CH2
CH2
)、n=9
･MePOE23：R為甲基、(OX)100%為(O-CH2
CH2
)、n=23
･MePOE45：R為甲基、(OX)100%為(O-CH2
CH2
)、n=45
･MePOE91：R為甲基、(OX)100%為(O-CH2
CH2
)、n=91
･BuPOE3：R為丁基、(OX)100%為(O-CH2
CH2
)、n=3
･EHPOE6：R為2-乙基己基、(OX)100%為(O-CH2
CH2
)、n=6
･EHPOE30：R為2-乙基己基、(OX)100%為(O-CH2
CH2
)、n=30
･C10POE31：R為異癸基、(OX)100%為(O-CH2
CH2
)、n=31
･C12POE5：R為十二基、(OX)100%為(O-CH2
CH2
)、n=5
･C12POE19：R為十二基、(OX)100%為(O-CH2
CH2
)、n=19
･C12POE25：R為十二基、(OX)100%為(O-CH2
CH2
)、n=25
･C12POE41：R為十二基、(OX)100%為(O-CH2
CH2
)、n=41
･C13POE49：R為十三基、(OX)100%為(O-CH2
CH2
)、n=49
･C22POE30：R為二十二基、(OX)100%為(O-CH2
CH2
)、n=30
此外，上述化合物(D)係任一者之AH
皆為羥基。
[實施例1]
以MDI：PTG1000：PEG600：BD：MePOE9=49.0：31.7：3.6：14.2：1.5(質量比)的比例進行混合而製造胺基甲酸酯預聚物。然後，以小型捏合機，在240℃、螺桿旋轉數100rpm的條件下，將所得到之胺基甲酸酯預聚物捏合5分鐘，藉此得到熱塑性聚胺基甲酸酯。從原料摻合比所算出的源自異氰酸酯基之氮原子含量為5.5質量%，聚氧伸乙基的含有比例為5.0質量%。又，聚胺基甲酸酯中的末端基R-(OX)n
-的比例為1.5質量%、0.038mmol/g。又，藉由以下方法評價聚胺基甲酸酯於50℃的飽和吸水率。
>浸漬於50℃的水之後的飽和吸水率>
藉由熱壓而作成厚度約300μm的薄膜後，於25℃、50%RH的條件下放置3天。測定放置後的質量，作為乾燥時的質量。接著，將乾燥之薄膜浸漬於50℃的離子交換水，從50℃的水中取出後，立即擦去薄膜表面多餘的水滴並測定吸水後的質量。每2天測定樣本的質量，直到質量飽和為止，將質量不再變化時的吸水後之質量作為飽和吸水後的質量。藉由下式算出吸水率，結果為1.7質量%。
吸水率(%)=[(飽和吸水後的質量-乾燥時的質量)/乾燥時的質量]×100
然後，藉由真空熱壓而將所得到之聚胺基甲酸酯作成厚度約2mm的非多孔性片材後，將聚胺基甲酸酯片材的表面進行研削，藉此得到厚度1.5mm的聚胺基甲酸酯成形體。藉由以下方法，評價將聚胺基甲酸酯成形體浸漬於50℃的溫水中72小時後於23℃的JIS-D硬度及接觸角。
>浸漬於50℃的水中72小時後於23℃的JIS-D硬度>
將聚胺基甲酸酯成形體浸漬於50℃的離子交換水中72小時後，浸漬於23℃的水中30分鐘。從水中取出後，立即擦去表面多餘的水滴後，藉由依據JIS K6253的硬度計硬度試驗(D型)來測定硬度。D硬度為54。
>與水的接觸角>
在20℃、65%RH的條件下，將聚胺基甲酸酯成形體放置3天。然後使用協和界面科學(股)製DropMaster500，於聚胺基甲酸酯成形體上滴下水滴，測定滴下15分鐘後與水的接觸角。接觸角為40度。
接著，於厚度1.5mm的聚胺基甲酸酯成形體的成為研磨面之主面上，以3.0mm的間隔，螺旋狀地形成寬度0.5mm、深度1.0mm的溝槽。然後，將聚胺基甲酸酯成形體衝孔成直徑38cm的圓形而製造研磨層。然後，以雙面黏著片將緩衝層貼合於研磨層的背面，作成多層型研磨墊。作為緩衝層，係使用厚度0.8mm的發泡聚胺基甲酸酯製片材之Inoac Corporation(股)製「PORON H48」。然後，藉由以下評價方法，評價所得到之研磨墊的研磨特性。
>研磨速度、刮痕>
將所得到之研磨墊裝設於MAT(股)製研磨裝置「MAT-BC15」。然後，使用ALLIED MATERIAL(股)製鑽石修整器(鑽石編號#60、基底金屬直徑19cm)，在修整器旋轉數140rpm、研磨墊旋轉數100rpm、修整器載重5N的條件下，一邊以150mL/分鐘的速度流動純水，一邊使用鑽石修整器將研磨墊表面進行60分鐘調節(conditioning)。接著，準備pH12之研磨漿液，其係將Cabot Microelectronics公司製研磨漿液「SS-25」稀釋而調整成2倍。然後，在平台(platen)旋轉數100rpm、轉頭(head)旋轉數99rpm、研磨壓力41.4kPa的條件下，一邊以80mL/分鐘的速度將研磨漿液供給至研磨墊的研磨面，一邊將表面具有膜厚1000nm之氧化矽膜的直徑4英吋之矽晶圓進行60秒鐘研磨。然後，在研磨60秒鐘後，進行30秒鐘研磨墊的調節。然後，再次研磨另一矽晶圓，再進行30秒鐘調節。以此方式研磨10片矽晶圓。
然後，測定第10片研磨之矽晶圓在研磨前及研磨後的氧化矽膜之膜厚而求出研磨速度。研磨速度為299nm/min。又，針對第10片研磨之晶圓，使用KEYENCE(股)製雷射顯微鏡「VKX-200」，以接物鏡倍率1000倍隨機觀察100處，確認有無刮痕。未確認到刮痕。
>平坦化性>
在與上述相同的條件下，研磨一片SKW公司製STI研磨評價用圖案晶圓「SKW3-2」，其中該圖案晶圓具有凸部與凹部交互地重複排列的凹凸圖案。此外，此圖案晶圓具有各種寬度及間距的凹凸圖案區域。圖案凸部係於矽晶圓上積層膜厚15nm之氧化矽膜、並於其上積層膜厚170nm之氮化矽膜、再於其上積層膜厚700nm之氧化矽膜(藉由高密度電漿化學氣相沈積所形成之HDP氧化矽膜)而成的結構。圖案凹部係在將矽晶圓進行300nm蝕刻而形成溝槽後，形成膜厚700nm之HDP氧化矽膜而成的結構。作為評價對象，係選擇包含凸部寬度30μm及凹部寬度70μm之圖案的區域。將圖案晶圓研磨，時間為積層於圖案凸部之氮化矽膜上的氧化矽膜消失為止，再追加研磨相當於此時間之10%的時間。使用表面粗糙度測定機(Mitutoyo(股)製「SJ-400」)，在標準記錄針、測定範圍80μm、JIS2001、GAUSS過濾器、截止值λc2.5mm及截止值λs8.0μm的設定下進行測定，從剖面曲線求出研磨後上述圖案的高低差，結果為65nm。高低差越小平坦化性越優異。
結果顯示於下列表1。
[表1]
| 實施例編號 | 實施例1 | 實施例2 | 實施例3 | 實施例4 | 實施例5 | 實施例6 | 實施例7 | 比較例1 | 比較例2 | 比較例3 | 比較例4 | |
| 化合物(D)的種類 | MePOE9 | MePOE45 | MePOE45 | C10POE31 | C12PEO25 | C12PEO25 | C22PEO30 | - | - | - | MePOE4 | |
| 聚胺基甲酸酯原料中的化合物(D)的比例 | [質量%] | 1.5 | 1.5 | 4.8 | 6.2 | 1.7 | 3.6 | 1.7 | - | - | - | 1.0 |
| [mmol/g] | 0.038 | 0.008 | 0.024 | 0.042 | 0.013 | 0.028 | 0.010 | - | - | - | 0.048 | |
| 聚胺基甲酸酯 原料組成 [質量%] | MDI | 49.0 | 48.9 | 49.0 | 49.0 | 49.0 | 49.0 | 49.0 | 49.0 | 49.1 | 49.0 | 49.0 |
| PTG1000 | 31.7 | 31.7 | 31.3 | 30.0 | 31.3 | 31.2 | 31.2 | 31.9 | 27.6 | 31.4 | 31.4 | |
| PEG600 | 3.6 | 3.4 | - | - | 3.6 | 1.6 | 3.6 | 4.8 | 9.3 | - | 4.7 | |
| PEG2000 | - | - | - | - | - | - | - | - | - | 4.7 | - | |
| BD | 14.2 | 14.5 | 14.9 | 14.8 | 14.4 | 14.6 | 14.5 | 14.3 | 14.0 | 14.9 | 13.9 | |
| 化合物(D) | 1.5 | 1.5 | 4.8 | 6.2 | 1.7 | 3.6 | 1.7 | - | - | - | 1.0 | |
| 源自異氰酸酯基之 氮原子的含有比例[質量%] | 5.5% | 5.5% | 5.5% | 5.5% | 5.5% | 5.5% | 5.5% | 5.5% | 5.5% | 5.5% | 5.5% | |
| 末端聚氧伸乙基的 含有比例[質量%] | 5.0% | 4.9% | 4.7% | 5.7% | 5.1% | 4.7% | 5.0% | 4.8% | 9.3% | 4.7% | 5.5% | |
| 於50℃的溫水中 飽和膨潤時的吸水率[%] | 1.7% | 1.9% | 2.3% | 2.2% | 1.9% | 1.6% | 2.0% | 2.3% | 3.4% | 2.9% | 2.2% | |
| 於50℃溫水中 飽和膨潤後於23℃的JIS-D硬度 | 54 | 54 | 54 | 53 | 54 | 54 | 54 | 54 | 51 | 52 | 54 | |
| 經過15分鐘後的接觸角[度] | 40 | 40 | 38 | 40 | 38 | 34 | 38 | 46 | 41 | 42 | 45 | |
| 研磨速度[nm/min] | 299 | 305 | 316 | 301 | 321 | 336 | 310 | 265 | 251 | 259 | 271 | |
| 刮痕 | 無 | 無 | 無 | 無 | 無 | 無 | 無 | 無 | 無 | 無 | 無 | |
| 高低差[nm] | 65 | 60 | 60 | 60 | 60 | 60 | 65 | 70 | 80 | 75 | 70 |
[實施例2~7、比較例1~4]
除了將聚胺基甲酸酯之單體混合物的組成變更成表1所示之組成以外，以與實施例1相同的方式製造聚胺基甲酸酯。然後，以與實施例1相同的方式作成聚胺基甲酸酯成形體、研磨層及研磨墊，相同地進行評價。結果顯示於表1。
由表1的結果可知下列事項。使用具有氧伸乙基(O-CH2
CH2
)的重複單元數n在8~120之範圍的末端基的實施例1~7所得到之聚胺基甲酸酯的研磨層，儘管浸漬於50℃的水中時的飽和吸水率低，其與水的接觸角仍低。因此，抑制因吸水所導致的研磨層軟化，並且表面的親水性高，呈現高研磨速度、低刮傷性及高平坦化性。另一方面，使用不含具有聚氧伸乙基之末端基的比較例1~3所得到之聚胺基甲酸酯的研磨層或者使用氧伸乙基的重複單元數n小於8的比較例4所得到之聚胺基甲酸酯的研磨層，浸漬於50℃的水中時的飽和吸水率高，或者與水的接觸角高。因此，表面的親水性低，或者因為吸水而研磨層軟化，研磨速度變低，而且平坦化性亦低劣。
[實施例8~14、比較例5~8]
除了將聚胺基甲酸酯之單體混合物的組成變更成表2所示之組成以外，以與實施例1相同的方式製造聚胺基甲酸酯。然後，以與實施例1相同的方式作成聚胺基甲酸酯成形體、研磨層及研磨墊。然後，使用鑽石編號#100的鑽石修整器，並選擇包含凸部寬度100μm及凹部寬度100μm之圖案的區域作為評價對象的凹凸圖案，除此以外，與實施例1相同地進行評價。結果顯示於下列表2。
[表2]
| 實施例編號 | 實施例8 | 實施例9 | 實施例10 | 實施例11 | 實施例12 | 實施例13 | 實施例14 | 比較例5 | 比較例6 | 比較例7 | 比較例8 | |
| 化合物(D)的種類 | MePOE23 | MePOE45 | MePOE91 | EHPEO30 | C12PEO25 | C12PEO25 | C22PEO30 | - | - | - | - | |
| 聚胺基甲酸酯原料中的化合物(D)的比例 | [質量%] | 3.0 | 3.0 | 3.0 | 2.1 | 1.8 | 4.0 | 1.9 | - | - | - | - |
| [mmol/g] | 0.030 | 0.015 | 0.008 | 0.014 | 0.014 | 0.031 | 0.012 | - | - | - | - | |
| 聚胺基甲酸酯 原料組成[質量%] | MDI | 51.6 | 51.7 | 51.7 | 51.6 | 51.6 | 51.5 | 51.7 | 51.7 | 51.6 | 51.7 | 51.7 |
| PTG850 | 30.0 | 29.7 | 29.6 | 30.8 | 31.1 | 29.0 | 30.9 | 32.9 | 31.8 | 30.0 | 29.7 | |
| PEG600 | - | - | - | - | - | - | - | - | 1.2 | 3.0 | - | |
| PEG2000 | - | - | - | - | - | - | - | - | - | - | 3.0 | |
| BD | 15.4 | 15.6 | 15.7 | 15.5 | 15.5 | 15.5 | 15.5 | 15.4 | 15.4 | 15.3 | 15.6 | |
| 化合物(D) | 3.0 | 3.0 | 3.0 | 2.1 | 1.8 | 4.0 | 1.9 | - | - | - | - | |
| 源自異氰酸酯基之 氮原子的含有比例[質量%] | 5.8% | 5.8% | 5.8% | 5.8% | 5.8% | 5.8% | 5.8% | 5.8% | 5.8% | 5.8% | 5.8% | |
| 末端聚氧伸乙基 的含有比例[質量%] | 2.9% | 3.0% | 3.0% | 1.9% | 1.5% | 3.4% | 1.5% | 0.0% | 1.2% | 3.0% | 3.0% | |
| 於50℃的溫水中 飽和膨潤時的吸水率[%] | 1.7% | 2.1% | 2.3% | 2.3% | 1.5% | 1.8% | 1.5% | 1.6% | 1.7% | 1.9% | 1.9% | |
| 於50℃溫水中飽和膨潤後於23℃的JIS-D硬度 | 60 | 60 | 60 | 60 | 61 | 60 | 60 | 62 | 60 | 59 | 58 | |
| 經過15分鐘後的接觸角[度] | 44 | 42 | 41 | 44 | 42 | 39 | 44 | 52 | 51 | 50 | 49 | |
| 研磨速度[nm/min] | 395 | 412 | 421 | 383 | 400 | 434 | 407 | 316 | 324 | 333 | 341 | |
| 刮痕 | 無 | 無 | 無 | 無 | 無 | 無 | 無 | 有 | 有 | 無 | 無 | |
| 高低差[nm] | 60 | 55 | 50 | 60 | 55 | 50 | 60 | 65 | 65 | 65 | 70 |
由表2的結果可知下列事項。使用具有氧伸乙基的重複單元數n在8~120之範圍的末端基的實施例8~14所得到之聚胺基甲酸酯的研磨層，儘管浸漬於50℃的水中時的飽和吸水率低，其與水的接觸角仍低。因此，抑制因吸水所導致的研磨層軟化，並且表面的親水性高，呈現高研磨速度、低刮傷性及高平坦化性。另一方面，使用不含具有聚氧伸乙基之末端基的比較例5~8所得到之聚胺基甲酸酯的研磨層，研磨層表面的親水性低，研磨速度低，而且平坦化性、低刮傷性低劣。
[實施例15~21、比較例9~12]
除了將聚胺基甲酸酯之單體混合物的組成變更成表3所示之組成以外，以與實施例1相同的方式製造聚胺基甲酸酯。此外，在實施例21中，使用表3所示的2種化合物作為化合物(D)。然後，以與實施例1相同的方式作成聚胺基甲酸酯成形體、研磨層及研磨墊。然後，除了使用鑽石編號#100的鑽石修整器以外，與實施例1相同地進行評價。結果顯示於下列表3。
[表3]
| 實施例編號 | 實施例15 | 實施例16 | 實施例17 | 實施例18 | 實施例19 | 實施例20 | 實施例21 | 比較例9 | 比較例10 | 比較例11 | 比較例12 | |
| 化合物(D)的種類 | MePOE45 | MePOE45 | MePOE91 | C12PEO19 | C12PEO25 | C12PEO41 | (1)MePOE45 (2)C13PEO49 | - | - | - | EHPOE6 | |
| 聚胺基甲酸酯原料中的化合物(D)的比例 | [質量%] | 4.3 | 3.8 | 2.8 | 2.4 | 5.0 | 4.7 | 6.2 | - | - | - | 2.7 |
| [mmol/g] | 0.022 | 0.019 | 0.007 | 0.023 | 0.039 | 0.024 | 0.029 | - | - | - | 0.069 | |
| 聚胺基甲酸酯 原料組成[質量%] | MDI | 46.3 | 46.2 | 46.3 | 46.3 | 46.3 | 46.4 | 46.1 | 46.3 | 46.3 | 46.2 | 46.2 |
| PTG850 | 24.1 | 21.4 | 22.5 | 21.6 | 23.7 | 23.6 | 22.2 | 29.0 | 21.6 | 24.3 | 27.1 | |
| PEG600 | - | 3.8 | - | 2.4 | - | - | - | - | 8.2 | - | - | |
| PEG2000 | - | - | 2.8 | 2.4 | - | - | - | - | - | 4.3 | - | |
| ND | 25.3 | 24.8 | 25.6 | 24.9 | 25.0 | 25.3 | 25.5 | 24.7 | 23.9 | 25.2 | 24.0 | |
| 化合物(D) | 4.3 | 3.8 | 2.8 | 2.4 | 5.0 | 4.7 | (1) 3.1 | - | - | - | 2.7 | |
| (2) 3.1 | ||||||||||||
| 源自異氰酸酯基之 氮原子的含有比例[質量%] | 5.2% | 5.2% | 5.2% | 5.2% | 5.2% | 5.2% | 5.2% | 5.2% | 5.2% | 5.2% | 5.2% | |
| 末端聚氧伸乙基 的含有比例[質量%] | 4.2% | 7.5% | 5.6% | 6.8% | 4.3% | 4.3% | 5.9% | 0.0% | 8.2% | 4.3% | 1.8% | |
| 於50℃的溫水中 飽和膨潤時的吸水率[%] | 1.7% | 1.9% | 2.3% | 1.4% | 1.5% | 1.4% | 2.2% | 1.4% | 1.8% | 1.7% | 1.4% | |
| 於50℃溫水中 飽和膨潤後於23℃的JIS-D硬度 | 58 | 57 | 57 | 58 | 58 | 58 | 57 | 59 | 56 | 57 | 59 | |
| 經過15分鐘後的接觸角[度] | 43 | 42 | 42 | 42 | 38 | 40 | 39 | 56 | 52 | 51 | 55 | |
| 研磨速度[nm/min] | 370 | 381 | 388 | 393 | 412 | 395 | 401 | 288 | 328 | 330 | 287 | |
| 刮痕 | 無 | 無 | 無 | 無 | 無 | 無 | 無 | 有 | 無 | 無 | 有 | |
| 高低差[nm] | 65 | 60 | 60 | 55 | 55 | 55 | 55 | 70 | 70 | 70 | 65 |
由表3的結果可知下列事項。使用具有氧伸乙基的重複單元數n在8~120之範圍的末端基的實施例15~21所得到之聚胺基甲酸酯的研磨層，儘管浸漬於50℃的水中時的飽和吸水率低，其與水的接觸角仍低。因此，抑制因吸水所導致的研磨層軟化，並且表面的親水性高，呈現高研磨速度及低刮傷性、高平坦化性。另一方面，使用不含具有聚氧伸乙基之末端基的比較例9~11所得到之聚胺基甲酸酯的研磨層或者使用氧伸乙基的重複單元數n小於8的比較例12所得到之聚胺基甲酸酯的研磨層，則與水的接觸角高。因此，表面的親水性低、研磨速度變低，平坦化性、低刮傷性低劣。
[實施例22~25，比較例13~19]
除了將聚胺基甲酸酯之單體混合物的組成變更成表4所示之組成以外，以與實施例1相同的方式製造聚胺基甲酸酯。然後，以與實施例1相同的方式作成聚胺基甲酸酯成形體。然後，於聚胺基甲酸酯成形體的成為研磨面之主面上，以6.0mm的間隔，螺旋狀地形成寬度1.0mm、深度1.0mm的溝槽，除此以外，以與實施例1相同的方式作成研磨層及研磨墊。然後，使用鑽石編號#200的鑽石修整器，選擇包含凸部寬度250μm及凹部寬度250μm之圖案的區域作為評價對象的凹凸圖案，除此以外，與實施例1相同地進行評價。結果顯示於下列表4。
[表4]
| 實施例編號 | 實施例22 | 實施例23 | 實施例24 | 實施例25 | 比較例13 | 比較例14 | 比較例15 | 比較例16 | 比較例17 | 比較例18 | 比較例19 | |
| 化合物(D)的種類 | MePOE45 | MePOE91 | C12PEO41 | C13PEO49 | - | - | - | MePOE4 | BuPOE3 | EHPOE6 | C12POE5 | |
| (D)相對於聚胺基甲酸酯的比例 | [質量%] | 6.8 | 6.8 | 7.5 | 7.4 | - | - | - | 1.2 | 1.0 | 2.1 | 2.0 |
| [mmol/g] | 0.034 | 0.017 | 0.038 | 0.031 | - | - | - | 0.058 | 0.049 | 0.053 | 0.049 | |
| 聚胺基甲酸酯 原料組成[質量%] | MDI | 54.4 | 54.3 | 54.3 | 54.4 | 54.4 | 54.4 | 54.4 | 54.3 | 54.2 | 54.3 | 54.4 |
| PTG850 | 21.6 | 21.5 | 21.0 | 20.9 | 28.9 | 22.4 | 21.6 | 23.0 | 22.2 | 22.2 | 21.2 | |
| PEG600 | - | - | - | - | - | 6.8 | - | 5.4 | - | 5.2 | - | |
| PEG2000 | - | - | - | - | - | - | 6.8 | - | 5.8 | - | 5.5 | |
| BD | 17.2 | 17.4 | 17.2 | 17.3 | 16.7 | 16.4 | 17.2 | 16.1 | 16.8 | 16.2 | 16.9 | |
| 化合物(D) | 6.8 | 6.8 | 7.5 | 7.4 | - | - | - | 1.2 | 1.0 | 2.1 | 2.0 | |
| 源自異氰酸酯基之 氮原子的含有比例[質量%] | 6.1% | 6.1% | 6.1% | 6.1% | 6.1% | 6.1% | 6.1% | 6.1% | 6.1% | 6.1% | 6.1% | |
| 末端聚氧伸乙基的含有比例[質量%] | 6.7% | 6.7% | 6.8% | 6.8% | 0.0% | 6.8% | 6.8% | 6.4% | 6.4% | 6.6% | 6.6% | |
| 於50℃的溫水中 飽和膨潤時的吸水率[%] | 1.9% | 2.0% | 1.7% | 2.1% | 1.9% | 2.2% | 2.4% | 2.1% | 2.4% | 2.0% | 2.1% | |
| 於50℃溫水中 飽和膨潤後於23℃的JIS-D硬度 | 69 | 68 | 68 | 68 | 70 | 68 | 67 | 68 | 68 | 68 | 67 | |
| 經過15分鐘後的接觸角[度] | 42 | 41 | 39 | 40 | 51 | 46 | 46 | 47 | 46 | 46 | 47 | |
| 研磨速度[nm/min] | 357 | 363 | 374 | 351 | 253 | 280 | 294 | 277 | 284 | 318 | 307 | |
| 刮痕 | 無 | 無 | 無 | 無 | 有 | 無 | 無 | 有 | 無 | 有 | 無 | |
| 高低差[nm] | 95 | 90 | 90 | 95 | 115 | 110 | 105 | 110 | 110 | 100 | 105 |
由表4的結果可知下列事項。使用具有氧伸乙基的重複單元數n在8~120之範圍的末端基的實施例22~25所得到之聚胺基甲酸酯的研磨層，儘管浸漬於50℃的水中時的飽和吸水率低，其與水的接觸角仍低。因此，抑制因吸水所導致的研磨層軟化，並且表面的親水性高，呈現高研磨速度、低刮傷性及高平坦化性。另一方面，使用不含具有聚氧伸乙基之末端基的比較例13~15所得到之聚胺基甲酸酯的研磨層或者使用氧伸乙基的重複單元數n小於8的比較例16~19所得到之聚胺基甲酸酯的研磨層，則與水的接觸角高。因此，研磨層表面的親水性低，研磨速度低，而且平坦化性、低刮傷性低劣。
[產業上的可利用性]
本發明之聚胺基甲酸酯、研磨層用成形體及研磨墊對於半導體基板或玻璃等的研磨用途係有用。在將半導體或硬碟、液晶顯示器等的基板材料、或者透鏡或反射鏡等的光學零件等進行化學機械研磨時特別適合。
無。
無。
無。
Claims (14)
- 一種研磨層用聚胺基甲酸酯，其係於聚胺基甲酸酯分子鏈末端具有下列式(I)所示之末端基的聚胺基甲酸酯：R-(OX)n-…(I)[式(I)中，R表示可經雜原子取代、亦可有雜原子介於其間的碳數1~30之一價烴基，X表示90~100%為伸乙基的碳數2~4之伸烷基，n表示8~120之數值]。
- 如請求項1之研磨層用聚胺基甲酸酯，其中該R為碳數1~22之脂肪族烴基。
- 如請求項1之研磨層用聚胺基甲酸酯，其中該n為15~100。
- 如請求項1之研磨層用聚胺基甲酸酯，其中含有0.005~0.05mmol/g的該式(I)所示之末端基。
- 如請求項1之研磨層用聚胺基甲酸酯，其中含有1~10質量%的該式(I)所示之末端基。
- 如請求項1之研磨層用聚胺基甲酸酯，其係有機聚異氰酸酯(A)、高分子多元醇(B)、鏈伸長劑(C)及下列式(II)所示之化合物(D)的反應生成物：R-(OX)n-AH…(II)[式(II)中，R、X及n與式(I)相同，AH為羥基、胺基、或包含該等的碳數1~4之一價烴基]。
- 如請求項6之研磨層用聚胺基甲酸酯，其中該有機聚異氰酸酯(A)的源自異氰酸酯基之氮原子的比例為4.6~6.8質量%。
- 如請求項6之研磨層用聚胺基甲酸酯，其中該高分子多元醇(B)含有70質量%以上的聚四亞甲二醇。
- 如請求項1之研磨層用聚胺基甲酸酯，其中使該聚胺基甲酸酯於50℃的溫水中飽和膨潤時的吸水率為3%以下。
- 如請求項1之研磨層用聚胺基甲酸酯，其具有熱塑性。
- 一種研磨層，其係如請求項1之研磨層用聚胺基甲酸酯的成形體。
- 如請求項11之研磨層，其為非多孔性。
- 如請求項11之研磨層，其浸漬於50℃的溫水72小時後，於23℃的JIS-D硬度為45~75。
- 一種研磨墊，其包含：研磨層，包含如請求項1至10中任一項之研磨層用聚胺基甲酸酯；及緩衝層，具有比該研磨層之硬度更低的硬度。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018226291 | 2018-12-03 | ||
| JP2018-226291 | 2018-12-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202026324A TW202026324A (zh) | 2020-07-16 |
| TWI714336B true TWI714336B (zh) | 2020-12-21 |
Family
ID=70974217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108140211A TWI714336B (zh) | 2018-12-03 | 2019-11-06 | 研磨層用聚胺基甲酸酯、研磨層及研磨墊 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20210388234A1 (zh) |
| EP (1) | EP3892418A4 (zh) |
| JP (1) | JP6960063B2 (zh) |
| KR (1) | KR102638363B1 (zh) |
| CN (1) | CN113039041B (zh) |
| IL (1) | IL282788B2 (zh) |
| SG (1) | SG11202104629QA (zh) |
| TW (1) | TWI714336B (zh) |
| WO (1) | WO2020115968A1 (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI812936B (zh) * | 2021-04-01 | 2023-08-21 | 智勝科技股份有限公司 | 研磨墊及研磨方法 |
| IL311635A (en) * | 2021-09-30 | 2024-05-01 | Kuraray Co | Thermoplastic polyurethane for the polishing layer, the polishing layer, and the polishing pad |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007063323A (ja) * | 2005-08-29 | 2007-03-15 | Dainippon Ink & Chem Inc | 研磨パッド用ポリウレタン組成物及びそれを用いた研磨パッド |
| WO2009131106A1 (ja) * | 2008-04-25 | 2009-10-29 | トーヨーポリマー株式会社 | ポリウレタン発泡体及び研磨パッド |
| EP2316614A1 (en) * | 2008-08-08 | 2011-05-04 | Kuraray Co., Ltd. | Polishing pad and method for manufacturing the polishing pad |
| CN102449017A (zh) * | 2009-06-18 | 2012-05-09 | Jsr株式会社 | 聚氨酯及含有它的研磨层形成用组合物、以及化学机械研磨用垫及使用它的化学机械研磨方法 |
| WO2018021428A1 (ja) * | 2016-07-29 | 2018-02-01 | 株式会社クラレ | 研磨パッドおよびそれを用いた研磨方法 |
| US20180071888A1 (en) * | 2016-09-13 | 2018-03-15 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | High planarization efficiency chemical mechanical polishing pads and methods of making |
| TW201821464A (zh) * | 2016-11-30 | 2018-06-16 | 美商羅門哈斯電子材料Ｃｍｐ控股公司 | 用於化學機械拋光墊的改進組合物以及由其製備的cmp墊 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4079028A (en) * | 1975-10-03 | 1978-03-14 | Rohm And Haas Company | Polyurethane thickeners in latex compositions |
| US4971882A (en) * | 1988-12-22 | 1990-11-20 | Xerox Corporation | Toner and developer compositions with waxes and charge enhancing additives |
| JP3543825B2 (ja) * | 1992-04-21 | 2004-07-21 | 日清オイリオ株式会社 | 艶出し剤組成物 |
| DE4327481A1 (de) * | 1993-08-16 | 1995-02-23 | Bayer Ag | Als Verdickungsmittel geeignete Polyurethane und ihre Verwendung zur Verdickung wäßriger Systeme |
| JP3918359B2 (ja) | 1998-05-15 | 2007-05-23 | Ｊｓｒ株式会社 | 研磨パッド用重合体組成物および研磨パッド |
| JP3880028B2 (ja) | 1999-08-06 | 2007-02-14 | Ｊｓｒ株式会社 | 研磨パッド用重合体組成物及びそれを用いた研磨パッド |
| JP3925041B2 (ja) | 2000-05-31 | 2007-06-06 | Ｊｓｒ株式会社 | 研磨パッド用組成物及びこれを用いた研磨パッド |
| JP3851135B2 (ja) | 2001-10-17 | 2006-11-29 | ニッタ・ハース株式会社 | 研磨パッド |
| JP3571334B2 (ja) | 2002-05-20 | 2004-09-29 | 東洋紡績株式会社 | 研磨パッド |
| JP4189963B2 (ja) | 2003-08-21 | 2008-12-03 | 東洋ゴム工業株式会社 | 研磨パッド |
| TWI403387B (zh) * | 2005-09-22 | 2013-08-01 | Kuraray Co | 高分子材料、由它得到之發泡體及使用它之研磨墊 |
| JP5506008B2 (ja) * | 2005-11-08 | 2014-05-28 | 東洋ゴム工業株式会社 | 研磨パッド |
| CN101096475B (zh) * | 2006-06-27 | 2011-04-20 | 深圳市海川实业股份有限公司 | 一种聚氨酯增稠剂的制备方法 |
| JP2008235508A (ja) * | 2007-03-20 | 2008-10-02 | Kuraray Co Ltd | 研磨パッド、それを用いた研磨方法および半導体デバイスの製造方法 |
| CN102101908B (zh) * | 2009-12-18 | 2012-11-28 | 广州熵能聚合物技术有限公司 | 一种水溶性聚氨酯缔合型增稠剂及其应用 |
| JP5528169B2 (ja) * | 2010-03-26 | 2014-06-25 | 東洋ゴム工業株式会社 | 研磨パッドおよびその製造方法、ならびに半導体デバイスの製造方法 |
| JP5426469B2 (ja) * | 2010-05-10 | 2014-02-26 | 東洋ゴム工業株式会社 | 研磨パッドおよびガラス基板の製造方法 |
| JP5738731B2 (ja) * | 2011-09-22 | 2015-06-24 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP5789523B2 (ja) * | 2012-01-10 | 2015-10-07 | 株式会社クラレ | 研磨パッド、及び研磨パッドを用いた化学的機械的研磨方法 |
| EP2999728A1 (en) * | 2013-05-22 | 2016-03-30 | Lubrizol Advanced Materials, Inc. | Articles made from thermoplastic polyurethanes with crystalline chain ends |
| CN105170019B (zh) * | 2015-07-31 | 2018-03-23 | 泰山玻璃纤维有限公司 | 一种阳离子型聚氨酯大分子多子表面活性剂的制备方法 |
-
2019
- 2019-09-03 JP JP2020559723A patent/JP6960063B2/ja active Active
- 2019-09-03 IL IL282788A patent/IL282788B2/en unknown
- 2019-09-03 EP EP19893889.6A patent/EP3892418A4/en active Pending
- 2019-09-03 WO PCT/JP2019/034512 patent/WO2020115968A1/ja active Application Filing
- 2019-09-03 SG SG11202104629QA patent/SG11202104629QA/en unknown
- 2019-09-03 KR KR1020217015876A patent/KR102638363B1/ko active IP Right Grant
- 2019-09-03 US US17/288,579 patent/US20210388234A1/en active Pending
- 2019-09-03 CN CN201980075650.3A patent/CN113039041B/zh active Active
- 2019-11-06 TW TW108140211A patent/TWI714336B/zh active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007063323A (ja) * | 2005-08-29 | 2007-03-15 | Dainippon Ink & Chem Inc | 研磨パッド用ポリウレタン組成物及びそれを用いた研磨パッド |
| WO2009131106A1 (ja) * | 2008-04-25 | 2009-10-29 | トーヨーポリマー株式会社 | ポリウレタン発泡体及び研磨パッド |
| EP2316614A1 (en) * | 2008-08-08 | 2011-05-04 | Kuraray Co., Ltd. | Polishing pad and method for manufacturing the polishing pad |
| CN102449017A (zh) * | 2009-06-18 | 2012-05-09 | Jsr株式会社 | 聚氨酯及含有它的研磨层形成用组合物、以及化学机械研磨用垫及使用它的化学机械研磨方法 |
| WO2018021428A1 (ja) * | 2016-07-29 | 2018-02-01 | 株式会社クラレ | 研磨パッドおよびそれを用いた研磨方法 |
| US20180071888A1 (en) * | 2016-09-13 | 2018-03-15 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | High planarization efficiency chemical mechanical polishing pads and methods of making |
| TW201821464A (zh) * | 2016-11-30 | 2018-06-16 | 美商羅門哈斯電子材料Ｃｍｐ控股公司 | 用於化學機械拋光墊的改進組合物以及由其製備的cmp墊 |
Also Published As
| Publication number | Publication date |
|---|---|
| SG11202104629QA (en) | 2021-06-29 |
| IL282788A (en) | 2021-06-30 |
| KR20210082497A (ko) | 2021-07-05 |
| EP3892418A4 (en) | 2022-08-17 |
| US20210388234A1 (en) | 2021-12-16 |
| JPWO2020115968A1 (ja) | 2021-10-07 |
| IL282788B2 (en) | 2024-08-01 |
| IL282788B1 (en) | 2024-04-01 |
| EP3892418A1 (en) | 2021-10-13 |
| CN113039041A (zh) | 2021-06-25 |
| JP6960063B2 (ja) | 2021-11-05 |
| TW202026324A (zh) | 2020-07-16 |
| WO2020115968A1 (ja) | 2020-06-11 |
| KR102638363B1 (ko) | 2024-02-19 |
| CN113039041B (zh) | 2023-04-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102170859B1 (ko) | 연마 패드 및 그것을 사용한 연마 방법 | |
| US10625391B2 (en) | Non-porous molded article for polishing layer, polishing pad, and polishing method | |
| CN107000157B (zh) | 抛光层用成型体及抛光垫 | |
| TWI714336B (zh) | 研磨層用聚胺基甲酸酯、研磨層及研磨墊 | |
| JP7097171B2 (ja) | 研磨パッド | |
| TWI813885B (zh) | 研磨墊、研磨墊的製造方法及研磨方法 | |
| WO2021117834A1 (ja) | ポリウレタン、研磨層、研磨パッド及び研磨方法 | |
| EP4382250A1 (en) | Polishing pad | |
| JP7253475B2 (ja) | 研磨パッド及び研磨パッドをコンパクト化する方法 | |
| WO2023149434A1 (ja) | 研磨層、研磨パッド、研磨パッドの製造方法及び研磨方法 | |
| WO2023054331A1 (ja) | 研磨層用熱可塑性ポリウレタン、研磨層、及び研磨パッド |