TWI688994B - Ultraviolet irradiation device and ultraviolet irradiation method - Google Patents
Ultraviolet irradiation device and ultraviolet irradiation method Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 42
- 239000000758 substrate Substances 0.000 claims abstract description 163
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 34
- 239000001301 oxygen Substances 0.000 claims description 34
- 229910052760 oxygen Inorganic materials 0.000 claims description 34
- 238000001816 cooling Methods 0.000 claims description 31
- 230000001678 irradiating effect Effects 0.000 claims description 30
- 230000005855 radiation Effects 0.000 claims 1
- 239000002245 particle Substances 0.000 abstract description 23
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- 230000007246 mechanism Effects 0.000 description 20
- 230000007723 transport mechanism Effects 0.000 description 19
- 230000005540 biological transmission Effects 0.000 description 14
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 8
- 230000004308 accommodation Effects 0.000 description 7
- 238000003780 insertion Methods 0.000 description 7
- 230000037431 insertion Effects 0.000 description 7
- 239000000470 constituent Substances 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 230000003028 elevating effect Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
- H01L21/0231—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to electromagnetic radiation, e.g. UV light
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- H01L21/67011—Apparatus for manufacture or treatment
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02046—Dry cleaning only
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02345—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to radiation, e.g. visible light
- H01L21/02348—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to radiation, e.g. visible light treatment by exposure to UV light
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
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Abstract
可抑制收容部內的顆粒的產生,將基板保持清淨。 The generation of particles in the storage section can be suppressed, and the substrate can be kept clean.
包含:可將基板以密閉空間而收容的收容部;設於前述收容部的外部,並可對前述基板照射紫外線的照射部;以及設於前述收容部的外部,並以前述紫外線從前述收容部的外部照射在收容於前述收容部的內部的前述基板的方式而使前述照射部在前述收容部的外部移動的移動部。 Including: a storage portion that can house the substrate in a closed space; an irradiation portion that is provided outside the storage portion and can irradiate the substrate with ultraviolet rays; and an irradiation portion that is provided outside the storage portion and uses the ultraviolet light from the storage portion A moving portion that causes the outside of the housing to be irradiated on the substrate housed inside the housing portion and moves the irradiation portion outside the housing portion.
Description
本發明,係有關紫外線照射裝置及紫外線照射方法。 The invention relates to an ultraviolet irradiation device and an ultraviolet irradiation method.
在構成液晶顯示器等的顯示面板的玻璃基板上,係形成有配線圖案及電極圖案等的微細的圖案。如此的圖案,係藉光刻法等的方法而形成。光刻法,係包含將抗蝕膜塗佈於玻璃基板的程序、將抗蝕膜曝光的程序、將曝光後的抗蝕膜顯影的程序、及對顯影後的抗蝕膜照射紫外線等的光的程序(固化程序)。 Fine patterns such as wiring patterns and electrode patterns are formed on the glass substrate constituting a display panel such as a liquid crystal display. Such a pattern is formed by a method such as photolithography. The photolithography method includes a procedure of applying a resist film on a glass substrate, a procedure of exposing the resist film, a procedure of developing the exposed resist film, and irradiating the developed resist film with light such as ultraviolet light Procedure (curing procedure).
上述的固化程序,係藉對基板照射紫外線的紫外線照射裝置而進行。例如,於專利文獻1,係已揭露具備使基板搬送於水平方向的帶式搬送機構、及使紫外線照射於基板的紫外線照射機構的構成。
The above curing process is performed by an ultraviolet irradiation device that irradiates the substrate with ultraviolet rays. For example,
於專利文獻2,係已揭露以下構成:具備保持基板的基板保持具、使紫外線照射於基板的紫外線產生源、及改變來自紫外線產生源的紫外線的照射方向的反射板。
[專利文獻1]日本專利特開平4-97515號公報 [Patent Document 1] Japanese Patent Laid-Open No. 4-97515
[專利文獻2]日本專利特開平2006-114848號公報 [Patent Document 2] Japanese Patent Laid-Open No. 2006-114848
然而,在專利文獻1方面,係在帶式搬送機構之上方設置設有紫外線照射機構等的上蓋,並在以上蓋所覆蓋的空間中邊將基板搬送於水平方向邊照射紫外線的構成,故搬送基板時,具有在空間內產生微細的塵埃等(以下稱作「顆粒」)之虞。
However, in
在專利文獻2方面,係在處理室內設置基板保持台及馬達,並以馬達使基板保持台上下移動或旋轉的構成,故具有在移動基板時在處理室內產生顆粒之虞。
In
在此等專利文獻1及2中,係具有在移動基板時產生顆粒之虞,故有時產生的顆粒會附著於基板上,在將基板保持清淨方面存在課題。
In these
鑒於如以上的情事,本發明係目的在於提供可抑制收容部內的顆粒的產生,並可將基板保持清淨的紫外線照射裝置及紫外線照射方法。 In view of the above circumstances, the present invention aims to provide an ultraviolet irradiation device and an ultraviolet irradiation method that can suppress the generation of particles in the storage portion and can keep the substrate clean.
本發明的一態樣相關的紫外線照射裝置,係 包含:可將基板以密閉空間而收容的收容部;設於前述收容部的外部,並可對前述基板照射紫外線的照射部;以及設於前述收容部的外部,並以前述紫外線從前述收容部的外部照射在收容於前述收容部的內部的前述基板的方式而使前述照射部在前述收容部的外部移動的移動部。 The ultraviolet irradiation device related to one aspect of the present invention is Including: a storage portion that can house the substrate in a closed space; an irradiation portion that is provided outside the storage portion and can irradiate the substrate with ultraviolet rays; and an irradiation portion that is provided outside the storage portion and uses the ultraviolet light from the storage portion A moving portion that causes the outside of the housing to be irradiated on the substrate housed inside the housing portion and moves the irradiation portion outside the housing portion.
依此構成時,可在具有密閉空間的收容部的內部使基板靜止的狀態下,邊在收容部的外部使照射部移動邊對收容部的內部的基板照射紫外線,故無須考量伴隨基板的移動的顆粒的產生。此外,照射部的移動係在收容部的外部進行,故即使伴隨照射部的移動而產生顆粒,仍可藉使收容部為密閉空間,而迴避往收容部內的顆粒的侵入。因此,可抑制收容部內的顆粒的產生,可將基板保持清淨。 According to this structure, the substrate inside the storage section can be irradiated with ultraviolet rays while the irradiation section is moved outside the storage section while the substrate is stationary inside the storage section having a sealed space, so there is no need to consider accompanying the movement of the substrate The generation of particles. In addition, the movement of the irradiating part is performed outside the accommodating part, so even if particles are generated along with the movement of the irradiating part, the intrusion of the particles into the accommodating part can be avoided by making the accommodating part a closed space. Therefore, the generation of particles in the storage section can be suppressed, and the substrate can be kept clean.
此外,在使基板靜止的狀態下使照射部移動,使得即使採用俯視尺寸比照射部大的基板,仍與在使照射部靜止的狀態下使基板移動的情況比較下,可節省對基板照射紫外線時所需的空間,可縮小佔用面積。 In addition, moving the irradiating part while the substrate is stationary makes it possible to save the irradiation of ultraviolet rays on the substrate compared with the case where the substrate is moved when the irradiating part is stationary, even if a substrate larger in plan view than the irradiating part is used. The required space can reduce the occupied area.
此外,作成在收容部內使基板靜止的狀態,使得收容部內係確保基板的收容空間即可,故與在收容部內使基板移動的情況比較下,可縮小收容部的容積,使收容部內的氧濃度/露點的管理變容易。此外,可削減在收容部內的氧濃度時使用的氮的消耗量。 In addition, it is sufficient to keep the substrate in the storage section so that the storage space for the substrate is secured in the storage section. Therefore, compared with the case where the substrate is moved in the storage section, the volume of the storage section can be reduced and the oxygen concentration in the storage section can be reduced. / Dew point management becomes easy. In addition, it is possible to reduce the consumption of nitrogen used for the oxygen concentration in the storage section.
上述的紫外線照射裝置中,亦可在前述收容部係設有可使前述紫外線透射的透射部。 In the above-mentioned ultraviolet irradiation device, the accommodating portion may be provided with a transmissive portion that can transmit the ultraviolet rays.
依此構成時,可在採用透射部的簡單的構成下,經由透射部對基板照射紫外線。 With this configuration, the substrate can be irradiated with ultraviolet rays through the transmissive part with a simple configuration using the transmissive part.
上述的紫外線照射裝置中,亦可前述收容部係包含覆蓋前述基板之上方的頂板,前述透射部係設於前述頂板。 In the above ultraviolet irradiation device, the accommodating portion may include a top plate covering the upper side of the substrate, and the transmissive portion may be provided on the top plate.
依此構成時,可在收容部的頂板設置透射部的簡單的構成下,經由透射部對基板照射紫外線。此外,在收容部的一部分設置透射部,使得與在整個收容部設置透射部的情況比較下,可提升透射部的保養性。 With this configuration, the substrate can be irradiated with ultraviolet rays through the transmissive portion under a simple configuration in which the transmissive portion is provided on the top plate of the housing portion. In addition, the provision of the transmissive portion in a part of the housing portion makes it possible to improve the maintainability of the transmissive portion as compared with the case where the transmissive portion is provided in the entire housing portion.
上述的紫外線照射裝置中,亦可前述移動部,係包含以夾著前述收容部的方式而延伸於前述照射部的移動方向的導引部、及以跨前述收容部的方式而形成為門型並作成可沿著前述導引部而移動的門型框,並在前述門型框,係設有保持前述照射部的保持部。 In the above-mentioned ultraviolet irradiation device, the moving part may include a guide part extending in the moving direction of the irradiating part so as to sandwich the receiving part, and formed into a door type so as to straddle the receiving part A portal frame that can move along the guide portion is formed, and the portal frame is provided with a holding portion that holds the irradiation portion.
依此構成時,與沿著一般的導軌而使照射部移動的情況比較下,可藉具有高的剛性的門型框而使照射部沿著導引部移動,故可穩定進行照射部的移動。 According to this structure, compared with the case where the irradiating part is moved along a general guide rail, the irradiating part can be moved along the guide part by the door frame with high rigidity, so the irradiating part can be stably moved .
上述的紫外線照射裝置中,亦可前述收容部,係可將前述基板以密閉空間而收容且包含排列於前述照射部的移動方向的第一收容部及第二收容部,且前述導引部,係包含以夾著前述第一收容部的方式而延伸的第一導軌、及以在前述第一導軌排列於前述照射部的移動方向並夾著前述第二收容部的方式而延伸的第二導軌。 In the above-mentioned ultraviolet irradiation device, the accommodating portion may include the first accommodating portion and the second accommodating portion arranged in the moving direction of the irradiation portion, and the guide portion may accommodate the substrate in a closed space. It includes a first rail extending so as to sandwich the first accommodating portion, and a second rail extending so as to sandwich the second accommodating portion in the moving direction of the first rail arranged in the direction of the irradiation portion .
依此構成時,可沿著第一導軌及第二導軌使照射部移 動,故可連續進行往第一收容部內的基板的紫外線照射、及往第二收容部內的基板的紫外線照射。 With this configuration, the irradiation section can be moved along the first rail and the second rail Therefore, the ultraviolet irradiation to the substrate in the first storage section and the ultraviolet irradiation to the substrate in the second storage section can be continuously performed.
此外,包含第一收容部及第二收容部,故可同時處理兩個基板。 In addition, since the first storage portion and the second storage portion are included, two substrates can be processed simultaneously.
此外,可在具有密閉空間的第一收容部內及第二收容部內使基板靜止的狀態下,邊在第一收容部外及第二收容部外使照射部移動邊對第一收容部內及第二收容部內的基板照射紫外線,故可抑制第一收容部內及第二收容部內的顆粒的產生,可將基板保持清淨。 In addition, in a state where the substrate is stationary in the first storage section and the second storage section having the sealed space, the irradiation section can be moved to the first storage section and the second storage section while moving the irradiation section outside the first storage section and the second storage section. Since the substrate in the storage section is irradiated with ultraviolet rays, the generation of particles in the first storage section and the second storage section can be suppressed, and the substrate can be kept clean.
此外,在具備第一收容部及第二收容部的構成中,可達成佔用面積的縮小化、各收容部內的氧濃度/露點的管理的容易化,同時削減在調整各收容部內的氧濃度時使用的氮的消耗量。 In addition, in the configuration including the first storage portion and the second storage portion, it is possible to reduce the occupied area, to facilitate the management of the oxygen concentration/dew point in each storage portion, and to reduce the adjustment of the oxygen concentration in each storage portion Consumption of nitrogen used.
上述的紫外線照射裝置中,亦可在前述照射部的移動方向上的前述第一導軌與前述第二導軌之間,係可裝卸地設有輔助前述門型框的移動的導引輔助部。 In the above ultraviolet irradiation device, a guide assisting portion that assists the movement of the door frame may be detachably provided between the first guide rail and the second guide rail in the moving direction of the irradiation section.
依此構成時,可藉將導引輔助部進行裝卸,從而切換僅沿著第一導軌或第二導軌中的其中一者的門型框的移動、及連續沿著第一導軌及第二導軌的門型框的移動。例如,可藉使導引輔助部脫離,從而切換成僅沿著第一導軌或第二導軌中的其中一者的門型框的移動。另一方面,可藉將導引輔助部連接,從而切換成連續沿著第一導軌及第二導軌的門型框的移動。 With this configuration, the guide auxiliary part can be attached and detached to switch the movement of the door frame along only one of the first guide rail or the second guide rail, and continuously along the first guide rail and the second guide rail The movement of the door frame. For example, the guide auxiliary portion may be disengaged to switch to the movement of the door frame along only one of the first rail or the second rail. On the other hand, it is possible to switch to continuous movement of the door frame along the first rail and the second rail by connecting the guide auxiliary part.
上述的紫外線照射裝置中,亦可在前述收容 部的外部,係設有可冷卻前述照射部的冷卻部。 The above-mentioned ultraviolet irradiation device may be A cooling unit capable of cooling the irradiation unit is provided outside the unit.
依此構成時,可冷卻照射部,故即使在將紫外線連續照射於基板時等連續驅動照射部的情況下,仍可抑制照射部過熱。 With this configuration, the irradiation section can be cooled, so that even when the irradiation section is continuously driven when ultraviolet rays are continuously irradiated on the substrate, the irradiation section can be suppressed from overheating.
上述的紫外線照射裝置中,亦可前述移動部係與前述照射部一起使前述冷卻部在前述收容部的外部移動。 In the above ultraviolet irradiation device, the moving part may move the cooling part outside the storage part together with the irradiation part.
依此構成時,可將照射部及冷卻部一起總括而予以移動,故與使照射部及冷卻部個別獨立移動的情況比較下,可達成裝置構成的精簡化。 According to this configuration, the irradiation unit and the cooling unit can be moved together in a collective manner. Therefore, compared with the case where the irradiation unit and the cooling unit are independently moved, the simplification of the device configuration can be achieved.
上述的紫外線照射裝置中,亦可在前述收容部,係設有可調整前述收容部的內部環境的氧濃度的氧濃度調整部。 In the above-mentioned ultraviolet irradiation device, an oxygen concentration adjustment section that can adjust the oxygen concentration of the internal environment of the accommodation section may be provided in the accommodation section.
依此構成時,可將收容部的內部環境的氧濃度調整為既定的濃度,故可在既定的氧濃度的條件下將紫外線照射於基板。 With this configuration, the oxygen concentration in the internal environment of the housing section can be adjusted to a predetermined concentration, and therefore the substrate can be irradiated with ultraviolet light under the condition of the predetermined oxygen concentration.
上述的紫外線照射裝置中,亦可在前述收容部,係設有可調整前述收容部的內部環境的露點的露點調整部。 In the above-mentioned ultraviolet irradiation device, a dew point adjustment unit that can adjust the dew point of the internal environment of the accommodation unit may be provided in the accommodation unit.
依此構成時,可將收容部的內部環境的露點調整為既定的露點,故可在既定的露點的條件下將紫外線照射於基板。 According to this configuration, the dew point of the internal environment of the storage unit can be adjusted to a predetermined dew point, so that the substrate can be irradiated with ultraviolet rays under the condition of the predetermined dew point.
本發明的一態樣相關的紫外線照射方法,係使用了包含可將基板以密閉空間而收容的收容部、及設於 前述收容部的外部並可對前述基板照射紫外線的照射部的紫外線照射裝置的紫外線照射方法,包含:將前述基板在前述收容部以密閉空間而收容的收容步驟;對前述基板照射紫外線的照射步驟;以及以前述紫外線從前述收容部的外部照射於以密閉空間收容於前述收容部的內部的前述基板的方式而使前述照射部在前述收容部的外部移動的移動步驟。 The ultraviolet irradiation method related to one aspect of the present invention uses a storage portion including a substrate that can store a substrate in a closed space, and a The ultraviolet irradiation method of the ultraviolet irradiation device of the irradiation unit that can irradiate the substrate with ultraviolet rays from the outside of the housing section includes: a housing step of housing the substrate in an enclosed space in the housing section; an irradiation step of irradiating the substrate with ultraviolet light And a moving step of moving the irradiation part outside the storage part in such a manner that the ultraviolet ray is irradiated from the outside of the storage part to the substrate contained in the sealed space inside the storage part.
依此方法時,可在具有密閉空間的收容部的內部使基板靜止的狀態下,邊在收容部的外部使照射部移動邊對收容部的內部的基板照射紫外線,故無須考量伴隨基板的移動的顆粒的產生。此外,照射部的移動係在收容部的外部進行,故即使伴隨照射部的移動而產生顆粒,仍可藉使收容部為密閉空間,而迴避往收容部內的顆粒的侵入。因此,可抑制收容部內的顆粒的產生,可將基板保持清淨。 According to this method, the substrate inside the housing section can be irradiated with ultraviolet rays while the irradiation section is moved outside the housing section while the substrate is stationary inside the housing section having a sealed space, so there is no need to consider accompanying the movement of the substrate The generation of particles. In addition, the movement of the irradiating part is performed outside the accommodating part, so even if particles are generated along with the movement of the irradiating part, the intrusion of the particles into the accommodating part can be avoided by making the accommodating part a closed space. Therefore, the generation of particles in the storage section can be suppressed, and the substrate can be kept clean.
此外,在使基板靜止的狀態下使照射部移動,使得即使採用俯視尺寸比照射部大的基板,仍與在使照射部靜止的狀態下使基板移動的情況比較下,可節省對基板照射紫外線時所需的空間,可縮小佔用面積。 In addition, moving the irradiating part while the substrate is stationary makes it possible to save the irradiation of ultraviolet rays on the substrate compared with the case where the substrate is moved when the irradiating part is stationary, even if a substrate larger in plan view than the irradiating part is used. The required space can reduce the occupied area.
此外,作成在收容部內使基板靜止的狀態,使得收容部內係確保基板的收容空間即可,故與在收容部內使基板移動的情況比較下,可縮小收容部的容積,使收容部內的氧濃度/露點的管理變容易。此外,可削減在調整收容部內的氧濃度時使用的氮的消耗量。 In addition, it is sufficient to keep the substrate in the storage section so that the storage space for the substrate is secured in the storage section. Therefore, compared with the case where the substrate is moved in the storage section, the volume of the storage section can be reduced and the oxygen concentration in the storage section can be reduced. / Dew point management becomes easy. In addition, the consumption of nitrogen used when adjusting the oxygen concentration in the storage unit can be reduced.
上述的紫外線照射方法中,亦可在前述收容部,係設有可使前述紫外線透射的透射部,前述移動步驟,係以前述紫外線經由前述透射部而照射於前述收容部的內部的前述基板的方式而使前述照射部在前述收容部的外部移動。 In the above-mentioned ultraviolet irradiation method, the accommodating part may be provided with a transmissive part capable of transmitting the ultraviolet rays, and the moving step may be performed by irradiating the substrate inside the accommodating part with the ultraviolet rays through the transmissive part Method, the irradiation unit is moved outside the storage unit.
依此方法時,可在採用透射部的簡單的構成下,經由透射部對基板照射紫外線。 According to this method, the substrate can be irradiated with ultraviolet rays through the transmissive part with a simple configuration using the transmissive part.
上述的紫外線照射方法中,亦可前述移動步驟,係在以夾著前述收容部的方式而延伸於前述照射部的移動方向的導引部的一端與另一端之間使前述照射部往返移動。 In the above ultraviolet irradiation method, the moving step may be to reciprocate the irradiating part between one end and the other end of the guide part extending in the moving direction of the irradiating part so as to sandwich the accommodating part.
依此方法時,與在導引部的一端與另一端之間使照射部僅移動於一方向的情況比較下,即使為將紫外線對基板反復照射時,仍可平滑地效率佳地照射。此外,設置一個照射部即足夠,故可達成裝置構成的精簡化。 According to this method, compared with the case where the irradiation part is moved in only one direction between one end and the other end of the guide part, even when the substrate is repeatedly irradiated with ultraviolet rays, it can be irradiated smoothly and efficiently. In addition, it is sufficient to provide one irradiating part, so that the simplification of the device configuration can be achieved.
上述的紫外線照射方法中,亦可在前述收容部的外部,係設有可冷卻前述照射部的冷卻部,而前述移動步驟,係與前述照射部一起使前述冷卻部在前述收容部的外部移動。 In the above-mentioned ultraviolet irradiation method, a cooling part capable of cooling the irradiation part may be provided outside the accommodation part, and the moving step may move the cooling part outside the accommodation part together with the irradiation part .
依此方法時,可將照射部及冷卻部一起總括而予以移動,故與使照射部及冷卻部個別獨立移動的情況比較下,可達成裝置構成的精簡化。 According to this method, the irradiating part and the cooling part can be moved collectively, so compared with the case where the irradiating part and the cooling part are moved independently, a simplified structure of the device can be achieved.
上述的紫外線照射方法中,亦可包含調整前述收容部的內部環境的氧濃度的氧濃度調整步驟。 The above-mentioned ultraviolet irradiation method may further include an oxygen concentration adjustment step of adjusting the oxygen concentration of the internal environment of the housing section.
依此方法時,可將收容部的內部環境的氧濃度調整為既定的濃度,故可在既定的氧濃度的條件下將紫外線照射於基板。 According to this method, the oxygen concentration in the internal environment of the housing portion can be adjusted to a predetermined concentration, so that the substrate can be irradiated with ultraviolet rays under the condition of the predetermined oxygen concentration.
上述的紫外線照射方法中,亦可包含調整前述收容部的內部環境的露點的露點調整步驟。 The above-mentioned ultraviolet irradiation method may further include a dew point adjustment step of adjusting the dew point of the internal environment of the housing section.
依此方法時,可將收容部的內部環境的露點調整為既定的露點,故可在既定的露點的條件下將紫外線照射於基板。 According to this method, the dew point of the internal environment of the accommodating portion can be adjusted to a predetermined dew point, so that the substrate can be irradiated with ultraviolet rays under the condition of the predetermined dew point.
依本發明時,可提供可抑制收容部內的顆粒的產生,並可將基板保持清淨的紫外線照射裝置及紫外線照射方法。 According to the present invention, it is possible to provide an ultraviolet irradiation device and an ultraviolet irradiation method that can suppress the generation of particles in the storage portion and can keep the substrate clean.
1、201‧‧‧紫外線照射裝置 1, 201‧‧‧ ultraviolet irradiation device
10‧‧‧基板 10‧‧‧ substrate
10A‧‧‧第一基板(基板) 10A‧‧‧The first substrate (substrate)
10B‧‧‧第二基板(基板) 10B‧‧‧Second substrate (substrate)
2、202‧‧‧腔室(收容部) 2, 202‧‧‧ chamber (containment department)
5、205‧‧‧搬送機構(移動部) 5,205‧‧‧Transporting mechanism (mobile part)
6‧‧‧冷卻部 6‧‧‧Cooling Department
7‧‧‧氣體供應部(氧濃度調整部、露點調整部) 7‧‧‧Gas supply section (oxygen concentration adjustment section, dew point adjustment section)
20‧‧‧頂板 20‧‧‧Top board
23‧‧‧透射部 23‧‧‧Transmission Department
40‧‧‧照射部 40‧‧‧Irradiation Department
50、250‧‧‧導引部 50、250‧‧‧Guiding Department
54‧‧‧門型框 54‧‧‧door frame
54c‧‧‧保持部 54c‧‧‧Maintaining Department
202A‧‧‧第一腔室(第一收容部) 202A‧‧‧ First Chamber (First Containment Department)
202B‧‧‧第二腔室(第二收容部) 202B‧‧‧Second Chamber (Second Containment Department)
209‧‧‧帶式搬送機(輔助導引部) 209‧‧‧belt conveyor (auxiliary guide)
251A‧‧‧第一導軌 251A‧‧‧First rail
251B‧‧‧第二導軌 251B‧‧‧Second rail
[圖1]第一實施形態相關的紫外線照射裝置的透視圖。 [Fig. 1] A perspective view of an ultraviolet irradiation device according to the first embodiment.
[圖2]第一實施形態相關的紫外線照射裝置的俯視圖。 [Fig. 2] A plan view of the ultraviolet irradiation device according to the first embodiment.
[圖3]包含圖2的III-III剖面圖的第一實施形態相關的紫外線照射裝置之側面圖。 [Fig. 3] A side view of the ultraviolet irradiation device according to the first embodiment including the cross-sectional view III-III of Fig. 2.
[圖4]第二實施形態相關的紫外線照射裝置的透視圖。 [Fig. 4] A perspective view of an ultraviolet irradiation device according to a second embodiment.
[圖5]第二實施形態相關的紫外線照射裝置的俯視圖。 [Fig. 5] A plan view of an ultraviolet irradiation device according to a second embodiment.
[圖6]第二實施形態相關的紫外線照射裝置之側面圖。 [Fig. 6] A side view of an ultraviolet irradiation device according to a second embodiment.
以下,參照圖式,而說明本發明的實施形態。於以下之說明,係設定XYZ直角座標系,邊參照此XYZ直角座標系邊說明有關各構材的位置關係。使水平面內的既定方向為X方向,使在水平面內與X方向正交的方向為Y方向,使與X方向及Y方向分別正交的方向(亦即鉛直方向)為Z方向。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the following description, the XYZ rectangular coordinate system is set, and the positional relationship of each member will be explained while referring to this XYZ rectangular coordinate system. Let the predetermined direction in the horizontal plane be the X direction, let the direction orthogonal to the X direction in the horizontal plane be the Y direction, and let the directions orthogonal to the X direction and the Y direction (ie, the vertical direction) be the Z direction.
圖1,係第一實施形態相關的紫外線照射裝置1的透視圖。圖2,係第一實施形態相關的紫外線照射裝置1的俯視圖。圖3,係包含圖2的III-III剖面圖的第一實施形態相關的紫外線照射裝置1之側面圖。
FIG. 1 is a perspective view of an
<紫外線照射裝置> <ultraviolet irradiation device>
如示於圖1~圖3,紫外線照射裝置1,係對基板10進行紫外線的照射的裝置。紫外線照射裝置1,係具備腔室2(收容部)、台3、照射單元4、搬送機構5(移動部)、冷卻部6、氣體供應部7及控制部8。控制部8,
係將紫外線照射裝置1的構成要素總括控制。
As shown in FIGS. 1 to 3, the
<腔室> <chamber>
腔室2,係收容要進行紫外線的照射處理的基板10。腔室2,係形成為俯視下形成矩形的箱狀。具體而言,腔室2,係由覆蓋基板10之上方的矩形板狀的頂板20、以包圍基板10之側方的方式而覆蓋的矩形框狀的周壁21、覆蓋基板10的下方的底板22而形成。在周壁21的-Y方向側,係設有供於相對於腔室2進行基板10的搬入及搬出用的基板搬出入口21a。
The
例如,頂板20、周壁21及底板22,係由遮蔽紫外線的遮光構材而形成。藉此,對腔室2的內部的基板10照射紫外線時,可迴避紫外線漏至腔室2的外部。
For example, the
腔室2,係構成為可將基板10以密閉空間進行收容。例如,將頂板20、周壁21及底板22的各連接部以焊接等而無間隙地結合,使得可提升腔室2內的氣密性。例如,於腔室2,係設有泵浦機構等的減壓機構(未圖示)。藉此,可在使腔室2內減壓的狀態下收容基板10。
The
如示於圖3,於腔室2內,係設有將基板10加熱的加熱機構11。加熱機構11,係具有與基板10大致相同的俯視尺寸的矩形板狀,配置成從下方支撐基板10。加熱機構11,係安裝於台3。加熱機構11,係包含加熱器等(未圖示)。
As shown in FIG. 3, in the
<透射部> <transmission section>
如示於圖2,在腔室2的頂板20,係設有可使紫外線通過的透射部23。透射部23,係構成頂板20的一部分。透射部23,係形成為俯視下比頂板20小的矩形板狀。透射部23,係安裝於將頂板20開口於厚度方向的矩形的開口部20h。例如,透射部23,係運用石英、耐熱玻璃、樹脂片、樹脂膜等。
As shown in FIG. 2, the
透射部23的尺寸,係設定為比基板10大的尺寸。藉此,對基板10照射紫外線時,可迴避紫外線為頂板20的遮光部(透射部23以外的部分)所遮蔽,故可將紫外線均勻照射於基板10的整個上表面。
The size of the
另外,開口部20h的尺寸,係亦可設定為可使基板10出入的尺寸。此外,透射部23,係亦可裝卸自如地嵌入於開口部20h。藉此,將透射部23嵌入於開口部20h時係可使腔室2內為密閉空間,使透射部23從開口部20h脫離時係可使基板10出入於腔室2內。
In addition, the size of the
<台> <unit>
台3,係以上表面支撐腔室2及搬送機構5。台3,係形成在Z方向具有厚度的板狀。
The table 3 supports the
台3,係由框體下部31從下方進行支撐。
The table 3 is supported from below by the
框體下部31,係將複數個鋼材等的角柱組合成格子狀而形成。
The
另外,在框體下部31的下端部,係旋轉自如地安裝複數個車輪31a。藉此,可使框體下部31在XY平面內移動自如。
In addition, a plurality of
在台3,係設有框體32。框體32,係具備柱部33及壁部34。
The table 3 is provided with a
柱部33,係將複數個鋼材等的角柱組合成格子狀而形成,並包圍腔室2、照射單元4及搬送機構5。
The
壁部34,係設於柱部33之間隙(各角柱之間),並覆蓋腔室2、照射單元4及搬送機構5的周圍及上方。
The
例如,壁部34,係由透明的板材而形成。藉此,可從框體32的外部視認框體32內的構成要素。
For example, the
<升降機構> <lifting mechanism>
如示於圖3,在腔室2的下方,係設有可使基板10移動於Z方向的升降機構25。在升降機構25,係設有複數個升降銷25a。複數個升降銷25a的前端(+Z側的端),係配置在平行於XY平面的相同面內。
As shown in FIG. 3, below the
複數個升降銷25a的前端,係作成可插穿台3、底板22及加熱機構11。
The front ends of the plurality of lifting
具體而言,在台3,係形成將台3開口於厚度方向的複數個插穿孔3a。在底板22,係在俯視下重疊於各插穿孔3a的位置形成有將底板22開口於厚度方向的複數個插穿孔22a。在加熱機構11,係在俯視下重疊於各插穿孔22a的位置形成有將加熱機構11開口於厚度方向的複數
個插穿孔11a。複數個升降銷25a的前端,係作成可經由各插穿孔3a、22a、11a相對於基板10的下表面而抵接/背離。為此,成為藉複數個升降銷25a的前端,而平行於XY平面地支撐基板10。
Specifically, in the table 3, a plurality of
升降機構25,係成為邊支撐收容於腔室2內的基板10邊移動於腔室2內的Z方向。於圖3,係示出複數個升降銷25a的前端經由各插穿孔3a、22a、11a而抵接於基板10的下表面並上升,從而使基板10從加熱機構11背離的狀態。
The elevating
另外,於升降機構25,使複數個升降銷25a升降的驅動源25b,係配置於腔室2的外部。為此,即使隨著驅動源25b的驅動產生顆粒,仍可將腔室2作成密閉空間,使得可迴避往腔室2內的顆粒的侵入。
In addition, in the elevating
<照射單元> <irradiation unit>
照射單元4,係設於腔室2的外部。照射單元4,係具備照射部40及聚光構材41。
The
照射部40,係構成為可將i射線等的紫外線照射於基板10。
The
於此,「紫外線」,係表示波長範圍的下限為1nm程度、上限為可見光線的短波長端的光。 Here, "ultraviolet" means light having a lower limit of the wavelength range of about 1 nm and an upper limit of the short-wavelength end of visible light.
例如,照射部40,係使用金屬鹵素燈。
For example, the
另外,照射部40,係不限於此,亦可使用高壓水銀燈、LED燈。此外,照射部40,係亦可將此等燈組合複
數個。
In addition, the
例如,在照射部40的下表面,係亦可設有將波長比300nm低的成分去除的過濾器。藉此,經由過濾器而射出的紫外線的波長係成為300nm以上,故可藉紫外線的照射而抑制基板10的過度的溫度上升。
For example, a filter may be provided on the lower surface of the
聚光構材41,係將從照射部40所射出的紫外線聚光於基板10上。使紫外線聚光於基板10上,使得可抑制從照射部40所射出的紫外線擴散至基板10的外部,故可提升照度。
The condensing
<搬送機構> <Transport organization>
如示於圖1及圖2,搬送機構5,係設於腔室2的外部。搬送機構5,係以紫外線從腔室2的外部照射在收容於腔室2的內部的基板10的方式而使照射單元4在腔室2的外部移動。搬送機構5,係具備導引部50、基底53及門型框54。
As shown in FIGS. 1 and 2, the
導引部50,係具備一對的導軌51、及滑件52。例如,導引部50,係可運用線性馬達致動器。
The
一對的導軌51,係以將腔室2從-Y方向側及+Y方向側夾住的方式而延伸於是照射單元4的移動方向(照射部40的移動方向)的X方向。
The pair of
滑件52,係構成為可沿著一對的導軌51而滑動。
The
基底53,係在台3的四角設置複數個(例如在本實施形態係在四角各設置一個共四個)。各基底53,係支
撐一對的導軌51的X方向兩端部。
A plurality of
門型框54,係以跨腔室2於Y方向的方式而形成為門型,同時作成可沿著一對的導軌51而移動。門型框54,係具備延伸於Z方向的一對的門柱部54a、及以連結一對的門柱部54a之間的方式而延伸於Y方向的連結部54b。在門型框54的各門柱部54a的下端部,係安裝滑件52。
The
如示於圖3,在門型框54的連結部54b的內部,係設有保持照射單元4的保持部54c。保持部54c,係形成從門型框54的Y方向中間部的下表面朝向上方凹入的凹部。照射單元4之中照射面4a(下表面)以外的部分,係為保持部54c的凹部所包圍,由門型框54的壁部而覆蓋。例如,門型框54,係由遮蔽紫外線的遮光構材而形成。藉此,從照射單元4照射紫外線時,可迴避紫外線擴散至門型框54之側方,可將紫外線朝向下方(腔室2內的基板10)照射。
As shown in FIG. 3, inside the connecting
如示於圖2,在X方向,各導軌51的長度L1,係比腔室2的長度L2長(L1>L2)。在本實施形態,係在X方向,各導軌51的長度L1,係作成比將腔室2的長度L2、及二個門型框54的長度(2×L3)相加的長度(L2+2×L3)長。藉此,俯視下,可使照射單元4從超過腔室2的-X方向端的區域移動直到超過腔室2的+X方向端的區域為止。
As shown in FIG. 2, in the X direction, the length L1 of each
<冷卻部> <Cooling Department>
如示於圖1及圖2,在腔室2的外部,係設有可將照射單元4冷卻的冷卻部6。冷卻部6,係安裝於門型框54的+Y方向側之側壁部(門柱部54a)。例如,冷卻部6,係使用鼓風機。藉此,可將因照射單元4而產生的熱氣排出至外部。
As shown in FIGS. 1 and 2, outside the
搬送機構5,係與照射單元4一起使冷卻部6在腔室2的外部移動。
The
<氣體供應部> <Gas Supply Department>
於腔室2,係設有可調整腔室2的內部環境的狀態的氣體供應部7。氣體供應部7,係在乾燥氣體方面供應氮(N2)、氦(He)、氬(Ar)等的惰性氣體。
The
於此,氣體供應部,係相當於記載於請求項的「氧濃度調整部」及「露點調整部」。 Here, the gas supply unit corresponds to the "oxygen concentration adjustment unit" and "dew point adjustment unit" described in the request.
可藉氣體供應部7,而調整腔室2的內部環境的露點,並可調整腔室2內的水分濃度。
The dew point of the internal environment of the
例如,氣體供應部7,係以使腔室2的內部環境的露點成為-80℃(水分濃度0.54ppm質量基準)以上且-5℃(水分濃度4000ppm質量基準)以下的方式而調整乾燥氣體的供應。
For example, the
例如,在使抗蝕膜的曝光後的預圖案(pre-pattern)固化時的環境中,如此使露點成為優選的上限以下,使得可使圖案的固化容易進行。另一方面,設成優選的下限以 上,使得可將在運用裝置上的作業性等提升。 For example, in an environment where the pre-pattern after exposure of the resist film is cured, the dew point is made such that the dew point is preferably not more than the upper limit, so that the pattern can be easily cured. On the other hand, set the preferred lower limit to This makes it possible to improve the workability of the operating device.
此外,亦可藉氣體供應部7,而調整腔室2的內部環境的氧濃度。腔室2的內部環境的氧濃度(質量基準),係越低越優選。具體而言,使腔室2的內部環境的氧濃度優選上為1000ppm以下,較優選上為500ppm以下。
In addition, the oxygen concentration of the internal environment of the
例如,在使抗蝕膜的曝光後的預圖案(pre-pattern)固化時的環境中,如此使氧濃度成為優選的上限以下,使得可使圖案的固化容易進行。 For example, in the environment when the pre-pattern after exposure of the resist film is cured, the oxygen concentration is set to the preferable upper limit or less in this manner, so that the curing of the pattern can be easily performed.
<紫外線照射方法> <Ultraviolet irradiation method>
接著,說明本實施形態相關的紫外線照射方法。在本實施形態,係利用上述的紫外線照射裝置1而對基板10照射紫外線。在紫外線照射裝置1的各部分進行的動作,係藉控制部8而控制。
Next, the ultraviolet irradiation method according to this embodiment will be described. In this embodiment, the
本實施形態相關的紫外線照射方法,係包含收容步驟、照射步驟及移動步驟。 The ultraviolet irradiation method according to this embodiment includes a storage step, an irradiation step, and a moving step.
在收容步驟中,腔室2,係以密閉空間收容基板10。例如,經由基板搬出入口21a將基板10搬送至腔室2內後,將基板搬出入口21a閉塞而將腔室2密閉。
In the housing step, the
在照射步驟中,照射單元4,係對基板10照射紫外線。
In the irradiation step, the
在移動步驟中,搬送機構5,係以紫外線從腔室2的外部照射在收容於腔室2的內部的基板10的方式而使照
射單元4在腔室2的外部移動。
In the moving step, the
在移動步驟中,以紫外線經由透射部23而照射於腔室2的內部的基板10的方式而使照射單元4在腔室2的外部移動。如上述,在門型框54的+Y方向側之側壁部係安裝冷卻部6,故在移動步驟中,與照射單元4一起使冷卻部6在腔室2的外部移動。
In the moving step, the
在移動步驟中,在一對的導軌51的-X方向端(一端)與+X方向端(另一端)之間使照射單元4往返移動。例如,在圖3的俯視下,使照射單元4從超過腔室2的-X方向端的區域直到超過腔室2的+X方向端的區域為止往返移動。
In the moving step, the
另外,本實施形態相關的紫外線照射方法,係包含氣體供應步驟。 In addition, the ultraviolet irradiation method according to this embodiment includes a gas supply step.
於此,氣體供應步驟,係相當於記載於請求項的「氧濃度調整步驟」及「露點調整步驟」。 Here, the gas supply step corresponds to the "oxygen concentration adjustment step" and "dew point adjustment step" described in the request item.
在氣體供應步驟中,氣體供應部7,係調整腔室2的內部環境的露點。此外,在氣體供應步驟中,氣體供應部7,係調整腔室2的內部環境的氧濃度。
In the gas supply step, the
如以上,依本實施形態時,可在具有密閉空間的腔室2的內部使基板10靜止的狀態下,在腔室2的外部邊使照射單元4移動邊對腔室2的內部的基板10照射紫外線,故無須考量伴隨基板10的移動的顆粒的產生。此外,照射單元4的移動係在腔室2的外部進行,故即使伴隨照射單元4的移動而產生顆粒,仍可將腔室2作
成密閉空間,使得可迴避往腔室2內的顆粒的侵入。因此,可抑制腔室2內的顆粒的產生,可將基板10保持為清淨。
As described above, according to this embodiment, the
此外,在使基板10靜止的狀態下使照射單元4移動,使得即使採用俯視尺寸比照射單元4大的基板10,仍與在使照射單元4靜止的狀態下使基板10移動的情況比較下,可節省對基板10照射紫外線時所需的空間,可縮小佔用面積。
In addition, the
此外,作成在腔室2內使基板10靜止的狀態,使得腔室2內係僅確保基板10的收容空間即可,故與在腔室2內使基板10移動的情況比較下,可縮小腔室2的容積,使腔室2內的氧濃度/露點的管理變容易。此外,可削減在調整腔室2內的氧濃度時使用的氮的消耗量。
In addition, the state in which the
此外,於腔室2,係設有可使紫外線透射的透射部23,使得可在採用透射部23的簡單的構成下,經由透射部23對基板10照射紫外線。
In addition, the
此外,腔室2,係包含覆蓋基板10之上方的頂板20,透射部23係設於頂板20,使得可在將透射部23設於腔室2的頂板20的簡單的構成下,經由透射部23對基板10照射紫外線。此外,在腔室2的一部分設置透射部23,使得與在整個腔室2設置透射部的情況比較下,可提升透射部23的保養性。
In addition, the
此外,搬送機構5,係包含以夾著腔室2的方式而延伸於照射單元4的移動方向的一對的導軌51(導
引部50)、及以跨收容部2的方式而形成為門型並作成可沿著一對的導軌51而移動的門型框54,而在門型框54係設有保持照射單元4的保持部54c,使得與沿著一般的導軌而使照射單元4移動的情況比較下,可藉具有高的剛性的門型框54使照射單元4沿著一對的導軌51而移動,故可穩定進行照射單元4的移動。
In addition, the
此外,在腔室2的外部,係設有可將照射單元4冷卻的冷卻部6,使得可將照射單元4冷卻,故即使為將紫外線對基板10連續照射時等將照射單元4連續驅動的情況下,仍可抑制照射單元4過熱。
In addition, a cooling
此外,搬送機構5,係與照射單元4一起使冷卻部6在腔室2的外部移動,使得可將照射單元4及冷卻部6一起總括而予以移動,故與使照射單元4及冷卻部6個別獨立移動的情況比較下,可達成裝置構成的精簡化。
In addition, the conveying
此外,於腔室2,係設有可調整腔室2的內部環境的氧濃度及露點的氣體供應部7,使得可將腔室2的內部環境的氧濃度調整為既定的濃度,故可在既定的氧濃度的條件下將紫外線照射於基板10。此外,可將腔室2的內部環境的露點調整為既定的露點,故可在既定的露點的條件下將紫外線照射於基板10。
In addition, the
此外,在移動步驟中,在一對的導軌51的-X方向端(一端)與+X方向端(另一端)之間使照射單元4往返移動,使得在一對的導軌51的一端與另一端之間僅使照射單元4移動於一方向的情況比較下,即使為將紫
外線對基板10反復照射時,仍可平滑地效率佳地照射。此外,設置一個照射單元4即足夠,故可達成裝置構成的精簡化。
In addition, in the moving step, the
接著,有關本發明的第二實施形態,利用圖4~圖6進行說明。 Next, the second embodiment of the present invention will be described using FIGS. 4 to 6.
圖4,係第二實施形態相關的紫外線照射裝置201的透視圖。圖5,係第二實施形態相關的紫外線照射裝置201的俯視圖。圖6,係第二實施形態相關的紫外線照射裝置201之側面圖。
FIG. 4 is a perspective view of the
在第二實施形態,係相對於第一實施形態,在腔室202具備第一腔室202A(第一收容部)及第二腔室202B(第二收容部)方面,在導引部250具備第一導軌251A及第二導軌251B方面特別不同。在圖4~圖6中,對與第一實施形態同樣的構成係附加相同符號,其詳細說明係省略。
In the second embodiment, as compared to the first embodiment, the
<紫外線照射裝置> <ultraviolet irradiation device>
如示於圖4~圖6,紫外線照射裝置201,係具備腔室202、台203、照射單元4、搬送機構205、冷卻部6、氣體供應部7及控制部8。控制部8,係將紫外線照射裝置201的構成要素總括控制。
As shown in FIGS. 4 to 6, the
腔室202,係具備第一腔室202A及第二腔室
202B。
The
第一腔室202A及第二腔室202B,係排列於是照射單元4的移動方向的X方向。
The
第一腔室202A係收容第一基板10A,第二腔室202B係收容第二基板10B。另外,第一基板10A及第二基板10B,係可採用彼此相同的基板,亦可採用彼此不同的基板。
The
台203,係以上表面支撐第一腔室202A、第二腔室202B及搬送機構205。台203,係俯視下形成延伸於X方向的長方形狀的板狀。
The table 203 supports the
台203,係由框體下部231從下方進行支撐。
The table 203 is supported from below by the
框體下部231,係將複數個鋼材等的角柱組合成格子狀而形成。
The
在台203,係設有框體232。框體232,係具備柱部233及壁部234。
The table 203 is provided with a
柱部233,係將複數個鋼材等的角柱組合成格子狀而形成,並包圍第一腔室202A、第二腔室202B、照射單元4及搬送機構205。
The
壁部234,係設於柱部233之間隙(各角柱之間),並覆蓋第一腔室202A、第二腔室202B、照射單元4及搬送機構205的周圍及上方。
The
例如,壁部234,係由透明的板材而形成。藉此,可從框體232的外部視認框體232內的構成要素。
For example, the
搬送機構205,係設於第一腔室202A及第二
腔室202B的外部。搬送機構205,係以紫外線從各腔室202A、202B的外部照射在收容於各腔室202A、202B的內部的各基板10A、10B的方式而使照射單元4在各腔室202A、202B的外部移動。搬送機構205,係具備導引部250、基底53及門型框54。
The
導引部250,係具備一對的第一導軌251A及一對的第二導軌251B、滑件52。
The
一對的第一導軌251A,係以將第一腔室202A從-Y方向側及+Y方向側夾住的方式而延伸於X方向。
The pair of
一對的第二導軌251B,係以將第二腔室202B從-Y方向側及+Y方向側夾住的方式而延伸於X方向。
The pair of
滑件52,係構成為可沿著一對的各導軌251A、導軌251B而滑動。
The
基底53,係在台203設置複數個(例如本實施形態下係八個)。各基底53,係支撐一對的各導軌251A、251B的X方向兩端部。
A plurality of
門型框54,係作成可沿著一對的各導軌251A、251B而移動。門型框54的各門柱部54a的下端部,係載置於滑件52上表面。
The
如示於圖5,在X方向,各導軌251A、251B的長度L11、L12,係比各腔室202A、202B的長度L21、L22長(L11>L21、L12>L22)。在本實施形態,在X方向,各導軌251A、251B的長度L11、L12,係作成比將各腔室202A、202B的長度L21、L22、及門型框54二
個份的長度(2×L3)相加的長度(L21+2×L3、L22+2×L3)長。藉此,俯視下,可使照射單元4從超過各腔室202A、202B的-X方向端的區域移動直到超過各腔室202A、202B的+X方向端的區域為止。
As shown in FIG. 5, in the X direction, the lengths L11 and L12 of the
<帶式搬送機> <belt conveyor>
於本實施形態,在是照射單元4的移動方向的X方向上的第一導軌251A與第二導軌251B之間,係可裝卸地設有輔助門型框54的移動的帶式搬送機209(導引輔助部)。帶式搬送機209,係以將第一導軌251A與第二導軌251B之間橋接的方式而延伸於X方向。帶式搬送機209,係作成可切換旋轉方向。藉此,變成為輔助門型框54的從第一導軌251A往第二導軌251B的移動、及從第二導軌251B往第一導軌251A的移動。
In this embodiment, between the
<紫外線照射方法> <Ultraviolet irradiation method>
接著,說明本實施形態相關的紫外線照射方法。在本實施形態,係利用上述的紫外線照射裝置201而對各基板10A、10B照射紫外線。在紫外線照射裝置201的各部分進行的動作,係藉控制部8而控制。另外,在本實施形態相關的紫外線照射方法中,有關與第一實施形態同樣的方法,係省略其詳細說明。
Next, the ultraviolet irradiation method according to this embodiment will be described. In this embodiment, the ultraviolet
在移動步驟中,在一對的第一導軌251A的-X方向端與一對的第二導軌251B的+X方向端之間使照射單
元4往返移動。例如,在圖5的俯視下,使照射單元4從超過第一腔室202A的-X方向端的區域直到超過第二腔室202B的+X方向端的區域為止往返移動。如上述,在是照射單元4的移動方向的X方向上的第一導軌251A與第二導軌251B之間設有帶式搬送機209,故可平滑地進行照射單元4的往返移動。
In the moving step, between the -X direction end of the pair of
如以上,依本實施形態時,腔室202,係包含可將各基板10A、10B以密閉空間進行收容且排列於照射單元4的移動方向(X方向)的第一腔室202A及第二腔室202B,而導引部250係包含以夾著第一腔室202A而延伸的第一導軌251A、及以在第一導軌251A排列於照射單元4的移動方向(X方向)並夾著第二腔室202B的方式而延伸的第二導軌251B,使得可沿著第一導軌251A及第二導軌251B而使照射單元4移動,故可連續進行往第一腔室202A內的基板10A的紫外線照射、及往第二腔室202B內的基板10B的紫外線照射。
As described above, according to the present embodiment, the
此外,包含第一腔室202A及第二腔室202B,故可同時處理兩個基板10A、10B。
In addition, since the
此外,可在具有密閉空間的各腔室202A、202B內使各基板10A、10B靜止的狀態下,邊在各腔室202A、202B外使照射單元4移動邊對各腔室202A、202B內的各基板10A、10B照射紫外線,故可抑制各腔室202A、202B內的顆粒的產生,可將各基板10A、10B保持清淨。
In addition, the
此外,在具備第一腔室202A及第二腔室202B的構
成中,可達成佔用面積的縮小化、各腔室202A、202B內的氧濃度/露點的管理的容易化,同時削減在調整各腔室202A、202B內的氧濃度時使用的氮的消耗量。
In addition, the structure provided with the
此外,在照射單元4的移動方向(X方向)上的第一導軌251A與第二導軌251B之間,係可裝卸地設有輔助門型框54的移動的帶式搬送機209,使得可藉將帶式搬送機209裝卸,從而切換沿著第一導軌251A或第二導軌251B中的其中一者的門型框54的移動、及連續沿著第一導軌251A及第二導軌251B的門型框54的移動。例如,可藉使帶式搬送機209脫離,從而切換成僅沿著第一導軌251A或第二導軌251B中的其中一者的門型框54的移動。另一方面,可藉使帶式搬送機209連接,從而切換成連續沿著第一導軌251A及第二導軌251B的門型框54的移動。
In addition, between the
另外,在上述的例中所示的各構材的諸多形狀、組合等係作為一例,而可基於設計要求等進行各種變更。 In addition, many shapes, combinations, etc. of each member shown in the above example are examples, and various changes can be made based on design requirements and the like.
例如,在上述實施形態中,係雖設置一個或二個腔室,惟不限於此,將腔室設置三個以上的複數個亦無妨。 For example, in the above-mentioned embodiment, although one or two chambers are provided, it is not limited to this, and it is no problem to provide more than three plural chambers.
此外,在上述第二實施形態中,係雖在輔助導引部方面採用帶式搬送機,惟不限於此,採用線性馬達致動器亦無妨。例如,帶式搬送機及線性馬達致動器,係亦可作成可接續於X方向。藉此,可調整X方向上的門型框54的移動距離。
In addition, in the above-described second embodiment, although the belt conveyor is used for the auxiliary guide portion, it is not limited to this, and it is not a problem to use a linear motor actuator. For example, belt conveyors and linear motor actuators can also be made to be connected in the X direction. Thereby, the moving distance of the
此外,在上述第二實施形態中,係雖設置第一導軌及第二導軌,惟僅設置一個導軌亦無妨。此情況下,在X方向,導軌的長度,係作成比將各腔室202A、202B的長度L21、L22相加的長度長。
In addition, in the above-described second embodiment, although the first rail and the second rail are provided, it is not a problem to provide only one rail. In this case, in the X direction, the length of the guide rail is made longer than the length of the sum of the lengths L21 and L22 of the
另外,在上述中作為實施形態或其變化例而記載的各構成要素,係不脫離本發明的趣旨的範圍下可適當組合,此外,亦可作成酌情不使用經組合的複數個構成要素之中一部分的構成要素。 In addition, each of the constituent elements described as the embodiment or its modified examples described above can be combined as appropriate without departing from the scope of the present invention, and it can also be made so as not to use a plurality of combined constituent elements as appropriate Part of the constituent elements.
1‧‧‧紫外線照射裝置 1‧‧‧UV irradiation device
2‧‧‧腔室(收容部) 2‧‧‧ Chamber (Containment Department)
3‧‧‧台 3‧‧‧
4‧‧‧照射單元 4‧‧‧Irradiation unit
4a‧‧‧照射面 4a‧‧‧Irradiated surface
5‧‧‧搬送機構(移動部) 5‧‧‧Transport mechanism (moving department)
6‧‧‧冷卻部 6‧‧‧Cooling Department
7‧‧‧氣體供應部(氧濃度調整部、露點調整部) 7‧‧‧Gas supply section (oxygen concentration adjustment section, dew point adjustment section)
8‧‧‧控制部 8‧‧‧Control Department
10‧‧‧基板 10‧‧‧ substrate
20‧‧‧頂板 20‧‧‧Top board
20h‧‧‧開口部 20h‧‧‧Opening
21‧‧‧周壁 21‧‧‧ Zhoubi
21a‧‧‧基板搬出入口 21a‧‧‧Substrate moving in and out
22‧‧‧底板 22‧‧‧Bottom plate
23‧‧‧透射部 23‧‧‧Transmission Department
25‧‧‧升降機構 25‧‧‧ Lifting mechanism
25a‧‧‧升降銷 25a‧‧‧Lift pin
25b‧‧‧驅動源 25b‧‧‧Drive source
31‧‧‧框體下部 31‧‧‧Lower part of the frame
31a‧‧‧車輪 31a‧‧‧wheel
32‧‧‧框體 32‧‧‧frame
33‧‧‧柱部 33‧‧‧Column
34‧‧‧壁部 34‧‧‧ Wall
40‧‧‧照射部 40‧‧‧Irradiation Department
41‧‧‧聚光構材 41‧‧‧Concentrating material
50‧‧‧導引部 50‧‧‧Guiding Department
51‧‧‧導軌 51‧‧‧rail
52‧‧‧滑件 52‧‧‧Slider
53‧‧‧基底 53‧‧‧ base
54‧‧‧門型框 54‧‧‧door frame
54a‧‧‧門柱部 54a‧‧‧Door post
54b‧‧‧連結部 54b‧‧‧Link
54c‧‧‧保持部 54c‧‧‧Maintaining Department
Claims (16)
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JP2015-153347 | 2015-08-03 |
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JPS62143426A (en) * | 1985-12-18 | 1987-06-26 | Hitachi Ltd | Light irradiation device |
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JP4086582B2 (en) * | 2002-08-06 | 2008-05-14 | キヤノン株式会社 | Illumination apparatus and exposure apparatus |
JP4342974B2 (en) * | 2003-02-12 | 2009-10-14 | 東京エレクトロン株式会社 | Curing apparatus and method, and coating film forming apparatus |
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JP5186224B2 (en) * | 2008-01-29 | 2013-04-17 | 東京応化工業株式会社 | Substrate treatment device |
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