JP6662725B2 - 塗布パターン形成方法、塗布パターン形成装置、および塗布パターン付き基材 - Google Patents
塗布パターン形成方法、塗布パターン形成装置、および塗布パターン付き基材 Download PDFInfo
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- JP6662725B2 JP6662725B2 JP2016126862A JP2016126862A JP6662725B2 JP 6662725 B2 JP6662725 B2 JP 6662725B2 JP 2016126862 A JP2016126862 A JP 2016126862A JP 2016126862 A JP2016126862 A JP 2016126862A JP 6662725 B2 JP6662725 B2 JP 6662725B2
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- 238000000034 method Methods 0.000 title claims description 25
- 239000000758 substrate Substances 0.000 title claims description 22
- 238000000576 coating method Methods 0.000 claims description 149
- 239000011248 coating agent Substances 0.000 claims description 148
- 239000007788 liquid Substances 0.000 claims description 36
- 239000000463 material Substances 0.000 description 43
- 230000002093 peripheral effect Effects 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000005192 partition Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
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- 230000005499 meniscus Effects 0.000 description 1
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- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/002—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the work consisting of separate articles
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
- G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
- G03F7/2018—Masking pattern obtained by selective application of an ink or a toner, e.g. ink jet printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/10—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed before the application
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
- G03F7/2055—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser for the production of printing plates; Exposure of liquid photohardening compositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
Description
塗布パターン形成装置1は、塗布部2、塗布ステージ3、親液性調節部4、および制御部5を備えており、塗布部2が塗布ステージ3上の基材Wの上方を移動しながら塗布部2内のノズルから塗布液の液滴を吐出することにより、基材Wへの塗布動作が行われる。そして、基材W上に着弾した液滴同士が連結し、基材W上に塗布パターン51が形成される。また、塗布部2が基材Wへ液滴を吐出する前に、親液性調節部4が基材W上の塗布パターン51が形成される領域であるパターン領域52の親液性を調節し、塗布パターン形成後の塗布液の塗れ広がりの挙動をあらかじめ制御する。
2 塗布部
3 塗布ステージ
4 親液性調節部
5 制御部
10 塗布ヘッド
11 ノズル
12 塗布ヘッド移動装置
13 吐出ユニット
14 駆動隔壁
15 サブタンク
16 メインタンク
17 真空源
18 真空調圧弁
21 走査方向移動装置
22 シフト方向移動装置
23 回転装置
24 露光装置
25 走査方向移動装置
26 シフト方向移動装置
51 塗布パターン
52 パターン領域
53 外周部
54 小パターン領域
55 小パターン領域
56 小パターン領域
91 パターン領域
92 塗布パターン
93 非充填部
W 基材
Claims (4)
- 基材上に設けられたパターン領域に塗布液を塗布し、前記パターン領域の形状を有する塗布パターンを形成させる塗布パターン形成方法であり、
前記パターン領域の親液性を調節する親液性調節工程と、
親液性が調節された前記パターン領域に塗布液を塗布して塗布パターンを形成する塗布パターン形成工程と、
を有し、
前記親液性調節工程では、前記パターン領域が少なくとも一方向に関して複数の小パターン領域に区分され、隣接する前記小パターン領域同士は異なる親液性を有するよう前記パターン領域の親液性が調節され、
前記パターン領域が区分される方向である区分方向において、前記パターン領域の端部以外の前記小パターン領域が最も低い親液性を有し、この最も低い親液性を有する前記小パターン領域から前記パターン領域の端部に向かって前記小パターン領域の親液性が高くなることを特徴とする、塗布パターン形成方法。 - 前記親液性調節工程では、少なくとも前記パターン領域の角部に前記小パターン領域が設けられ、前記パターン領域を構成する複数の前記小パターン領域の中で角部の前記小パターン領域が最も親液性が高くなるよう前記パターン領域の親液性が調節されることを特徴とする、請求項1に記載の塗布パターン形成方法。
- 前記親液性調節工程では、前記パターン領域の端部を構成する前記小パターン領域の親液性が前記パターン領域と接する前記パターン領域の外側部分の親液性よりも高くなるよう前記パターン領域の親液性が調節されることを特徴とする、請求項1もしくは2のいずれかに記載の塗布パターン形成方法。
- 基材上に設けられたパターン領域に塗布液を塗布し、前記パターン領域の形状を有する塗布パターンを形成させる塗布パターン形成装置であり、
前記パターン領域の親液性を調節する親液性調節部と、
前記パターン領域に塗布液を塗布して塗布パターンを形成する塗布部と、
を有し、
前記親液性調節部により、前記パターン領域が少なくとも一方向に関して複数の小パターン領域に区分され、隣接する前記小パターン領域同士は異なる親液性を有するよう前記パターン領域の親液性が調節され、
前記パターン領域が区分される方向である区分方向において、前記パターン領域の端部以外の前記小パターン領域が最も低い親液性を有し、この最も低い親液性を有する前記小パターン領域から前記パターン領域の端部に向かって前記小パターン領域の親液性が高くなることを特徴とする、塗布パターン形成装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016126862A JP6662725B2 (ja) | 2016-06-27 | 2016-06-27 | 塗布パターン形成方法、塗布パターン形成装置、および塗布パターン付き基材 |
KR1020187037535A KR20190025568A (ko) | 2016-06-27 | 2017-06-22 | 도포 패턴 형성 방법, 도포 패턴 형성 장치, 및 도포 패턴이 형성된 기재 |
US16/313,190 US20190160483A1 (en) | 2016-06-27 | 2017-06-22 | Coating pattern formation method, coating pattern formation device, and coating-patterned substrate |
CN201780038028.6A CN109414724A (zh) | 2016-06-27 | 2017-06-22 | 涂布图案形成方法、涂布图案形成装置和带涂布图案的基材 |
PCT/JP2017/023041 WO2018003656A1 (ja) | 2016-06-27 | 2017-06-22 | 塗布パターン形成方法、塗布パターン形成装置、および塗布パターン付き基材 |
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JP2016126862A JP6662725B2 (ja) | 2016-06-27 | 2016-06-27 | 塗布パターン形成方法、塗布パターン形成装置、および塗布パターン付き基材 |
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JP2018001044A JP2018001044A (ja) | 2018-01-11 |
JP6662725B2 true JP6662725B2 (ja) | 2020-03-11 |
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US (1) | US20190160483A1 (ja) |
JP (1) | JP6662725B2 (ja) |
KR (1) | KR20190025568A (ja) |
CN (1) | CN109414724A (ja) |
WO (1) | WO2018003656A1 (ja) |
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CN110082063A (zh) * | 2019-03-04 | 2019-08-02 | 中国科学院化学研究所 | 一种控制液滴碰撞后旋转运动的方法及用途 |
JP7404695B2 (ja) * | 2019-07-30 | 2023-12-26 | 株式会社リコー | インク吐出装置、インク吐出システム及びインク吐出方法 |
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JP4149161B2 (ja) * | 2001-12-06 | 2008-09-10 | 大日本印刷株式会社 | パターン形成体の製造方法およびパターン製造装置 |
JP2004351839A (ja) * | 2003-05-30 | 2004-12-16 | Brother Ind Ltd | 接合構造及び接合構造の製造方法 |
GB0316926D0 (en) * | 2003-07-18 | 2003-08-27 | Eastman Kodak Co | Method of coating |
JP3923462B2 (ja) * | 2003-10-02 | 2007-05-30 | 株式会社半導体エネルギー研究所 | 薄膜トランジスタの作製方法 |
JP4096941B2 (ja) * | 2004-12-10 | 2008-06-04 | セイコーエプソン株式会社 | 電気配線の形成方法、配線基板の製造方法、電気光学素子の製造方法、電子機器の製造方法、配線基板、電気光学素子、および電子機器 |
JP6143152B2 (ja) * | 2012-03-21 | 2017-06-07 | 株式会社リコー | 表面処理装置、表面処理方法、パターン形成装置、及び構造体 |
US9738807B2 (en) * | 2014-10-08 | 2017-08-22 | Kabushiki Kaisha Toshiba | Method of forming pattern and pattern |
-
2016
- 2016-06-27 JP JP2016126862A patent/JP6662725B2/ja active Active
-
2017
- 2017-06-22 CN CN201780038028.6A patent/CN109414724A/zh active Pending
- 2017-06-22 KR KR1020187037535A patent/KR20190025568A/ko not_active Application Discontinuation
- 2017-06-22 US US16/313,190 patent/US20190160483A1/en not_active Abandoned
- 2017-06-22 WO PCT/JP2017/023041 patent/WO2018003656A1/ja active Application Filing
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Publication number | Publication date |
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KR20190025568A (ko) | 2019-03-11 |
CN109414724A (zh) | 2019-03-01 |
US20190160483A1 (en) | 2019-05-30 |
JP2018001044A (ja) | 2018-01-11 |
WO2018003656A1 (ja) | 2018-01-04 |
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