TWI712837B - 顯示裝置 - Google Patents

顯示裝置 Download PDF

Info

Publication number
TWI712837B
TWI712837B TW108127256A TW108127256A TWI712837B TW I712837 B TWI712837 B TW I712837B TW 108127256 A TW108127256 A TW 108127256A TW 108127256 A TW108127256 A TW 108127256A TW I712837 B TWI712837 B TW I712837B
Authority
TW
Taiwan
Prior art keywords
layer
display device
link
electrode
item
Prior art date
Application number
TW108127256A
Other languages
English (en)
Chinese (zh)
Other versions
TW202011092A (zh
Inventor
李台源
朴鍾贊
嚴玹哲
Original Assignee
南韓商Ｌｇ顯示器股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商Ｌｇ顯示器股份有限公司 filed Critical 南韓商Ｌｇ顯示器股份有限公司
Publication of TW202011092A publication Critical patent/TW202011092A/zh
Application granted granted Critical
Publication of TWI712837B publication Critical patent/TWI712837B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/451—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by the compositions or shapes of the interlayer dielectrics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H10D86/443—Interconnections, e.g. scanning lines adapted for preventing breakage, peeling or short circuiting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/80—Constructional details
    • H10K10/82—Electrodes
    • H10K10/84—Ohmic electrodes, e.g. source or drain electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H10K59/1315—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Geometry (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
TW108127256A 2018-09-11 2019-07-31 顯示裝置 TWI712837B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020180108411A KR102658427B1 (ko) 2018-09-11 2018-09-11 표시 장치
KR10-2018-0108411 2018-09-11

Publications (2)

Publication Number Publication Date
TW202011092A TW202011092A (zh) 2020-03-16
TWI712837B true TWI712837B (zh) 2020-12-11

Family

ID=69621431

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108127256A TWI712837B (zh) 2018-09-11 2019-07-31 顯示裝置

Country Status (7)

Country Link
US (3) US10991782B2 (https=)
JP (4) JP7101149B2 (https=)
KR (1) KR102658427B1 (https=)
CN (1) CN110890400B (https=)
DE (1) DE102019120820B4 (https=)
GB (1) GB2578200B (https=)
TW (1) TWI712837B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021189488A1 (zh) * 2020-03-27 2021-09-30 京东方科技集团股份有限公司 显示面板和显示装置
US20230172035A1 (en) * 2020-05-18 2023-06-01 Sharp Kabushiki Kaisha Display device
CN111933681A (zh) 2020-09-07 2020-11-13 深圳市华星光电半导体显示技术有限公司 顶发光amoled显示面板、制作方法以及显示装置
CN112436036B (zh) * 2020-11-20 2023-06-30 合肥维信诺科技有限公司 显示基板、显示面板及显示装置
CN116762476A (zh) * 2021-02-03 2023-09-15 株式会社半导体能源研究所 显示装置的制造方法
KR20240038895A (ko) 2022-09-16 2024-03-26 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
KR20240106258A (ko) * 2022-12-29 2024-07-08 엘지디스플레이 주식회사 디스플레이 장치
TWI857663B (zh) * 2023-06-17 2024-10-01 友達光電股份有限公司 顯示面板
WO2025220174A1 (ja) * 2024-04-18 2025-10-23 シャープディスプレイテクノロジー株式会社 表示装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI578593B (zh) * 2012-12-07 2017-04-11 樂金顯示科技股份有限公司 有機發光二極體裝置及其製造方法
TWI582945B (zh) * 2016-07-27 2017-05-11 友達光電股份有限公司 畫素結構及顯示面板
US20180033821A1 (en) * 2016-07-29 2018-02-01 Lg Display Co., Ltd. Organic light emitting display device
CN108123062A (zh) * 2016-11-29 2018-06-05 乐金显示有限公司 有机发光显示装置

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4552239B2 (ja) * 1999-05-12 2010-09-29 ソニー株式会社 表示用薄膜半導体素子及び表示装置
KR100583311B1 (ko) 2003-10-14 2006-05-25 엘지.필립스 엘시디 주식회사 액정표시패널 및 그 제조 방법
KR101503122B1 (ko) 2012-09-26 2015-03-18 엘지디스플레이 주식회사 유기전계발광표시장치와 이의 제조방법
US9122116B2 (en) 2011-07-20 2015-09-01 Sharp Kabushiki Kaisha Active matrix substrate and display panel including the same
KR101971201B1 (ko) * 2012-08-20 2019-04-23 삼성디스플레이 주식회사 양면 표시 장치 및 이의 제작 방법
KR102222680B1 (ko) * 2013-02-01 2021-03-03 엘지디스플레이 주식회사 플렉서블 디스플레이 기판, 플렉서블 유기 발광 표시 장치 및 플렉서블 유기 발광 표시 장치 제조 방법
US9740035B2 (en) * 2013-02-15 2017-08-22 Lg Display Co., Ltd. Flexible organic light emitting display device and method for manufacturing the same
KR102066087B1 (ko) 2013-05-28 2020-01-15 엘지디스플레이 주식회사 플렉서블 표시장치 및 그의 제조방법
US9614021B2 (en) * 2013-07-24 2017-04-04 Samsung Display Co., Ltd. Organic light-emitting display apparatus and manufacturing method thereof
KR102204785B1 (ko) 2014-07-25 2021-01-19 엘지디스플레이 주식회사 유기전계발광 표시장치 및 그 제조 방법
KR102482986B1 (ko) * 2014-12-29 2022-12-29 엘지디스플레이 주식회사 유기 발광 표시 장치 및 그의 제조 방법
US10032844B2 (en) 2014-12-29 2018-07-24 Lg Display Co., Ltd. Organic light emitting display device and method of manufacturing the same
KR102455318B1 (ko) 2015-10-30 2022-10-18 삼성디스플레이 주식회사 유기 발광 표시 장치
KR102505879B1 (ko) * 2016-03-24 2023-03-06 삼성디스플레이 주식회사 디스플레이 장치
KR102571085B1 (ko) * 2016-04-04 2023-08-28 삼성디스플레이 주식회사 디스플레이 장치
KR102615113B1 (ko) * 2016-05-10 2023-12-19 삼성디스플레이 주식회사 플렉서블 디스플레이 장치
KR101859484B1 (ko) * 2016-05-30 2018-05-21 엘지디스플레이 주식회사 표시 장치 및 그 제조 방법
KR102671040B1 (ko) * 2016-10-10 2024-06-03 삼성디스플레이 주식회사 디스플레이 장치
KR101920770B1 (ko) * 2016-10-31 2018-11-22 엘지디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
KR102794402B1 (ko) * 2016-10-31 2025-04-09 엘지디스플레이 주식회사 유기발광 표시장치
KR102594921B1 (ko) 2016-10-31 2023-10-26 엘지디스플레이 주식회사 유기 발광 표시 장치
KR102731256B1 (ko) 2016-12-30 2024-11-19 엘지디스플레이 주식회사 표시장치와 그의 제조방법
KR102787595B1 (ko) * 2017-01-10 2025-04-01 삼성디스플레이 주식회사 표시 장치
JP6827332B2 (ja) * 2017-02-01 2021-02-10 株式会社ジャパンディスプレイ 表示装置
KR102126552B1 (ko) 2017-12-19 2020-06-24 엘지디스플레이 주식회사 표시 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI578593B (zh) * 2012-12-07 2017-04-11 樂金顯示科技股份有限公司 有機發光二極體裝置及其製造方法
TWI582945B (zh) * 2016-07-27 2017-05-11 友達光電股份有限公司 畫素結構及顯示面板
US20180033821A1 (en) * 2016-07-29 2018-02-01 Lg Display Co., Ltd. Organic light emitting display device
CN108123062A (zh) * 2016-11-29 2018-06-05 乐金显示有限公司 有机发光显示装置

Also Published As

Publication number Publication date
US11778860B2 (en) 2023-10-03
KR20200029861A (ko) 2020-03-19
JP7397900B2 (ja) 2023-12-13
GB201912006D0 (en) 2019-10-02
US20200083307A1 (en) 2020-03-12
US10991782B2 (en) 2021-04-27
DE102019120820A1 (de) 2020-03-12
TW202011092A (zh) 2020-03-16
JP2020043058A (ja) 2020-03-19
US20210225976A1 (en) 2021-07-22
JP2022084762A (ja) 2022-06-07
JP7101149B2 (ja) 2022-07-14
KR102658427B1 (ko) 2024-04-17
CN110890400A (zh) 2020-03-17
GB2578200B (en) 2021-11-03
JP2025106622A (ja) 2025-07-15
US20230354645A1 (en) 2023-11-02
JP2024023492A (ja) 2024-02-21
GB2578200A (en) 2020-04-22
JP7675158B2 (ja) 2025-05-12
US12414369B2 (en) 2025-09-09
DE102019120820B4 (de) 2023-10-12
CN110890400B (zh) 2023-09-08

Similar Documents

Publication Publication Date Title
TWI712837B (zh) 顯示裝置
TWI747461B (zh) 具有基板孔的顯示裝置
TWI760011B (zh) 顯示裝置及其製造方法
JP6709274B2 (ja) 表示装置
JP6818729B2 (ja) 表示装置
US12336383B2 (en) Display panel and display device comprising the same
CN108242457A (zh) 显示装置
CN104167508A (zh) 发光器件、发光器件的制造方法和显示单元
CN111200081B (zh) 有机发光显示装置和发光显示装置
TW202125195A (zh) 觸控顯示器裝置
CN116382501A (zh) 触摸显示设备
US9911802B2 (en) Display device and method for manufacturing the same
CN117460327A (zh) 发光显示设备及其制造方法
KR102515631B1 (ko) 유기 발광 표시 장치
JP2023164876A (ja) 有機発光表示装置
KR20210086059A (ko) 표시 장치 및 그의 제조 방법
CN219696456U (zh) 显示装置