TWI688994B - 紫外線照射裝置及紫外線照射方法 - Google Patents
紫外線照射裝置及紫外線照射方法 Download PDFInfo
- Publication number
- TWI688994B TWI688994B TW105119004A TW105119004A TWI688994B TW I688994 B TWI688994 B TW I688994B TW 105119004 A TW105119004 A TW 105119004A TW 105119004 A TW105119004 A TW 105119004A TW I688994 B TWI688994 B TW I688994B
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- Taiwan
- Prior art keywords
- substrate
- irradiation
- ultraviolet
- accommodating
- chamber
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 42
- 239000000758 substrate Substances 0.000 claims abstract description 163
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 34
- 239000001301 oxygen Substances 0.000 claims description 34
- 229910052760 oxygen Inorganic materials 0.000 claims description 34
- 238000001816 cooling Methods 0.000 claims description 31
- 230000001678 irradiating effect Effects 0.000 claims description 30
- 230000005855 radiation Effects 0.000 claims 1
- 239000002245 particle Substances 0.000 abstract description 23
- 239000007789 gas Substances 0.000 description 21
- 230000007246 mechanism Effects 0.000 description 20
- 230000007723 transport mechanism Effects 0.000 description 19
- 230000005540 biological transmission Effects 0.000 description 14
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 8
- 230000004308 accommodation Effects 0.000 description 7
- 238000003780 insertion Methods 0.000 description 7
- 230000037431 insertion Effects 0.000 description 7
- 239000000470 constituent Substances 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 230000003028 elevating effect Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
- H01L21/0231—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to electromagnetic radiation, e.g. UV light
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02046—Dry cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02345—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to radiation, e.g. visible light
- H01L21/02348—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to radiation, e.g. visible light treatment by exposure to UV light
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31058—After-treatment of organic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-153347 | 2015-08-03 | ||
JP2015153347A JP6596257B2 (ja) | 2015-08-03 | 2015-08-03 | 紫外線照射装置及び紫外線照射方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201709285A TW201709285A (zh) | 2017-03-01 |
TWI688994B true TWI688994B (zh) | 2020-03-21 |
Family
ID=57986326
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105119004A TWI688994B (zh) | 2015-08-03 | 2016-06-16 | 紫外線照射裝置及紫外線照射方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6596257B2 (ko) |
KR (1) | KR102654792B1 (ko) |
CN (1) | CN106409723B (ko) |
TW (1) | TWI688994B (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6866193B2 (ja) * | 2017-03-10 | 2021-04-28 | 東京応化工業株式会社 | 紫外線照射装置及び紫外線照射方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002016040A (ja) * | 2000-06-28 | 2002-01-18 | Tokyo Electron Ltd | 基板処理装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62143426A (ja) * | 1985-12-18 | 1987-06-26 | Hitachi Ltd | 光照射装置 |
JPH0497515A (ja) | 1990-08-15 | 1992-03-30 | Nec Corp | レジスト除去装置 |
KR20030082729A (ko) * | 2002-04-18 | 2003-10-23 | 주식회사 디엠에스 | 노광 시스템 |
JP4086582B2 (ja) * | 2002-08-06 | 2008-05-14 | キヤノン株式会社 | 照明装置及び露光装置 |
JP4342974B2 (ja) * | 2003-02-12 | 2009-10-14 | 東京エレクトロン株式会社 | 硬化処理装置及びその方法、並びに塗布膜形成装置 |
JP4508738B2 (ja) * | 2004-06-17 | 2010-07-21 | 東京応化工業株式会社 | 熱安定化装置 |
JP2006114848A (ja) | 2004-10-18 | 2006-04-27 | Apex Corp | 紫外線照射処理装置、紫外線照射処理方法及び半導体製造装置 |
JP4859660B2 (ja) * | 2006-12-27 | 2012-01-25 | 東京応化工業株式会社 | 基板処置装置 |
JP2008192844A (ja) * | 2007-02-05 | 2008-08-21 | Tokyo Electron Ltd | 基板処理方法及び塗布現像処理装置 |
JP5186224B2 (ja) * | 2008-01-29 | 2013-04-17 | 東京応化工業株式会社 | 基板処置装置 |
JP5281350B2 (ja) * | 2008-09-29 | 2013-09-04 | 株式会社オーク製作所 | 周辺露光装置及び周辺露光方法 |
WO2011080852A1 (ja) * | 2009-12-28 | 2011-07-07 | シャープ株式会社 | 液晶表示パネルの製造方法及び製造装置 |
CN101976004B (zh) * | 2010-09-03 | 2012-09-12 | 深圳市华星光电技术有限公司 | 液晶面板的紫外线固化装置以及固化方法 |
TW201224678A (en) * | 2010-11-04 | 2012-06-16 | Orc Mfg Co Ltd | Exposure device |
JP5891013B2 (ja) * | 2011-11-18 | 2016-03-22 | 東京応化工業株式会社 | 紫外線照射装置及び基板処理装置 |
JP5934665B2 (ja) * | 2013-02-22 | 2016-06-15 | 東京エレクトロン株式会社 | 成膜方法、プログラム、コンピュータ記憶媒体及び成膜システム |
JP6072644B2 (ja) * | 2013-08-05 | 2017-02-01 | 東京エレクトロン株式会社 | 紫外線照射装置、基板処理方法、プログラム及びコンピュータ記憶媒体 |
-
2015
- 2015-08-03 JP JP2015153347A patent/JP6596257B2/ja active Active
-
2016
- 2016-06-16 TW TW105119004A patent/TWI688994B/zh active
- 2016-07-27 KR KR1020160095240A patent/KR102654792B1/ko active IP Right Grant
- 2016-08-01 CN CN201610622675.9A patent/CN106409723B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002016040A (ja) * | 2000-06-28 | 2002-01-18 | Tokyo Electron Ltd | 基板処理装置 |
Also Published As
Publication number | Publication date |
---|---|
CN106409723B (zh) | 2022-08-23 |
KR102654792B1 (ko) | 2024-04-05 |
JP2017034118A (ja) | 2017-02-09 |
KR20170016286A (ko) | 2017-02-13 |
TW201709285A (zh) | 2017-03-01 |
CN106409723A (zh) | 2017-02-15 |
JP6596257B2 (ja) | 2019-10-23 |
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