TWI704016B - 油墨塗佈裝置及油墨塗佈方法 - Google Patents

油墨塗佈裝置及油墨塗佈方法 Download PDF

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Publication number
TWI704016B
TWI704016B TW108113693A TW108113693A TWI704016B TW I704016 B TWI704016 B TW I704016B TW 108113693 A TW108113693 A TW 108113693A TW 108113693 A TW108113693 A TW 108113693A TW I704016 B TWI704016 B TW I704016B
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TW
Taiwan
Prior art keywords
ink
edge
area
inkjet head
coating
Prior art date
Application number
TW108113693A
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English (en)
Chinese (zh)
Other versions
TW201946697A (zh
Inventor
村野賢一
Original Assignee
日商住友重機械工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商住友重機械工業股份有限公司 filed Critical 日商住友重機械工業股份有限公司
Publication of TW201946697A publication Critical patent/TW201946697A/zh
Application granted granted Critical
Publication of TWI704016B publication Critical patent/TWI704016B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Ink Jet (AREA)
TW108113693A 2018-05-17 2019-04-19 油墨塗佈裝置及油墨塗佈方法 TWI704016B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018095507A JP6968505B2 (ja) 2018-05-17 2018-05-17 インク塗布装置及びインク塗布方法
JP2018-095507 2018-05-17

Publications (2)

Publication Number Publication Date
TW201946697A TW201946697A (zh) 2019-12-16
TWI704016B true TWI704016B (zh) 2020-09-11

Family

ID=68585247

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108113693A TWI704016B (zh) 2018-05-17 2019-04-19 油墨塗佈裝置及油墨塗佈方法

Country Status (4)

Country Link
JP (1) JP6968505B2 (ja)
KR (1) KR20190132204A (ja)
CN (1) CN110505762A (ja)
TW (1) TWI704016B (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7464378B2 (ja) * 2019-11-22 2024-04-09 住友重機械工業株式会社 インク塗布制御装置及びインク塗布方法
JP7428541B2 (ja) * 2020-03-02 2024-02-06 住友重機械工業株式会社 インク塗布装置、インク塗布装置の制御装置、及びインク塗布方法
JP7488108B2 (ja) * 2020-05-19 2024-05-21 住友重機械工業株式会社 インク塗布装置、その制御装置、及びインク塗布方法
JP7495276B2 (ja) * 2020-06-01 2024-06-04 住友重機械工業株式会社 印刷用データ生成装置及びインク塗布装置の制御装置
KR102468359B1 (ko) 2020-11-30 2022-11-17 (주)에스티아이 잉크젯 토출 제어 방법과 이를 이용한 잉크젯 프린트 시스템
KR102473638B1 (ko) 2020-12-29 2022-12-02 (주)에스티아이 잉크젯 프린트 시스템
CN117957069A (zh) * 2021-09-24 2024-04-30 富士胶片株式会社 图案形成基板制造方法及液体排出装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004104104A (ja) * 2003-08-04 2004-04-02 Ricoh Co Ltd 液状樹脂噴射装置及び樹脂構造物
TW201208888A (en) * 2010-06-30 2012-03-01 Fujifilm Corp Liquid application device, liquid application method, and nanoimprint system
TW201309135A (zh) * 2011-07-15 2013-02-16 Sumitomo Heavy Industries 薄膜形成方法及薄膜形成裝置
TW201334876A (zh) * 2012-01-06 2013-09-01 Sumitomo Heavy Industries 薄膜形成裝置及薄膜形成方法
TWI528470B (zh) * 2013-07-25 2016-04-01 Sumitomo Heavy Industries Film forming method and thin film forming apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5764997B2 (ja) * 2011-03-22 2015-08-19 セイコーエプソン株式会社 印刷装置、印刷方法及びプログラム
JP2013011775A (ja) 2011-06-30 2013-01-17 Kyocera Document Solutions Inc 画像形成装置
JP6053459B2 (ja) * 2012-11-01 2016-12-27 住友重機械工業株式会社 基板製造方法及び基板製造装置
JP2014104385A (ja) * 2012-11-26 2014-06-09 Sumitomo Heavy Ind Ltd 基板製造方法及び基板製造装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004104104A (ja) * 2003-08-04 2004-04-02 Ricoh Co Ltd 液状樹脂噴射装置及び樹脂構造物
TW201208888A (en) * 2010-06-30 2012-03-01 Fujifilm Corp Liquid application device, liquid application method, and nanoimprint system
TW201309135A (zh) * 2011-07-15 2013-02-16 Sumitomo Heavy Industries 薄膜形成方法及薄膜形成裝置
TW201334876A (zh) * 2012-01-06 2013-09-01 Sumitomo Heavy Industries 薄膜形成裝置及薄膜形成方法
TWI528470B (zh) * 2013-07-25 2016-04-01 Sumitomo Heavy Industries Film forming method and thin film forming apparatus

Also Published As

Publication number Publication date
JP6968505B2 (ja) 2021-11-17
CN110505762A (zh) 2019-11-26
JP2019198834A (ja) 2019-11-21
KR20190132204A (ko) 2019-11-27
TW201946697A (zh) 2019-12-16

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