KR20190132204A - 잉크도포장치 및 잉크도포방법 - Google Patents

잉크도포장치 및 잉크도포방법 Download PDF

Info

Publication number
KR20190132204A
KR20190132204A KR1020190045685A KR20190045685A KR20190132204A KR 20190132204 A KR20190132204 A KR 20190132204A KR 1020190045685 A KR1020190045685 A KR 1020190045685A KR 20190045685 A KR20190045685 A KR 20190045685A KR 20190132204 A KR20190132204 A KR 20190132204A
Authority
KR
South Korea
Prior art keywords
ink
edge
region
impact point
inner region
Prior art date
Application number
KR1020190045685A
Other languages
English (en)
Korean (ko)
Inventor
켄이치 무라노
Original Assignee
스미도모쥬기가이고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미도모쥬기가이고교 가부시키가이샤 filed Critical 스미도모쥬기가이고교 가부시키가이샤
Publication of KR20190132204A publication Critical patent/KR20190132204A/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Ink Jet (AREA)
KR1020190045685A 2018-05-17 2019-04-18 잉크도포장치 및 잉크도포방법 KR20190132204A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2018-095507 2018-05-17
JP2018095507A JP6968505B2 (ja) 2018-05-17 2018-05-17 インク塗布装置及びインク塗布方法

Publications (1)

Publication Number Publication Date
KR20190132204A true KR20190132204A (ko) 2019-11-27

Family

ID=68585247

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190045685A KR20190132204A (ko) 2018-05-17 2019-04-18 잉크도포장치 및 잉크도포방법

Country Status (4)

Country Link
JP (1) JP6968505B2 (ja)
KR (1) KR20190132204A (ja)
CN (1) CN110505762A (ja)
TW (1) TWI704016B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220075790A (ko) 2020-11-30 2022-06-08 (주)에스티아이 잉크젯 토출 제어 방법과 이를 이용한 잉크젯 프린트 시스템
KR20220094471A (ko) 2020-12-29 2022-07-06 (주)에스티아이 잉크젯 프린트 시스템

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7464378B2 (ja) * 2019-11-22 2024-04-09 住友重機械工業株式会社 インク塗布制御装置及びインク塗布方法
JP7428541B2 (ja) * 2020-03-02 2024-02-06 住友重機械工業株式会社 インク塗布装置、インク塗布装置の制御装置、及びインク塗布方法
JP7488108B2 (ja) * 2020-05-19 2024-05-21 住友重機械工業株式会社 インク塗布装置、その制御装置、及びインク塗布方法
JP7495276B2 (ja) * 2020-06-01 2024-06-04 住友重機械工業株式会社 印刷用データ生成装置及びインク塗布装置の制御装置
CN117957069A (zh) * 2021-09-24 2024-04-30 富士胶片株式会社 图案形成基板制造方法及液体排出装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013011775A (ja) 2011-06-30 2013-01-17 Kyocera Document Solutions Inc 画像形成装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3544543B2 (ja) * 2003-08-04 2004-07-21 株式会社リコー 液状樹脂噴射装置及び樹脂構造物
JP5489887B2 (ja) * 2010-06-30 2014-05-14 富士フイルム株式会社 液体塗布装置及び液体塗布方法並びにナノインプリントシステム
JP5764997B2 (ja) * 2011-03-22 2015-08-19 セイコーエプソン株式会社 印刷装置、印刷方法及びプログラム
KR20140024931A (ko) * 2011-07-15 2014-03-03 스미도모쥬기가이고교 가부시키가이샤 박막형성방법 및 박막형성장치
JP6057406B2 (ja) * 2012-01-06 2017-01-11 住友重機械工業株式会社 薄膜形成装置及び薄膜形成方法
JP6053459B2 (ja) * 2012-11-01 2016-12-27 住友重機械工業株式会社 基板製造方法及び基板製造装置
JP2014104385A (ja) * 2012-11-26 2014-06-09 Sumitomo Heavy Ind Ltd 基板製造方法及び基板製造装置
JP2015026655A (ja) * 2013-07-25 2015-02-05 住友重機械工業株式会社 薄膜形成方法及び薄膜形成装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013011775A (ja) 2011-06-30 2013-01-17 Kyocera Document Solutions Inc 画像形成装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220075790A (ko) 2020-11-30 2022-06-08 (주)에스티아이 잉크젯 토출 제어 방법과 이를 이용한 잉크젯 프린트 시스템
KR20220094471A (ko) 2020-12-29 2022-07-06 (주)에스티아이 잉크젯 프린트 시스템

Also Published As

Publication number Publication date
JP6968505B2 (ja) 2021-11-17
CN110505762A (zh) 2019-11-26
TWI704016B (zh) 2020-09-11
JP2019198834A (ja) 2019-11-21
TW201946697A (zh) 2019-12-16

Similar Documents

Publication Publication Date Title
KR20190132204A (ko) 잉크도포장치 및 잉크도포방법
KR101463869B1 (ko) 박막형성장치 및 박막형성방법
JP2008162072A (ja) 印刷装置および印刷方法
JP2010017683A (ja) 液滴塗布装置及び液滴塗布方法
KR20140024934A (ko) 기판제조방법 및 기판제조장치
KR102327959B1 (ko) 패턴 형성 장치, 패턴 형성 방법 및 토출 데이터 생성 방법
KR100720348B1 (ko) 배향막 형성 장치, 배향막 형성 방법, 묘화 장치 및 묘화방법
CN109927413B (zh) 膜形成装置及膜形成方法
KR101713813B1 (ko) 막 형성방법 및 막 형성장치
JP2014104385A (ja) 基板製造方法及び基板製造装置
JP2010026181A (ja) 液滴塗布装置及び液滴塗布方法
JP2019217669A (ja) 印刷方法および印刷装置
JP6289880B2 (ja) 薄膜形成方法及び薄膜形成装置
JP2017104854A (ja) 膜パターン描画方法、塗布膜基材、及び、塗布装置
JP7488108B2 (ja) インク塗布装置、その制御装置、及びインク塗布方法
JP7464378B2 (ja) インク塗布制御装置及びインク塗布方法
JP2014067984A (ja) 基板製造方法及び薄膜形成装置
CN115939042A (zh) 一种显示基板的制作方法及设备
JP2021137690A (ja) インク塗布装置、インク塗布装置の制御装置、及びインク塗布方法
JP2014099520A (ja) 基板製造方法及び基板製造装置
JP2008233692A (ja) インク吐出装置およびその制御方法
JP2008246350A (ja) インク吐出装置、インク吐出方法、および表示装置
JP2014100636A (ja) 基板製造方法及び基板製造装置
JP2011147926A (ja) 線の描画方法及びインクジェット描画装置

Legal Events

Date Code Title Description
A201 Request for examination