TWI695855B - 聚醯亞胺前驅體、樹脂組合物及樹脂膜之製造方法 - Google Patents

聚醯亞胺前驅體、樹脂組合物及樹脂膜之製造方法 Download PDF

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TWI695855B
TWI695855B TW107135584A TW107135584A TWI695855B TW I695855 B TWI695855 B TW I695855B TW 107135584 A TW107135584 A TW 107135584A TW 107135584 A TW107135584 A TW 107135584A TW I695855 B TWI695855 B TW I695855B
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film
polyimide
less
group
polyimide precursor
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TW107135584A
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TW201902992A (zh
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米谷昌樹
清水建樹
金田隆行
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日商旭化成股份有限公司
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1025—Preparatory processes from tetracarboxylic acids or derivatives and diamines polymerised by radiations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/16—Polyester-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Liquid Crystal (AREA)
TW107135584A 2015-09-24 2016-09-22 聚醯亞胺前驅體、樹脂組合物及樹脂膜之製造方法 TWI695855B (zh)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2015186730 2015-09-24
JP??2015-186730 2015-09-24
JP??2015-218783 2015-11-06
JP2015218783 2015-11-06
JP??2016-055476 2016-03-18
JP2016055476 2016-03-18
JP??2016-124849 2016-06-23
JP2016124849 2016-06-23

Publications (2)

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TW201902992A TW201902992A (zh) 2019-01-16
TWI695855B true TWI695855B (zh) 2020-06-11

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TW107135584A TWI695855B (zh) 2015-09-24 2016-09-22 聚醯亞胺前驅體、樹脂組合物及樹脂膜之製造方法
TW105130650A TWI641632B (zh) 2015-09-24 2016-09-22 Polyimine precursor, resin composition and method for producing resin film

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TW105130650A TWI641632B (zh) 2015-09-24 2016-09-22 Polyimine precursor, resin composition and method for producing resin film

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JP (5) JP6444522B2 (ko)
KR (3) KR102460768B1 (ko)
CN (2) CN112940253A (ko)
TW (2) TWI695855B (ko)
WO (1) WO2017051827A1 (ko)

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EP3575281B1 (en) * 2017-01-27 2023-08-23 Wingo Technology Co., Ltd. Diamine compound, and polyimide compound and molded article in which said diamine compound is used
CN110382596B (zh) * 2017-04-07 2022-05-10 株式会社I.S.T 聚酰亚胺膜
WO2019188265A1 (ja) 2018-03-30 2019-10-03 株式会社カネカ ポリアミド酸、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびフレキシブルデバイス、ならびにポリイミド膜の製造方法
KR102516144B1 (ko) * 2018-08-28 2023-03-29 주식회사 엘지화학 투명 필름 제조용 용매의 전처리 방법
KR102452136B1 (ko) * 2018-12-20 2022-10-07 코오롱인더스트리 주식회사 폴리아믹산, 폴리이미드 수지 및 폴리이미드 필름
CN112204086B (zh) * 2019-02-01 2023-04-14 株式会社Lg化学 基于聚酰亚胺的聚合物膜、使用其的显示装置用基底和光学装置
WO2020159193A1 (ko) * 2019-02-01 2020-08-06 주식회사 엘지화학 폴리이미드 전구체 조성물 및 이로부터 제조된 폴리이미드 필름, 디스플레이 장치용 기판, 및 광학 장치
WO2020157953A1 (ja) * 2019-02-01 2020-08-06 ウィンゴーテクノロジー株式会社 ポリイミド化合物及び該ポリイミド化合物を含む成形物
JP7364140B2 (ja) 2019-02-01 2023-10-18 エルジー・ケム・リミテッド ポリイミド前駆体組成物およびそれから製造されたポリイミドフィルム、ディスプレイ装置用基板、および光学装置
JPWO2020195819A1 (ko) * 2019-03-26 2020-10-01
JP7349253B2 (ja) * 2019-03-29 2023-09-22 株式会社カネカ ポリアミド酸、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびフレキシブルデバイス、ならびにポリイミド膜の製造方法。
WO2021028960A1 (ja) * 2019-08-09 2021-02-18 太陽ホールディングス株式会社 着色樹脂組成物、硬化物および積層体
KR20220056861A (ko) * 2019-10-03 2022-05-06 미쓰이 가가쿠 가부시키가이샤 폴리이미드 필름, 폴리아마이드산 및 이것을 포함하는 바니시, 및 폴리이미드 적층체 및 그 제조 방법
JP7365940B2 (ja) * 2020-03-05 2023-10-20 東京応化工業株式会社 ワニス組成物、及びポリイミド樹脂の製造方法
JPWO2021193568A1 (ko) 2020-03-27 2021-09-30
KR20230007329A (ko) 2020-04-16 2023-01-12 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 이미드-아미드산 공중합체 및 그의 제조방법, 바니시, 그리고 폴리이미드 필름
JPWO2021210641A1 (ko) * 2020-04-16 2021-10-21
JP7483480B2 (ja) * 2020-04-24 2024-05-15 旭化成株式会社 ポリイミド前駆体、ポリイミド樹脂組成物、並びにポリイミド樹脂フィルム及びその製造方法
JP2021175790A (ja) * 2020-04-24 2021-11-04 旭化成株式会社 ポリイミド前駆体及びそれを含む樹脂組成物、ポリイミド樹脂膜、樹脂フィルム及びその製造方法
CN111533909B (zh) * 2020-06-08 2023-04-25 武汉柔显科技股份有限公司 一种聚酰胺酰亚胺、聚酰胺酰亚胺薄膜及显示装置
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JPWO2022085620A1 (ko) * 2020-10-22 2022-04-28
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JP7174199B1 (ja) * 2021-04-02 2022-11-17 旭化成株式会社 ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法
CN113292726B (zh) * 2021-04-10 2023-03-24 常州市尚科新材料有限公司 聚酰亚胺模塑粉及其制备方法和应用
CN117120514A (zh) 2021-04-16 2023-11-24 三菱瓦斯化学株式会社 酰亚胺-酰胺酸共聚物和其制造方法、清漆以及聚酰亚胺薄膜
WO2023190749A1 (ja) * 2022-03-29 2023-10-05 Ｕｂｅ株式会社 フレキシブル配線基板用ポリイミド前駆体組成物、ポリイミドフィルムおよびポリイミド金属積層体
CN118139913A (zh) * 2022-07-29 2024-06-04 Ｕｂｅ株式会社 聚酰亚胺前体组合物、聚酰亚胺膜和聚酰亚胺膜/基材层积体
WO2024024901A1 (ja) * 2022-07-29 2024-02-01 Ｕｂｅ株式会社 ポリイミド前駆体組成物、ポリイミドフィルムおよびポリイミドフィルム／基材積層体
JP7235157B1 (ja) 2022-07-29 2023-03-08 Ｕｂｅ株式会社 ポリイミド前駆体組成物、ポリイミドフィルムおよびポリイミドフィルム／基材積層体
WO2024058194A1 (ja) * 2022-09-16 2024-03-21 三菱瓦斯化学株式会社 ポリイミドフィルムの製造方法

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TW201718714A (zh) 2017-06-01
CN112940253A (zh) 2021-06-11
JP2019070811A (ja) 2019-05-09
KR102133559B1 (ko) 2020-07-13
KR20220147724A (ko) 2022-11-03
KR102659377B1 (ko) 2024-04-19
WO2017051827A1 (ja) 2017-03-30
KR102460768B1 (ko) 2022-10-28
JP7095024B2 (ja) 2022-07-04
KR20180048605A (ko) 2018-05-10
JP2022128480A (ja) 2022-09-01
JP6444522B2 (ja) 2018-12-26
CN108026273A (zh) 2018-05-11
JP6725626B2 (ja) 2020-07-22
JPWO2017051827A1 (ja) 2018-03-22
JP7383764B2 (ja) 2023-11-20
TW201902992A (zh) 2019-01-16
JP2024023254A (ja) 2024-02-21
JP2020172652A (ja) 2020-10-22
CN108026273B (zh) 2021-04-06
TWI641632B (zh) 2018-11-21
KR20200085383A (ko) 2020-07-14

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