TWI697535B - 接著劑、及發光裝置 - Google Patents

接著劑、及發光裝置 Download PDF

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TWI697535B
TWI697535B TW103131347A TW103131347A TWI697535B TW I697535 B TWI697535 B TW I697535B TW 103131347 A TW103131347 A TW 103131347A TW 103131347 A TW103131347 A TW 103131347A TW I697535 B TWI697535 B TW I697535B
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anisotropic conductive
epoxy compound
acrylic resin
mass
aforementioned
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TW103131347A
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TW201518456A (zh
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青木正治
蟹澤士行
波木秀次
小山太一
石神明
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日商迪睿合股份有限公司
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    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1802—C2-(meth)acrylate, e.g. ethyl (meth)acrylate
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    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
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Abstract

接著劑係含有環氧化合物、陽離子觸媒、與含有丙烯酸與具有羥基之丙烯酸酯的丙烯酸樹脂。丙烯酸樹脂中之丙烯酸，與環氧化合物反應，產生丙烯酸樹脂之島與環氧化合物之海的連接，並且使氧化膜之表面變粗，增強與環氧化合物之海的錨定效應。又，丙烯酸樹脂中之具有羥基的丙烯酸酯，因羥基之極性，而對配線得到靜電性接著力。如此地，藉由以丙烯酸樹脂之島及環氧化合物之海的硬化物全體對氧化膜接著，得到優良的接著力。

Description

接著劑、及發光裝置
本發明係關於將電子零件彼此予以電性連接的接著劑，特別係關於將LED(Light Emitting Diode)等之發光元件與配線基板連接的接著劑、及連接發光元件與配線基板之發光裝置。
作為將LED等晶片零件構裝至電路基板的手法，廣泛採用於環氧系接著劑中分散導電性粒子，使用成形為薄膜狀之各向異性導電薄膜(ACF：Anisortropic Conductive Film)，進行倒裝晶片構裝之方法(例如參照專利文獻1、2)。依此方法，晶片零件與電路基板之間的電性連接，係以各向異性導電薄膜之導電性粒子來達成，因此可縮短連接製程，可提高生產效率。
[先前技術文獻] [專利文獻]
[專利文獻1]日本特開2010-24301號公報
[專利文獻2]日本特開2012-186322號公報
近年來之LED製品中，為了低成本化，係有使用將電路基板之配線金屬由Au、Ag變更為Al、Cu者，或使用了於PET(Polyethylene terephthalate)基材上形成有ITO(Indium Tin Oxide)配線之透明基板者。
但是，於Al、Cu等金屬配線或ITO配線之表面，形成有鈍態、氧化被膜等之氧化膜，因此以習知的環氧系接著劑難以接著。
本發明係解決上述習知技術中之課題者，其目的在於提供對氧化膜具有優良接著性之接著劑、及使用其之發光裝置。
為了解決上述課題，本發明之接著劑，其特徵在於，含有脂環式環氧化合物或氫化環氧化合物、陽離子觸媒、與重量平均分子量為50000~900000之丙烯酸樹脂，且前述丙烯酸樹脂，含有0.5~10wt%之丙烯酸、與0.5~10wt%之具有羥基的丙烯酸酯。
又，本發明之發光裝置，其特徵為具備具有由鋁所構成之配線圖型的基板、形成於前述配線圖型之電極上的各向異性導電膜、與構裝於前述各向異性導電膜上 的發光元件；前述各向異性導電膜，係為各向異性導電接著劑之硬化物；前述各向異性導電接著劑係含有脂環式環氧化合物或氫化環氧化合物、陽離子觸媒、重量平均分子量為50000~900000之丙烯酸樹脂、與導電性粒子；且前述丙烯酸樹脂，係含有0.5~10wt%之丙烯酸、與0.5~10wt%之具有羥基的丙烯酸酯。
又，本發明之發光裝置，其特徵為具備具有由透明導電膜所構成之配線圖型的透明基板、形成於前述配線圖型之電極上的各向異性導電膜、與構裝於前述各向異性導電膜上的發光元件；前述各向異性導電膜，係為各向異性導電接著劑之硬化物；前述各向異性導電接著劑係含有脂環式環氧化合物或氫化環氧化合物、陽離子觸媒、重量平均分子量為50000~900000之丙烯酸樹脂、與導電性粒子；且前述丙烯酸樹脂，係含有0.5~10wt%之丙烯酸、與0.5~10wt%之具有羥基的丙烯酸酯。
依照本發明，藉由摻合含有丙烯酸、與具有羥基之丙烯酸酯的丙烯酸樹脂，能夠以硬化物全體對氧化膜接著，可得到優良之接著力。
11‧‧‧配線
11a‧‧‧氧化膜
12‧‧‧環氧化合物之海
13‧‧‧丙烯酸樹脂之島
21‧‧‧基板
22‧‧‧配線圖型
23‧‧‧發光元件
24‧‧‧n電極
25‧‧‧p電極
26‧‧‧凸塊
30‧‧‧各向異性導電膜
42‧‧‧鋁片
50‧‧‧各向異性導電接著劑
51‧‧‧配線基板
52‧‧‧LED晶片
53‧‧‧加熱工具
54‧‧‧工具
[圖1]顯示以環氧化合物為海、及以丙烯酸樹脂為島 時的海島模式的截面圖。
[圖2]顯示發光裝置之一例的截面圖。
[圖3]顯示90度剝離強度試驗之概要的截面圖。
[圖4]用以說明LED構裝樣品之製作步驟的圖。
[圖5]顯示晶粒抗剪強度試驗之概要的截面圖。
以下，針對本發明之實施形態(以下稱為本實施形態)，一邊參照圖式同時依下述順序詳細說明。再者，本發明不僅限定於以下實施形態，當然可在不脫離本發明之要旨的範圍內作各種變更。又，圖式為示意性，各尺寸的比率等可能與實際狀況相異。具體的尺寸等應參酌以下說明來判斷。又，圖式相互間，亦當然包含彼此的尺寸關係或比率相異的部分。
1.接著劑
2.發光裝置
3.實施例
<1.接著劑>
適用本發明的接著劑，係含有脂環式環氧化合物或氫化環氧化合物、陽離子觸媒、與重量平均分子量為50000~900000之丙烯酸樹脂，且丙烯酸樹脂含有0.5~10wt%之丙烯酸、與0.5~10wt%之具有羥基的丙烯酸酯者。
圖1係顯示於接著劑與氧化膜的界面，以環氧化合物為海、以丙烯酸樹脂為島時的海島模式之截面圖。此海島模式，係顯示分散於環氧化合物之海12的丙烯酸樹脂之島13，接觸於配線11之氧化膜11a上的狀態之硬化物模式。
此硬化物模式中，丙烯酸樹脂中之丙烯酸，係與環氧化合物反應，產生丙烯酸樹脂之島13與環氧化合物之海12的連接，並且使氧化膜11a之表面變粗，增強與環氧化合物之海12的錨定效應。又，丙烯酸樹脂中之具有羥基的丙烯酸酯，藉由羥基之極性，對於配線11得到靜電接著力。如此，藉由對氧化膜11a，以丙烯酸樹脂之島13及環氧化合物之海12的硬化物全體接著，可得到優良的接著力。
作為脂環式環氧化合物，較佳可列舉分子內具有2個以上之環氧基者。脂環式環氧化合物可為液狀、亦可為固體狀。具體而言，可列舉3,4-環氧基環己烯基甲基-3’,4’-環氧基環己烯羧酸酯、縮水甘油基六氫雙酚A等。此等之中，就可對硬化物確保適於LED元件之構裝等的光透過性，速硬化性亦優良的觀點而言，尤佳為使用3,4-環氧基環己烯基甲基-3’,4’-環氧基環己烯羧酸酯。
作為氫化環氧化合物，可使用先前所述之脂環式環氧化合物之氫化物、或雙酚A型、雙酚F型等周知之氫化環氧化合物。
脂環式環氧化合物或氫化環氧化合物，可單 獨使用，亦可合併使用2種以上。又，除了此等環氧化合物以外，只要不損及本發明效果，亦可合併使用其他環氧化合物。可列舉例如，使雙酚A、雙酚F、雙酚S、四甲基雙酚A、二芳基雙酚A、氫醌、兒茶酚、間苯二酚、甲酚、四溴雙酚A、三羥基聯苯、二苯甲酮、雙間苯二酚、雙酚六氟丙酮、四甲基雙酚A、四甲基雙酚F、參(羥基苯基)甲烷、聯二甲苯酚、酚酚醛清漆、甲酚酚醛清漆等之多元酚與表氯醇反應而得之縮水甘油醚；使甘油、新戊二醇、乙二醇、丙二醇、丁二醇、己二醇、聚乙二醇、聚丙二醇等之脂肪族多元醇與表氯醇反應而得之聚縮水甘油醚；使如p-氧基安息香酸、β-氧基萘甲酸之羥基羧酸與表氯醇反應而得之縮水甘油醚酯；由如鄰苯二甲酸、甲基鄰苯二甲酸、間苯二甲酸、對苯二甲酸、四氫鄰苯二甲酸、內亞甲基四氫鄰苯二甲酸、內亞甲基六氫鄰苯二甲酸、偏苯三甲酸、聚合脂肪酸之聚羧酸所得之聚縮水甘油酯；由胺基酚、胺基烷基酚所得之縮水甘油基胺基縮水甘油醚；由胺基安息香酸所得之縮水甘油基胺基縮水甘油酯；由苯胺、甲苯胺、三溴苯胺、二甲苯二胺、二胺基環己烷、雙胺基甲基環己烷、4,4’-二胺基二苯基甲烷、4,4’-二胺基二苯基碸等所得之縮水甘油基胺；環氧化聚烯烴等周知之環氧基樹脂類。
陽離子觸媒，可列舉例如鋁鉗合物系潛在性硬化劑、咪唑系潛在性硬化劑、鋶系潛在性硬化劑等之潛在性陽離子硬化劑。此等之中，尤佳為使用速硬化性優良 之鋁鉗合物系潛在性硬化劑。
陽離子觸媒之含量過少時無反應性、過多時則有接著劑之製品壽命降低的傾向，因此相對於環氧化合物100重量份而言，較佳為0.1~30質量份、更佳為0.5~20質量份。
丙烯酸樹脂，其重量平均分子量為50000~900000。圖1所示之硬化物模式中，丙烯酸樹脂之重量平均分子量與丙烯酸樹脂之島13的大小顯示有相關性，藉由使丙烯酸樹脂之重量平均分子量為50000~900000，可使適度大小的丙烯酸樹脂之島13接觸於氧化膜11a。丙烯酸樹脂之重量平均分子量未達50000時，丙烯酸樹脂之島13與氧化膜11a的接觸面積變小，無法得到接著力提高的效果。又，丙烯酸樹脂之重量平均分子量超過900000時，丙烯酸樹脂之島13增大，無法說是對於氧化膜11a以丙烯酸樹脂之島13及環氧化合物之海12的硬化物全體接著的狀態，接著力降低。
又，丙烯酸樹脂，係含有丙烯酸0.5~10wt%、更佳為含有1~5wt%。藉由於丙烯酸樹脂中含有丙烯酸0.5~10wt%，因與環氧化合物之反應，產生丙烯酸樹脂之島13與環氧化合物之海12的連接，並且使氧化膜11a之表面變粗，增強與環氧化合物之海12的錨定效應。
又，丙烯酸樹脂，係含有具有羥基之丙烯酸酯0.5~10wt%、更佳為含有1~5wt%。藉由於丙烯酸樹脂中含有具有羥基之丙烯酸酯0.5~10wt%，因羥基之極性， 可對配線11得到靜電性之接著力。
作為具有羥基之丙烯酸酯，可列舉甲基丙烯酸2-羥基乙酯、甲基丙烯酸2-羥基丙酯、丙烯酸2-羥基乙酯、丙烯酸2-羥基丙酯等，可使用選自由此等丙烯酸酯所成之群組的1種以上之丙烯酸酯。此等之中，尤佳為使用對氧化膜之接著性優良的甲基丙烯酸2-羥基乙酯。
又，丙烯酸樹脂，於丙烯酸及具有羥基之丙烯酸酯以外，包含不具有羥基之丙烯酸酯。作為不具有羥基之丙烯酸酯，可列舉丙烯酸丁酯、丙烯酸乙酯、丙烯腈等。較佳為，丙烯酸樹脂係含有由此等丙烯酸丁酯、丙烯酸乙酯、丙烯腈中選擇之1種以上的丙烯酸酯。
又，丙烯酸樹脂之含量，相對於環氧化合物100質量份而言，較佳為1~10質量份、更佳為1~5質量份。藉由使丙烯酸樹脂之含量相對於環氧化合物100質量份而言為1~10質量份，可得到丙烯酸樹脂12之島以良好的密度分散於環氧基樹脂13之海中的硬化物。
又，適用本發明之接著劑，為了提高與無機材料之界面的接著性，亦可進一步含有矽烷偶合劑作為其他成分。矽烷偶合劑可列舉環氧系、甲基丙烯醯氧基系、胺基系、乙烯基系、巰基．硫醚系、脲基系等，此等可單獨使用、亦可組合2種以上使用。此等之中，在本實施形態中尤佳為使用環氧系矽烷偶合劑。
又，為了控制流動性，提高粒子捕捉率，接著劑亦可含有無機填料。無機填料並無特殊限定，可使用 二氧化矽、滑石、氧化鈦、碳酸鈣、氧化鎂等。如此之無機填料，可依緩合以接著劑連接之連接構造體的應力為目的適當使用。又，亦可摻合熱可塑性樹脂、橡膠成分等之柔軟劑等。
依照如此之接著劑，可對於鋁等之難接著金屬得到高的接著力。
又，接著劑亦可為含有導電性粒子之各向異性導電接著劑。導電性粒子可使用周知之導電性粒子。可列舉例如鎳、鐵、銅、鋁、錫、鉛、鉻、鈷、銀、金等之各種金屬或金屬合金之粒子；於金屬氧化物、碳、石墨、玻璃、陶瓷、塑膠等之粒子表面被覆有金屬者；於此等粒子表面進一步被覆有絕緣薄膜者等。為於樹脂粒子表面被覆有金屬者時，樹脂粒子可使用例如環氧基樹脂、酚樹脂、丙烯酸樹脂、丙烯腈．苯乙烯(AS)樹脂、苯并胍胺樹脂、二乙烯基苯系樹脂、苯乙烯系樹脂等之粒子。
導電性粒子之平均粒徑，通常為1~10μm、更佳為2~6μm。又，接著劑成分中之導電性粒子的平均粒子密度，由連接信賴性及絕緣信賴性的觀點而言，較佳為1000~100000個/mm2、更佳為30000~80000個/mm2。
依照如此之各向異性導電接著劑，對於具有氧化膜之鋁配線或ITO配線，可得到優良的連接信賴性。
<2.發光裝置>
接下來，說明適用本發明之發光裝置。圖2係顯示發 光裝置之一例的截面圖。發光裝置係具備具有配線圖型22之基板21、形成於配線圖型22之電極上的各向異性導電膜30、與構裝於各向異性導電膜30上之發光元件23，各向異性導電膜30係由前述之各向異性導電接著劑的硬化物所構成。此發光裝置，係藉由於在基板21上之配線圖型22與各自形成有作為發光元件23之LED元件的n電極24與p電極25的連接用凸塊26之間，塗佈前述之各向異性導電接著劑，將基板21與發光元件23進行倒裝晶片構裝而得到。
本實施形態中，藉由使用前述之各向異性導電接著劑，可適合使用具有由鋁所構成之配線圖型的基板。藉此，可實現LED製品之低成本化。
又，可適合使用具有由ITO等之透明導電膜所構成之配線圖型的透明基板。藉此，可於例如於PET(Polyethylene terephthalate)基材上形成有ITO(Indium Tin Oxide)配線的透明基板上構裝LED。
再者，亦可依需要，以覆蓋LED元件23全體的方式以透明壓模樹脂密封。又，亦可於LED元件23設置光反射層。又，作為發光元件，於LED元件以外，可在不損及本發明效果的範圍內使用周知之發光元件。
<3.實施例> [實施例]
以下說明本發明之實施例。本實施例中，係 製作各種各向異性導電接著劑，評估顏色、全反射率、及剝離強度。又，使用各向異性導電接著劑，於基板上搭載LED晶片，製作LED構裝樣品，評估晶粒抗剪強度、及導體電阻。再者，本發明不限定於此等實施例。
[顏色評估]
將各向異性導電接著劑於由陶瓷所構成之白色板上塗佈成為厚度100μm，於180℃加熱30sec使其硬化。對所得硬化物，使用色度計測定白色度(JIS P 8148)。將白色度為70%以上者評估為「白色」、白色度未達70%時，以目視評估顏色。
[全反射率之測定]
將各向異性導電接著劑於由陶瓷所構成之白色板上塗佈成為厚度100μm，於180℃加熱30sec使其硬化。對所得硬化物，使用分光光度計((股)島津製作所製UV3100)，以硫酸鋇為標準，測定對波長460nm之光的全反射率(鏡面反射及擴散反射)。又，對於100℃、1000h之條件的耐熱試驗後之硬化物，亦測定對波長460nm之光的全反射率。再者，光反射率，實用上期望為超過30%。
[剝離強度之測定]
將各向異性導電接著劑於由陶瓷所構成之白色板上塗 佈成為厚度100μm，將1.5mm×10mm之鋁片以180℃-1.5N-30sec的條件熱壓接，製作接合體。
如圖3所示，使用Tensilon拉伸試驗機，將接合體之鋁片42以拉伸速度50mm/sec朝向90° Y軸方向拉剝，測定該拉剝所需之剝離強度的最大值。
[LED構裝樣品之製作]
如圖4所示，製作LED構裝樣品。將50μm節距之配線基板(50μm Al配線-25μmPI(聚醯亞胺)層-50μm Al基座)51於架台(stage)上複數配列，於各配線基板51上塗佈各向異性導電接著劑50約10μg。於各向異性導電接著劑50上，搭載Cree公司製LED晶片(商品名：DA3547、最大額定值：150mA、尺寸：0.35mm×0.46mm)52，使用熱加壓工具53進行倒裝晶片構裝，得到LED構裝樣品。
又，實施例5中，使用形成有50μm節距之ITO配線的配線基板(50μm ITO配線-25μm PI(聚醯亞胺)層-50μmAl基座)，作為配線基板。
[晶粒抗剪強度之測定]
如圖5所示，使用晶粒抗剪測試器，以工具54之剪切速度20μm/sec、25℃的條件，測定各LED構裝樣品之接合強度。
[導體電阻之評估]
測定各LED構裝樣品之初期、冷熱循環試驗(TCT)後、100℃-1000小時之環境試驗後、及60℃-90%RH-500小時之環境試驗後的導體電阻。冷熱循環試驗，係將LED構裝樣品，於-40℃及100℃環境中各暴露30分鐘，以其為1循環進行100、500、1000循環的冷熱循環，分別測定導體電阻。導體電阻之評估，係測定If=50mA時之Vf值，由試驗成績表之Vf值起，Vf值之上昇量未達5%時為「○」、5%以上時為「×」。
[綜合評估]
將各向異性導電接著劑之顏色為白色、初期及100℃-1000h環境試驗後之全反射率為70%以上、初期及60℃-90%RH-500小時環境試驗後之剝離強度為2.0N以上、初期及60℃-90%RH-500小時之環境試驗後的晶粒抗剪強度為5.0N以上、及電導性評估全部為「○」者評估為「○」、其以外者評估為「×」。
[實施例1]
於以脂環式環氧化合物(品名：Celloxide 2021P、Daicel化學公司製)100質量份、潛在性陽離子硬化劑(鋁鉗合物系潛在性硬化劑)5質量份、丙烯酸樹脂(丙烯酸丁酯(BA)：15%、丙烯酸乙酯(EA)：63%、丙烯腈(AN)：20%、丙烯酸(AA)：1w%、甲基丙烯酸2- 羥基乙酯(HEMA)：1wt%、重量平均分子量Mw：70萬)3質量份構成的接著劑中，分散導電性粒子(品名：AUL704、積水化學工業公司製)10質量份，製作各向異性導電接著劑。又，LED構裝樣品製作時的硬化條件，係180℃-1.5N-30sec。
表1顯示實施例1之各評估結果。各向異性導電接著劑之顏色為白色、初期之全反射率為75%、100℃-1000h環境試驗後之全反射率為74%。又，初期之剝離強度為4.0N、60℃-90%RH-500小時環境試驗後之剝離強度為4.1N。又，LED構裝樣品之初期晶粒抗剪強度為8.5N、60℃-90%RH-500小時環境試驗後之晶粒抗剪強度為5.3N。又，LED構裝樣品初期之電導性評估為○、冷熱循環試驗100循環後之電導性評估為○、500循環後之電導性評估為○、1000循環後之電導性評估為○、100℃-1000小時環境試驗後之電導性評估為○、及60℃-90%RH-500小時環境試驗後之電導性評估為○。因而，綜合評估為○。
[實施例2]
除了使用重量平均分子量Mw為50萬者作為丙烯酸樹脂以外，係與實施例1相同方式製作各向異性導電接著劑，得到LED構裝樣品。
表1顯示實施例2之各評估結果。各向異性導電接著劑之顏色為白色、初期之全反射率為73%、100 ℃-1000h環境試驗後之全反射率為73%。又，初期之剝離強度為3.1N、60℃-90%RH-500小時環境試驗後之剝離強度為2.9N。又，LED構裝樣品之初期晶粒抗剪強度為7.8N、60℃-90%RH-500小時環境試驗後之晶粒抗剪強度為7.6N。又，LED構裝樣品之初期電導性評估為○、冷熱循環試驗之100循環後之電導性評估為○、500循環後之電導性評估為○、1000循環後之電導性評估為○、100℃-1000小時環境試驗後之電導性評估為○、及60℃-90%RH-500小時環境試驗後之電導性評估為○。因而，綜合評估為○。
[實施例3]
除了使用重量平均分子量Mw為20萬者作為丙烯酸樹脂以外，係與實施例1相同方式製作各向異性導電接著劑，得到LED構裝樣品。
表1顯示實施例3之各評估結果。各向異性導電接著劑之顏色為白色、初期之全反射率為75%、100℃-1000h環境試驗後之全反射率為74%。又，初期之剝離強度為3.5N、60℃-90%RH-500小時環境試驗後之剝離強度為3.1N。又，LED構裝樣品之初期晶粒抗剪強度為7.5N、60℃-90%RH-500小時環境試驗後之晶粒抗剪強度為7.6N。又，LED構裝樣品之初期電導性評估為○、冷熱循環試驗之100循環後之電導性評估為○、500循環後之電導性評估為○、1000循環後之電導性評估為○、100 ℃-1000小時環境試驗後之電導性評估為○、及60℃-90%RH-500小時環境試驗後之電導性評估為○。因而，綜合評估為○。
[實施例4]
除了使用重量平均分子量Mw為5萬者作為丙烯酸樹脂以外，係與實施例1相同方式製作各向異性導電接著劑，得到LED構裝樣品。
表1顯示實施例4之各評估結果。各向異性導電接著劑之顏色為白色、初期之全反射率為71%、100℃-1000h環境試驗後之全反射率為71%。又，初期之剝離強度為3.8N、60℃-90%RH-500小時環境試驗後之剝離強度為3.3N。又，LED構裝樣品之初期晶粒抗剪強度為6.9N、60℃-90%RH-500小時環境試驗後之晶粒抗剪強度為7.1N。又，LED構裝樣品之初期電導性評估為○、冷熱循環試驗之100循環後之電導性評估為○、500循環後之電導性評估為○、1000循環後之電導性評估為○、100℃-1000小時環境試驗後之電導性評估為○、及60℃-90%RH-500小時環境試驗後之電導性評估為○。因而，綜合評估為○。
[實施例5]
除了使用形成有50μm節距之ITO配線的配線基板(50μmITO配線-25μmPI(聚醯亞胺)層-50μmAl基座) 作為配線基板以外，係與實施例1相同方式製作LED構裝樣品。
表1顯示實施例5之各評估結果。各向異性導電接著劑之顏色為白色、初期之全反射率為75%、100℃-1000h環境試驗後之全反射率為74%。又，LED構裝樣品之晶粒抗剪強度的測定，於ITO與基板的界面發生破壞，接著劑與ITO之接著強度為良好。又，LED構裝樣品之初期電導性評估為○、冷熱循環試驗之100循環後之電導性評估為○、500循環後之電導性評估為○、1000循環後之電導性評估為○、及60℃-90%RH-500小時環境試驗後之電導性評估為○。因而，綜合評估為○。
[比較例1]
除了使用重量平均分子量Mw為20萬、及丙烯酸(AA)之含量為0wt%之丙烯酸樹脂(BA：15%、EA：64%、AN：20%、AA：0w%、HEMA：1wt%、Mw：20萬)以外，係與實施例1相同方式製作各向異性導電接著劑，得到LED構裝樣品。
表1顯示比較例1之各評估結果。各向異性導電接著劑之顏色為白色、初期之全反射率為73%、100℃-1000h環境試驗後之全反射率為72%。又，初期之剝離強度為0.9N、60℃-90%RH-500小時環境試驗後之剝離強度為1.1N。又，LED構裝樣品之初期晶粒抗剪強度為6.1N、60℃-90%RH-500小時環境試驗後之晶粒抗剪強度 為5.3N。又，LED構裝樣品之初期電導性評估為○、冷熱循環試驗之100循環後之電導性評估為○、500循環後之電導性評估為×、1000循環後之電導性評估為×、100℃-1000小時環境試驗後之電導性評估為○、及60℃-90%RH-500小時環境試驗後之電導性評估為○。因而，綜合評估為×。
[比較例2]
除了使用重量平均分子量Mw為20萬、丙烯酸(AA)之含量為0wt%、及甲基丙烯酸2-羥基乙酯(HEMA)之含量為0wt%之丙烯酸樹脂(BA：15%、EA：65%、AN：20%、AA：0w%、HEMA：0wt%、Mw：20萬)以外，係與實施例1相同方式製作各向異性導電接著劑，得到LED構裝樣品。
表1顯示比較例2之各評估結果。各向異性導電接著劑之顏色為白色、初期之全反射率為74%、100℃-1000h環境試驗後之全反射率為74%。又，初期之剝離強度為未達0.5N、60℃-90%RH-500小時環境試驗後之剝離強度為未達0.5N。又，LED構裝樣品之初期晶粒抗剪強度為4.5N、60℃-90%RH-500小時環境試驗後之晶粒抗剪強度為3.9N。又，LED構裝樣品之初期電導性評估為○、冷熱循環試驗之100循環後之電導性評估為○、500循環後之電導性評估為×、1000循環後之電導性評估為×、100℃-1000小時環境試驗後之電導性評估為○、及60 ℃-90%RH-500小時環境試驗後之電導性評估為○。因而，綜合評估為×。
[比較例3]
於以脂環式環氧化合物(品名：Celloxide 2021P、Daicel化學公司製)50質量份、酸酐硬化劑(甲基六氫鄰苯二甲酸酐)40質量份、丙烯酸樹脂(BA：15%、EA：63%、AN：20%、AA：1w%、HEMA：1wt%、Mw：70萬)3質量份所構成之接著劑中，分散導電性粒子(品名：AUL704、積水化學工業公司製)10質量份，製作各向異性導電接著劑。又，LED構裝樣品製作時的硬化條件，係230℃-1.5N-30sec。
表1顯示比較例3之各評估結果。各向異性導電接著劑之顏色為白色、初期之全反射率為75%、100℃-1000h環境試驗後之全反射率為75%。又，初期之剝離強度為1.6N、60℃-90%RH-500小時環境試驗後之剝離強度為1.3N。又，LED構裝樣品之初期晶粒抗剪強度為7.2N、60℃-90%RH-500小時環境試驗後之晶粒抗剪強度為6.3N。又，LED構裝樣品之初期電導性評估為○、冷熱循環試驗之100循環後之電導性評估為×、500循環後之電導性評估為×、1000循環後之電導性評估為×、100℃-1000小時環境試驗後之電導性評估為○、及60℃-90%RH-500小時環境試驗後之電導性評估為×。因而，綜合評估為×。
[比較例4]
除了使用重量平均分子量Mw為20萬、丙烯酸(AA)之含量為0wt%、及甲基丙烯酸2-羥基乙酯(HEMA)之含量為0wt%之丙烯酸樹脂(BA：15%、EA：65%、AN：20%、AA：0w%、HEMA：0wt%、Mw：20萬)以外，係與比較例3相同方式，製作各向異性導電接著劑，製作LED構裝樣品。
表1顯示比較例4之各評估結果。各向異性導電接著劑之顏色為白色、初期之全反射率為77%、100℃-1000h環境試驗後之全反射率為77%。又，初期之剝離強度為未達0.5N、60℃-90%RH-500小時環境試驗後之剝離強度為未達0.5N。又，LED構裝樣品之初期晶粒抗剪強度為3.8N、60℃-90%RH-500小時環境試驗後之晶粒抗剪強度為3.2N。又，LED構裝樣品之初期電導性評估為○、冷熱循環試驗之100循環後之電導性評估為×、500循環後之電導性評估為×、1000循環後之電導性評估為×、100℃-1000小時環境試驗後之電導性評估為○、及60℃-90%RH-500小時環境試驗後之電導性評估為×。因而，綜合評估為×。
[比較例5]
除了使用環烯烴100質量份以取代脂環式環氧化合物以外，係與實施例1相同方式製作各向異性導電接著劑， 得到LED構裝樣品。又，LED構裝樣品之製作時的硬化條件，係180℃-1.5N-240sec。
表1顯示比較例5之各評估結果。各向異性導電接著劑之顏色為黃色、初期之全反射率為61%、100℃-1000h環境試驗後之全反射率為32%。又，初期之剝離強度為1.2N、60℃-90%RH-500小時環境試驗後之剝離強度為1.4N。又，LED構裝樣品之初期晶粒抗剪強度為7.2N、60℃-90%RH-500小時環境試驗後之晶粒抗剪強度為6.5N。又，LED構裝樣品之初期電導性評估為○、冷熱循環試驗之100循環後之電導性評估為×、500循環後之電導性評估為×、1000循環後之電導性評估為×、100℃-1000小時環境試驗後之電導性評估為○、及60℃-90%RH-500小時環境試驗後之電導性評估為○。因而，綜合評估為×。
[比較例6]
除了使用雙酚F型環氧化合物以取代脂環式環氧化合物，使用陰離子硬化劑(胺系硬化劑)以取代潛在性陽離子硬化劑，且不摻合丙烯酸樹脂以外，係與實施例1相同方式製作各向異性導電接著劑，得到LED構裝樣品。又，LED構裝樣品之製作時的硬化條件，係150℃-1.5N-30sec。
表1顯示比較例6之各評估結果。各向異性導電接著劑之顏色為黃色、初期之全反射率為58%、100 ℃-1000h環境試驗後之全反射率為15%。又，初期之剝離強度為1.4N、60℃-90%RH-500小時環境試驗後之剝離強度為未達0.1N。又，LED構裝樣品之初期晶粒抗剪強度為6.8N、60℃-90%RH-500小時環境試驗後之晶粒抗剪強度為1.1N。又，LED構裝樣品之初期電導性評估為○、冷熱循環試驗之100循環後之電導性評估為○、500循環後之電導性評估為×、1000循環後之電導性評估為×、100℃-1000小時環境試驗後之電導性評估為○、及60℃-90%RH-500小時環境試驗後之電導性評估為×。因而，綜合評估為×。
[比較例7]
除了摻合丙烯酸樹脂(BA：15%、EA：63%、AN：20%、AA：1w%、HEMA：1wt%、Mw：70萬)3質量份以外，係與比較例6相同方式，製作各向異性導電接著劑，製作LED構裝樣品。
表1顯示比較例7之各評估結果。各向異性導電接著劑之顏色為黃色、初期之全反射率為53%、100℃-1000h環境試驗後之全反射率為11%。又，初期之剝離強度為2.5N、60℃-90%RH-500小時環境試驗後之剝離強度為未達0.1N。又，LED構裝樣品之初期晶粒抗剪強度為7.1N、60℃-90%RH-500小時環境試驗後之晶粒抗剪強度為0.4N。又，LED構裝樣品之初期電導性評估為○、冷熱循環試驗之100循環後之電導性評估為○、500循環 後之電導性評估為○、1000循環後之電導性評估為×、100℃-1000小時環境試驗後之電導性評估為○、及60℃-90%RH-500小時環境試驗後之電導性評估為×。因而，綜合評估為×。
Figure 103131347-A0202-12-0024-1
比較例1、2，於丙烯酸樹脂中不含有丙烯酸(AA)及甲基丙烯酸2-羥基乙酯(HEMA)，因此對鋁的接著力低、電導信賴性亦低。
又，比較例3、4中，係使用酸酐作為硬化劑，因此60℃-90%RH-500小時環境試驗後之電導信賴性低。又，比較例3與比較例4之比較，係與比較例1、2與實施例之比較相同地，可知較佳為使用具有AA、HEMA之丙烯酸樹脂。
又，比較例5中，係使用環烯烴作為主劑，因此反應緩慢，硬化費時。又，因樹脂本身的色調或雙鍵所致的變色，無法保持白色。且電導信賴性亦低。
比較例6、7中，因胺系硬化劑之極性效果，對鋁雖具有接著力，但不耐濕度，60℃-90%RH-500小時環境試驗後之電導信賴性低。又，因胺的變色，故白色度低。
另一方面，實施例1~5，因為摻合有脂環式環氧化合物、潛在性陽離子硬化劑、與具有丙烯酸(AA)與甲基丙烯酸2-羥基乙酯(HEMA)之丙烯酸樹脂，因此具有光學用途的特性，且，對於具有氧化膜之鋁或ITO配線，可得到高的接著力及優良的電導信賴性。
11‧‧‧配線
11a‧‧‧氧化膜
12‧‧‧環氧化合物之海
13‧‧‧丙烯酸樹脂之島

Claims (6)

  1. 一種接著劑，其係含有脂環式環氧化合物或氫化環氧化合物、陽離子觸媒、與重量平均分子量為50000~900000之丙烯酸樹脂，且前述丙烯酸樹脂，係含有0.5~10wt%之丙烯酸、與0.5~10wt%之具有羥基的丙烯酸酯，前述陽離子觸媒，為咪唑系潛在性硬化劑或鋶系潛在性硬化劑，相對於前述環氧化合物100質量份而言，前述陽離子觸媒之含量，為0.1~30質量份，相對於前述環氧化合物100質量份而言，前述丙烯酸樹脂之含量，為1~10質量份。
  2. 如請求項1之接著劑，其中，前述具有羥基之丙烯酸酯，為選自由甲基丙烯酸2-羥基乙酯、甲基丙烯酸2-羥基丙酯、丙烯酸2-羥基乙酯、丙烯酸2-羥基丙酯所成群組之1種以上。
  3. 如請求項1之接著劑，其中，前述丙烯酸樹脂，係含有選自丙烯酸丁酯、丙烯酸乙酯、丙烯腈之1種以上的丙烯酸酯。
  4. 如請求項1至3中任一項之接著劑，其係含有導電性粒子。
  5. 一種發光裝置，其係具備：具有由鋁所構成之配線圖型的基板、形成於前述配線圖型之電極上的各向異性導電膜、與 構裝於前述各向異性導電膜上的發光元件，且前述各向異性導電膜，係為各向異性導電接著劑之硬化物；前述各向異性導電接著劑係含有脂環式環氧化合物或氫化環氧化合物、陽離子觸媒、重量平均分子量為50000~900000之丙烯酸樹脂、與導電性粒子；前述丙烯酸樹脂，係含有0.5~10wt%之丙烯酸、與0.5~10wt%之具有羥基的丙烯酸酯，前述陽離子觸媒，為咪唑系潛在性硬化劑或鋶系潛在性硬化劑，相對於前述環氧化合物100質量份而言，前述陽離子觸媒之含量，為0.1~30質量份，相對於前述環氧化合物100質量份而言，前述丙烯酸樹脂之含量，為1~10質量份。
  6. 一種發光裝置，其係具備：具有由透明導電膜所構成之配線圖型的透明基板、形成於前述配線圖型之電極上的各向異性導電膜、與構裝於前述各向異性導電膜上的發光元件，且前述各向異性導電膜，係為各向異性導電接著劑之硬化物；前述各向異性導電接著劑係含有脂環式環氧化合物或氫化環氧化合物、陽離子觸媒、重量平均分子量為50000~900000之丙烯酸樹脂、與導電性粒子；前述丙烯酸樹脂，係含有0.5~10wt%之丙烯酸、與0.5~10wt%之具有羥基的丙烯酸酯，前述陽離子觸媒，為咪唑系潛在性硬化劑或鋶系潛在性硬化劑，相對於前述環氧化合物100質量份而言，前述陽離子觸媒之含量，為0.1~30質量份，相對於前述環氧化合物100質量份而言，前述丙烯酸樹脂 之含量，為1~10質量份。
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