WO2017043554A1 - 塗布方法 - Google Patents
塗布方法 Download PDFInfo
- Publication number
- WO2017043554A1 WO2017043554A1 PCT/JP2016/076370 JP2016076370W WO2017043554A1 WO 2017043554 A1 WO2017043554 A1 WO 2017043554A1 JP 2016076370 W JP2016076370 W JP 2016076370W WO 2017043554 A1 WO2017043554 A1 WO 2017043554A1
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- WO
- WIPO (PCT)
- Prior art keywords
- coating
- pattern
- substrate
- pattern region
- liquid
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/002—Pretreatement
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
- H10K71/236—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers using printing techniques, e.g. applying the etch liquid using an ink jet printer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K99/00—Subject matter not provided for in other groups of this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2350/00—Pretreatment of the substrate
- B05D2350/30—Change of the surface
Definitions
- the present invention relates to a coating method in which a coating solution is coated on a substrate by an inkjet method to form a coating film having an arbitrary shape.
- a coating pattern having an arbitrary shape cannot be obtained with high accuracy.
- a pattern region 91 having higher lyophilicity than the surroundings is formed in advance on the substrate W according to the shape of the coating pattern, and droplets are applied onto the pattern region 91.
- the coating pattern 92 shown in FIG. 6B is formed, surface tension acts on the coating pattern 92 as shown by an arrow in FIG.
- FIG. 6C there is a possibility that the non-filling portion 93 is generated at the corner of the coating pattern 92 as shown in FIG.
- the present invention has been made in view of the above problems, and an object of the present invention is to provide a coating method capable of forming a coating pattern according to a preset shape.
- the coating method of the present invention is a coating method in which a coating liquid is applied to the entire pattern region formed on a substrate to form a coating pattern having the shape of the pattern region.
- the periphery of the area is lower in lyophilicity than the pattern area, and a lyophobic portion having lower lyophilicity than other parts in the pattern area is provided in the pattern area. .
- the application pattern is pulled back to the center by the surface tension due to the provision of the liquid repellent part, whereas the action of pushing back the liquid repellent part occurs. It is possible to suppress deformation.
- liquid repellent portion is provided at least near the corner in the pattern region.
- the dimension of the liquid repellent part is preferably smaller than the flying diameter of the coating liquid.
- the distance between the liquid repellent part and the corner part closest to the corner part is preferably between 1/20 and 3 times the flying diameter of the coating liquid.
- the shape of the corner of the coating pattern can be made more accurate.
- the coating method of the present invention it is possible to form a coating pattern according to a preset shape.
- FIG. 1 is a schematic view of a coating apparatus for carrying out the present invention.
- the coating apparatus 1 includes a coating unit 2, a coating stage 3, an alignment unit 4, and a control unit 5, and the nozzles in the coating unit 2 move while the coating unit 2 moves above the substrate W on the coating stage 3.
- the application operation to the substrate W is performed by discharging droplets of the application liquid from the substrate. Then, the droplets that have landed on the substrate W are connected to each other, and the coating pattern 51 is formed on the substrate W. Further, before the coating unit 2 discharges droplets onto the substrate W, the alignment unit 4 images the alignment mark of the substrate W, and the control unit 5 adjusts the position and angle of the coating stage 3 based on the result. Thus, the positional deviation of the substrate W is corrected.
- the direction in which the coating unit 2 moves (scans) when droplets are discharged onto the substrate W is the X-axis direction
- the direction orthogonal to the X-axis direction on the horizontal plane is the Y-axis direction, the X-axis
- the description proceeds with the direction orthogonal to both the Y-axis directions as the Z-axis direction.
- the coating unit 2 includes a coating head 10 and a coating head moving device 12.
- the coating head 10 can be moved to an arbitrary position of the substrate W on the coating stage 3 by the coating head moving device 12, and after moving to the discharge position, the coating head 10 is discharged from the nozzle 11 to each discharge target. Then, droplets are discharged by the ink jet method.
- the coating head 10 has a substantially rectangular parallelepiped shape whose longitudinal direction is the Y-axis direction, and a plurality of discharge units 13 are incorporated therein.
- the discharge unit 13 is provided with a plurality of nozzles 11, and the nozzles 11 are arranged on the lower surface of the application head 10 by incorporating the discharge unit 13 into the application head 10.
- the coating head 10 communicates with the sub tank 15 through a pipe.
- the sub tank 15 is provided in the vicinity of the coating head 10, temporarily stores the coating liquid supplied via the pipe from the main tank 16 provided apart from the sub tank 15, and stores the coating liquid in the coating head 10. It has a role to supply with high accuracy.
- the coating liquid supplied from the sub tank 15 to the coating head 10 is branched in the coating head 10 and supplied to all the nozzles 11 of each discharge unit 13.
- Each nozzle 11 has a drive partition 14, and the control partition 5 controls discharge on / off for each nozzle 11, so that the drive partition 14 of any nozzle 11 expands and contracts to discharge droplets.
- a piezoelectric actuator is used as the drive partition wall 14.
- a negative pressure of a predetermined magnitude is applied to the vacuum source 17. This negative pressure is regulated by a vacuum pressure regulating valve 18 provided between the sub tank 15 and the vacuum source 17.
- the coating head moving device 12 includes a scanning direction moving device 21, a shift direction moving device 22, and a rotating device 23.
- the coating head moving device 12 moves the coating head 10 in the X-axis direction and the Y-axis direction, and rotates in the Z-axis direction. Rotate as an axis.
- the scanning direction moving device 21 is a linear motion mechanism composed of a linear stage or the like, and is driven by the control unit 5 to move the coating head 10 in the X-axis direction (scanning direction).
- the scanning direction moving device 21 is driven, and the coating head 10 scans above the substrate W to discharge droplets from the nozzles 11, so that the coating liquid is continuously applied to the coating regions arranged in the X-axis direction. Apply.
- the shift direction moving device 22 is a linear motion mechanism composed of a linear stage or the like, and is driven by the control unit 5 to move the coating head 10 in the Y-axis direction (shift direction).
- the coating head 10 is moved in the Y-axis direction. It is possible to apply to the entire surface of the substrate W by shifting and applying so as to complement the interval.
- the coating head 10 is shifted in the Y-axis direction every time a coating operation is completed, and divided into a plurality of times. By performing coating, it is possible to perform coating on the entire surface of the substrate W.
- the rotation device 23 is a rotation stage having the rotation direction in the Z-axis direction, and the application head 10 is rotated by being controlled by the control unit 5.
- the interval between the nozzles 11 in the direction (Y-axis direction) orthogonal to the scanning direction of the coating head 10 is adjusted, and the size of the coating region and the size of the droplet are measured.
- the interval is suitable for the height.
- the application stage 3 has a mechanism for fixing the substrate W, and the application operation to the substrate W is performed with the substrate W placed on the application stage 3 and fixed.
- the coating stage 3 has a suction mechanism, and by operating a vacuum pump (not shown) or the like, a suction force is generated on the surface in contact with the substrate W, and the substrate W is suction-fixed. Yes.
- the coating stage 3 can be moved in the X-axis direction and the Y-axis direction by a driving device (not shown), and can be rotated about the Z-axis direction as a rotation axis. After the alignment part 4 confirms the alignment mark of the material W, the application stage 3 moves and rotates when the displacement of the placement of the substrate W is corrected based on the confirmation result. Note that the movement and rotation of the coating stage 3 is for fine adjustment of the mounting state of the substrate W, and therefore the distance that the coating stage 3 can move and the angle that can be rotated may be small.
- the alignment unit 4 includes an image recognition camera 24, a scanning direction moving device 25, and a shift direction moving device 26.
- the image recognition camera 24 is assembled to the scanning direction moving device 25 and the shift direction moving device 26. By driving these moving devices, the image recognition camera 24 can move in the X-axis direction and the Y-axis direction. Is possible.
- the image recognition camera 24 is a monochrome CCD camera in this embodiment, and can control the timing of image acquisition from the outside. By giving an instruction from the control unit 5, the image recognition camera 24 acquires image data, and the acquired image data is transferred to the control unit 5 via a cable.
- the scanning direction moving device 25 is a linear motion mechanism composed of a linear stage or the like, and is driven by the control unit 5 to move the image recognition camera 24 and the shift direction moving device 26 in the X-axis direction.
- the shift direction moving device 26 is a linear motion mechanism composed of a linear stage or the like, and is driven by the control unit 5 to move the image recognition camera 24 in the Y-axis direction.
- the image recognition camera 24 moves in the X-axis direction and the Y direction with respect to the substrate W placed on the coating stage 3. It moves relatively in the axial direction, and images the alignment marks of the substrate W at a plurality of positions.
- control unit 5 calculates the placement deviation of the base material W based on the position information of each imaged alignment mark, and the control unit 5 operates the coating stage 3 so as to correct this placement deviation.
- the control unit 5 includes a computer, a sequencer, and the like, such as liquid feeding to the coating head 10, ejection of droplets from the nozzle 11 and adjustment of the ejection amount, image acquisition by the image recognition camera 24, driving of each moving mechanism, and the like. Control the operation.
- control unit 5 includes a storage device that stores various types of information, such as a hard disk, a RAM, or a ROM, and forms a coating film in a pattern area described later in the step of coating a droplet.
- a storage device that stores various types of information, such as a hard disk, a RAM, or a ROM, and forms a coating film in a pattern area described later in the step of coating a droplet.
- the coordinate data of the droplet ejection position is stored in this storage device. Further, other data necessary for application is also stored in this storage device.
- FIG. 2 is a diagram illustrating a base material according to the present embodiment.
- the pattern region 52 is provided in advance on the substrate W before applying the coating liquid.
- the pattern area 52 is an area provided in accordance with the shape of the application pattern 51, and is more lyophilic than the outer peripheral portion 53 that surrounds the pattern region 52 (in other words, the outer peripheral portion 53 is larger than the pattern region 52. Low lyophilicity).
- the substrate W is initially formed only by the outer peripheral portion 53, and the irradiated portion is more lyophilic than the outer peripheral portion 53 by irradiating a laser beam to an arbitrary position on the surface of the substrate W.
- a high pattern region 52 is formed.
- the coating liquid applied to the pattern region 52 of the substrate W from the coating head 10 of the coating apparatus 1 is transferred to the substrate W. Since the coating liquid stays in the pattern area 52 when wet and spread above, the coating liquid can be prevented from spreading over the boundary between the pattern area 52 and the outer peripheral portion 53, and the shape of the pattern area 52 can be easily changed.
- the application pattern 51 can be obtained.
- a glass substrate, a silicon wafer, a resin film, or the like is applied to the base material W.
- the portion irradiated with the laser is highly lyophilic, but conversely, the portion irradiated with the laser can be made lyophilic.
- the outer peripheral portion 53 can be formed by irradiating the substrate W having high lyophilicity with the laser, and the portion surrounded by the outer peripheral portion 53 can be used as the pattern region 52. Switching between these operations can be performed by the gas used together with the laser irradiation.
- the laser irradiation to the substrate W is performed in an atmosphere environment of a gas containing oxygen or nitrogen (air also corresponds thereto).
- the lyophilicity can be increased by performing the above, and the lyophilicity can be lowered by performing laser irradiation on the substrate W in an atmosphere environment of a fluorine-based gas.
- a liquid repellent portion 54 having a lower lyophilic property than the other portions of the pattern region 52 is provided in the pattern region 52 of the substrate W according to the coating method of the present invention.
- a plurality of liquid repellent portions 54 are provided in the pattern region 52 at equal intervals.
- the liquid repellent part 54 is formed by not performing laser irradiation that enhances lyophilicity. That is, the laser irradiation to the base material W is performed in a region excluding the liquid repellent portion 54 from the pattern region 52. Therefore, a liquid repellent part 54 having the same lyophilicity as the outer peripheral part 53 is formed in the pattern region 52.
- the lyophilicity of the outer peripheral part 53 and the liquid repellent part 54 does not necessarily need to be the same.
- the lyophilicity of the liquid repellent portion 54 is as follows. It is preferable that the height is higher than the outer peripheral portion 53.
- the coating liquid is applied to the entire pattern region 52.
- the application pattern 51 is attracted to the center by the surface tension of the application pattern 51 itself.
- the coating pattern 51 is reversed in the direction opposite to the center side due to the surface tension.
- the action of pushing back occurs. Therefore, the deformation of the application pattern 51 due to the surface tension is suppressed, and the application pattern 51 having the shape as the shape of the pattern region 52 as shown in FIG. 4 can be obtained.
- the liquid repellent portion 54 is provided at least near the corner in the pattern region 52. By doing so, it is possible to suppress the deformation of the coating pattern 51 at the corner where the deformation of the coating pattern 51 due to the surface tension is most likely to occur, and it is possible to obtain the coating pattern 51 having a more accurate shape.
- the coating pattern 51 has a shape with a part cut off.
- the distance between the liquid repellent part 54 closest to the corner of the pattern area 52 and the corner of the pattern area 52 is preferably between 1/20 and 3 times the flying diameter of the coating liquid.
- the flying diameter of the coating liquid in this description refers to the diameter of a sphere when it is assumed that the shape of the coating liquid discharged from the nozzle 11 of the coating head 10 is a true sphere. Specifically, the flying diameter when a 1 pl coating liquid is discharged from the nozzle 11 is about 12 ⁇ m, and the flying diameter when a 42 pl coating liquid is discharged from the nozzle 11 is about 43 ⁇ m.
- the coating liquid is directly between the liquid repellent part 54 and the corner. Although it is difficult to land, the coating liquid that has landed around the liquid-repellent portion 54 wraps around, so that the coating liquid is filled in the vicinity of the corner.
- the dimension of the liquid repellent part 54 is preferably smaller than the flying diameter of the coating liquid.
- the coating method of the present invention is not limited to the form described above, and may be in another form within the scope of the present invention.
- the lyophobic portions 54 are provided at equal intervals in the pattern region 52, but it is sufficient that they are provided at least at the corners, as shown in FIGS. 5 (a) to 5 (c). It may be arranged as shown.
- the pattern region 52, the outer peripheral portion 53, and the liquid repellent portion 54 are formed by adjusting the lyophilicity of the surface of the substrate W by irradiating a laser beam, but lamp light or heat is used. Then, the lyophilicity of the surface of the substrate W may be adjusted.
- the surface of the substrate W is formed of a material whose lyophilicity changes when exposed to light (for example, a material where fluorine is deposited on the surface and the lyophilicity decreases when exposed to light).
- DMD Digital Mirror Device
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Abstract
Description
塗布装置1は、塗布部2、塗布ステージ3、アライメント部4、および制御部5を備えており、塗布部2が塗布ステージ3上の基材Wの上方を移動しながら塗布部2内のノズルから塗布液の液滴を吐出することにより、基材Wへの塗布動作が行われる。そして、基材W上に着弾した液滴同士が連結し、基材W上に塗布パターン51が形成される。また、塗布部2が基材Wへ液滴を吐出する前に、アライメント部4が基材Wのアライメントマークを撮像し、その結果にもとづいて制御部5が塗布ステージ3の位置および角度を調節して基材Wの位置ずれを補正する。
2 塗布部
3 塗布ステージ
4 アライメント部
5 制御部
10 塗布ヘッド
11 ノズル
12 塗布ヘッド移動装置
13 吐出ユニット
14 駆動隔壁
15 サブタンク
16 メインタンク
17 真空源
18 真空調圧弁
21 走査方向移動装置
22 シフト方向移動装置
23 回転装置
24 画像認識カメラ
25 走査方向移動装置
26 シフト方向移動装置
51 塗布パターン
52 パターン領域
53 外周部
54 撥液部
91 パターン領域
92 塗布パターン
93 非充填部
W 基材
Claims (4)
- 基材上に形成されたパターン領域全体に塗布液を塗布し、前記パターン領域の形状を有する塗布パターンを形成させる塗布方法であり、
前記パターン領域の周囲は前記パターン領域よりも親液性が低く、
前記パターン領域内には、前記パターン領域内のその他の部分よりも親液性が低い撥液部が設けられていることを特徴とする、塗布方法。 - 前記撥液部は、前記パターン領域内の少なくとも隅部近傍に設けられていることを特徴とする、請求項1に記載の塗布方法。
- 前記撥液部の寸法は、塗布液の飛翔径よりも小さいことを特徴とする、請求項1または2のいずれかに記載の塗布方法。
- 前記隅部に最も近い前記撥液部と前記隅部との距離は、塗布液の前記飛翔径の20分の1倍から3倍の間であることを特徴とする、請求項2または3のいずれかに記載の塗布方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/757,773 US20180339308A1 (en) | 2015-09-10 | 2016-09-08 | Coating method |
KR1020187008853A KR20180051546A (ko) | 2015-09-10 | 2016-09-08 | 도포 방법 |
CN201680052094.4A CN108025328B (zh) | 2015-09-10 | 2016-09-08 | 涂布方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015178114A JP6545051B2 (ja) | 2015-09-10 | 2015-09-10 | 塗布方法 |
JP2015-178114 | 2015-09-10 |
Publications (1)
Publication Number | Publication Date |
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WO2017043554A1 true WO2017043554A1 (ja) | 2017-03-16 |
Family
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PCT/JP2016/076370 WO2017043554A1 (ja) | 2015-09-10 | 2016-09-08 | 塗布方法 |
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US (1) | US20180339308A1 (ja) |
JP (1) | JP6545051B2 (ja) |
KR (1) | KR20180051546A (ja) |
CN (1) | CN108025328B (ja) |
WO (1) | WO2017043554A1 (ja) |
Families Citing this family (2)
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CN110354927B (zh) * | 2019-07-18 | 2021-12-21 | 陕西科技大学 | 一种重力驱动的大规模微量液滴排布装置及方法 |
JP7472680B2 (ja) * | 2020-06-29 | 2024-04-23 | セイコーエプソン株式会社 | 立体物印刷装置および立体物印刷方法 |
Citations (4)
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JP2004089878A (ja) * | 2002-08-30 | 2004-03-25 | Sharp Corp | パターン形成基材およびパターン形成方法 |
JP2004349639A (ja) * | 2003-05-26 | 2004-12-09 | Seiko Epson Corp | パターンの形成方法及びパターン形成装置、デバイスの製造方法、電気光学装置及び電子機器 |
JP2009006295A (ja) * | 2007-06-29 | 2009-01-15 | Seiko Epson Corp | パターン形成方法及び電気光学装置製造方法並びに電子機器製造方法 |
JP2013223854A (ja) * | 2012-03-21 | 2013-10-31 | Ricoh Co Ltd | 表面処理装置、表面処理方法、パターン形成装置、及び構造体 |
Family Cites Families (3)
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CN1905782A (zh) * | 2002-03-27 | 2007-01-31 | 精工爱普生株式会社 | 表面处理方法及膜图案的形成方法 |
JP5417732B2 (ja) * | 2008-03-31 | 2014-02-19 | 住友化学株式会社 | 親液撥液パターンの形成方法および有機エレクトロルミネッセンス素子の製造方法 |
JPWO2010064301A1 (ja) * | 2008-12-02 | 2012-05-10 | 株式会社島津製作所 | 光マトリックスデバイスの製造方法 |
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2015
- 2015-09-10 JP JP2015178114A patent/JP6545051B2/ja not_active Expired - Fee Related
-
2016
- 2016-09-08 KR KR1020187008853A patent/KR20180051546A/ko unknown
- 2016-09-08 CN CN201680052094.4A patent/CN108025328B/zh not_active Expired - Fee Related
- 2016-09-08 WO PCT/JP2016/076370 patent/WO2017043554A1/ja active Application Filing
- 2016-09-08 US US15/757,773 patent/US20180339308A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004089878A (ja) * | 2002-08-30 | 2004-03-25 | Sharp Corp | パターン形成基材およびパターン形成方法 |
JP2004349639A (ja) * | 2003-05-26 | 2004-12-09 | Seiko Epson Corp | パターンの形成方法及びパターン形成装置、デバイスの製造方法、電気光学装置及び電子機器 |
JP2009006295A (ja) * | 2007-06-29 | 2009-01-15 | Seiko Epson Corp | パターン形成方法及び電気光学装置製造方法並びに電子機器製造方法 |
JP2013223854A (ja) * | 2012-03-21 | 2013-10-31 | Ricoh Co Ltd | 表面処理装置、表面処理方法、パターン形成装置、及び構造体 |
Also Published As
Publication number | Publication date |
---|---|
CN108025328B (zh) | 2021-03-12 |
JP6545051B2 (ja) | 2019-07-17 |
JP2017051910A (ja) | 2017-03-16 |
CN108025328A (zh) | 2018-05-11 |
US20180339308A1 (en) | 2018-11-29 |
KR20180051546A (ko) | 2018-05-16 |
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